JPH0397835A - Heat treatment for ni-mo-p alloy film - Google Patents
Heat treatment for ni-mo-p alloy filmInfo
- Publication number
- JPH0397835A JPH0397835A JP1232588A JP23258889A JPH0397835A JP H0397835 A JPH0397835 A JP H0397835A JP 1232588 A JP1232588 A JP 1232588A JP 23258889 A JP23258889 A JP 23258889A JP H0397835 A JPH0397835 A JP H0397835A
- Authority
- JP
- Japan
- Prior art keywords
- heating
- film
- heat treatment
- alloy
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 143
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 13
- 239000000956 alloy Substances 0.000 title claims abstract description 13
- 229910001096 P alloy Inorganic materials 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000007772 electroless plating Methods 0.000 claims abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 6
- 238000010894 electron beam technology Methods 0.000 claims abstract description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 8
- 230000000704 physical effect Effects 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 71
- 230000008859 change Effects 0.000 description 15
- 238000012360 testing method Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 7
- 229910018104 Ni-P Inorganic materials 0.000 description 5
- 229910018536 Ni—P Inorganic materials 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 241000195493 Cryptophyta Species 0.000 description 1
- 229910018062 Ni-M Inorganic materials 0.000 description 1
- 229910003296 Ni-Mo Inorganic materials 0.000 description 1
- XOJVVFBFDXDTEG-UHFFFAOYSA-N Norphytane Natural products CC(C)CCCC(C)CCCC(C)CCCC(C)C XOJVVFBFDXDTEG-UHFFFAOYSA-N 0.000 description 1
- 229910021120 PdC12 Inorganic materials 0.000 description 1
- 229910008066 SnC12 Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
Ｌ１ユ』コリ４廷１
本発明は金属、セラミックス、合成樹脂等で形成された
基材表面を覆う無電解Ｎｉ−Ｍｏ−Ｐ合金皮膜の電気的
特性を高い８！度まで安定して雑持させるための熱処理
方法に関するものである。[Detailed Description of the Invention] The present invention improves the electrical properties of an electroless Ni-Mo-P alloy film covering the surface of a base material made of metal, ceramics, synthetic resin, etc. to a high level of 8! The present invention relates to a heat treatment method for stably retaining particles to a certain degree.
Ｌ見盈遣
無電解めっき法により形成された燐含有ＰＩｉ５〜１５
重偕％のＮｉ−Ｐ合金皮膜は、微結晶ないしアモルファ
ス相で形威されており、高い比抵抗と低い温度抵抗係数
（ＴＣＲ）を有することから、金ｊＩＷ／ＩＩＩ型の電
気抵抗材料としてディスクリート部品や、ハイブリッド
ＩＣなどに利用されている。Phosphorus-containing PIi5 to 15 formed by L Mieikari electroless plating method
Ni-P alloy film with 1% weight is formed in a microcrystalline or amorphous phase and has high resistivity and low temperature coefficient of resistance (TCR), so it is used as a discrete gold jIW/III type electrical resistance material. It is used in parts and hybrid ICs.
ただし、この良好な電気抵抗特性はＮｉ−Ｐ合金の微結
晶構造ないしはアモルファス構造により得られており、
これらの構造は熱ｈ学的に準安定状態なので耐熱性に劣
るという欠点を有する。これは、抵抗材料自体が通電に
よって発熱体（例、感熱記録の印字素子であるサーマル
ヘッド等で代表される発熱抵抗体）となること、および
その製造工程、組付け工程に必ずと言ってよいほど加熱
過程が存在することを考慮すると極めて重要な問題であ
る。However, this good electrical resistance property is obtained due to the microcrystalline structure or amorphous structure of the Ni-P alloy.
Since these structures are thermally metastable, they have the disadvantage of poor heat resistance. This is because the resistive material itself becomes a heating element when energized (e.g., a heating resistor typified by a thermal head, which is a printing element for heat-sensitive recording), and its manufacturing and assembly processes are essential. This is an extremely important issue considering that there is a heating process.
この問題に対処して、第三元素としてＷ，Ｍｏなどの高
融点金属をＮｉ−Ｐ合金に共析（共析出〉させることが
検討されている。特にＭｏの共析は極めて有効であり、
Ｎｉ−Ｐ合金では高々３００℃までの加熱で比抵抗が減
少し、ＴＣＰが上昇して抵抗特性が劣化してしまうのに
対し、Ｎｉ−Ｍｏ−Ｐ合金皮膜の場合は３００℃−７０
０℃の加熱により比抵抗が上昇し、ＴＣＰが減少するこ
とによりむしろ抵抗特性が向上するとともに、その加熱
温度までの抵抗特性の安定化がなされる。To deal with this problem, eutectoiding (eutectoid) high melting point metals such as W and Mo as third elements into Ni-P alloys is being considered. In particular, eutectoiding of Mo is extremely effective;
In the case of Ni-P alloy, heating up to 300°C reduces the specific resistance, increases TCP and deteriorates the resistance properties, whereas in the case of Ni-Mo-P alloy film, heating up to 300°C - 70°C
Heating at 0° C. increases the specific resistance, and by decreasing TCP, the resistance characteristics are rather improved, and the resistance characteristics are stabilized up to the heating temperature.
言い換えると、抵抗特性の向上およびその耐熱性の向上
が同時に達成される。第１１図は、これらの例としてＮ
ｉ−Ｐ合金皮膜およびＮｉ −Ｍｏ −Ｐ合金皮膜を真
空炉内にて各設定澹度で１時間加熱し、放冷後にｖ１抗
特性を測定した結果を示している。In other words, an improvement in resistance characteristics and an improvement in its heat resistance are achieved at the same time. Figure 11 shows N as an example of these.
