JPH04101451A - Lead frame material - Google Patents
Lead frame materialInfo
- Publication number
- JPH04101451A JPH04101451A JP21938890A JP21938890A JPH04101451A JP H04101451 A JPH04101451 A JP H04101451A JP 21938890 A JP21938890 A JP 21938890A JP 21938890 A JP21938890 A JP 21938890A JP H04101451 A JPH04101451 A JP H04101451A
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- organic film
- plating
- copper
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 44
- 238000007747 plating Methods 0.000 claims abstract description 40
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 20
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 19
- 238000004140 cleaning Methods 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 6
- 239000003960 organic solvent Substances 0.000 claims abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 4
- 239000001301 oxygen Substances 0.000 claims abstract description 4
- 238000010301 surface-oxidation reaction Methods 0.000 claims description 8
- 238000004458 analytical method Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 abstract description 18
- 238000003860 storage Methods 0.000 abstract description 5
- 230000001590 oxidative effect Effects 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 238000011282 treatment Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 12
- 230000003064 anti-oxidating effect Effects 0.000 description 11
- 230000003647 oxidation Effects 0.000 description 11
- 238000007254 oxidation reaction Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 9
- 238000001035 drying Methods 0.000 description 8
- 230000003078 antioxidant effect Effects 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910000531 Co alloy Inorganic materials 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 229910001096 P alloy Inorganic materials 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- AYTIAPQIRMHXML-KVVVOXFISA-N n-cyclohexylcyclohexanamine;(z)-octadec-9-enoic acid Chemical compound C1CCCCC1NC1CCCCC1.CCCCCCCC\C=C/CCCCCCCC(O)=O AYTIAPQIRMHXML-KVVVOXFISA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- -1 Nickel sulfate nickel chloride Nickel sulfate Cobalt boric acid Chemical compound 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、ニッケル合金めつきリードフレーム材料に係
り、より詳細には、例えば、パワーＩＣなどに用いられ
るニッケルまたはニッケル合金めっきを施した電子部品
、特に、はんだ付性を必要とするリードフレーム材料に
関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a nickel alloy plated lead frame material, and more particularly, to an electronic lead frame material plated with nickel or nickel alloy used in power ICs, etc. It relates to components, particularly lead frame materials that require solderability.
［従来の技術］
従来、ニッケルめっき材料は、はんた付性が劣るため、
はんだ付性を有する部分にスポット銀めっきや錫めっき
を行ったものか多い。[Conventional technology] Conventionally, nickel plating materials had poor solderability, so
Many have spot silver plating or tin plating on the solderable parts.
また、ニッケルめっき材料に直接はんだ付けする場合に
は、フラックスを用いて行っていた。フラックスを用い
ないではんだ付性を良くするために、ニッケルーホウ素
合金めっき、ニッケルーリン合金めっきやニッケルーコ
バルト合金めっきなどが開発されている。これらの合金
めっき皮膜は、還元性が高くはんだ付性に優れている。Furthermore, when soldering directly to nickel-plated materials, flux has been used. In order to improve solderability without using flux, nickel-boron alloy plating, nickel-phosphorus alloy plating, nickel-cobalt alloy plating, etc. have been developed. These alloy plating films have high reducibility and excellent solderability.
また、銅や鉄鋼の金属表面に、変色防止や防錆の目的で
有機皮膜を付着させることは、すでに般化している。し
かし、ニッケルーリン合金めっきやニッケルーコバルト
合金の防錆ＩＡ理については研究されていない。これは
、ニッケルが銅に比べて酸化しにくく、顕著な変色を起
こさないためである。さらにリードフレーム材料は加工
・半導体のボンディングなどの後工程があるため、ヘン
シトリアゾールなどの防錆処理は行われていなかった。Furthermore, it has already become common to attach organic films to metal surfaces such as copper and steel for the purpose of preventing discoloration and rust prevention. However, no research has been conducted on the rust prevention IA process for nickel-phosphorus alloy plating or nickel-cobalt alloy. This is because nickel is less susceptible to oxidation than copper and does not cause significant discoloration. Furthermore, because lead frame materials require post-processing such as processing and semiconductor bonding, anti-corrosion treatments such as hensitriazole were not applied.
