JPH0395918A - Substrate holding device - Google Patents
Substrate holding deviceInfo
- Publication number
- JPH0395918A JPH0395918A JP1231379A JP23137989A JPH0395918A JP H0395918 A JPH0395918 A JP H0395918A JP 1231379 A JP1231379 A JP 1231379A JP 23137989 A JP23137989 A JP 23137989A JP H0395918 A JPH0395918 A JP H0395918A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- temperature
- holding device
- flows
- substrate holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 31
- 239000012530 fluid Substances 0.000 abstract description 15
- 230000001105 regulatory effect Effects 0.000 abstract description 7
- 230000001276 controlling effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000012993 chemical processing Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、化学薬品処理、ＥＢ（電子ビーム）描画装置
あるいは、Ｘ線露光装置等において、基板（ウエハ）を
吸着し、各種処理を行なう基板保持装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to chemical processing, EB (electron beam) lithography equipment, X-ray exposure equipment, etc., in which substrates (wafers) are adsorbed and various treatments are performed. The present invention relates to a substrate holding device.
［従来の技術］
温調手段を持つ基板保持装置は、温調水流入口、温調水
流出口、および温調水循環領域で構成されている。従来
の温調手段を持つ基板保持装置では、温調水循環領域は
１本の流路をはりめぐらしてある場合と、大きな水だま
りとなっている場合などがあった。[Prior Art] A substrate holding device having a temperature control means includes a temperature control water inlet, a temperature control water outlet, and a temperature control water circulation area. In conventional substrate holding apparatuses having temperature control means, the temperature control water circulation area may have a single channel or a large pool of water.
［発明が解決しようとする課題］
吸着している基板の温度変動をなくし、温度変動によっ
て生じる熱歪を少なくするために基板保持装置に温調手
段を持たせ基板を冷却したりまたは所定温度に保つ等の
温度制御を行なう。しかし、人口から出口まですべて１
本の流路で構成すると、人口と出口の間の圧力損失が大
きくなり、圧力損失による発熱量が大きくなる。このた
め入口と出口との間に温度差が生じる。この温度差によ
って基板の熱歪が生じる。熱歪が生じると、描かれるパ
ターンの寸法精度、解像度を悪くする。[Problems to be Solved by the Invention] In order to eliminate temperature fluctuations in the adsorbed substrate and reduce thermal distortion caused by temperature fluctuations, the substrate holding device is provided with a temperature control means to cool the substrate or to maintain the temperature at a predetermined temperature. Perform temperature control such as maintenance. However, everything from population to exit is 1.
If it is configured with a straight flow path, the pressure loss between the population and the outlet will be large, and the amount of heat generated due to the pressure loss will be large. This creates a temperature difference between the inlet and the outlet. This temperature difference causes thermal distortion of the substrate. When thermal distortion occurs, the dimensional accuracy and resolution of the drawn pattern deteriorate.
また、温調水循環領域を大きな水だまりとする場合、温
調水循環領域内で水の流れの良い部分と悪い部分が起き
る。水の流れの悪い部分では、基板に発生した熱を充分
除去できないため、温度上昇が他の基板上よりも高くな
る。Furthermore, when the temperature-controlled water circulation area is a large pool of water, there will be areas where the water flows well and areas where the water flows poorly within the temperature-controlled water circulation area. In areas where water flows poorly, the heat generated on the substrate cannot be removed sufficiently, so the temperature rise is higher than on other substrates.
本発明は上記従来技術の問題点に鑑みなされたものであ
って、温調流体の圧力損失を減少させ効率的な熱交換が
可能な温調手段を備えた基板保持装置の提供を目的とす
る。The present invention has been made in view of the problems of the prior art described above, and an object of the present invention is to provide a substrate holding device equipped with a temperature control means capable of reducing pressure loss of temperature control fluid and efficiently exchanging heat. .
［課題を解決するための手段および作用］本発明は、温
調水循環領域を配管抵抗をなくすために複数の流路で構
成し、さらに基板の温度差をなくすために温調水の流れ
る方向を隣接する流路で相互に逆方向となるように配置
した。[Means and effects for solving the problem] The present invention configures the temperature-controlled water circulation area with a plurality of flow paths to eliminate piping resistance, and furthermore, the direction of flow of the temperature-controlled water is configured to eliminate the temperature difference between the substrates. Adjacent channels were arranged in opposite directions.
