JPH0387558U - - Google Patents

Info

Publication number
JPH0387558U
JPH0387558U JP14499189U JP14499189U JPH0387558U JP H0387558 U JPH0387558 U JP H0387558U JP 14499189 U JP14499189 U JP 14499189U JP 14499189 U JP14499189 U JP 14499189U JP H0387558 U JPH0387558 U JP H0387558U
Authority
JP
Japan
Prior art keywords
polishing
large number
workpiece
plate
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14499189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14499189U priority Critical patent/JPH0387558U/ja
Publication of JPH0387558U publication Critical patent/JPH0387558U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は平円盤1に貼り付板3を載置した場合
の斜面図、第2図は本考案によるポリツシング定
盤4の斜面図、第3図はポリツシング定盤4に孔
4bを設けた場合の側断面図である。 図で1は平円盤、2は被加工物、3は貼り付板
、4はポリツシング定盤、4aは溝、4bは孔、
5は把手。
Fig. 1 is a perspective view of the flat disk 1 with the adhesive plate 3 placed on it, Fig. 2 is a perspective view of the polishing plate 4 according to the present invention, and Fig. 3 is the polishing plate 4 with holes 4b. FIG. In the figure, 1 is a flat disk, 2 is a workpiece, 3 is a sticking plate, 4 is a polishing surface plate, 4a is a groove, 4b is a hole,
5 is the handle.

補正 平2.1.29 実用新案登録請求の範囲を次のように補正する
Amendment: January 29, 2002 The scope of claims for utility model registration is amended as follows.

【実用新案登録請求の範囲】 回転する平円盤1上に被加工物2を間接的又は
直接的に固定して配置せしめる一方、錫や銅等の
溝4aを切り、内部に逃げを取つた各種ポリツシ
ング定盤4やリング状又は平板の固定磁石並びに
ダイヤモンドや、それに類する固定磁石等も
用意
しておき、前記ポリツシング定盤4や固定磁石
表面を被加工物の上から接せしめてなるラツピン
グ及びポリツシング加工装置。
[Scope of claim for utility model registration] A workpiece 2 is indirectly or directly fixed and placed on a rotating flat disc 1, while a groove 4a is cut in tin, copper, etc. to provide an escape inside. Various types of polishing surface plates 4 , ring-shaped or flat plate fixed magnets, diamonds, and similar fixed magnets are also prepared, and the surface of the polishing surface plate 4 or fixed magnets is brought into contact with the workpiece from above for lapping. and polishing processing equipment.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回転する平円盤1上に被加工物2を間接的又は
直接的に多数固定して配置せしめる一方、錫や銅
等の同心円又はスパイラルの多数の溝4aを切つ
た各種ポリツシング定盤4を用意しておき、前記
ポリツシング定盤4の表面を被加工物の上から接
せしめてなるラツピング及びポリツシング加工装
置。
A large number of workpieces 2 are indirectly or directly fixed and placed on a rotating flat disc 1, while various polishing plates 4 made of tin, copper, etc., each having a large number of concentric or spiral grooves 4a cut therein are prepared. This is a wrapping and polishing processing apparatus in which the surface of the polishing surface plate 4 is brought into contact with the workpiece from above.
JP14499189U 1989-12-18 1989-12-18 Pending JPH0387558U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14499189U JPH0387558U (en) 1989-12-18 1989-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14499189U JPH0387558U (en) 1989-12-18 1989-12-18

Publications (1)

Publication Number Publication Date
JPH0387558U true JPH0387558U (en) 1991-09-05

Family

ID=31691655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14499189U Pending JPH0387558U (en) 1989-12-18 1989-12-18

Country Status (1)

Country Link
JP (1) JPH0387558U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5250385B2 (en) * 1972-09-18 1977-12-23
JPS5920938U (en) * 1982-07-29 1984-02-08 トヨタ自動車株式会社 Workpiece positioning guide mechanism in press equipment
JPS6299072A (en) * 1985-10-22 1987-05-08 Sumitomo Electric Ind Ltd Method of working semiconductor wafer
JPS6487148A (en) * 1987-09-28 1989-03-31 Toshiba Corp Polishing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5250385B2 (en) * 1972-09-18 1977-12-23
JPS5920938U (en) * 1982-07-29 1984-02-08 トヨタ自動車株式会社 Workpiece positioning guide mechanism in press equipment
JPS6299072A (en) * 1985-10-22 1987-05-08 Sumitomo Electric Ind Ltd Method of working semiconductor wafer
JPS6487148A (en) * 1987-09-28 1989-03-31 Toshiba Corp Polishing method

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