しかし、はんだ付性を良くするためにスポット銀めっき
や錫めっきをするとコストが高くなり、経済性の面等か
ら好ましくない。However, spot silver plating or tin plating to improve solderability increases cost, which is not preferable from an economic standpoint.
さらに、フラックスを用いるとはんだ付は後に、フラッ
クスの除去洗浄をしなければならない。これは、製造工
程が多くなるだけでなく、製品の品質、信頼性にも悪影
響をおよぼしていた。Furthermore, if flux is used, the flux must be removed and cleaned after soldering. This not only increases the number of manufacturing steps, but also adversely affects the quality and reliability of the product.
また、ニッケルーリン合金めつきやニッケルコバルト合
金をめっきした材料でも長期保存後には、はんだ付性が
悪くなるという問題を生じていた。Further, even materials plated with nickel-phosphorus alloy or nickel-cobalt alloy have a problem of poor solderability after long-term storage.
［発明が解決しようとする課題］
本発明は、従来の技術がもつ、以上のような問題点を解
消させ、はんだ付性を向上し、長期保存しても安定した
品質を発揮するニッケルおよびニッケル合金めっきリー
ドフレーム材料を提供することを目的とする。[Problems to be Solved by the Invention] The present invention solves the above-mentioned problems of the conventional technology, improves solderability, and uses nickel and nickel that exhibit stable quality even after long-term storage. The purpose is to provide alloy plated lead frame materials.
［課題を解決するための手段］
本発明のリードフレーム材料は、銅または銅合金に施し
たニッケルまたはニッケル合金めっきにおける該めっき
の表面酸化状態が、Ｘ線光電子分析値の酸素ピーク強度
とニッケルピーク強度との比（Ｏｌｓ） ／ （Ｎ ｉ
２ｐ） （括弧内は各元素のＥＳＣＡのピーク強度
を示す。以下同じ）として１以下であり、前記めっき表
面に、有機溶剤洗浄によって除去できるが、または３０
０℃以下の温度で分解する性質を持つ有機皮膜を有して
いることを特徴とする。[Means for Solving the Problems] The lead frame material of the present invention is characterized in that the surface oxidation state of the nickel or nickel alloy plating applied to copper or copper alloy is the same as the oxygen peak intensity and the nickel peak in X-ray photoelectron analysis values. Ratio to intensity (Ols) / (N i
2p) (The ESCA peak intensity of each element is shown in parentheses. The same applies hereinafter) is 1 or less, and the plating surface can be removed by cleaning with an organic solvent, or 30
It is characterized by having an organic film that decomposes at temperatures below 0°C.
なお、前記有機皮膜の厚さは、００１μｍ以上、０．１
μｍ以下とすることか好ましい。The thickness of the organic film is 0.001 μm or more and 0.1 μm or more.
It is preferable that the thickness be less than μm.
また、有機皮膜の表面張力は、プレス油との接触角で２
０°以下とすることが好ましい。In addition, the surface tension of the organic film is determined by the contact angle with the press oil.
It is preferable that the angle is 0° or less.
［作用］
発明者は、ニッケルおよびニッケル合金めっき材料のは
んだ付性について鋭意研究を行った結果、ニッケルおよ
びニッケル合金めっき表面の酸化とはんだ付性との間に
おける相関関係を見出し本発明に至ったものである。[Function] As a result of intensive research on the solderability of nickel and nickel alloy plating materials, the inventor found a correlation between oxidation of the nickel and nickel alloy plating surface and solderability, leading to the present invention. It is something.
