JPH0382770A - Elecrtroless plating device - Google Patents
Elecrtroless plating deviceInfo
- Publication number
- JPH0382770A JPH0382770A JP21935389A JP21935389A JPH0382770A JP H0382770 A JPH0382770 A JP H0382770A JP 21935389 A JP21935389 A JP 21935389A JP 21935389 A JP21935389 A JP 21935389A JP H0382770 A JPH0382770 A JP H0382770A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- vessel
- electroless
- plated
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 27
- 238000007772 electroless plating Methods 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 241000218691 Cupressaceae Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
Landscapes
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は無電解めっき装置の改良に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to improvements in electroless plating equipment.
（従来の技術）
たとえばプリント配線基板の製造において、両面（外層
の）の回路パターン間、内層回路パターン同士もしくは
内層回路パターンと表面の回路パターンとの電気的な接
続は、スルホール乃至バイアーホールを利用して行って
いる。すなわち、積層一体化してなる積層板、もしくは
内層回路素板などの所定位置に、それら積層板などの厚
さ方向に貫通する孔を穿設し、この穿設した孔の内壁面
に無電解めっき処理により導体層を被着形成して、所要
の電気的な接続を行っている。しかして、上記無電解め
っき処理は、次のように行われている。すなわち、第２
図に模式的に示す如く、無電解めっき液１を収容した開
放型めっき槽２内に、所要のスルホール乃至バイアーホ
ールを設けたプリント配線基板３を収容、配置し、要す
ればプリント配線基板３や無電解めっき液１を揺動乃至
振動させながら、前記スルホールなどの内壁面に所要の
金属層を析出、形成させている：なお、図において４は
前記プリント配線基板３を装着、支持するバスケットで
ある。(Prior art) For example, in the manufacture of printed wiring boards, through holes or via holes are used to electrically connect circuit patterns on both sides (outer layer), between inner layer circuit patterns, or between inner layer circuit patterns and surface circuit patterns. I'm doing it. That is, a hole is drilled through the thickness of the laminate at a predetermined position in a laminate formed by integrating the layers or an inner circuit board, and the inner wall surface of the hole is electroless plated. The process deposits a conductor layer to make the necessary electrical connections. The electroless plating process is performed as follows. That is, the second
As schematically shown in the figure, a printed wiring board 3 having required through holes or via holes is housed and arranged in an open type plating tank 2 containing an electroless plating solution 1, and if necessary, a printed wiring board 3 A required metal layer is deposited and formed on the inner wall surface of the through-hole by shaking or vibrating the plating solution 1 and the electroless plating solution 1. In the figure, 4 is a basket on which the printed wiring board 3 is mounted and supported. It is.
（発明が解決しようとする課題）
しかし、上記無電解めっき方法乃至無電解めっき装置を
用いた場合には、次のような不都合が往々認められる。(Problems to be Solved by the Invention) However, when the above electroless plating method or electroless plating apparatus is used, the following disadvantages are often observed.
すなわち、前記スルホール乃至バイアーホールの内壁面
に、めっき不着部（未着部）がしばしば発生し、所要の
電気的な接続の機能を十分に果し得ない場合が起る。し
かして、この傾向は前記スルホール乃至バイアーホール
の径が、たとえば０．４１程度以下と小径になるほど多
発する。こうした現象は、回路パターン幅の微小化乃至
配線の高密度化の推進、これに伴うスルホール径の微小
化が図られている現状では由々しい問題となっている。That is, unplated parts (unplated parts) often occur on the inner wall surfaces of the through-holes and via-holes, and the required electrical connection function may not be fully achieved. However, this tendency occurs more frequently as the diameter of the through hole or via hole becomes smaller, for example, about 0.41 or less. Such a phenomenon has become a serious problem in the current situation where circuit pattern widths are becoming smaller, wiring density is becoming higher, and through-hole diameters are being made smaller as a result.
本発明者は、上記スルホ゛−ル乃至バイアーホール内壁
面のめっき不着部（未着部）発生について検討した結果
、無電解めっき処理の過程で発生した反応ガスが、前記
スルホール内壁面などに付着残留することに起因してい
ることを確認した。As a result of studying the occurrence of non-plated areas (unplated areas) on the inner wall surfaces of the through-holes and via holes, the inventors have found that reactive gases generated during the electroless plating process remain attached to the inner wall surfaces of the through-holes. It was confirmed that this was caused by
上記事情鑑み本発明は、たとえば径０．４ｍｍ程度以下
のスルホール内壁面にもほぼ均一なめっき層を容易にか
つ、確丈に被告形成し得る無電解めっき装置を提供する
ことを目的とする。In view of the above circumstances, an object of the present invention is to provide an electroless plating apparatus that can easily and accurately form a substantially uniform plating layer even on the inner wall surface of a through-hole having a diameter of about 0.4 mm or less, for example.
