JPH04104976A - Green sheet - Google Patents
Green sheetInfo
- Publication number
- JPH04104976A JPH04104976A JP2216793A JP21679390A JPH04104976A JP H04104976 A JPH04104976 A JP H04104976A JP 2216793 A JP2216793 A JP 2216793A JP 21679390 A JP21679390 A JP 21679390A JP H04104976 A JPH04104976 A JP H04104976A
- Authority
- JP
- Japan
- Prior art keywords
- binder
- green sheet
- organic resin
- inorganic powder
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011230 binding agent Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000011812 mixed powder Substances 0.000 claims abstract description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 4
- 239000005388 borosilicate glass Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 239000005355 lead glass Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 6
- 239000002002 slurry Substances 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はグリーンシートに関し、特に複数のグリーンシ
ートを積層した後に一括焼成を行う積層型多層配線基板
の製造に用いるグリーンシートに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a green sheet, and more particularly to a green sheet used for manufacturing a laminated multilayer wiring board in which a plurality of green sheets are laminated and then fired all at once.
第３図は従来の積層型多層配線基板のグリーンシートを
示す断面図である。FIG. 3 is a sectional view showing a green sheet of a conventional laminated multilayer wiring board.
従来、この種の多層配線基板の製造工程は、まず原料の
無機粉末にバインダー（有機樹脂結合剤）と溶剤を加え
、混合機によって混合・混線を行いバインダーが溶解し
た溶剤中に無機粉末が均一に分散した泥しよう（スラリ
ー）を作成する。Conventionally, the manufacturing process for this type of multilayer wiring board was to first add a binder (organic resin binder) and a solvent to the raw inorganic powder, mix and cross-wire using a mixer, and then distribute the inorganic powder uniformly in the solvent in which the binder was dissolved. Create a slurry that is dispersed in
そして、次に泥しようをドクターブレード法等によって
有機フィルム上に厚さが均一になるように供給し、乾燥
させてグリーンシート（生セラミツクシート）を作成す
る。尚、この時グリーンシート内部は第３図に示す様に
、均一に配置された各無機粉末１２がバインダー１３に
よって結合されている。Next, the slurry is supplied onto the organic film using a doctor blade method or the like so that it has a uniform thickness, and is dried to create a green sheet (raw ceramic sheet). At this time, inside the green sheet, as shown in FIG. 3, inorganic powders 12 uniformly arranged are bound together by a binder 13.
そして、その後グリーンシート１１に上下層間の導通を
得るためのスルーホールをあけ、導体配線パターンを厚
膜印刷等によって形成する。そして、このスルーホール
及び導体配線パターンを形成した複数のグリーンシート
を精度良く積層し、熱プレスによって一体化させ積層体
を作成する。Thereafter, through holes are made in the green sheet 11 to provide electrical continuity between the upper and lower layers, and a conductive wiring pattern is formed by thick film printing or the like. Then, a plurality of green sheets having through-holes and conductor wiring patterns formed thereon are laminated with high accuracy and integrated by hot pressing to create a laminate.
そして、この積層体を加熱しバインダーを燃焼・焼失さ
せ（脱バインダー）、さらに加熱・焼成して多層配線基
板を得るというものである。そして、得られた多層配線
基板は緻密な構造であり、その誘電率は無機粉末材料特
有の値である。Then, this laminate is heated to burn out the binder (removing the binder), and is further heated and fired to obtain a multilayer wiring board. The obtained multilayer wiring board has a dense structure, and its dielectric constant has a value unique to inorganic powder materials.
現在のコンピュータをはじめとする電子装置においては
、処理速度の高速化が要求されている。BACKGROUND OF THE INVENTION There is a demand for faster processing speeds in current electronic devices such as computers.
それに伴って、多層配線基板の誘電率も高速化に有利な
低誘電率化が要求されている。しかしながら上述した従
来のグリーンシートでは、無機粉末材料によって多層配
線基板の誘電率が決ってしまい、低誘電率化が不可能で
あった。Accordingly, the dielectric constant of the multilayer wiring board is also required to be lower, which is advantageous for higher speeds. However, in the conventional green sheet described above, the dielectric constant of the multilayer wiring board is determined by the inorganic powder material, and it is impossible to reduce the dielectric constant.