すなわち、酸化状態はＸ線光電子分析（ＥＳＣ八分へ）
によってニッケルまたはニッケル合金めっき表面の（Ｎ
１２ｐ）、（Ｃｏ２ｐ）、（Ｏｌｓ）などを測定し、
ニッケル酸化物と金属とのピークの強度比、または酸素
ピーク強度とニッケルピーク強度との比（Ｏｉｓ） ／
（Ｎ ｉ ２ｐ）を求めた場合、この値において、（
Ｎｉ酸化物）／ （Ｎ ｉ金属）≦１および（Ｏｉｓ）
／ （Ｎ ｉ ２ｐ）≦１の二・ンケルまたはニッケ
ル合金めつきは良好なはんだ付性を示すことが判明した
。In other words, the oxidation state was determined by X-ray photoelectron analysis (ESC to 8 minutes)
(N) of nickel or nickel alloy plated surface
12p), (Co2p), (Ols), etc.
Intensity ratio of nickel oxide and metal peaks, or ratio of oxygen peak intensity to nickel peak intensity (Ois) /
When calculating (N i 2p), at this value, (
Ni oxide)/(Ni metal)≦1 and (Ois)
It has been found that nickel or nickel alloy plating with /(N i 2p)≦1 exhibits good solderability.
しかし、経時的に上記条件に表面状態を維持することは
困難であり、そのための手段につき木発明者は鋭意検討
を重ね、めっき表面に有機皮膜を形成してはとうかとの
着想を得た。ただ、従来、リードフレーム材料に有機皮
膜を形成した技術は存在していなかった。However, it is difficult to maintain the surface condition under the above conditions over time, and the inventors of the present invention conducted extensive research into ways to do so, and came up with the idea of forming an organic film on the plating surface. However, until now, there was no technology for forming an organic film on lead frame materials.
従来有機皮膜を付与したリードフレーム材料が存在して
いなかった理由は、リードフレーム材料にはスタンピン
グ・ボンディングなどの後工程が有り、後工程への有機
皮膜の影響が十分に研究されていなかったためにあると
考えられる。The reason why conventional lead frame materials with organic coatings did not exist is that lead frame materials require post-processing such as stamping and bonding, and the influence of organic coatings on post-processing has not been sufficiently studied. It is believed that there is.
しかし、上記常識に反し、有機皮膜の付与を行った場合
について詳細な検討を行フたところ、（Ｏｉｓ） ／
（Ｎ ｉ ２ｐ）≦１の場合には、酸化防止皮膜か有機
洗浄によって除去てきるが、または３００℃以下の温度
で分解する性質を持つ有機皮膜を付与すれば、半導体チ
ップを付けたときにもはんだ層中に皮膜が残らず、ボン
ディングに悪影響を与えないことを見い出した。However, contrary to the above common sense, after conducting a detailed study on the case where an organic film is applied, (Ois) /
If (N i 2p)≦1, it can be removed by an antioxidant film or organic cleaning, but if an organic film that decomposes at a temperature of 300°C or less is applied, it will be easier to remove when a semiconductor chip is attached. It was also discovered that no film remains in the solder layer and does not adversely affect bonding.
従って、未発明では、めっきの表面状態を（Ｏｌｓ）
／ （Ｎ ｉ ２ｐ）≦１とし、ざらに経時的にこの状
態を保存するためめっき表面に有機皮膜を形成している
。なお、めっき形成と有機皮膜形成との間の時間か長い
とめっきの酸化か進行しやすいためめっき直後に有機皮
膜の形成を行う。Therefore, in the uninvention, the surface state of plating is (Ols)
/ (N i 2p)≦1, and an organic film is formed on the plating surface to roughly preserve this state over time. Incidentally, if the time between plating formation and organic film formation is long, oxidation of the plating tends to proceed, so the organic film is formed immediately after plating.