The graph shows the results of heating the i-P alloy film and the Ni-Mo-P alloy film in a vacuum furnace at each temperature setting for 1 hour, and measuring the v1 resistance after cooling.
発明が解 しようとする課題
しかるに、Ｎｉ−Ｍｏ−Ｐ合金皮膜に高い熱的安定性を
付与するには極めて高い温度（３００℃−５００℃）で
の熱処理を必要とすることである。Problem to be Solved by the Invention However, in order to impart high thermal stability to the Ni-Mo-P alloy film, heat treatment at an extremely high temperature (300°C to 500°C) is required.
仮に熱処理を施さなければ、該皮膜使用時に温度上界が
あると、第１１図図示のごとく抵抗が変化してしまうこ
とに留意すべきである。そして、Ｎｉ−Ｍｏ−Ｐ合金皮
膜の熱処理を行うことにつき以下の問題を挙げることが
できる。It should be noted that if heat treatment is not performed, the resistance will change as shown in FIG. 11 if there is an upper temperature limit when the film is used. The following problems can be raised when heat treating a Ni-Mo-P alloy film.
■ 熱処理２１度が高く、しかも該熱凱理に長時問を必
要とするため、使用エネルギーＲ費が嵩むだけでなく、
生産性が阻害される。■ Since the heat treatment is 21 degrees high and requires a long time for the heat treatment, not only does the energy consumption R cost increase;
Productivity is hindered.
■ 皮躾の局所のみを熱処理することができない。■ It is not possible to heat treat only the local area of skin care.
■ Ｎｉ−Ｍｏ−Ｐ合金皮膜が施される基祠は上記熱処
理温度および処理時間に耐えなければならず、Ｍ羽の材
質が制限される。(2) The base shrine to which the Ni-Mo-P alloy film is applied must withstand the above heat treatment temperature and treatment time, and the material of the M wing is limited.
■ 上記熱処理温度、時間ではＮｉ−Ｍｏ−Ｐ合金皮膜
の表面が酸化してしまう可能性があるため、皮膜の使用
目的によっては熱処理雰囲気を選択しなければならない
〈例：真空中、不活性ガス中など〉。■ The surface of the Ni-Mo-P alloy film may be oxidized at the above heat treatment temperature and time, so the heat treatment atmosphere must be selected depending on the intended use of the film (e.g. in vacuum, inert gas). Inside, etc.
課題を するための
本発明はかかる技術的背蒙の下に創案されたものであり
、無電解めっき法により基材上に形成されたモリブデン
含有量１０〜２５重量％、燐含有量０．５〜２．０重闇
％のＮｉ−Ｍｏ−Ｐ合金皮膜に熱処理を施す方法におい
て熱処理時間を短縮し、皮膜の局所の熱処理を可能にし
、皮膜に封ずる熱処理の影響を無くし、熱処理に伴う基
材の劣化を防ぎつつ、その抵抗特性を高い温度まで安定
に維持させることを目的としている。The present invention for solving the problems was created based on such technical knowledge, and is formed on a base material by electroless plating with a molybdenum content of 10 to 25% by weight and a phosphorus content of 0.5%. In the method of heat-treating a Ni-Mo-P alloy film with a concentration of ~2.0%, it shortens the heat treatment time, enables local heat treatment of the film, eliminates the effect of heat treatment sealing on the film, and reduces the base density caused by heat treatment. The purpose is to maintain the resistance characteristics of the material stably up to high temperatures while preventing deterioration of the material.
この目的は、Ｎｉ−Ｍｏ−Ｐ合金皮膜に対して通電によ
るジュール加熱、レーザー照射または電子ビーム照射に
よる極短時間のパルス加熱を施すことによって達成され
る。This objective is achieved by subjecting the Ni-Mo-P alloy film to Joule heating by energization, extremely short pulse heating by laser irradiation or electron beam irradiation.
本発明者等はＮ ｉ −Ｍｏ−Ｐ合金皮膜の熱変化ｊ＄
勤に閏する研究を行なった。一般に、無電解めっき法に
より作製されためつきしたままのＮｉ−Ｍｏ−Ｐ合金皮
膜は、Ｘ線回折的には結晶構造を示すが、実際には結晶
質のＮｉ −Ｍｏ固溶体相（［）と非品質Ｎｉ−Ｍｏ−
Ｐ相（■相｝との２相により構成されている。しかるに
、通常の電気炉などを用いた長時間加熱をＮ ｒ −Ｍ
ｏ−Ｐ合金皮膜に施した場合（以下、定常加熱と称する
）の抵抗特性の変化が第１１図に示されているところ、
その場合、５００℃までの熱処理において比抵抗が増加
するのは、■相から■相へＮ１の拡散が起って両相の境
界近傍にＭｏの局所濃縮部が生じることによる。その詳
細については、■Ｊ．Ｅｌｅｃｔｒｏｃｈｅｍ．Ｓｏｃ
．， １ ３ ５， ７ １ ８ （ １ ９
８Ｂ’）（Ｉ．コイワ、Ｍ，ウスダ、Ｋ．ヤマダ、Ｔ．
オウサカ発表）、■．Ｌｐｎ．Ｊ．Ａｐｐｌ．Ｐｈｙｓ
．， ２ ８ ． ２９９ （１９８９）（Ｔ．オウ
サカ、Ｋ．アライ、Ｙ．ヤマダ、Ｔ，ナミカワ発表）等
を参照されたい。本発明者等は既に、Ｎｉ−Ｐ合金皮膜
につき、以上述べたような定常加熱およびパルス加熱に
より全く同等の結果が得られることを見い出しており（
特願昭６３−２５６４７４号参照）、そのためＮｉ−Ｍ
ｏ−Ｐ合金皮膜においても同様な効果が期持されるとい
う観点の下で本発明の開発が進められ、以下の結果が得
られた。The present inventors have investigated the thermal change of Ni-Mo-P alloy film.