［実施例］
以下本発明の実施例について図面を用いて詳細に説明す
る。[Examples] Examples of the present invention will be described in detail below with reference to the drawings.
第１図（ａ）は、本発明の基板保持装置の上面図、第１
図（ｂ）は、第１図（ａ）の装置の側面図、第１図（Ｃ
）は第１図（ｂ）のＡ−Ａ線に沿って切断して見た断面
図、第１図（ｄ）は、Ｂ−Ｂ線に沿って切断して見た断
面図である。これらの図において、基板保持装置は、基
板を搭載する木体２からなり、基板を本体上面（第１図
（ａ））において、吸着する。本実施例ではバキューム
方式で、基板を吸着するためバキューム溝１およびバキ
ュームにするためのバキューム人口４０が設けられる。FIG. 1(a) is a top view of the substrate holding device of the present invention;
Figure (b) is a side view of the device in Figure 1 (a), Figure 1 (C
) is a sectional view taken along the line AA in FIG. 1(b), and FIG. 1(d) is a sectional view taken along the line BB. In these figures, the substrate holding device consists of a wooden body 2 on which a substrate is mounted, and the substrate is attracted to the upper surface of the body (FIG. 1(a)). In this embodiment, a vacuum method is used, and a vacuum groove 1 for sucking the substrate and a vacuum hole 40 for vacuuming are provided.
バキューム人口４０よりボンブによって基板付近の流体
を排気して、バキュ・−ムにする。吸着方式については
、バキューム方式であっても、静電方式であってもよい
。次に吸着した基板の温度を一定に保つため流路を設け
る。The fluid near the substrate is evacuated using a bomb from the vacuum port 40 to create a vacuum. The adsorption method may be a vacuum method or an electrostatic method. Next, a flow path is provided to keep the temperature of the adsorbed substrate constant.
この実施例の流路は相互に入り組んだ２つの渦巻き状流
路である。The channels in this embodiment are two interwoven spiral channels.
第１図（ｄ）の温調流体人口４１より充分温度管理され
た流体を流入させる。人口４１より流入した流体は、２
つに分岐し、流路１１と１２に流れ込む。それぞれに流
れ込んだ流体の一方は、外側から内側へもう一方は内側
から外側へ流れ、流路１３と１４へ到達し、再び１つに
なり温調流体出口４２より流出する。これにより、温調
水流入口、温調水流出口および温調水循環領域を並列し
た２つの別系統流路で構成したことになる。A fluid whose temperature is sufficiently controlled is allowed to flow in from the temperature control fluid population 41 shown in FIG. 1(d). The fluid flowing in from the population of 41 is 2
It branches into two and flows into channels 11 and 12. One of the fluids flowing into each flows from the outside to the inside and the other flows from the inside to the outside, reaches the flow paths 13 and 14, becomes one again, and flows out from the temperature control fluid outlet 42. As a result, the temperature-controlled water inlet, the temperature-controlled water outlet, and the temperature-controlled water circulation area are configured as two separate flow paths arranged in parallel.
また、２つの流れを逆向きとし、互いの管路抵抗によっ
て生ずる発熱を打ち消し、温度差をなくすようにしたも
のである。Furthermore, the two flows are directed in opposite directions, canceling out the heat generated by each other's pipe line resistance and eliminating temperature differences.
第１の実施例より加工面あるいはコスト面で有利な第２
の実施例を第２図で示す。第１図では、温調水循環領域
は螺線状となっているが、これは同心円の溝を切った第
２図のようであっても良い。ただし、第２図の流路２１
〜２２．２３〜２４．２５〜２６．２７〜２８．２９〜
３０．３１〜３２の隣接部間には、仕切板をつけて温調
水はこの間を流れないようにする。このようにすると、
温調水は入口４１より流入し、その後２系統に別れる。The second embodiment is more advantageous in processing and cost than the first embodiment.
An example of this is shown in FIG. In FIG. 1, the temperature-controlled water circulation area has a spiral shape, but it may also have a shape with concentric grooves as shown in FIG. 2. However, the flow path 21 in FIG.
〜22.23〜24.25〜26.27〜28.29〜
30. Install a partition plate between adjacent parts 31 and 32 to prevent temperature-controlled water from flowing between them. In this way,
Temperature-controlled water flows in from the inlet 41 and then separates into two systems.