また、めっき条件（例えはめっき浴温度）、水洗条件（
水洗条件は残存イオン量に関係し、残存イオン量はめっ
きの酸化速度に関係する）等によっては、めっき直後で
あっても酸化が進行する場合もある。それを防止するた
めこれらの条件を適正な範囲に制御することが好ましい
。In addition, plating conditions (for example, plating bath temperature), water washing conditions (
The oxidation may proceed even immediately after plating, depending on the conditions (the water washing conditions are related to the amount of remaining ions, and the amount of remaining ions is related to the oxidation rate of the plating). In order to prevent this, it is preferable to control these conditions within appropriate ranges.
さらに、有機皮膜の形成処理後の乾燥条件によっては、
めつきの酸化か進行する場合もあるため、これを防止す
るために、乾燥条件としては、ブロアー乾燥、露点 ２
０℃以下、乾燥温度：８０℃以下とすることが好ましい
。Furthermore, depending on the drying conditions after the organic film formation process,
Since oxidation of plating may progress, to prevent this, drying conditions include blower drying and dew point 2.
Preferably, the temperature is 0°C or lower, and the drying temperature is 80°C or lower.
なお、有機溶剤洗浄によって除去できるが、または３０
０℃以下の温度で分解する性質を持つ有機皮膜の材料と
しては、例えば、ジシクロヘキシルアミンオレイン酸塩
を用いれはよい。もちろんこれに限定されるものではな
い。Although it can be removed by cleaning with an organic solvent, or
For example, dicyclohexylamine oleate may be used as the material for the organic film that has the property of decomposing at a temperature of 0° C. or lower. Of course, it is not limited to this.
なお、スタンピングに悪影響を与えないためには有機皮
膜は薄い方が望ましい。しかし、有機皮膜が薄すきると
酸化防止効果が低下することもある。従って、有機皮膜
の厚さは０．０１μｍ以上とすることが好ましい。Note that it is desirable that the organic film be thin in order not to adversely affect stamping. However, if the organic film is too thin, the antioxidant effect may be reduced. Therefore, the thickness of the organic film is preferably 0.01 μm or more.
方、有機皮膜が厚すぎると除去するために時間がかかる
ため、有機皮膜の厚さは０．１μｍ以下であることが望
ましい。また、有機皮膜の厚さを０．１μｍ以下とした
場合には、初期はんだ付は性試験において円形のけんだ
ハジキの発生は全く認められなくなるので、この点から
も０１μｍ以下とすることか好ましい。On the other hand, if the organic film is too thick, it will take time to remove it, so it is desirable that the thickness of the organic film is 0.1 μm or less. Furthermore, if the thickness of the organic film is 0.1 μm or less, no circular repellency will be observed in the initial soldering test. .
なお、有機皮膜の厚さはＸ線光電子分析（ＥＳＣＡ分析
）によっても評価てきる。ＥＳＣＡ分析によって（Ｎｉ
２ｐ）、（Ｃｉｓ）、（Ｎ Ｉｓ）、（Ｏｌｓ）を測定
し、炭素ピーク強度とニッケルピーク強度の比（ＣＩｓ
） ／ （Ｎ ｉ ２ｐ）を求めればよい。また、窒素
を含有する有機皮膜では窒素ピーク強度とニッケルピー
ク強度の比（Ｎｌｓ）／（Ｎｉ２ｐ）で皮膜の厚さを評
価しても良い。この値において（Ｃ１ｓ） ／ （Ｎ
ｉ ２ｐ）は０４以上１４以下であることか望ましい。Note that the thickness of the organic film can also be evaluated by X-ray photoelectron analysis (ESCA analysis). By ESCA analysis (Ni
2p), (Cis), (N Is), (Ols), and the ratio of carbon peak intensity to nickel peak intensity (CIs
) / (N i 2p). Further, in the case of an organic film containing nitrogen, the thickness of the film may be evaluated by the ratio of nitrogen peak intensity to nickel peak intensity (Nls)/(Ni2p). At this value (C1s) / (N
i2p) is desirably 04 or more and 14 or less.
（たたしくＣ１５） ／ （Ｎ ｉ ２ｐ）のブランク
は０．３である）。(Truly C15) / (N i 2p) blank is 0.3).