I conducted research related to my work. In general, a pristine Ni-Mo-P alloy film produced by electroless plating shows a crystalline structure in X-ray diffraction, but it actually consists of a crystalline Ni-Mo solid solution phase ([). Non-quality Ni-Mo-
It is composed of two phases: P phase (■ phase}. However, long-term heating using a normal electric furnace etc.
Figure 11 shows the change in resistance characteristics when applied to the o-P alloy film (hereinafter referred to as steady heating).
In this case, the reason why the resistivity increases in heat treatment up to 500° C. is that N1 diffuses from phase 2 to phase 2 and a locally concentrated portion of Mo is generated near the boundary between the two phases. For details, see ■J. Electrochem. Soc.
．． , 1 3 5, 7 1 8 ( 1 9
8B') (I. Koiwa, M. Usuda, K. Yamada, T.
Osaka announcement), ■. Lpn. J. Appl. Phys.
．． , 2 8. 299 (1989) (presented by T. Osaka, K. Arai, Y. Yamada, T. Namikawa), etc. The present inventors have already discovered that completely equivalent results can be obtained for Ni-P alloy films by steady heating and pulse heating as described above (
(See Japanese Patent Application No. 63-256474), therefore Ni-M
The development of the present invention was carried out with the view that similar effects could be expected in o-P alloy films, and the following results were obtained.
本発明者等が、Ｎｉ−Ｍｏ−Ｐ合金皮膜に対してジュー
ル加熱による極短時問のパルス加熱を施した試料の抵抗
特性、ならびにｘＩ！回折による工相の組成変化を調べ
たところ、葡述の定常加熱とほぼ同様な抵抗特性の挙動
が観察された。ただし、パルス加熱による■相の組成変
化は定常加熱に比べより顕著に起り、しかも比抵抗が極
大に達した後の更に高い温度での加熱による比抵抗減少
Ｇま定常加熱よりも大きい。もつとも、抵抗材料として
比抵抗はできるだけ高い方がよいから、熱処理はこの極
大蛤より小さな比抵抗が得られるような温度領域で行わ
れるため、このことは実際には問題とはならない。した
がって、パルス加熱により得られる効果のメカニズムは
定常加熱の場合と若干異なることが想定されるものの、
実用範囲内においては全く同様な効果が得られると言え
る。The present inventors investigated the resistance characteristics and xI! of a sample in which the Ni-Mo-P alloy film was subjected to extremely short pulse heating using Joule heating. When we investigated the compositional change of the phase due to diffraction, we observed a behavior of the resistance characteristics that was almost the same as that of the steady heating method described by Tosho. However, the change in the composition of the phase II due to pulse heating occurs more markedly than during steady heating, and furthermore, the decrease in resistivity G due to heating at a higher temperature after the resistivity reaches its maximum is greater than that during steady heating. However, since it is better for a resistive material to have as high a resistivity as possible, this is not actually a problem because the heat treatment is carried out in a temperature range where a resistivity smaller than this maximum value can be obtained. Therefore, although it is assumed that the mechanism of the effect obtained by pulse heating is slightly different from that of steady heating,
It can be said that exactly the same effect can be obtained within a practical range.
また、詳細は後述されるが、定常加熱で得られた最も高
い比抵抗（ｗＪ述の極大値）は、その後の加熱に対し５
００℃まで安定であったが、パルス加熱で得られた該極
大値は、その後の加熱に対し７００℃までの安定性が得
られた。これは、定常加熱およびパルス加熱で得られた
Ｎｉ−Ｍｏ−Ｐ合金組織の僅かな違いが良い方向に作用
した結果であるものと思われる。さらに、パルス加熱で
は処理時間が極めて短いために、加熱後の抵抗特性を即
座に測定することができ、定常加熱に比して細かな物性
ＩＩ ＩＩＩが可能であることが明らかとなった。また
、定常加熱による物性ｖ４ｍは部品組み付け前に行われ
な１ｊればならないのに対し、パルス加熱では局所的な
加熱が可能であるために部品組み付け後に適用可能であ
る。Also, although the details will be described later, the highest specific resistance (maximum value described in wJ) obtained by steady heating is 5% with respect to subsequent heating.
The maximum value obtained by pulse heating was stable up to 700°C with respect to subsequent heating. This seems to be the result of a slight difference in the Ni-Mo-P alloy structure obtained by steady heating and pulse heating working in a positive direction. Furthermore, since the processing time is extremely short in pulse heating, the resistance characteristics after heating can be measured immediately, and it has become clear that finer physical properties II and III can be obtained compared to steady heating. Further, physical property v4m by steady heating must be performed before assembling parts, whereas pulse heating allows local heating and can therefore be applied after assembling parts.
本発明で対象とするＮｉ−Ｍｏ−Ｐ合金皮股の好適なる
モリブデン含有渋は１０〜２５重量％、燐含有量は０．
５〜２．０重缶％であり、皮膜の厚さ、形状（而積〉、
および基材の熱物性（比熱、熱伝導度）に応じた所定の
熱量を、ジュール加熱（通電加熱）、レーザー照射また
は電子ビーム照射によってパルス幅１〜１０００ｍｓｅ
ｃ （ミリ秒冫程度の極短ＦＲ周内に投入することが推
奨される。The preferred molybdenum content of the Ni-Mo-P alloy crotch targeted by the present invention is 10 to 25% by weight, and the phosphorus content is 0.
