JPH0390103U - - Google Patents
Info
- Publication number
- JPH0390103U JPH0390103U JP15153789U JP15153789U JPH0390103U JP H0390103 U JPH0390103 U JP H0390103U JP 15153789 U JP15153789 U JP 15153789U JP 15153789 U JP15153789 U JP 15153789U JP H0390103 U JPH0390103 U JP H0390103U
- Authority
- JP
- Japan
- Prior art keywords
- frequency circuit
- high frequency
- dielectric substrate
- top cover
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
Landscapes
- Waveguides (AREA)
Description
第１図は本考案の一実施例の高周波回路の平面
図、第２図ａは上蓋の裏面側からみた平面図、第
２図ｂは第２図ａのｂ−ｂ線断面図、第２図ｃは
第２図ａのｃ−ｃ線断面図、第３図及び第４図は
上蓋を施蓋した状態の側面図、第５図は本考案の
他の実施例の高周波回路の平面図、第６図ａは上
蓋の裏面側からみた平面図、第６図ｂは第６図ａ
のｂ−ｂ線断面図、第７図及び第８図は上蓋を施
蓋した状態の側面図である。
１，２１……誘電体基板、２……入力整合回路
、３……出力整合回路、４，２３……接地パター
ン、９，２４……上蓋本体、１０，２５……凸状
パターン、１２，２６……ヒートシンク、１５，
２８……ＳＭＡコネクタ、１６，２９……接地部
、２２……主線路。
FIG. 1 is a plan view of a high frequency circuit according to an embodiment of the present invention, FIG. Figure c is a sectional view taken along line CC in Figure 2a, Figures 3 and 4 are side views with the top cover closed, and Figure 5 is a plan view of a high frequency circuit according to another embodiment of the present invention. , Fig. 6a is a plan view seen from the back side of the top cover, Fig. 6b is Fig. 6a
7 and 8 are side views with the upper lid closed. DESCRIPTION OF SYMBOLS 1, 21... Dielectric substrate, 2... Input matching circuit, 3... Output matching circuit, 4, 23... Ground pattern, 9, 24... Upper lid body, 10, 25... Convex pattern, 12, 26... heat sink, 15,
28...SMA connector, 16, 29...grounding section, 22...main line.
Claims (1)
誘電体基板の裏面に形成された裏面電極と、前記
誘電体基板上に形成された高周波回路と、前記高
周波回路の接地パターンの少なくとも一部分及び
前記固定治具と接続され且つ前記高周波回路を覆
い得る導電性の上蓋とから成り、前記上蓋から前
記高周波回路のアースを採ることを特徴とする高
周波回路装置。 誘電体基板上に形成された高周波回路と、前
記高周波回路の接地パターンの少なくとも一部分
と接続され且つ前記高周波回路を覆い得る導電性
の上蓋とから成り、前記上蓋から前記高周波回路
のアースを採ることを特徴とする高周波回路装置
。[Claims for Utility Model Registration] A dielectric substrate disposed on a fixing jig, a back electrode formed on the back surface of the dielectric substrate, a high frequency circuit formed on the dielectric substrate, and a high frequency circuit formed on the dielectric substrate. A high-frequency circuit device comprising at least a part of a circuit grounding pattern and a conductive top cover that is connected to the fixing jig and can cover the high-frequency circuit, the high-frequency circuit device being characterized in that the high-frequency circuit is grounded from the top cover. It consists of a high frequency circuit formed on a dielectric substrate and a conductive top cover that is connected to at least a part of a grounding pattern of the high frequency circuit and can cover the high frequency circuit, and the high frequency circuit is grounded from the top cover. A high frequency circuit device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15153789U JPH0390103U (en) | 1989-12-27 | 1989-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15153789U JPH0390103U (en) | 1989-12-27 | 1989-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390103U true JPH0390103U (en) | 1991-09-13 |
Family
ID=31697832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15153789U Pending JPH0390103U (en) | 1989-12-27 | 1989-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390103U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200470389Y1 (en) * | 2012-01-02 | 2013-12-11 | 이영호 | A method of using a new type of fabric adhesive tape which made of Polyester textile and adhesive tapes which melt with heated when make the fabric materials connected without sewing and knitting. |
-
1989
- 1989-12-27 JP JP15153789U patent/JPH0390103U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200470389Y1 (en) * | 2012-01-02 | 2013-12-11 | 이영호 | A method of using a new type of fabric adhesive tape which made of Polyester textile and adhesive tapes which melt with heated when make the fabric materials connected without sewing and knitting. |