JPH0396027U - - Google Patents
Info
- Publication number
- JPH0396027U JPH0396027U JP554190U JP554190U JPH0396027U JP H0396027 U JPH0396027 U JP H0396027U JP 554190 U JP554190 U JP 554190U JP 554190 U JP554190 U JP 554190U JP H0396027 U JPH0396027 U JP H0396027U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component body
- external
- resist layer
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 4
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の面実装型電子部品
を示す斜視図、第２図は従来のチツプ型積層コン
デンサを示す斜視図、第３図は従来のチツプ型積
層コンデンサの実装状態を示す断面図、第４図は
従来のチツプ型積層コンデンサの実装状態の他の
例を示す断面図、第５図は本考案の一実施例の面
実装型電子部品の実装状態を示す断面図である。
図において、１１……面実装型電子部品として
のチツプ型積層コンデンサ、１２……電子部品素
体、１３，１４……外部電極、１５，１６……ソ
ルダーレジスト層、１７……プリント回路基板、
１８，１９……接続ランドを示す。
Fig. 1 is a perspective view showing a surface-mounted electronic component according to an embodiment of the present invention, Fig. 2 is a perspective view showing a conventional chip-type multilayer capacitor, and Fig. 3 shows the mounting state of a conventional chip-type multilayer capacitor. 4 is a sectional view showing another example of a conventional chip-type multilayer capacitor in a mounted state, and FIG. 5 is a sectional view showing a mounted state of a surface-mounted electronic component according to an embodiment of the present invention. be. In the figure, 11... Chip-type multilayer capacitor as a surface-mounted electronic component, 12... Electronic component element, 13, 14... External electrode, 15, 16... Solder resist layer, 17... Printed circuit board,
18, 19... Indicates connection lands.
Claims (1)
と該実装される面に連なる他の外表面領域とに跨
がるように設けられた少なくとも１の外部電極と
を備える面実装型電子部品において、 前記実装される面と垂直な面に設けられた外部
電極部分の表面にソルダーレジスト層が形成され
ていることを特徴とする面実装型電子部品。[Claims for Utility Model Registration] An electronic component body, at least one external surface provided so as to straddle the surface on which the electronic component body is mounted and another outer surface area that is connected to the surface on which the electronic component body is mounted. A surface-mounted electronic component comprising: an electrode, wherein a solder resist layer is formed on the surface of an external electrode portion provided on a surface perpendicular to the surface to be mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP554190U JPH0396027U (en) | 1990-01-24 | 1990-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP554190U JPH0396027U (en) | 1990-01-24 | 1990-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396027U true JPH0396027U (en) | 1991-10-01 |
Family
ID=31509244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP554190U Pending JPH0396027U (en) | 1990-01-24 | 1990-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396027U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036149A (en) * | 2012-08-09 | 2014-02-24 | Tdk Corp | Electronic component |
| CN103928231A (en) * | 2013-01-14 | 2014-07-16 | 三星电机株式会社 | Multilayer ceramic capacitor, mounting board therefor, and manufacturing method thereof |
-
1990
- 1990-01-24 JP JP554190U patent/JPH0396027U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036149A (en) * | 2012-08-09 | 2014-02-24 | Tdk Corp | Electronic component |
| CN103928231A (en) * | 2013-01-14 | 2014-07-16 | 三星电机株式会社 | Multilayer ceramic capacitor, mounting board therefor, and manufacturing method thereof |
| JP2014187058A (en) * | 2013-01-14 | 2014-10-02 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic capacitor, mounting board for multilayer ceramic capacitor, and manufacturing method of multilayer ceramic capacitor |