5 to 2.0% of heavy cans, and the thickness, shape (and volume) of the film,
A predetermined amount of heat according to the thermophysical properties (specific heat, thermal conductivity) of the base material is applied with a pulse width of 1 to 1000 msec by Joule heating (current heating), laser irradiation, or electron beam irradiation.
c (It is recommended to insert it within an extremely short FR cycle of about milliseconds.
友置亘ユ
＜Ｎｉ−Ｍｏ−Ｐ合金皮膜形成〉
９６％アルファ・アルミナ・セラミックスを基板として
用い、無電解Ｎｉ−Ｍｏ−Ｐ合金薄膜抵抗体製造工程に
より第１図、第２図に示すようなパターンの抵抗体を作
製した。図中．．１はＮｉ−Ｍｏ−Ｐ合金皮膜抵抗体を
示し、該抵抗休１の両端部にパルス加熱（ジュール加熱
）のための通電電極用電気銅めっき部を設けてある。抵
抗休１の幅（Ｗ）は５ ０ μｍ，膜厚（１）は０．５
μｍとした。試験片の他の寸法は図中に示すとおりであ
る。Wataru Tomooki <Formation of Ni-Mo-P alloy film> Using 96% alpha alumina ceramics as a substrate, the electroless Ni-Mo-P alloy thin film resistor manufacturing process was used to form a film as shown in Figures 1 and 2. A resistor with a pattern was fabricated. In the figure. ．． Reference numeral 1 indicates a Ni-Mo-P alloy film resistor, and electrolytic copper plating portions for current-carrying electrodes for pulse heating (Joule heating) are provided at both ends of the resistor 1. The width (W) of resistance layer 1 is 50 μm, and the film thickness (1) is 0.5
It was set as μm. Other dimensions of the test piece are as shown in the figure.
無電解Ｎｉ−Ｍｏ−Ｐ合金皮膜抵抗体製造工程は以下の
とおりである。The manufacturing process of the electroless Ni-Mo-P alloy film resistor is as follows.
■ 脱脂・・・セラミック基板３を常温でエタノール中
に浸漬し、１０分間の超音波洗浄を施した。■ Degreasing: The ceramic substrate 3 was immersed in ethanol at room temperature and subjected to ultrasonic cleaning for 10 minutes.
■ 活性化及び水洗・・・ＳｎＣ１２ （１！ｉＦ／Ｉ
），３６％Ｉ１ｃＪ（ｌｉｄ／ｊ！）水溶液に１分間没
漬（常温〉シた後、脱イオン水洗を行なった。■ Activation and washing...SnC12 (1!iF/I
), 36% I1cJ (lid/j!) aqueous solution for 1 minute (at room temperature), and then washed with deionized water.
■ 触媒化・・・ＰｄＣ１２ （０． １ｇ／！）、３
６％ｌ−１ｃ，！ （０． １ｍ／Ｊ）水溶液中に１分
間浸漬（常編）した後、脱イオン水洗を行なった。■ Catalyticization...PdC12 (0.1g/!), 3
6%l-1c,! (0.1 m/J) After being immersed in an aqueous solution for 1 minute (regular), it was washed with deionized water.
■ 反復処理・・・前記■、■項の処理を再度行なった
。■ Repetitive processing: The processes in sections (1) and (2) above were performed again.
■ 無電解めっき及び水洗・・・前記凱理後のセラミッ
ク基板３を無電解Ｎｉ−Ｍｏ−Ｐ合金めつき浴〈温度９
０℃）中に浸漬し、Ｍｏ含有爵２２．３重層％、Ｐ含有
最０．７垂潰％、ｌ＆！厚０．５μｍのＮｉ−Ｍｏ−Ｐ
合金皮膜ｅｉたｍ、脱イオン水洗を行なった。めっき浴
組成は以下に示すとおりである。なお、膜厚の調整は処
理時間の選択によって行われる。■ Electroless plating and water washing: The ceramic substrate 3 after the above-described process is placed in an electroless Ni-Mo-P alloy plating bath (temperature 9).
0°C), Mo content: 22.3%, P content: 0.7%, l&! Ni-Mo-P with a thickness of 0.5 μm
The alloy film was removed and washed with deionized water. The plating bath composition is as shown below. Note that the film thickness is adjusted by selecting the processing time.
ＮａＨ２ＰＯ２−Ｈ２０ −−−０．２０ｍｏｌｔ
／ＩＮａ３Ｃ６Ｈ５ ０７ − ２口２０−−−０．
１０ｍＯ１／ＩＣ２Ｈ４０３ − ”
０． ２０ｍｏｊ！／ＩＮｉＳＯ４’６Ｈ２０
−−−０． １０ｍｏＪ／ｆＮａ２ＭｏＯ４−２Ｈ，，
Ｏ −−−０．０２ｍｏｌ／１＊注：ＮａＯＨにより
ｐＨを９．０に調整した。NaH2PO2-H20---0.20molt
/INa3C6H5 07 - 2 mouths 20---0.
10mO1/IC2H403-”
0. 20moj! /INiSO4'6H20
---0. 10moJ/fNa2MoO4-2H,,
O---0.02 mol/1*Note: pH was adjusted to 9.0 with NaOH.
■ 乾燥・・・水洗後の試料を熱風で乾燥させた（ｍ度
１００℃、約３分間｝。■ Drying: The sample after washing with water was dried with hot air (100°C, approximately 3 minutes).
■ パターニング・・−フオトリソグラフィー法により
第１図、第２図に示すようなパターンの抵抗体１を形成
した。(2) Patterning: A resistor 1 having a pattern as shown in FIGS. 1 and 2 was formed by photolithography.