（第２図（ｂ））。一方の温調水は流路２１に流れ込み
流路２２とは逆方向から円周に沿って流路２２に流れ、
流路２２より一端下にもぐってから流路２４に入り、同
様に流路２４−２３−２５→２６の順に流れる。もう一
方の温調水は、流路に２７−２８→３０−２９→２１→
２２の順に流れる。流路２６と２２に流れ込んだ温調水
は、再び１つの流路になり出口４２より流出する。この
ような構成にすると、一方は、中心より外側に向かって
温調水が流れ、もう一方は、外側より中心に向かって温
調水が流れ、並列な２本の別系統流路であって、流れる
方向が逆向きとすることができる。従って、圧力損失に
よる発熱量が減少し、入口と出口の間の温度差を減少さ
せることができる。(Figure 2(b)). One temperature-controlled water flows into the flow path 21 and flows from the opposite direction to the flow path 22 along the circumference,
It goes below the flow path 22 at one end and then enters the flow path 24, and similarly flows in the order of flow paths 24-23-25→26. The other temperature-controlled water is in the flow path 27-28 → 30-29 → 21 →
It flows in the order of 22. The temperature-controlled water that has flowed into the channels 26 and 22 becomes one channel again and flows out from the outlet 42. With this configuration, the temperature-controlled water flows from the center to the outside on one side, and the temperature-controlled water flows from the outside toward the center on the other side, and there are two parallel separate flow paths. , the flow direction can be reversed. Therefore, the amount of heat generated due to pressure loss is reduced, and the temperature difference between the inlet and the outlet can be reduced.
［発明の効果］
本発明では、温調水循環領域を複数の別系統流路にした
ことにより、管路の圧力損失を下げることができ、その
結果７品調水を送るボンブの揚程を小さくでき、小型の
ボンブを使って、温調水を循環させることができ、コス
トを下げることができる。[Effects of the Invention] In the present invention, by making the temperature-controlled water circulation area into a plurality of separate flow channels, the pressure loss in the pipeline can be lowered, and as a result, the lift of the bomb that sends the seven-product conditioned water can be reduced. , temperature-controlled water can be circulated using a small bomb, reducing costs.
また、一般にステッパーやＥＢ描画装置に基板保持装置
を使用するとき、温調水を循環させたときの振動が無視
できない値となる。この振動は、管路と、流体の管摩擦
によって起こるため、管路の圧力損失を下げることが有
利となる。本発明は、流路を複数にすることによって、
基板保持装置の振動を少なくすることができる。Further, when a substrate holding device is generally used in a stepper or an EB lithography device, vibrations generated when temperature-controlled water is circulated have a value that cannot be ignored. Since this vibration is caused by pipe friction between the pipe and the fluid, it is advantageous to reduce pressure loss in the pipe. By providing a plurality of flow channels, the present invention achieves
Vibration of the substrate holding device can be reduced.
また、温調水を一定方向から流すと、その方向に力が働
くため温調水を流さない時と、流す時で基板保持装置の
位置ずれが起きる。この位置ずれを少なくするには、基
板保持装置を支える系の剛陣を高めることが１つの手段
である。しかしこの実施例のように流れの方向を反対向
きに配置することによって容易に流体の慣性力をなくす
ことができる。Furthermore, when temperature-controlled water is flowed from a certain direction, a force acts in that direction, which causes the substrate holding device to shift in position between when temperature-controlled water is not flowing and when it is flowing. One way to reduce this positional shift is to increase the rigidity of the system that supports the substrate holding device. However, by arranging the flow directions in opposite directions as in this embodiment, the inertial force of the fluid can be easily eliminated.