また、プレス油との馴染み性をよくするため表面張力が
低いものが望ましい。鋭意研究の結果、ニッケル合金表
面の有機皮膜とプレス油との接触角は２０°以下にする
ことが好ましいことがわかった。In addition, it is desirable that the surface tension is low in order to improve compatibility with press oil. As a result of intensive research, it was found that the contact angle between the organic film on the surface of the nickel alloy and the press oil is preferably 20 degrees or less.
［実施例］
（実施例１）
脱酸銅に対し、常法により脱脂洗浄・酸洗浄を順次行っ
た。[Example] (Example 1) Deoxidized copper was sequentially subjected to degreasing cleaning and acid cleaning using a conventional method.
その後直ぐに、ニッケルーコバルト合金めっきを１．５
μｍ厚に施し、純水にて洗浄した。Immediately thereafter, 1.5 nickel-cobalt alloy plating was applied.
It was applied to a thickness of μm and washed with pure water.
洗浄後直ぐに酸化防止処理（有機皮膜の被覆）を行い、
さらに水洗した後、乾燥し、第１図に示す層構造のリー
ドフレーム材料の試料を作成した。Immediately after cleaning, anti-oxidation treatment (organic film coating) is applied.
After further washing with water and drying, a sample of the lead frame material having the layered structure shown in FIG. 1 was prepared.
以下にその条件の詳細を述べる。The details of the conditions are described below.
くめつき〉
２４０ ｇ／ｎ
４０ ｇ／ｕ
２ｇ／、Ｑ
３５ｇ／ｆＬ
＃６１０ ５ｍｆｌ／ｆｌ
＃６３ １０ｍＡ／４
（荘原ニーシライト社製）
・基本浴組成
硫酸ニッケル
塩化ニッケル
硫酸コバルト
ホウ酸
市販光沢剤
・めっき条件
電流密度
温度 ４５℃
攪拌あり
く酸化防止処理〉
・基本液組成
ジシクロヘキシルアミンオレイン酸塩
３ Ａ ／ ｄ ｍ’
０ 、１５％
ノニオン系界面活性剤
水
・処理条件
０ 、０５％
９９ 。 ８％
スプレー散布
・処理時間 ５秒
・乾燥 ブロアー、温度７０℃、露点１０℃上記方法に
よって作成した試料につき、酸化防止処理直後と、下記
の経時促進処理後に表面酸化状態・はんだ付は性を調査
した。Kumetsuki> 240 g/n 40 g/u 2 g/, Q 35 g/fL #610 5 mfl/fl #63 10 mA/4 (manufactured by Shobara Nishilite Co., Ltd.) Basic bath composition Nickel sulfate nickel chloride Nickel sulfate Cobalt boric acid Commercial brightener Plating conditions Current density temperature 45°C Stirring Anti-oxidation treatment> - Base liquid composition dicyclohexylamine oleate 3 A/d m' 0, 15% Nonionic surfactant water - Processing conditions 0, 05% 99. 8% Spraying / Processing time: 5 seconds / Drying Blower, Temperature: 70°C, Dew point: 10°C The surface oxidation state and soldering properties of the samples prepared by the above method were investigated immediately after the oxidation prevention treatment and after the following aging acceleration treatment. did.
〈経時促進試験法〉
ン詰度 ・ ２５ ℃
湿度、９０％
保持、デシケータ中に垂直に吊るして保持保持時間・２
時間
なお、表面酸化状態は、ＥＳＣＡにより測定し、はんた
付は性は下記の条件にて測定した。<Aging accelerated test method> Packing degree: 25°C, humidity, 90% maintained, hung vertically in a desiccator, maintained for holding time 2
The surface oxidation state was measured by ESCA, and the solderability was measured under the following conditions.