■ 電極付け・・・フォトリソグラフィー法と電気銅め
っきによりパルス加熱のための電気銅めっき部２を形成
した。■ Electrode attachment: Electrolytic copper plated portion 2 for pulse heating was formed by photolithography and electrolytic copper plating.
〈パルス加熱〉 ■ 前記工程で得た抵抗休１の電気抵抗婉を測定する。<Pulse heating> (2) Measure the electrical resistance of the resistance layer 1 obtained in the above step.
■ 得られた電気抵抗鉤から所定の電力（０． １Ｗ＞
を与え得る電圧を計算し、抵抗体１に２００ｍｓｅｃ
（ミリ秒）の定電圧パルスを印加してジュール熱による
パルス加熱処理を施す（窒素ガス中）。■ A specified electric power (0.1W>
Calculate the voltage that can be applied to resistor 1 for 200 msec.
A constant voltage pulse of (milliseconds) is applied to perform pulse heating treatment using Joule heat (in nitrogen gas).
■ パルス加熱処理後の抵抗休１の電気抵抗鉋を測定す
る。■ Measure the electrical resistance planer after resistance rest 1 after pulse heat treatment.
■ 該電気抵抗釦に基づいて、先の投入電力鉛よりも所
定ｆｆｉ（０．１Ｗ＞だけ大きな電力を計算し、抵抗体
１に２００ｍＳｅＣ間の定電圧パルスを印加してジュー
ル熱によるパルス加熱処理を施す（窒素ガス中）。■ Based on the electric resistance button, calculate a power larger than the previously input power lead by a predetermined amount ffi (0.1 W), apply a constant voltage pulse of 200 mSeC to the resistor 1, and perform pulse heating treatment using Joule heat. (in nitrogen gas).
■ 前記■〜■項の処理を繰り返し、抵抗休１が溶解破
断するまでパルス加熱処理を施す。(2) Repeat the processes in sections (1) to (2) above, and perform pulse heat treatment until the resistor 1 melts and breaks.
〈比較例１〉
実施例１に対応して該実施例１と同様な方法で作製した
皮膜に対し、定常加熱（真空中にて各設定温度で１時間
加熱後、自然冷却）を行なった。Comparative Example 1 A film prepared in the same manner as in Example 1 was subjected to constant heating (heating in vacuum at each set temperature for 1 hour, then natural cooling).
〈試験結果〉
実施例１、比較例１で得られた皮膜の特性試験結果をそ
れぞれ第３図、第４図に示す。前述のように或る加熱Ｉ
ｌ（定常加熱では５００℃〜７００℃、パルス加熱では
１０Ｗ〉で比抵抗は極大値を示し、更に加熱すると減少
することが判る。また、この極大値は定常加熱に比して
パルス加熱では全電力域に５って滑らかな曲線を描いて
おり、加熱処理後の抵抗特性のυＩｌｌ！をより精密に
行い得ることが判る。これは、定常加熱がバッチ処理で
あるため熱飢理温度毎の条件設定に誤差が伴い易いのに
対し、パルス加熱では熱処理を連続的に行うことができ
るためである。<Test Results> The characteristics test results of the films obtained in Example 1 and Comparative Example 1 are shown in FIG. 3 and FIG. 4, respectively. As mentioned above, some heating I
It can be seen that the specific resistance shows a maximum value at 500°C to 700°C in steady heating and 10 W in pulse heating, and decreases with further heating.In addition, this maximum value is less than 100°C in pulse heating compared to steady heating. 5 draws a smooth curve in the power range, and it can be seen that υIll! of the resistance characteristics after heat treatment can be determined more precisely.This is because steady heating is a batch process, so This is because pulse heating allows heat treatment to be performed continuously, whereas the setting of conditions is likely to involve errors.
塞塾出４ｌ
基本的に実施例１と同様の方法で試料を作製した。ただ
し、無電解めっき浴のＮａ２Ｍ００４を０．０１ｍＯＩ
／１とすることによりＭｏ含有６１１９．５重量％、Ｐ
含有量０．６重徂％なる組成のＮｉ−Ｍｏ−Ｐ合金皮膜
を得た。以後のパルス加熱は同様にこれを行なった。さ
らに、本実施例では皮膜の比抵抗のみならず温度抵抗係
数の測定をも行なった。温度抵抗係数は、冷凍機付きオ
ーブンの中で（−＞６０℃〜（＋）７０℃の温Ｗ１範囲
で抵抗を測定し、そのときの温度一抵杭直線の勾配から
これを求めた。4l Samples were prepared basically in the same manner as in Example 1. However, 0.01 mOI of Na2M004 in the electroless plating bath
/1, Mo content 6119.5% by weight, P
A Ni-Mo-P alloy film having a composition of 0.6% by weight was obtained. Subsequent pulse heating was performed in the same manner. Furthermore, in this example, not only the specific resistance of the film but also the temperature resistance coefficient was measured. The temperature resistance coefficient was determined by measuring the resistance in a temperature W1 range of (->60°C to (+)70°C) in an oven equipped with a refrigerator, and from the slope of the straight line between the temperature and the temperature at that time.
〈比較例２〉
実施例２に対応して該実施例２と同様な方法で作製した
皮膜に対し、定常加熱（真空中にて各設定温度で１時間
加熱後、自然冷却）を行なった。<Comparative Example 2> Corresponding to Example 2, a film prepared in the same manner as in Example 2 was subjected to constant heating (heating in vacuum at each set temperature for 1 hour, and then natural cooling).
また、皮膜の比抵抗のみならず潟度ｖ１抗係数の測定を
も行なった。In addition, not only the specific resistance of the film but also the lagoonal v1 resistance coefficient was measured.