第１図＜ａ＞は、本発明を実施した基板保持装置の上面
図、
第１図（ｂ）は、第１図（ａ）の側面図、第１図（ｃ）
は、第１図（ｂ）のＡ−Ａ線に沿った断面図、
第ｌ図（ｄ）は、第１図（ａ）のＢ−Ｂ線に沿った断面
図である。
第２図（ａ）は、本発明を実施した基板保持装置の第２
の実施例を示した上面図、
第２図（ｂ）は、第２図（ａ）のＡ−Ａ線に沿った断面
図、
第２図（ｃ）は、第２図（ａ）のＢ−Ｂ線に沿った断面
図ある。
１；バキューム溝、２：本体、
４０；バキューム入口、４１；温調流体入口、４２；温
調流体出口、
１１〜１４．２１〜３２：流路。
Ａ
Ａ
第
図（ｂ）
２６
第
２
図
（ａ）FIG. 1<a> is a top view of a substrate holding device implementing the present invention, FIG. 1(b) is a side view of FIG. 1(a), and FIG. 1(c)
1(b) is a sectional view taken along line A-A in FIG. 1(b), and FIG. 1(d) is a sectional view taken along line BB in FIG. 1(a). FIG. 2(a) shows the second substrate holding device according to the present invention.
FIG. 2(b) is a sectional view taken along line A-A in FIG. 2(a), and FIG. 2(c) is a top view showing the embodiment of FIG. 2(a). - There is a cross-sectional view along the B line. 1: Vacuum groove, 2: Main body, 40: Vacuum inlet, 41: Temperature regulating fluid inlet, 42; Temperature regulating fluid outlet, 11-14. 21-32: Channel. A A Figure (b) 26 Figure 2 (a)
Claims (4)
持する保持手段と、該本体上の基板の温度制御を行なう
ための温調流路を備え、前記温調流路は並列に配設され
た少なくとも２系列の流路からなることを特徴とする基
板保持装置。(1) A main body on which a substrate is mounted, a holding means for fixing and holding the substrate on the main body, and a temperature control flow path for controlling the temperature of the substrate on the main body, the temperature control flow paths being arranged in parallel. A substrate holding device comprising at least two lines of flow channels.
系統であって流れ方向が相互に反対方向であることを特
徴とする特許請求の範囲第１項記載の基板保持装置。(2) The substrate holding device according to claim 1, wherein the flow paths arranged in parallel have adjacent flow paths in different systems and flow directions opposite to each other. .
き状流路からなり、一方は中心から外側へ流れ、他方は
外側から中心へ流れるように構成されたことを特徴とす
る特許請求の範囲第１項記載の基板保持装置。(3) A patent characterized in that the temperature control flow path is composed of two series of spiral flow paths that are intertwined with each other, one of which flows from the center to the outside, and the other of which flows from the outside to the center. A substrate holding device according to claim 1.
系統の流路を構成した同心円流路群からなり、一方の系
統は中心側から外側の流路に流れ、他方の系統は外側か
ら中心側の流路に流れるように構成したことを特徴とす
る特許請求の範囲第２項記載の基板保持装置。(4) The temperature control channels are arranged such that every other channel is connected to each other.
It is characterized by being composed of a group of concentric channels that constitute the flow paths of the system, one system flowing from the center side to the outer flow path, and the other system flowing from the outside to the center side flow path. A substrate holding device according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1231379A JPH0395918A (en) | 1989-09-08 | 1989-09-08 | Substrate holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1231379A JPH0395918A (en) | 1989-09-08 | 1989-09-08 | Substrate holding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395918A true JPH0395918A (en) | 1991-04-22 |
Family
ID=16922697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1231379A Pending JPH0395918A (en) | 1989-09-08 | 1989-09-08 | Substrate holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395918A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5738165A (en) * | 1993-05-07 | 1998-04-14 | Nikon Corporation | Substrate holding apparatus |
| WO2005024090A1 (en) * | 2003-09-05 | 2005-03-17 | Shinmaywa Industries, Ltd. | Vacuum film forming method and device, and filter produced by using them |
| JP2007318120A (en) * | 2006-05-15 | 2007-12-06 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5931886A (en) * | 1982-08-12 | 1984-02-21 | Mitsubishi Electric Corp | Method for preventing formation of tin whisker |
-
1989
- 1989-09-08 JP JP1231379A patent/JPH0395918A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5931886A (en) * | 1982-08-12 | 1984-02-21 | Mitsubishi Electric Corp | Method for preventing formation of tin whisker |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5738165A (en) * | 1993-05-07 | 1998-04-14 | Nikon Corporation | Substrate holding apparatus |
| WO2005024090A1 (en) * | 2003-09-05 | 2005-03-17 | Shinmaywa Industries, Ltd. | Vacuum film forming method and device, and filter produced by using them |
| JP2007318120A (en) * | 2006-05-15 | 2007-12-06 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
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