〔発明の構成］
（課題を解決するための手段）
本発明は、無電解めっき液収容槽を備えためっき檜と、
前記無電解めっき液収容槽の排気を行う減圧、排気手段
とを具備して成ることを特徴とする。[Structure of the Invention] (Means for Solving the Problems) The present invention provides a plated cypress equipped with an electroless plating solution storage tank,
It is characterized by comprising a depressurization and exhaust means for evacuating the electroless plating solution storage tank.
（作 用）
本発明に係る無電解めっき装置においては、所要の無電
解めっき反応で発生するガスは速やかにめっき槽外に排
出される。つまり、減圧２排気手段によって反応生成し
たガスは、無電解めっき槽外に容易に排気され、スルホ
ール内壁面などに付着、残留することもなくなる。した
がって、上記反応生成したガスの付着、残留に起因する
めっき未着の問題は全面的に防止乃至回避し得る。(Function) In the electroless plating apparatus according to the present invention, the gas generated in the required electroless plating reaction is quickly discharged to the outside of the plating tank. In other words, the gas generated by the reaction by the decompression and exhaust means is easily exhausted to the outside of the electroless plating tank, and does not adhere to or remain on the inner wall surface of the through hole. Therefore, the problem of non-plating caused by the adhesion or residual of the reaction-produced gas can be completely prevented or avoided.
（実施例）
以下第１図を参照して本発明の詳細な説明する。第１図
は、本発明に係る無電解めっき装置の要部構成例を断面
的に示したもので、無電Ｈめっき液、たとえば無電解銅
めっき液１を収容する槽５を備えためっき槽と、前記無
電解銅めっき液収容槽５の空間部５ａなどの排気を行う
減圧、排気手段６とを具備している。しかして、前記無
電解銅めっき液収容槽５は、図示されていないめっき１
夜１の供給口および排出口を有するとともに、めっき液
１を適宜攪拌し得る手段や加温手段などを備えている。(Example) The present invention will be described in detail below with reference to FIG. FIG. 1 is a cross-sectional view showing an example of the configuration of essential parts of an electroless plating apparatus according to the present invention. , a depressurizing and exhausting means 6 for exhausting the space 5a of the electroless copper plating solution storage tank 5 is provided. Therefore, the electroless copper plating solution storage tank 5 is used for plating 1 (not shown).
It has a supply port and a discharge port for the plating solution 1, as well as means for appropriately stirring the plating solution 1, heating means, and the like.
一方、前記無電解銅めっき液収容槽５の空間部５ａなど
の排気を行う減圧、排気手段６は、たとえば無電解銅め
っき液収容槽５を気密的に封止する開閉可能な蓋体６ａ
とこの蓋体６ａの一部開口部に連接されたバイブロｂと
、このバイブロｂの他端側に配設された排気ポンプ（図
示せず）とから構成されている。On the other hand, the depressurization and exhaust means 6 for evacuating the space 5a of the electroless copper plating solution storage tank 5 includes, for example, an openable and closable lid body 6a that airtightly seals the electroless copper plating solution storage tank 5.
It consists of a vibro b connected to a partial opening of the lid 6a, and an exhaust pump (not shown) disposed at the other end of the vibro b.
次に上記構成の無電解めっき装置の使用例を説明する。Next, an example of use of the electroless plating apparatus having the above configuration will be explained.
先ず無電解めっき液収容槽５内に無電解めっき液、たと
えば無電解鋼めっき液１を収容し、所要の温度に加温保
持するとともに適宜攪社する。First, an electroless plating solution, such as the electroless steel plating solution 1, is stored in the electroless plating solution storage tank 5, heated and maintained at a required temperature, and stirred as appropriate.
一方、開閉可能な蓋体６ａを開放し、スルホールめっき
処理するプリント配線基板３複数枚を装着。On the other hand, the openable and closable lid body 6a is opened, and three or more printed wiring boards to be subjected to through-hole plating are mounted.
支持したバスケット４を、前記無電解銅めっき液１中に
投入、浸漬するとともに、減圧、排気手段６を駆動して
所要の無電解めっき処理を行う。この無電解めっき処理
において生成するめっき株応ガスは、前記減圧、排気手
段６によって容易かつ、速やかに無電解めっき液収容槽
５外に放出される。The supported basket 4 is put into and immersed in the electroless copper plating solution 1, and the depressurization and exhaust means 6 are driven to perform the required electroless plating process. The plating stock reaction gas generated in this electroless plating process is easily and quickly discharged to the outside of the electroless plating solution storage tank 5 by the depressurization and exhaust means 6.
