JPH039320Y2 - - Google Patents
Info
- Publication number
- JPH039320Y2 JPH039320Y2 JP1984025347U JP2534784U JPH039320Y2 JP H039320 Y2 JPH039320 Y2 JP H039320Y2 JP 1984025347 U JP1984025347 U JP 1984025347U JP 2534784 U JP2534784 U JP 2534784U JP H039320 Y2 JPH039320 Y2 JP H039320Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- lead
- case piece
- case
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 30
- 229920003002 synthetic resin Polymers 0.000 claims description 12
- 239000000057 synthetic resin Substances 0.000 claims description 12
- 239000003792 electrolyte Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
この考案はチツプ形電解コンデンサに係り、特
に、その端子部の改良に関する。[Detailed Description of the Invention] This invention relates to a chip-type electrolytic capacitor, and particularly relates to improvements in the terminal portion thereof.
一般にチツプ形電解コンデンサでは、その外装
部材に電解コンデンサ素子を熱可塑性合成樹脂、
熱硬化性合成樹脂又は両者の積層によつて形成さ
れたケースが用いられている。 In general, chip-type electrolytic capacitors have electrolytic capacitor elements made of thermoplastic synthetic resin,
A case made of thermosetting synthetic resin or a laminate of both is used.
従来、この種のケースは、電解コンデンサ素子
を収納する収納空間を形成した２個のケース片を
接合したものである。このため、ケースから外部
に引出す端子部は、それらの接合部に挟んでケー
ス片の接合と同時に固定しているので、ケース片
が小さい場合、合成樹脂の成形時の流れが損なわ
れ、接合部の気密性が低くなる。そこで、十分な
気密性を得る必要から、合成樹脂量を増加させる
ことになり、電解コンデンサの全体積に占めるケ
ースの割合が増え、体積効率の低下や、ケース片
の必要以上の加圧成形で電解コンデンサ素子に圧
力が作用する等の不都合を生じる。 Conventionally, this type of case has two case pieces joined together to form a storage space for storing an electrolytic capacitor element. For this reason, the terminals that are drawn out from the case are sandwiched between these joints and fixed at the same time as the case pieces are joined, so if the case pieces are small, the flow of the synthetic resin during molding may be impaired, and the joints may airtightness becomes low. Therefore, the need to obtain sufficient airtightness led to an increase in the amount of synthetic resin, which increased the proportion of the case to the total volume of the electrolytic capacitor, resulting in a decrease in volumetric efficiency and excessive pressure molding of the case piece. This causes problems such as pressure acting on the electrolytic capacitor element.
特に、電解コンデンサでは、含浸されている電
解質の蒸発や外部から水分等の不純物が侵入する
と、電気的特性が劣化するので、十分な気密性が
要求されている。 In particular, electrolytic capacitors are required to have sufficient airtightness because their electrical characteristics deteriorate when the electrolyte in which they are impregnated evaporates or impurities such as moisture enter from the outside.
そこで、この考案は、端子構造の簡略化を図つ
たチツプ形電解コンデンサの提供を目的とする。 Therefore, the object of this invention is to provide a chip-type electrolytic capacitor with a simplified terminal structure.
即ち、この考案のチツプ形電解コンデンサは、
端面に素子リード（タブ１６，１８）が引き出さ
れた電解コンデンサ素子１４を収納するととも
に、該電解コンデンサ素子に含浸すべき電解液を
溜める凹部１２が形成された合成樹脂からなる第
１のケース片１０Ａに、合成樹脂からなる第２の
ケース片１０Ｂを接合して前記電解コンデンサ素
子とともに前記電解液を密封する外装ケースと、
前記第１のケース片に貫通させた垂直リード部４
と、この垂直リード部と一体に形成されるととも
に前記第１のケース片の前記凹部の縁部に配置さ
れて前記電解コンデンサ素子の前記素子リードが
接続された内側リード部８と、前記垂直リード部
と一体に形成されて帯状をなすリードフレーム２
から前記第１のケース片を単位として切断されて
形成され、前記第１のケース片の水平面をなす外
面部に配設された平板状をなす外側リード部２
Ａ，２A′，２Ｂ，２B′とを備えたものである。 In other words, the chip-type electrolytic capacitor of this invention is
A first case piece made of synthetic resin that accommodates an electrolytic capacitor element 14 from which element leads (tabs 16, 18) are pulled out on the end face, and has a recess 12 formed therein for storing an electrolyte to be impregnated into the electrolytic capacitor element. 10A, an exterior case in which a second case piece 10B made of synthetic resin is joined to seal the electrolytic solution together with the electrolytic capacitor element;
A vertical lead portion 4 penetrated through the first case piece.
an inner lead part 8 which is formed integrally with the vertical lead part and which is disposed at the edge of the recess of the first case piece to which the element lead of the electrolytic capacitor element is connected; A lead frame 2 formed integrally with the part and forming a band shape.
an outer lead portion 2 formed by cutting the first case piece as a unit and having a flat plate shape and disposed on an outer surface portion forming a horizontal surface of the first case piece;
A, 2A', 2B, 2B'.
以下、この考案を図面に示した実施例を参照し
て詳細に説明する。 Hereinafter, this invention will be described in detail with reference to embodiments shown in the drawings.
第１図ないし第３図はこの考案のチツプ形電解
コンデンサの端子構造の実施例を示し、第１図は
その分解斜視図、第２図はその外側リード部を示
す斜視図、第３図は第２図の−線に沿う断面
図である。 1 to 3 show an embodiment of the terminal structure of the chip-type electrolytic capacitor of this invention, FIG. 1 is an exploded perspective view thereof, FIG. 2 is a perspective view showing the outer lead part, and FIG. FIG. 3 is a sectional view taken along the - line in FIG. 2;
第１図において、リードフレーム２は導電性の
良い金属板を成形加工したものであり、このリー
ドフレーム２には、所定の幅を持つて帯状をなす
外側リード部２Ａ，２Ｂが平行に形成されている
とともに、一定の間隔で垂直に立てられた垂直リ
ード部４が形成されているとともに、スプロケツ
トホール６が形成され、垂直リード部４の頂部に
は、その端部を直角に折曲げ内側リード部８が形
成されている。そして、このリードフレーム２
は、合成樹脂の成形型の内部に配置される。 In FIG. 1, a lead frame 2 is formed by molding a metal plate with good conductivity, and this lead frame 2 has parallel outer lead portions 2A and 2B formed in a band shape with a predetermined width. At the same time, vertical lead parts 4 are formed vertically at regular intervals, and a sprocket hole 6 is formed at the top of the vertical lead part 4. A lead portion 8 is formed. And this lead frame 2
is placed inside a synthetic resin mold.
また、リードフレーム２の上面部には、垂直リ
ード部４の中心線上に熱可塑性合成樹脂で第１の
ケース片１０Ａが形成され、この第１のケース片
１０Ａには、電解液を溜める矩形の凹部１２が形
成されているとともに、この凹部１２を挟んで内
側リード部８を露出させてある。即ち、第１のケ
ース片１０Ａは、垂直リード部４の高さと同一の
高さに形成されている。 Further, on the upper surface of the lead frame 2, a first case piece 10A is formed of thermoplastic synthetic resin on the center line of the vertical lead part 4, and this first case piece 10A has a rectangular shape for storing the electrolyte. A recess 12 is formed, and the inner lead portion 8 is exposed across the recess 12. That is, the first case piece 10A is formed to have the same height as the vertical lead portion 4.
第１のケース片１０Ａの凹部１２には、電解液
が注入されるとともに、電解コンデンサ素子１４
が載置され、その端面から引き出されている素子
リードとしてのタブ１６，１８が凹部１２の縁部
に配設されている内側リード部８の上面に超音波
溶着等の接続手段を以て接続される。 An electrolytic solution is injected into the recess 12 of the first case piece 10A, and the electrolytic capacitor element 14
is mounted, and tabs 16 and 18 as element leads drawn out from the end faces are connected to the upper surface of the inner lead part 8 disposed at the edge of the recess 12 by a connecting means such as ultrasonic welding. .
この電解コンデンサ素子１４は、陽極箔と陰極
箔とをその間に介在させたセパレータで巻回する
とともに、各電極箔には接続用のタブ１６，１８
を接続したものである。 This electrolytic capacitor element 14 is constructed by winding an anode foil and a cathode foil with a separator interposed therebetween, and each electrode foil has connection tabs 16, 18.
is connected.