本発明のグリーンシートは、無機粉末と、バインダーと
、溶剤と、前記バインダーと同一の有機樹脂によって形
成した複数の微小な有機樹脂球とからなっている。The green sheet of the present invention is composed of an inorganic powder, a binder, a solvent, and a plurality of minute organic resin spheres made of the same organic resin as the binder.
また、本発明のグリーンシートは、前記無機粉末にアル
ミナとホウケイ酸鉛ガラスの混合粉を用いている。Further, in the green sheet of the present invention, a mixed powder of alumina and lead borosilicate glass is used as the inorganic powder.
さらにまた本発明のグリーンシートは、前記ノくインダ
ーにポリビニルブチラールを用いている。Furthermore, in the green sheet of the present invention, polyvinyl butyral is used as the inder.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示すグリーンシートの断面
図である。FIG. 1 is a sectional view of a green sheet showing an embodiment of the present invention.
本実施例のグリーンシート１は、バインダー３と、無機
粉末２と、溶剤と、バインダー３と同一の有機樹脂より
形成された微小な有機樹脂球４とによって構成されてい
る。The green sheet 1 of this embodiment is composed of a binder 3, an inorganic powder 2, a solvent, and minute organic resin spheres 4 made of the same organic resin as the binder 3.
グリーンシート１はまず原料の無機粉末であるアルミナ
とホウケイ酸鉛カラスの混合粉にバインダー（有機樹脂
結合剤〉としてｐＶＢ （ポリビニルブチラール）を加
え、溶剤としてアルコール系溶剤例えばエチルセルソル
ブを加え、混合機によって混合・混練を行い、バインダ
ーが溶解した溶剤中に無機粉末が均一に分散した泥しよ
う（スラリー）を作成する。そして、次に泥しようを２
０℃以下に冷却し、ＰＶＡ （ポリビニルアルコール）
を用いて形成した直径５０〜６０μｍの微小な有機樹脂
球を５〜１０重量％加え、さらに混合を行う０次に、得
られた泥しようをドクターブレード法等によって有機フ
ィルム等の上に厚さが均一なるように供給し、乾燥させ
ることによって得られる。Green sheet 1 is first made by adding pVB (polyvinyl butyral) as a binder (organic resin binder) to a mixed powder of alumina, which is an inorganic powder, and lead borosilicate glass, and adding an alcohol-based solvent such as ethyl cellosolve as a solvent. Mixing and kneading is performed using a machine to create a slurry in which inorganic powder is uniformly dispersed in a solvent in which a binder is dissolved.
Cool to below 0℃, PVA (polyvinyl alcohol)
Add 5 to 10% by weight of minute organic resin spheres with a diameter of 50 to 60 μm formed using It is obtained by supplying it evenly and drying it.
グリーンシート１を複数枚積層した後、加熱しバインダ
ー３を燃焼・焼失（脱バインダー）させると、グリーン
シート１内部の有機樹脂球４も同時に燃焼・焼失し、空
孔が形成される。その後さらに加熱し焼成を行うと、第
２図に示す様な内部に空孔６を持ったセラミック基板５
となる。この空孔６は有機樹脂球４の燃焼・焼失によっ
て形成されたため形状が均一であり、周囲が緻密なセラ
ミックで覆われている。従って、第２図に示すセラミッ
ク基板５は空孔６を有しているため、緻密なセラミック
基板よりも誘電率が低くなる。また、空孔６は緻密なセ
ラミック７で覆われているため、絶縁性についても十分
な値が得られる。When a plurality of green sheets 1 are stacked and then heated to burn and burn out the binder 3 (remove the binder), the organic resin spheres 4 inside the green sheet 1 are also burned and burnt out at the same time, forming voids. After that, by further heating and firing, a ceramic substrate 5 with holes 6 inside as shown in FIG.
becomes. The holes 6 are formed by burning and burning out the organic resin spheres 4, so they have a uniform shape, and the periphery is covered with dense ceramic. Therefore, since the ceramic substrate 5 shown in FIG. 2 has holes 6, its dielectric constant is lower than that of a dense ceramic substrate. Further, since the holes 6 are covered with the dense ceramic 7, a sufficient value of insulation can be obtained.