く試験結果〉
実施例２、比較例２で得られた皮膜の特性試験結果をそ
れぞれ第５図、第６図に示す。異なる化学組成のＮｉ−
Ｍｏ−ｐ合金皮膜においても、実施例１、比較例１にお
ける場合と同様な比抵抗変化が認められた。温度抵抗係
数は、定常加熱、パルス加熱いずれの場合においても比
抵抗が極大碩を示す加熱量で極小値を示した。無電解Ｎ
ｉ−Ｍｏ−Ｐ合金皮膜は、定常加熱においては５００℃
、パルス加熱においては１０Ｗでの加熱で最も良好な抵
抗特性を示す。このことからも定常加熱とパルス加熱で
は実用上において同様の挙動を示すことが判る。Test Results> The characteristics test results of the films obtained in Example 2 and Comparative Example 2 are shown in FIG. 5 and FIG. 6, respectively. Ni- with different chemical compositions
Also in the Mo-P alloy film, the same specific resistance change as in Example 1 and Comparative Example 1 was observed. The temperature resistance coefficient showed a minimum value at the heating amount at which the specific resistance reached its maximum in both steady heating and pulse heating. Electroless N
The i-Mo-P alloy film is heated to 500°C during steady heating.
In pulse heating, heating at 10 W shows the best resistance characteristics. This also shows that steady heating and pulse heating exhibit similar behavior in practice.
実滴例３
基本的に実施例１と同様の方法で試料を作製した。ただ
し、無電解めっき浴のＮ ａ ２ Ｍ Ｏ Ｏ ４を０
．００３ｍｏｌ／ＩとすることによりＭｏ含有ｆｉ１１
２．５重層％、Ｐ含有屋１．２重量％なる相成のＮ ｒ
−Ｍｏ−Ｐ合金皮膜を得た。以後のパルス加熱は同様に
これを行なった。Actual Droplet Example 3 A sample was prepared basically in the same manner as in Example 1. However, if the N a 2 M O O 4 of the electroless plating bath is 0
．． Mo-containing fi11 by setting it as 003 mol/I
2.5% multilayer, P content 1.2% by weight N r
-Mo-P alloy film was obtained. Subsequent pulse heating was performed in the same manner.
〈比較例３〉
実施例３に対応して該実施例３と同様な方法で作製した
皮膜に対し、定常加熱（真空中にて各設定温度で１時間
加熱後、自然冷却）を行なった。<Comparative Example 3> A film prepared in the same manner as in Example 3 was subjected to constant heating (heating in vacuum at each set temperature for 1 hour, and then natural cooling).
〈試験結果〉
実施例３、比較例３で得られた皮膜の特性試験結果をそ
れぞれ第７図、第８図に示す。前記各例におけるものと
は異なる化学組成のＮｉ−ＭｏＰ合金皮膜においても、
同様な結果が得られることが判る。<Test Results> The characteristics test results of the films obtained in Example 3 and Comparative Example 3 are shown in FIG. 7 and FIG. 8, respectively. Even in the Ni-MoP alloy film having a chemical composition different from that in each of the above examples,
It can be seen that similar results can be obtained.
【災旦Ａ
パルス加熱された試料の抵抗特性の熱的安定性を調べる
ために、実施例１、２、３の各操作で得られた各皮Ｉ！
ＩＡ，Ｂ，Ｃに１０Ｗ（各々の皮膜で比抵抗が極大値を
示す加熱量）までのパルス加熱を行い、その後種々の温
度で定常加熱（真空中にて各設定温度で１ｒｆ間加熱後
、自然冷却）を行なった。[Disaster A] In order to investigate the thermal stability of the resistance properties of pulse-heated samples, each skin I!
Pulse heating was performed on IA, B, and C up to 10 W (the amount of heating at which the specific resistance of each film showed the maximum value), and then steady heating was performed at various temperatures (after heating for 1 rf at each set temperature in vacuum, natural cooling).
〈試験結果〉
実施例４で得られた各皮膜の特性試験結果をそれぞれ第
９図に示す。該第９図によれば、どの皮膜も７００℃ま
での加熱に対し比抵抗が一定であり、熱的安定性に優れ
ていることが判る。<Test Results> The characteristics test results of each film obtained in Example 4 are shown in FIG. 9. According to FIG. 9, it can be seen that all the films have a constant resistivity when heated up to 700° C., indicating that they have excellent thermal stability.
実施例５
パルス加熱された試料の抵抗特性の熱的安定性を調べる
ために、実ｆｆＰＡ１、２、３の各操作で得られた各皮
！ｉＤ，Ｅ，Ｆに１０Ｗ（各々の皮膜で比抵抗が極大値
を示す加熱１ｆｉ）までのパルス加熱を行い、それらの
試料を真空炉中で昇温速度１０℃／分で昇渇した場合に
おける連続的な抵抗変化を測定した。Example 5 In order to investigate the thermal stability of the resistance properties of pulse-heated samples, each skin obtained in each operation of actual ffPA1, 2, and 3! iD, E, and F were subjected to pulse heating up to 10 W (heating 1fi at which the resistivity reached the maximum value for each film), and the samples were heated at a heating rate of 10°C/min in a vacuum furnace. Continuous resistance changes were measured.
〈試験結果〉
実施例５で得られた各皮膜の特性試験結果をそれぞれ第
１０図に示す。いずれの皮膜においても、緩やかな直線
的抵抗変化が見られる。実藻例４における場合と比して
、温度上昇に伴なって比抵抗埴が僅かに上昇するのは、
この皮膜が正の温度抵抗係数を有することによる。この
変化は可逆的であって、温度を常温に戻すと比抵抗も元
に戻る。<Test Results> The characteristics test results of each film obtained in Example 5 are shown in FIG. 10. A gentle linear resistance change is observed in both films. Compared to the case in Actual Algae Example 4, the slight increase in resistivity with increasing temperature is due to
This is because this film has a positive temperature resistance coefficient. This change is reversible, and when the temperature is returned to room temperature, the specific resistance also returns to its original value.