そして、第１のケース片１０Ａの上面には、電
解コンデンサ素子１４を被う第２のケース片１０
Ｂが超音波溶接等で一体的に接合されて電解コン
デンサ素子１４を密封する外装ケースが形成され
る。第２のケース片１０Ｂは、第１のケース片１
０Ａと同様に熱可塑性合成樹脂やアルミニウム等
の熱伝導性の良い金属板で予め一体成形したもの
である。 A second case piece 10 that covers the electrolytic capacitor element 14 is disposed on the upper surface of the first case piece 10A.
B are integrally joined by ultrasonic welding or the like to form an exterior case that seals the electrolytic capacitor element 14. The second case piece 10B is the first case piece 1
Like 0A, it is pre-integrated with a thermoplastic synthetic resin or a metal plate with good thermal conductivity such as aluminum.
また、リードフレーム２上に形成されたチツプ
形電解コンデンサは、リードフレーム２を第１の
ケース片１０Ａのその幅に合わせてケース片１０
Ａを単位として切り離し、第２図に示すように、
水平面をなすケース片１０Ａの底面部には、その
幅と等しい幅の平板状をなす外側リード部２A′，
２B′が形成されている。 In addition, the chip type electrolytic capacitor formed on the lead frame 2 is formed on the case piece 10A by aligning the lead frame 2 with the width of the first case piece 10A.
Separate A as a unit, as shown in Figure 2,
At the bottom of the horizontal case piece 10A, an outer lead part 2A' having a flat plate shape with a width equal to that of the case piece 10A,
2B' is formed.
このような構成によれば、従来のチツプ形電解
コンデンサのようにケースの接合面に端子部を形
成していないので、その製造工程を簡略化できる
とともに、第１及び第２のケース片１０Ａ，１０
Ｂ間の接合が強固なものとなり、高い気密性を実
現できる。特に、接合を強固にするために合成樹
脂を増加させる等の従来の欠点を除くことができ
る。 According to such a configuration, unlike conventional chip-type electrolytic capacitors, no terminal portion is formed on the joint surface of the case, so the manufacturing process can be simplified, and the first and second case pieces 10A, 10
The bond between B becomes strong, and high airtightness can be achieved. In particular, conventional drawbacks such as increasing the amount of synthetic resin to strengthen the bond can be eliminated.
なお、リードフレーム２は、第４図に示すよう
に、外側リード部２A′，２B′を形成してチツプ
形電解コンデンサを形成しても良い。このように
すれば、外側リード部２A′，２B′をケース片１
０Ａの底面部から長手方向に露出させることがで
きるので、半田付けの際に良好な固着状態が得ら
れるとともに、その確認も容易になる。 Incidentally, the lead frame 2 may be formed with outer lead portions 2A' and 2B' to form a chip-type electrolytic capacitor, as shown in FIG. In this way, the outer lead parts 2A' and 2B' can be connected to the case piece 1.
Since it can be exposed in the longitudinal direction from the bottom surface of 0A, a good fixed state can be obtained during soldering, and it can also be easily confirmed.
以上説明したように、この考案によれば、第１
のケース片の外側に外側リード部を設置し、この
外側リード部に一体に形成された垂直リード部を
第１のケース片を貫通させて設置し、この垂直リ
ード部に一体に形成された内側リード部を凹部の
縁部に臨ませて電解コンデンサ素子の素子リード
に接続したので、ケースの接合と端子部の形成と
が分離独立した構造となり、ケースの気密性を改
善できるとともに、外側リード部をケースの側部
から折り曲げる等の手数を省略でき、端子構造の
簡略化が実現できる。 As explained above, according to this invention, the first
An outer lead part is installed on the outside of the first case piece, a vertical lead part integrally formed with this outer lead part is installed to pass through the first case piece, and an inner part integrally formed with this vertical lead part is installed so as to pass through the first case piece. Since the lead part faces the edge of the recess and is connected to the element lead of the electrolytic capacitor element, the connection of the case and the formation of the terminal part are separated and independent, which improves the airtightness of the case and also allows the outer lead part to be connected to the element lead. This eliminates the need to bend the terminal from the side of the case, and simplifies the terminal structure.
