JPH0392036U - - Google Patents

Info

Publication number
JPH0392036U
JPH0392036U JP1989150850U JP15085089U JPH0392036U JP H0392036 U JPH0392036 U JP H0392036U JP 1989150850 U JP1989150850 U JP 1989150850U JP 15085089 U JP15085089 U JP 15085089U JP H0392036 U JPH0392036 U JP H0392036U
Authority
JP
Japan
Prior art keywords
thin metal
metal wire
wire
tool
feeding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989150850U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989150850U priority Critical patent/JPH0392036U/ja
Publication of JPH0392036U publication Critical patent/JPH0392036U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図はクランプの平面図及び側面
図、第３図は従来の挿通作業を示す図である。 １……金属細線、２……クランプ、９……ボン
デイングアーム、１０……ツール、１１……穴、
１２Ａ，１２Ｂ……繰り出しローラ、１３……長
穴、１７……ガイド手段。 1 and 2 are a plan view and a side view of the clamp, and FIG. 3 is a diagram showing a conventional insertion operation. 1... Metal thin wire, 2... Clamp, 9... Bonding arm, 10... Tool, 11... Hole,
12A, 12B...Feeding roller, 13...Elongated hole, 17...Guiding means.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] クランプで把持された金属細線で第１の位置と
第２の位置とをツールを介して接続するワイヤボ
ンデイング装置に於いて、前記金属細線を手動に
より繰り出すための繰り出し装置と、該繰り出し
装置により繰り出された金属細線を前記ツールの
穴へ導くガイド手段とを設けたことを特徴とする
ワイヤボンデイング装置。 A wire bonding device that connects a first position and a second position with a thin metal wire held by a clamp via a tool includes a feeding device for manually feeding out the thin metal wire, and a feeding device for manually feeding out the thin metal wire; A wire bonding apparatus comprising: a guide means for guiding the thin metal wire into the hole of the tool.
JP1989150850U 1989-12-29 1989-12-29 Pending JPH0392036U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989150850U JPH0392036U (en) 1989-12-29 1989-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989150850U JPH0392036U (en) 1989-12-29 1989-12-29

Publications (1)

Publication Number Publication Date
JPH0392036U true JPH0392036U (en) 1991-09-19

Family

ID=31697182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989150850U Pending JPH0392036U (en) 1989-12-29 1989-12-29

Country Status (1)

Country Link
JP (1) JPH0392036U (en)

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