実施例６
パルス加熱時における加熱雰囲気の彰費を見るために、
実施例２の操作で皮膜を作製し、さらにパルス加熱を空
気中で行なった。Example 6 To see the cost of the heating atmosphere during pulse heating,
A film was prepared according to the procedure of Example 2, and further pulse heating was performed in air.
〈試験結果〉
実施例６で得られた皮膜の特性試験結果を行なった結果
、第５図のグラフと全く同様な比低抗変化が得られた。<Test Results> As a result of conducting a characteristic test of the film obtained in Example 6, a change in specific resistance was obtained that was exactly the same as the graph shown in FIG.
［試験結果の評価］
■ ３種類の化学組成のＮｔ−Ｍｏ−ｐ合金皮膜の加熱
に対する抵抗特性の変化（第３図ないし第８図）から、
パルス加熱により定常加熱と同様なｇ／Ｊ果が祈られる
ことが理解される。しかも、パルス加熱に要する時間は
極短時間であって、約１時間の熱処理を必要とづる定常
加熱法に比して該時間はゼロに近く、生産性の向上に大
きく貢献できることが明らかである。[Evaluation of test results] ■ From the changes in resistance characteristics against heating of Nt-Mo-p alloy films with three types of chemical compositions (Figures 3 to 8),
It is understood that pulse heating is expected to produce the same g/J results as steady heating. Moreover, the time required for pulse heating is extremely short, and compared to the steady heating method which requires about 1 hour of heat treatment, the time required is close to zero, and it is clear that it can greatly contribute to improving productivity. .
■ 第３図ないし第８図における定常加熱とパルス加熱
の抵抗特性の変化を比較すると、パルス加熱を行なった
場合の比抵抗の変化は極めて円滑であり、パルス加熱で
は定常加熱に比べより精密な抵抗特性！＋１１御が可能
であることが理解される。■ Comparing the changes in resistance characteristics between steady heating and pulse heating in Figures 3 to 8, it is found that the change in resistivity when pulse heating is performed is extremely smooth, and pulse heating is more precise than steady heating. Resistance characteristics! It is understood that +11 control is possible.
■ 第９図、第１０図から、適切な電力でのパルス加熱
を行うと（本例では１０Ｗであった）、温度７００℃に
到るまで抵抗特性の安定なＮ ｉ −Ｍｏ−Ｐ合金皮膜
を得ることができる。定常加熱でこれと同様な安定性を
有する皮膜を得るためには、極めて高い！ｆＡ度（７０
０℃〉での長時間の熱処理を必要とし、この点において
もパルス加熱の優位性が立証される。■ From Figures 9 and 10, when pulse heating is performed with an appropriate power (10 W in this example), the Ni-Mo-P alloy film has stable resistance characteristics up to a temperature of 700°C. can be obtained. In order to obtain a film with the same stability under constant heating, the cost is extremely high! fA degree (70
0° C.> is required, and the superiority of pulse heating is proven in this respect as well.
■ 実施例６から、空気または窒素ガスのいずれの雰囲
気中でパルス加熱を施した皮膜も同様な抵抗特性を示し
、極短時間内に熱処理の可能なパルス加熱では加熱によ
る試料酸化の彰胃がほとんどないことが理解される。■ From Example 6, films subjected to pulse heating in either air or nitrogen gas atmospheres showed similar resistance characteristics, and pulse heating, which allows heat treatment in an extremely short period of time, did not cause oxidation of the sample due to heating. It is understood that there are very few.
発明の効果
以上の説明から明らかなように、Ｎｉ−ＭｏＰ合金皮膜
にパルス加熱を施す本発明方法によれば、■通常の熱処
理方法と比較して処理時間がほぼゼロになる、■ｗＡＷ
１時間の加熱であるから、処理雰囲気の影響を概略無視
することができ、また使用基材の材質選択の自由度がノ
け太し、例えば合成樹Ｗｉ基材の使用も許容される、■
特にレーザー照躬法あるいは電子ビーム照射法を利用す
れば、皮膜の局所のみの熱処理も容易にこれを行うこと
ができる。■従来の長時間の熱処理法に比して熱処理に
よる皮膜の物性！ｌＩ御をより精密に行い得る、■従来
の熱処理法においては、熱処理炉を用い、処理７ｊ曲気
を調整する必要があり、消費熱エネルギー・コスト、設
備コストが嵩む欠点があるところ、本発明法では、熱処
理工程が簡略化され、加えて実装後（組立て後〉の熱処
理も可能となり、滌費熱エネルギー・コスト、設備コス
トの低減化を図り得るとともに、生産性の向上を図るこ
とができるという利点を有するのみならず、Ｎ１−Ｍｏ
−Ｐ合金の抵抗特性の高い熱的安定性を得ることができ
る。Effects of the Invention As is clear from the above explanation, according to the method of the present invention in which a Ni-MoP alloy film is subjected to pulse heating, the processing time becomes almost zero compared to the normal heat treatment method.
Since the heating time is 1 hour, the influence of the processing atmosphere can be largely ignored, and there is a great deal of freedom in selecting the material of the base material to be used, for example, the use of synthetic wood Wi base material is also allowed.