第１図はこの考案のチツプ形電解コンデンサの
端子構造を示す分解斜視図、第２図はその外側リ
ード部を示す斜視図、第３図はその−線に沿
う断面図、第４図はこの考案のチツプ形電解コン
デンサの端子構造の他の実施例を示す縦断面図で
ある。
２……リードフレーム、２Ａ，２A′，２Ｂ，
２B′……外側リード部、４……垂直リード部、
８……内側リード部、１０Ａ……第１のケース
片、１０Ｂ……第２のケース片、１２……凹部、
１４……電解コンデンサ素子、１６，１８……タ
ブ（素子リード）。
Fig. 1 is an exploded perspective view showing the terminal structure of the chip-type electrolytic capacitor of this invention, Fig. 2 is a perspective view showing its outer lead part, Fig. 3 is a sectional view taken along the - line, and Fig. 4 is this. FIG. 7 is a longitudinal sectional view showing another embodiment of the terminal structure of the chip-type electrolytic capacitor of the invention. 2...Lead frame, 2A, 2A', 2B,
2B'...Outside lead part, 4...Vertical lead part,
8... Inner lead part, 10A... First case piece, 10B... Second case piece, 12... Recessed part,
14... Electrolytic capacitor element, 16, 18... Tab (element lead).
Claims (1)
サ素子を収納するとともに、該電解コンデンサ素
子に含浸すべき電解液を溜める凹部が形成された
合成樹脂からなる第１のケース片に、合成樹脂か
らなる第２のケース片を接合して前記電解コンデ
ンサ素子とともに前記電解液を密封する外装ケー
スと、 前記第１のケース片に貫通させた垂直リード部
と、 この垂直リード部と一体に形成されるとともに
前記第１のケース片の前記凹部の縁部に配置され
て前記電解コンデンサ素子の前記素子リードが接
続された内側リード部と、 前記垂直リード部と一体に形成されて帯状をな
すリードフレームから前記第１のケース片を単位
として切断されて形成され、前記第１のケース片
の水平面をなす外面部に配設された平板状をなす
外側リード部と、 を備えたことを特徴とするチツプ形電解コンデン
サの端子構造。[Claims for Utility Model Registration] A first case piece made of synthetic resin that accommodates an electrolytic capacitor element with an element lead drawn out from its end face, and has a recess formed therein for storing an electrolyte to be impregnated into the electrolytic capacitor element. an exterior case that seals the electrolyte together with the electrolytic capacitor element by joining a second case piece made of synthetic resin; a vertical lead portion that penetrates the first case piece; and the vertical lead portion. an inner lead part that is integrally formed and arranged at the edge of the recessed part of the first case piece and to which the element lead of the electrolytic capacitor element is connected; and a strip-shaped inner lead part that is integrally formed with the vertical lead part. a flat plate-shaped outer lead portion formed by cutting the first case piece as a unit from a lead frame forming the lead frame, and disposed on the outer surface portion of the first case piece that forms a horizontal surface; The terminal structure of a chip-type electrolytic capacitor is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2534784U JPS60137427U (en) | 1984-02-23 | 1984-02-23 | Terminal structure of chip type electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2534784U JPS60137427U (en) | 1984-02-23 | 1984-02-23 | Terminal structure of chip type electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60137427U JPS60137427U (en) | 1985-09-11 |
| JPH039320Y2 true JPH039320Y2 (en) | 1991-03-08 |
Family
ID=30520338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2534784U Granted JPS60137427U (en) | 1984-02-23 | 1984-02-23 | Terminal structure of chip type electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60137427U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6867928B2 (en) * | 2017-10-26 | 2021-05-12 | 株式会社トーキン | Manufacturing method of solid electrolytic capacitors, adapters, and solid electrolytic capacitors |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5183160A (en) * | 1974-12-16 | 1976-07-21 | Toko Inc | Denshibuhinno seizohoho |
| JPS56135923A (en) * | 1980-03-28 | 1981-10-23 | Nichicon Capacitor Ltd | Chip type electrolytic condenser |
-
1984
- 1984-02-23 JP JP2534784U patent/JPS60137427U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5183160A (en) * | 1974-12-16 | 1976-07-21 | Toko Inc | Denshibuhinno seizohoho |
| JPS56135923A (en) * | 1980-03-28 | 1981-10-23 | Nichicon Capacitor Ltd | Chip type electrolytic condenser |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60137427U (en) | 1985-09-11 |
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