〈はんだ付は性試験法〉 試験片 ニッケル合金めっき銅板 ５０ｍｍＸ５０ｍｍｘ０． ３０ｍｍ をイ吏用した。<Soldering is a sex test method> Test piece: Nickel alloy plated copper plate 50mmX50mmx0. 30mm I used it.
試験器 ：垂直浸漬型はんだ付は性試験機（＠田葉井製
作所製）
はんだ浴： Ｓ ｎ ６３ ／ Ｐ ｂ ３７はんた浴
温度 ・２７０ ℃
浸漬時間・１０秒
浸漬深さ＋４０ｍｍ
評価法 ；試験片のはんだ漏れ面積を測定した。Test device: Vertical immersion type soldering tester (manufactured by Tabai Seisakusho) Solder bath: S n 63 / P b 37 solder bath temperature: 270 °C Immersion time: 10 seconds Immersion depth + 40 mm Evaluation method; The solder leakage area of the test piece was measured.
上記方法によって得られた試料は、酸化防止処理直後に
おいては（Ｏｌｓ） ／ （Ｎｉ２ｐ） ＜０． ６で
あり、表面酸化が少なく、さらに酸化防止皮膜を付着し
であるため経時促進試験２時間後も（Ｏｌｓ） ／ （
Ｎ １２ｐ） ＜０． ７を保っていた。The sample obtained by the above method had (Ols) / (Ni2p) <0. 6, there is little surface oxidation, and the anti-oxidation film is attached, so even after 2 hours of accelerated aging test (Ols) / (
N 12p) <0. I kept it at 7.
そのためフラックスを使用しなくても良好なはんだ付性
をしめし、さらに長期保存しても安定した品質を発揮し
た。As a result, it exhibited good solderability even without the use of flux, and exhibited stable quality even after long-term storage.
試料の酸化防止皮膜は２００℃付近で気化する特性があ
る。ざらに、液濃度の制御・処理時間の適正化・後水洗
により皮膜を均一に薄く付けているためボンディング時
にはんだ層中に皮膜が残り不良となることもなかった。The antioxidant film of the sample has the property of vaporizing at around 200°C. In general, the coating was applied thinly and uniformly by controlling the liquid concentration, optimizing the processing time, and washing with water afterward, so there was no defective coating remaining in the solder layer during bonding.
なお、以上の試験における試験結果を以下の比較例のそ
れとともに表１に示す。Note that the test results of the above tests are shown in Table 1 together with those of the following comparative examples.
（比較例１）
実施例１と同様にニッケル合金めっきを行い、２４時間
放置後に酸化防止処理を行った。(Comparative Example 1) Nickel alloy plating was performed in the same manner as in Example 1, and after being left for 24 hours, anti-oxidation treatment was performed.
比較例１では、めっき直後において酸化防止処理を行わ
なかったため表面の酸化が進行し、酸化防止処理の効果
が発揮されなかった。また、はんだ付は性も低下した。In Comparative Example 1, oxidation of the surface progressed because no anti-oxidation treatment was performed immediately after plating, and the effect of the anti-oxidation treatment was not exhibited. Furthermore, the soldering properties were also reduced.
（比較例２）
実施例１と同様にニッケル合金めっき・酸化防止処理を
行った後、温度１２０℃、露点２５℃で乾燥を行った。(Comparative Example 2) After performing nickel alloy plating and anti-oxidation treatment in the same manner as in Example 1, drying was performed at a temperature of 120°C and a dew point of 25°C.
比較例２ては、乾燥条件が適正でなかったため表面の酸
化が進行し、（Ｏｌｓ） ／ （Ｎ ｉ ２ｐ） ＞
１てあり、全くはんだが付かなかりた。In Comparative Example 2, oxidation of the surface progressed because the drying conditions were not appropriate, and (Ols) / (N i 2p) >
1, and it didn't solder at all.
（比較例３） 温度６０℃でめっきを行い、めっき後渇洗した。(Comparative example 3) Plating was performed at a temperature of 60°C, and the plate was dried and washed after plating.
他の条件は実施例１と同様に行った。Other conditions were the same as in Example 1.