つまり、めっき反応ガス（水素など）は、めっき処理さ
れているプリント配線基板３のスルホール内壁面などに
付着、残留することなく、無電解めっき液収容槽５内か
ら全面的に順次放出され、たとえば径０．３Ｉｎｍ、長
さ（基板の厚さ） １．８＋ｕａのスルホールの場合
でも、その内壁面にはめつき未６部のない均一なめっき
層を容易に形成し得た。In other words, the plating reaction gas (hydrogen, etc.) is sequentially released from the electroless plating solution storage tank 5 without adhering to or remaining on the inner wall surface of the through-hole of the printed wiring board 3 being plated. Even in the case of a through hole with a diameter of 0.3 In and a length (substrate thickness) of 1.8+ ua, a uniform plating layer with no unplated parts could be easily formed on the inner wall surface.
［発明の効果］
上記説明からも分るように、本発明に係る無電解めっき
装置によれば、径０．４１以下のスルホール内壁面にも
均一なめっき層を容易に被告形成し得る。つまり、無電
解めっき反応によって生成するガスは、速やかにめっき
液檜外に放出（排出）され、無電解めっき液中や披めっ
き面などに残存することがなくなる。したがって、前記
反応生成ガスの付着による被めっき面へのめつき層の被
着＠（−旦は被着しても剥離したりする）など防止され
、所要のめっき層が常に均一に被着形成される。かくし
て、本発明に係る無電解めっき装置は、アディティブプ
ロセスによるプリント配線基板の製造などに適する無電
解めっき装置と言える。[Effects of the Invention] As can be seen from the above description, according to the electroless plating apparatus according to the present invention, a uniform plating layer can be easily formed even on the inner wall surface of a through hole having a diameter of 0.41 mm or less. In other words, the gas generated by the electroless plating reaction is quickly released (discharged) out of the plating solution and does not remain in the electroless plating solution or on the plated surface. Therefore, the adhesion of the plating layer to the surface to be plated due to the adhesion of the reaction product gas is prevented, and the required plating layer is always uniformly adhered. be done. Thus, the electroless plating apparatus according to the present invention can be said to be an electroless plating apparatus suitable for manufacturing printed wiring boards by an additive process.
第１図は本発明に係る無電解めっき装置の要部構成例を
示す断面図、第２図は従来の無電解めっき装置の要部構
成を示す断面図である。
１・・・・・・・・・無電解めっき戚
２．５・・・無電解めっき液収容冶
３・・・・・・・・・プリント配線基板（被めっき体）
４・・・・・・・・・バスケット（被めっき体支持）６
・・・・・・・・・減圧、排気手段
Ｂａ・・・・・・・・・蓋体
６ｂ・・・・・・・・・排気用バイブFIG. 1 is a cross-sectional view showing an example of the configuration of main parts of an electroless plating apparatus according to the present invention, and FIG. 2 is a cross-sectional view showing the structure of main parts of a conventional electroless plating apparatus. 1... Electroless plating unit 2.5... Electroless plating solution housing 3... Printed wiring board (object to be plated)
4...Basket (supporting plated object) 6
・・・・・・・・・Depressurization and exhaust means Ba・・・・・・Lid body 6b・・・・・・Exhaust vibrator
Claims (1)
解めっき液収容槽の排気を行う減圧，排気手段とを具備
して成ることを特徴とする無電解めっき装置。1. An electroless plating apparatus comprising: a plating tank having an electroless plating solution storage tank; and a depressurization and exhaust means for evacuating the electroless plating solution storage tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21935389A JPH0382770A (en) | 1989-08-25 | 1989-08-25 | Elecrtroless plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21935389A JPH0382770A (en) | 1989-08-25 | 1989-08-25 | Elecrtroless plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0382770A true JPH0382770A (en) | 1991-04-08 |
Family
ID=16734112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21935389A Pending JPH0382770A (en) | 1989-08-25 | 1989-08-25 | Elecrtroless plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0382770A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0743812A1 (en) * | 1994-12-01 | 1996-11-20 | Ibiden Co, Ltd. | Multilayer printed wiring board and process for producing the same |
| JP2003106066A (en) * | 2001-09-27 | 2003-04-09 | Js Corp | Sound insulation structure of door and door sound insulating member used therefor |
-
1989
- 1989-08-25 JP JP21935389A patent/JPH0382770A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0743812A1 (en) * | 1994-12-01 | 1996-11-20 | Ibiden Co, Ltd. | Multilayer printed wiring board and process for producing the same |
| EP0743812A4 (en) * | 1994-12-01 | 1999-05-06 | Ibiden Co Ltd | Multilayer printed wiring board and process for producing the same |
| JP2003106066A (en) * | 2001-09-27 | 2003-04-09 | Js Corp | Sound insulation structure of door and door sound insulating member used therefor |
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