JPH0379427U - - Google Patents
Info
- Publication number
- JPH0379427U JPH0379427U JP14191889U JP14191889U JPH0379427U JP H0379427 U JPH0379427 U JP H0379427U JP 14191889 U JP14191889 U JP 14191889U JP 14191889 U JP14191889 U JP 14191889U JP H0379427 U JPH0379427 U JP H0379427U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- pasting
- maintaining
- semiconductor wafer
- oxidizing atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000006552 photochemical reaction Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
第１図乃至第３図は、本考案の具体例を示すＵ
Ｖテープ貼付け装置の概略縦断面図である。また
第４図は、従来のＵＶテープ貼付け装置の斜視図
である。
１……半導体ウエーハ、２……ＵＶテープ、４
，５……非酸化雰囲気の維持手段（噴射管、チヤ
ンバ）。
Figures 1 to 3 show specific examples of the present invention.
FIG. 2 is a schematic vertical cross-sectional view of a V-tape pasting device. FIG. 4 is a perspective view of a conventional UV tape application device. 1...Semiconductor wafer, 2...UV tape, 4
, 5... Means for maintaining a non-oxidizing atmosphere (injection pipe, chamber).
Claims (1)
低下するＵＶテープを半導体ウエーハに貼付ける
装置に、非酸化雰囲気の維持手段を付設したこと
を特徴とするＵＶテープ貼付け装置。 A UV tape pasting device, characterized in that a device for pasting a UV tape whose adhesive strength is reduced by a photochemical reaction caused by ultraviolet irradiation onto a semiconductor wafer is provided with means for maintaining a non-oxidizing atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14191889U JPH0379427U (en) | 1989-12-06 | 1989-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14191889U JPH0379427U (en) | 1989-12-06 | 1989-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379427U true JPH0379427U (en) | 1991-08-13 |
Family
ID=31688776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14191889U Pending JPH0379427U (en) | 1989-12-06 | 1989-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379427U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012101851A1 (en) * | 2011-01-26 | 2012-08-02 | 株式会社ソニー・コンピュータエンタテインメント | Housing case for portable recording medium |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6343342A (en) * | 1986-08-08 | 1988-02-24 | Bando Chem Ind Ltd | Method of dicing semiconductor wafer |
-
1989
- 1989-12-06 JP JP14191889U patent/JPH0379427U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6343342A (en) * | 1986-08-08 | 1988-02-24 | Bando Chem Ind Ltd | Method of dicing semiconductor wafer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012101851A1 (en) * | 2011-01-26 | 2012-08-02 | 株式会社ソニー・コンピュータエンタテインメント | Housing case for portable recording medium |