比較例３ては、めっき条件が適正でなかったため表面の
酸化か進行し、（Ｏｌｓ） ／ （Ｎ ｉ ２ｐ） ＞
１であり、はんた付は性が低下した。In Comparative Example 3, the plating conditions were not appropriate, so oxidation of the surface progressed, and (Ols) / (N i 2p) >
1, and the soldering properties decreased.
このように比較例ス〜３では、（Ｏｌｓ）／（Ｎｉ２ｐ
）＞１であり、表面の酸化が進みボンディング不良が発
生した。In this way, in Comparative Example 3, (Ols)/(Ni2p
)>1, surface oxidation progressed and bonding failure occurred.
（比較例４）
実施例１と同様にニッケル合金めっきを行い、酸化防止
処理をしなかフた。(Comparative Example 4) Nickel alloy plating was performed in the same manner as in Example 1, but without antioxidation treatment.
比較例４は、酸化防止処理をしていないため表面酸化が
急速に進行し、（Ｏｉｓ） ／ （Ｎ ｉ ２ｐ） ＞
１であり、はんだ付は性が低下した。経時促進試験後に
は全くはんだが付かなかった。In Comparative Example 4, surface oxidation progressed rapidly because no antioxidation treatment was applied, and (Ois) / (N i 2p) >
1, and the soldering properties deteriorated. There was no solder at all after the aging accelerated test.
（実施例２）
酸化防止処理は、液濃度を１０倍に濃くし、処理時間１
０秒で行った。他の条件は実施例１と同様に行９た。(Example 2) Anti-oxidation treatment was performed by increasing the liquid concentration by 10 times and by increasing the treatment time to 1.
It took 0 seconds. Other conditions were the same as in Example 1.
本例も、比較例に比べると良好なはんだ付は性を示した
。This example also showed better soldering properties than the comparative example.
ただ、実施例２では、酸化防止皮膜が厚いため、実施例
１の場合に比べると酸化防止皮膜の除去に時間がかかっ
た。また、有機洗浄・予備加熱なして直接はんだ付けし
た場合、実施例１と比べると、はんた付は時にはんだが
完全には除去されず、若干の半田はじきが発生した。However, in Example 2, since the antioxidant coating was thick, it took more time to remove the antioxidant coating than in Example 1. Furthermore, when soldering was performed directly without organic cleaning or preheating, compared to Example 1, the solder was sometimes not completely removed and some solder repellency occurred.
（実施例３）
実施例３ては、酸化防止処理の液濃度を実施例１の場合
の１０分の１に薄くし、他の条件は実施例１と同様とし
た。(Example 3) In Example 3, the concentration of the solution for antioxidant treatment was reduced to one-tenth of that in Example 1, and the other conditions were the same as in Example 1.
本例も比較例に比べて良好なはんた付は性を示した。This example also showed better soldering properties than the comparative example.
ただ、実施例１と比へた場合には、（Ｏｌｓ）／（Ｎｉ
２ｐ）は、実施例Ｊの方が低く、また、はんた付は性も
実施例１の方か優れていた。However, when compared to Example 1, (Ols)/(Ni
2p) was lower in Example J, and the solderability was also better in Example 1.
表１
中はんた付は性：
○ はんだ付は性良好（はんだ濡れ面積９△ はんだハ
ジキ発生
× はんだ付は性不良（はんだ濡れ面積９＊＊Ｅ Ｓ
ＣＡ ： （Ｏｌｓ） ／ （Ｎ ｉ ２ｐ）＊＊＊（
初期） ：有機皮膜形成直後、（促進後）・促進試験
２時間経過後
５％以上）
０％以下）
［発明の効果コ
本発明のリードフレーム材料は、表面酸化か少なく、長
期保存後にも良好なはんだ付は性を示す特徴を持ってい
る。このため、ボンディング時にフラックスを使う必要
かなく製造工程を短くできるとともに、製品の品質・信
頼性を向上させることができる。Table 1 Quality of medium soldering: ○ Good soldering quality (solder wetting area 9△ Solder repelling occurred × Poor soldering quality (solder wetting area 9**E S
CA: (Ols) / (N i 2p) ***(
Initial stage): Immediately after organic film formation (after acceleration) / 5% or more after 2 hours of acceleration test) 0% or less) [Effects of the invention] The lead frame material of the present invention has little surface oxidation and remains good even after long-term storage. Soldering has characteristics that indicate gender. Therefore, there is no need to use flux during bonding, making it possible to shorten the manufacturing process and improve product quality and reliability.
