JPH038U - - Google Patents
Info
- Publication number
- JPH038U JPH038U JP1989057695U JP5769589U JPH038U JP H038 U JPH038 U JP H038U JP 1989057695 U JP1989057695 U JP 1989057695U JP 5769589 U JP5769589 U JP 5769589U JP H038 U JPH038 U JP H038U
- Authority
- JP
- Japan
- Prior art keywords
- endless belt
- rod
- movable portion
- horizontally movable
- pulleys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000013013 elastic material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第1図はチツプ抵抗器の製造工程を示す図、第
2図は本考案の実施例装置の斜視図、第3図は第
2図の−視拡大断面図、第4図は第2図の
−視拡大断面図である。
A…基板、A1,A2…筋目線、A3…棒状基
板、A5…チツプ片、1…エンドレスベルト、1
a…歯、1b…水平移動部分、2,3,4…プー
リ、5…受け部材、6,7…ガイド部材、8…押
えローラ。
Fig. 1 is a diagram showing the manufacturing process of a chip resistor, Fig. 2 is a perspective view of an embodiment of the device of the present invention, Fig. 3 is an enlarged cross-sectional view of Fig. - It is an enlarged sectional view. A...Substrate, A1, A2...Stripe line, A3...Rod-shaped substrate, A5...Chip piece, 1...Endless belt, 1
a...Teeth, 1b...Horizontally moving part, 2, 3, 4...Pulley, 5...Receiving member, 6, 7...Guide member, 8...Press roller.
Claims (1)
ンドレスベルトを、当該エンドレスベルトにおけ
る一部が略水平の状態で移動するようにして巻掛
けする一方、前記二つのプーリの間には、前記エ
ンドレスベルトにおける水平移動部分の下部に、
当該水平移動部分の下面を支持する受け部材を配
設すると共に、前記エンドレスベルトにおける水
平移動部分の上部に、当該水平移動部分の上面に
供給載置した棒状基板をエンドレスベルトの移動
方向に長手の状態で案内するようにしたガイド部
材を配設し、且つ、前記ガイド部材によつて案内
される棒状基板を、エンドレスベルトに対して押
圧するようにした押えローラを配設したことを特
徴とする電子部品における棒状基板のブレーク装
置。 An endless belt made of a soft elastic material is wound around at least two pulleys so that a part of the endless belt moves in a substantially horizontal state, and between the two pulleys, At the bottom of the horizontal movement part,
A receiving member is provided to support the lower surface of the horizontally movable portion, and a rod-shaped substrate, which is supplied and placed on the upper surface of the horizontally movable portion of the endless belt, is placed on the top of the horizontally movable portion of the endless belt. The present invention is characterized in that a guide member is disposed to guide the substrate in a fixed position, and a presser roller is disposed to press the rod-shaped substrate guided by the guide member against the endless belt. Breaking device for rod-shaped substrates in electronic components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989057695U JPH0644081Y2 (en) | 1989-05-18 | 1989-05-18 | Breaker for bar-shaped substrate in electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989057695U JPH0644081Y2 (en) | 1989-05-18 | 1989-05-18 | Breaker for bar-shaped substrate in electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH038U true JPH038U (en) | 1991-01-07 |
JPH0644081Y2 JPH0644081Y2 (en) | 1994-11-14 |
Family
ID=31582639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989057695U Expired - Fee Related JPH0644081Y2 (en) | 1989-05-18 | 1989-05-18 | Breaker for bar-shaped substrate in electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0644081Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008140974A (en) * | 2006-12-01 | 2008-06-19 | Kenyu:Kk | Automatic splitting method and automatic splitting apparatus of substrate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6023014A (en) * | 1983-07-18 | 1985-02-05 | ロ−ム株式会社 | Breaking device for substrate of electronic part |
-
1989
- 1989-05-18 JP JP1989057695U patent/JPH0644081Y2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6023014A (en) * | 1983-07-18 | 1985-02-05 | ロ−ム株式会社 | Breaking device for substrate of electronic part |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008140974A (en) * | 2006-12-01 | 2008-06-19 | Kenyu:Kk | Automatic splitting method and automatic splitting apparatus of substrate |
Also Published As
Publication number | Publication date |
---|---|
JPH0644081Y2 (en) | 1994-11-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |