JPH0378289A - Manufacture of solid wiring board - Google Patents
Manufacture of solid wiring boardInfo
- Publication number
- JPH0378289A JPH0378289A JP21465389A JP21465389A JPH0378289A JP H0378289 A JPH0378289 A JP H0378289A JP 21465389 A JP21465389 A JP 21465389A JP 21465389 A JP21465389 A JP 21465389A JP H0378289 A JPH0378289 A JP H0378289A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- conductor circuit
- injection molding
- injection
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000007787 solid Substances 0.000 title abstract 2
- 239000004020 conductor Substances 0.000 claims abstract description 38
- 238000001746 injection moulding Methods 0.000 claims abstract description 33
- 238000002347 injection Methods 0.000 claims abstract description 21
- 239000007924 injection Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 15
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 10
- 239000010970 precious metal Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 6
- 238000005520 cutting process Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、立体配線基板の製造方法に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a method for manufacturing a three-dimensional wiring board.
（従来の技術）
絶縁樹脂の成形品（モールド品）、たとえば筐体の内壁
面に所要の導体回路を形成し、電子機器類の構造をコン
パクト化することなどが試みられている。つまり、機械
的乃至電気的な保護機能を本来の役割とする筐体自体を
導体回路Ｊ！板として兼用させることが知られている。(Prior Art) Attempts have been made to form a required conductor circuit on the inner wall surface of an insulating resin molded product, such as a housing, to make the structure of electronic devices more compact. In other words, the conductor circuit J! It is known that it can also be used as a board.
しかして、上記筐体など樹脂成形品を導体回路Ｕ；仮と
して兼用させた配線基板は、一般に次のようにして製造
されている。すなわち、射出成形品の表面に、先ず化学
めっき（無電解めっき）処理を施し、次いで電気めっき
（電解めっき）処理を施す。しかる後、前記電気めっき
層上にエツチングレジストを印刷し、所要の露光、現像
処理を施してから、導体回路パターン形成領域以外の前
記めっき層を選択的にエツチング除去する。こうして射
出成形品の表面に所要の導体回路を形成してから、前記
エツチングレジストを剥離などにより除去し、所望の配
線基板（立体配線基板）を得ている。However, a wiring board in which a resin molded product such as the casing is also used as a conductor circuit U is generally manufactured in the following manner. That is, the surface of the injection molded product is first subjected to chemical plating (electroless plating) and then to electroplating (electrolytic plating). Thereafter, an etching resist is printed on the electroplated layer, subjected to necessary exposure and development treatment, and then the plated layer other than the conductor circuit pattern forming area is selectively etched away. After a desired conductor circuit is formed on the surface of the injection molded product in this manner, the etching resist is removed by peeling or the like to obtain a desired wiring board (three-dimensional wiring board).
（発明が解決しようとする課題）
しかし、上記立体配線基板の製造方法の場合には、次の
ような問題があり、実用上十分満足し得る手段とは言え
ない。先ず第一に、射出成形。(Problems to be Solved by the Invention) However, in the case of the above-mentioned method for manufacturing a three-dimensional wiring board, there are the following problems, and it cannot be said that the method is fully satisfactory in practice. First of all, injection molding.
この成形品の所定面に対する化学めっき前処理（粗面化
処理やキャタリスト処理）、化学めっき処理と電気めっ
き処理、レジスト塗布、露光゛現像処理、エツチング処
理、レジスト剥離など工程が繁雑なことが挙げられる。Processes such as chemical plating pre-treatment (roughening treatment and catalyst treatment), chemical plating treatment and electroplating treatment, resist coating, exposure/development treatment, etching treatment, and resist peeling for a given surface of the molded product are complicated. Can be mentioned.
第二に、基体（射出成形品）而が立体的であるため、レ
ジストの均一な塗布が困難であるばかりでなく、露光処
理に用いるマスクの製作も煩雑である。第三に、導体回
路は、基体（射出成形品）面にめっき披貨されているた
め、密着力など劣り信頼性の点で十分と言えないばかり
でなく、基体（射出成形品）を成す樹脂も限定されるな
どの問題がある。Second, since the substrate (injection molded product) is three-dimensional, it is not only difficult to apply a resist uniformly, but also the production of a mask used for exposure processing is complicated. Thirdly, since the conductor circuit is plated on the surface of the base (injection molded product), it not only has poor adhesion and is not reliable enough, but also the resin that forms the base (injection molded product). There are also problems such as being limited.
本発明は、上記事情に対処してなされたもので、工程、
操作が簡略化されかつ、精度よく信頼性の高い導体回路
を備えた立体配線基板が得られる製造方法の提供を目的
とする。The present invention has been made in response to the above-mentioned circumstances, and includes steps,
It is an object of the present invention to provide a manufacturing method that allows a three-dimensional wiring board to be obtained that has a conductor circuit that is simple to operate and that is accurate and reliable.
［発明の構成］
（課題を解決するための手段）
本発明は、雄型および雌型から成る射出成形用金型の少
くとも一方の型の射出成形面に、所要の導体回路と逆パ
ターンの絶縁性無機被膜を被管形成する工程と、
前記逆パターンの絶縁性無機被膜を被管形成した型の射
出成形面に少くとも貴金属の電気めっき処理を施して導
体回路を被管形成する工程と、前記導体回路を被管形成
した型を射出成形用金型に組立て、この型内に所要の樹
脂を射出し成形する一方、前記導体回路を型の射出成形
面から剥離し樹脂成形面に転若させる工程とを具備する
ことを特徴とする。[Structure of the Invention] (Means for Solving the Problems) The present invention provides a method in which a required conductor circuit and a reverse pattern are formed on the injection molding surface of at least one mold of an injection mold consisting of a male mold and a female mold. a step of coating the tube with an insulating inorganic coating, and a step of electroplating at least a noble metal on the injection molding surface of the mold coated with the insulating inorganic coating of the reverse pattern to form a conductor circuit. , the mold with the conductor circuit formed thereon is assembled into an injection mold, and the required resin is injected into the mold, while the conductor circuit is peeled off from the injection molding surface of the mold and transferred to the resin molding surface. The method is characterized by comprising a step of making the product younger.
（作 用）
本発明によれば、所要の導体回路は、射出成形用金型の
少くとも一方の型の射出成形面に剥離性のよい貴金属層
を下地とした電気めっきにより予め形成されており、こ
の型内に所要の樹脂を射出し成形することにより、前記
導体回路が型の射出成形面から容品に剥離して樹脂成形
品の所定面に転召乃至埋め込まれる。つまり繁雑な操作
、工程を要せずに、所要の導体回路が強固に密行一体化
した立体配線基板を、射出成形の工程で同時に得ること
ができる。(Function) According to the present invention, the required conductor circuit is formed in advance on the injection molding surface of at least one of the injection molds by electroplating with a noble metal layer having good releasability as a base. By injection molding a required resin into this mold, the conductive circuit is peeled off from the injection molded surface of the mold into the container and transferred or embedded into a predetermined surface of the resin molded product. In other words, a three-dimensional wiring board in which the required conductor circuits are tightly and tightly integrated can be simultaneously obtained in the injection molding process without requiring complicated operations and processes.
（実施例）
以下第１図〜第５図を参照して本発明の詳細な説明する
。第１図〜第５図は、本発明に係る立体配線基板の製造
方法における各工程の態様をそれぞれ模式的に示す断面
図である。(Example) The present invention will be described in detail below with reference to FIGS. 1 to 5. 1 to 5 are cross-sectional views schematically showing aspects of each step in the method for manufacturing a three-dimensional wiring board according to the present invention.
先ず、第１図に示すような構成の雄型１および雌型２か
ら成る射出成形用金型３を用意し、この射出成形用金型
３の少くとも一方の型１，２、たとえば雄型１の射出成
形面１ａに、有機金属化合物、たとえばトリメチルアル
ミニウムを用いて、ケミカルペーパーポジション法によ
り、第２図に示す如く厚さ ０．５μ程度の緻密なアル
ミナ層４を被管形成した。上記被管形成したアルミナ層
４について、たとえばダイヤモンド針による選択的な切
削加工を行い、第３図に示すように所要の導体回路状に
雄型１の面を露出させた（逆パターン４ａのアルミナ層
４を残存させた）。次いで、上記雄型１の逆パターン４
ａを残存させた射出成形面１ａ以外の面に、めっきレジ
スト層を被管形成した。上記逆パターン４ａおよびめっ
きレジスト層を被管形成した雄型１を一方の電極とし、
また貴金属たとえば金を対極として電気めっき洛中で電
気めっき処理を施し、先ず厚さ約２μの金の層を雄中１
の露出面に被着形成した。次いで、上記に準じて前記金
めっき層上に厚さ約３μの電気ニッケルめっき層および
厚さ約ｌＯμの電気鋼めっき層を順次被る形成して、第
４図に示すように雄型１の射出成形面ｌａの露出した領
域面に厚さ１５μ程度の導体回路５を被管形成した。か
くして、所要の導体回路５を形成した雄型１に水洗、乾
燥処理を順次施した後、上−記予め用意しておいた雌型
２と射出成形用金型３に組立て、所要の射出成形機にセ
ットし、この射出成形用金型内に所要の樹脂、たとえば
ポリカーボネート樹脂を射出し成形した。この射出成形
により、前記雄型１成形而１ａの導体回路５は、雄型１
成形而１ａから剥離して樹脂成形品面に転む乃至埋込ま
れ、樹脂成形品に一体化する。次いで前記射出成形用金
型３を射出成形機より取外し、その射出成形用金型３か
ら射出成形品６を取出すことにより、第５図に示すよう
な立体配線基板を得た。First, an injection mold 3 consisting of a male mold 1 and a female mold 2 having a configuration as shown in FIG. 1 is prepared. As shown in FIG. 2, a dense alumina layer 4 having a thickness of about 0.5 μm was formed on the injection molded surface 1a of the tube by a chemical paper position method using an organometallic compound such as trimethylaluminum. The alumina layer 4 formed in the tube is selectively cut using, for example, a diamond needle to expose the surface of the male mold 1 in the shape of a desired conductor circuit as shown in FIG. layer 4 remained). Next, the reverse pattern 4 of the above male pattern 1
A plating resist layer was formed on the surface of the tube other than the injection molded surface 1a on which portion a remained. The male mold 1, which is covered with the reverse pattern 4a and the plating resist layer, is used as one electrode,
In addition, electroplating is performed using a noble metal such as gold as a counter electrode in an electroplating machine.