第１図は本発明によるリードフレーム材料の一例の断面
図である。
１・・・銅または銅合金素材、２・・・ニッケルまたは
ニッケル合金めっき層、３・・・有機皮膜の酸化防止層
。FIG. 1 is a cross-sectional view of an example of a lead frame material according to the present invention. 1... Copper or copper alloy material, 2... Nickel or nickel alloy plating layer, 3... Antioxidation layer of organic film.
Claims (3)
合金めっきにおける該めっきの表面酸化状態が、Ｘ線光
電子分析値の酸素ピーク強度とニッケルピーク強度との
比（Ｏ１ｓ）／（Ｎｉ２ｐ）として１以下であり、前記
めっき表面に、有機溶剤洗浄によって除去できるか、ま
たは３００℃以下の温度で分解する性質を持つ有機皮膜
を有していることを特徴とするニッケル合金めっきリー
ドフレーム材料。(1) The surface oxidation state of nickel or nickel alloy plating applied to copper or copper alloy is 1 or less as the ratio of oxygen peak intensity to nickel peak intensity (O1s)/(Ni2p) in X-ray photoelectron analysis values. A nickel alloy plated lead frame material, characterized in that the plated surface has an organic film that can be removed by cleaning with an organic solvent or has a property of decomposing at a temperature of 300° C. or lower.
１μｍ以下であることを特徴とする請求項１記載のニッ
ケル合金めっきリードフレーム材料。(2) The thickness of the organic film is 0.01 μm or more, 0.01 μm or more;
The nickel alloy plated lead frame material according to claim 1, characterized in that the thickness is 1 μm or less.
で２０゜以下であることを特徴とする請求項１または２
に記載のニッケル合金めっきリードフレーム材料。(3) The organic film has a surface tension of 20° or less in contact angle with press oil.
Nickel alloy plated lead frame material as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2219388A JPH0770667B2 (en) | 1990-08-21 | 1990-08-21 | Leadframe material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2219388A JPH0770667B2 (en) | 1990-08-21 | 1990-08-21 | Leadframe material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04101451A true JPH04101451A (en) | 1992-04-02 |
| JPH0770667B2 JPH0770667B2 (en) | 1995-07-31 |
Family
ID=16734638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2219388A Expired - Lifetime JPH0770667B2 (en) | 1990-08-21 | 1990-08-21 | Leadframe material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0770667B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000064084A (en) * | 1998-08-20 | 2000-02-29 | Kobe Steel Ltd | Plating material for heat radiating board of electronic parts |
| US10177109B2 (en) | 2015-05-26 | 2019-01-08 | Mitsubishi Electric Corporation | Method of manufacturing semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63187656A (en) * | 1987-01-30 | 1988-08-03 | Furukawa Electric Co Ltd:The | Semiconductor device |
-
1990
- 1990-08-21 JP JP2219388A patent/JPH0770667B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63187656A (en) * | 1987-01-30 | 1988-08-03 | Furukawa Electric Co Ltd:The | Semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000064084A (en) * | 1998-08-20 | 2000-02-29 | Kobe Steel Ltd | Plating material for heat radiating board of electronic parts |
| US10177109B2 (en) | 2015-05-26 | 2019-01-08 | Mitsubishi Electric Corporation | Method of manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0770667B2 (en) | 1995-07-31 |
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