JPH0399451U - - Google Patents
Info
- Publication number
- JPH0399451U JPH0399451U JP884390U JP884390U JPH0399451U JP H0399451 U JPH0399451 U JP H0399451U JP 884390 U JP884390 U JP 884390U JP 884390 U JP884390 U JP 884390U JP H0399451 U JPH0399451 U JP H0399451U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- resin
- lead
- emitting diode
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は、本考案の一実施例の発光ダイオード
の断面図、第２図は従来の発光ダイオードの断面
図である。
１，１１……発光素子、２，１２……ボンデイ
ング線、３，１３……反射板付リード、４，１４
……外部リード、５，１５……樹脂、６，１６…
…レンズ部、７……凸形状部。
FIG. 1 is a sectional view of a light emitting diode according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional light emitting diode. 1, 11... Light emitting element, 2, 12... Bonding wire, 3, 13... Lead with reflector, 4, 14
...External lead, 5,15...Resin, 6,16...
...Lens portion, 7...Convex shaped portion.
Claims (1)
発光素子搭載の反射板付きリードとボンデイング
接続されるリードの封止樹脂内で最下位部に位置
する箇所に、封止樹脂の外壁に接する長さの凸形
状部を設けていることを特徴とする樹脂封止型発
光ダイオード。 In a resin-sealed light emitting diode,
A convex portion with a length that touches the outer wall of the sealing resin is provided at the lowest point within the sealing resin of the lead that is bonded to the lead with a reflector mounted with a light emitting element. A resin-sealed light emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP884390U JPH0399451U (en) | 1990-01-30 | 1990-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP884390U JPH0399451U (en) | 1990-01-30 | 1990-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0399451U true JPH0399451U (en) | 1991-10-17 |
Family
ID=31512459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP884390U Pending JPH0399451U (en) | 1990-01-30 | 1990-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0399451U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999060632A1 (en) * | 1998-05-20 | 1999-11-25 | Rohm Co., Ltd. | Reflective sensor |
-
1990
- 1990-01-30 JP JP884390U patent/JPH0399451U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999060632A1 (en) * | 1998-05-20 | 1999-11-25 | Rohm Co., Ltd. | Reflective sensor |