またさらに、クリーンシート１に上下層間の導通を得る
ためのスリーホール及び導体配線パターンを形成し、複
数のグリーンシートを精度良く積層し、熱プレスによっ
て一体化させた後に加熱し、バインダーを燃焼・焼失（
脱バインダー）させ、その後さらに加熱し焼成を行うと
、空孔を有するセラミックを絶縁層とした多層配線基板
が得られる。この多層配線基板は従来の緻密な構造の基
板より低誘電率であるため、信号の高速化に有利である
。また、セラミック部分の空孔は緻密なセラミックによ
って覆われているなめ、各信号配線間の絶縁抵抗は十分
高く良好な値である。Furthermore, three holes and a conductor wiring pattern are formed on the clean sheet 1 to obtain electrical conduction between the upper and lower layers, a plurality of green sheets are laminated with high precision, and after being integrated by heat pressing, the binder is burned and heated. Burnt down (
By removing the binder) and then further heating and firing, a multilayer wiring board having an insulating layer made of ceramic having pores is obtained. This multilayer wiring board has a lower dielectric constant than a conventional substrate with a dense structure, so it is advantageous for increasing signal speed. Further, since the pores in the ceramic portion are covered with dense ceramic, the insulation resistance between each signal wiring is sufficiently high and has a good value.
以上説明したように本発明は、積層型多層配線基板に用
いるグリーンシートにおいて、有機樹脂によって形成し
た複数の微小な球を内部に有することによって、低誘電
率の多層配線基板を実現できる効果がある。As explained above, the present invention has the effect of realizing a multilayer wiring board with a low dielectric constant by having a plurality of microscopic spheres formed from an organic resin inside a green sheet used for a laminated multilayer wiring board. .
第１図は本発明の一実施例を示すグリーンシートの断面
図、第２図は本実施例のグリーンシートを用いたセラミ
ック基板の断面図、第３図は従来技術のグリーンシート
の断面図である。
１．１１・・・グリーンシート、２，１２・・・無機粉
末、３．１３・・・バインダー、４・・・有機樹脂球、
５・・・セラミック基板、６・・・空孔、７・・・セラ
ミック。Fig. 1 is a cross-sectional view of a green sheet showing an embodiment of the present invention, Fig. 2 is a cross-sectional view of a ceramic substrate using the green sheet of this embodiment, and Fig. 3 is a cross-sectional view of a conventional green sheet. be. 1.11...Green sheet, 2,12...Inorganic powder, 3.13...Binder, 4...Organic resin spheres,
5... Ceramic substrate, 6... Hole, 7... Ceramic.
Claims (1)
ーと同一の有機樹脂によって形成した複数の微小な有機
樹脂球とからなることを特徴とするグリーンシート。 ２、前記無機粉末にアルミナとホウケイ酸鉛ガラスの混
合粉を用いたことを特徴とする請求項１記載のグリーン
シート。 ３、前記バインダーにポリビニルブチラールを用いたこ
とを特徴とする請求項１または２記載のグリーンシート
。[Scope of Claims] 1. A green sheet comprising an inorganic powder, a binder, a solvent, and a plurality of minute organic resin spheres formed from the same organic resin as the binder. 2. The green sheet according to claim 1, wherein the inorganic powder is a mixed powder of alumina and lead borosilicate glass. 3. The green sheet according to claim 1 or 2, wherein polyvinyl butyral is used as the binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2216793A JPH04104976A (en) | 1990-08-17 | 1990-08-17 | Green sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2216793A JPH04104976A (en) | 1990-08-17 | 1990-08-17 | Green sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04104976A true JPH04104976A (en) | 1992-04-07 |
Family
ID=16693966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2216793A Pending JPH04104976A (en) | 1990-08-17 | 1990-08-17 | Green sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04104976A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06219820A (en) * | 1992-12-29 | 1994-08-09 | Internatl Business Mach Corp <Ibm> | Ceramic composition, ceramic green sheet and preparation thereof |
| KR100454313B1 (en) * | 2002-01-25 | 2004-10-26 | 가부시키가이샤 무라타 세이사쿠쇼 | Photoreactive resin composition and method of manufacturing circuit board and ceramic multilayer substrate using the resin composition |
-
1990
- 1990-08-17 JP JP2216793A patent/JPH04104976A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06219820A (en) * | 1992-12-29 | 1994-08-09 | Internatl Business Mach Corp <Ibm> | Ceramic composition, ceramic green sheet and preparation thereof |
| KR100454313B1 (en) * | 2002-01-25 | 2004-10-26 | 가부시키가이샤 무라타 세이사쿠쇼 | Photoreactive resin composition and method of manufacturing circuit board and ceramic multilayer substrate using the resin composition |
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