In particular, if a laser beam irradiation method or an electron beam irradiation method is used, it is possible to easily heat treat only a local area of the film. ■The physical properties of the film obtained by heat treatment are better than that of conventional long-term heat treatment methods! ■Conventional heat treatment methods require the use of a heat treatment furnace and the need to adjust the heat treatment temperature, resulting in increased heat energy consumption, equipment costs, and other disadvantages; however, the present invention This method simplifies the heat treatment process and also enables post-mounting (post-assembly) heat treatment, which can reduce heat energy costs and equipment costs, as well as improve productivity. Not only does it have the advantage of
-High thermal stability of the resistance properties of the P alloy can be obtained.
第１図はアルミナセラミックス基板上に形成した本発明
の一実施例による無電解Ｎｉ−Ｍｏ−Ｐ合金皮膜抵抗体
の形状、寸法を示す図、第２図はそのｎ−ｉｔａＩｌＦ
ｉ面図、第３図はＮ ｉ−２２．３ｗｔ％Ｍｏ−０．７
ｗｔ％Ｐ合金皮膜にパルス加熱を施した場合の比抵抗の
変化を示すグラフ、第４図は前記皮膜と同等の皮膜に定
常加熱を施した場合の第３図と同様なグラフ、第５図は
Ｎｉ−１９．５ｗｔ％Ｍｏ−０．６ｗｔ％Ｐ合金皮膜に
パルス加熱を施した場合の比ｉ抗およびａ！度抵抗係数
の変化を示すグラフ、第６図は該皮膜と同等の皮膜に定
常加熱を施した場合の第５図と同様なグラフ、第７図は
Ｎｉ−１２．５ｗｔ％Ｍｏ−１． ２ｗｔ％Ｐ合金皮膜
にパルス加熱を蒲した場合の比抵抗の変化を示すグラフ
、第８図は該皮膜と同等の皮膜に定常加熱を施した場合
の第７図と同様なグラフ、第９図はパルス加熱後の試料
の熱的安定性を調べるために３種類の組成のＮ＋−Ｍｏ
−Ｐ合金皮膜に１０Ｗまでのパルス加熱を施した後、各
種温度で定常加熱を行なった場合の比抵抗の変化を示す
グラフ、第１０図は同様に３種類の組成のＮｉ−Ｍｏ−
Ｐ合金皮膜に１０Ｗまでのパルス加熱を施した後、真空
炉中で昇編速度１０℃／分で昇湿した場合の連続的な比
抵抗変化を測定したグラフ、第１１図はＮｉ−Ｍｏ−Ｐ
合金皮膜に定常加熱を施した場合の抵抗特性の変化をＮ
ｉ−Ｐ合金の場合と比較した図である。
１・・・抵抗体，２・・・電気銅めっき部，３・・・セ
ラミック基板。FIG. 1 is a diagram showing the shape and dimensions of an electroless Ni-Mo-P alloy film resistor according to an embodiment of the present invention formed on an alumina ceramic substrate, and FIG. 2 is a diagram showing the n-itaIIF
i-plane view, Figure 3 is Ni-22.3wt%Mo-0.7
A graph showing the change in specific resistance when a wt%P alloy film is subjected to pulse heating, Fig. 4 is a graph similar to Fig. 3 when steady heating is applied to a film equivalent to the above-mentioned film, and Fig. 5 are the specific i resistance and a! when pulse heating is applied to the Ni-19.5wt%Mo-0.6wt%P alloy film. FIG. 6 is a graph similar to FIG. 5 when a film equivalent to the above film is subjected to constant heating, and FIG. 7 is a graph showing changes in the resistance coefficient of Ni-12.5wt% Mo-1. A graph showing the change in resistivity when pulse heating is applied to a 2wt%P alloy film, Fig. 8 is a graph similar to Fig. 7 when steady heating is applied to a film equivalent to the above film, and Fig. 9. In order to investigate the thermal stability of the sample after pulse heating, three types of N+-Mo compositions were prepared.
Figure 10 is a graph showing the change in resistivity when the -P alloy film is subjected to pulse heating up to 10 W and then subjected to steady heating at various temperatures.
Figure 11 is a graph showing the continuous change in specific resistance when the P alloy film was subjected to pulse heating up to 10 W and then raised in a vacuum furnace at a knitting rate of 10°C/min. P
The change in resistance characteristics when constant heating is applied to the alloy film is
It is a figure compared with the case of i-P alloy. DESCRIPTION OF SYMBOLS 1...Resistor, 2...Electrolytic copper plating part, 3...Ceramic board.
Claims (1)
ブデン含有１０〜２５重量％、燐含有量 ０．５〜２．０重量％のＮｉ−Ｍｏ−Ｐ合金皮膜に、通
電によるジュール加熱、レーザー照射、もしくは電子ビ
ーム照射により極短時間のパルス加熱を施し、熱的に安
定な電気抵抗体を得ることを特徴とするＮｉ−Ｍｏ−Ｐ
合金皮膜の熱処理方法。(1) A Ni-Mo-P alloy film with a molybdenum content of 10 to 25% by weight and a phosphorus content of 0.5 to 2.0% by weight, formed on a base material by an electroless plating method, is subjected to Joule heating by energization. , Ni-Mo-P characterized in that a thermally stable electrical resistor is obtained by subjecting it to extremely short-time pulse heating by laser irradiation or electron beam irradiation.
Heat treatment method for alloy film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1232588A JPH0397835A (en) | 1989-09-07 | 1989-09-07 | Heat treatment for ni-mo-p alloy film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1232588A JPH0397835A (en) | 1989-09-07 | 1989-09-07 | Heat treatment for ni-mo-p alloy film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397835A true JPH0397835A (en) | 1991-04-23 |
Family
ID=16941716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1232588A Pending JPH0397835A (en) | 1989-09-07 | 1989-09-07 | Heat treatment for ni-mo-p alloy film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397835A (en) |
-
1989
- 1989-09-07 JP JP1232588A patent/JPH0397835A/en active Pending
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