It was deposited on the exposed surface of. Next, an electrolytic nickel plating layer with a thickness of about 3μ and an electrolytic steel plating layer with a thickness of about 10μ are sequentially formed on the gold plating layer according to the above procedure, and the male mold 1 is injected as shown in FIG. A conductive circuit 5 having a thickness of about 15 μm was formed to cover the exposed area of the molding surface la. After sequentially washing and drying the male mold 1 with the required conductor circuit 5 formed thereon, it is assembled into the female mold 2 and injection mold 3 prepared in advance, and the required injection molding is carried out. The mold was set in a machine, and a desired resin, such as polycarbonate resin, was injected into the injection mold. Through this injection molding, the conductor circuit 5 of the male mold 1 molded into the male mold 1 is
It peels off from the molded product 1a, rolls over or is embedded in the surface of the resin molded product, and is integrated into the resin molded product. Next, the injection molding die 3 was removed from the injection molding machine, and the injection molded product 6 was taken out from the injection molding die 3, thereby obtaining a three-dimensional wiring board as shown in FIG.
上記により製造した一方の面に、所望の導体回路５が設
けられた立体配線基板は、導体回路５が成形品６表面と
平坦な状態に埋込まれ、強固に一体化していた。また幅
ｌｌｌ１１の導体回路５でもビール不可能で、銅箔配線
基板の場合より強固な一体性を示した。In the three-dimensional wiring board manufactured as described above, on one side of which was provided the desired conductor circuit 5, the conductor circuit 5 was embedded in the surface of the molded product 6 in a flat state and was firmly integrated. Furthermore, even with the conductor circuit 5 having a width of lll11, beer was not possible, and a stronger integrity was exhibited than in the case of a copper foil wiring board.
なお、上記では射出成形用金型の雄型の射出成形面に、
所要の導体回路と逆パターンの絶縁性無機被膜を被告形
成したが、雌型の射出成形面に、所要の導体回路と逆パ
ターンの絶縁性無機被膜を被着形成してもよく、また雄
型および雌型の両射用成形面に、それぞれ所要の導体回
路と逆パターンの絶縁性無機被膜を波管形成しておくこ
とにより、両面型立体配線基板をうろこともできる。し
かして、前記逆パターンの形成はアルミナ層によらず、
たとえばシリカ、チタニアなどで形成としてもよい。す
なわち、チタンやケイ素などの有機物を出発材料として
ケミカルペーパーデボセション法などで形成してもよい
。In addition, in the above, on the injection molding surface of the male mold of the injection mold,
Although an insulating inorganic coating with a pattern opposite to the required conductor circuit was formed on the injection molded surface of the female mold, an insulating inorganic coating with a pattern opposite to the required conductor circuit may also be formed on the injection molding surface of the female mold. A double-sided three-dimensional wiring board can also be formed by forming an insulating inorganic coating with a pattern opposite to the required conductor circuit on each of the two injection molding surfaces of the female mold. However, the formation of the reverse pattern does not depend on the alumina layer,
For example, it may be formed of silica, titania, or the like. That is, it may be formed by a chemical paper debocession method using an organic material such as titanium or silicon as a starting material.
さらに、前記逆パターンを披む形成した型の射出成形面
に対する電気めっきによる導体回路の波管形成は、上記
例示の３層型に限定されない。つまり、金型の射出成形
面に対して、先ず前記金のような剥離性の良好な貴金属
層で形成しておけば、前記ニッケル、銅の複層系以外の
導電金属層とで、成るいは貴金属めっき層だけでで導体
回路を形成してもよい。一方、射出成形に用いる樹脂と
しては、前記ポリカーボネート樹脂に限らず、たとえば
ポリカーボネート樹脂−ポリブタジェンニトリルゴムの
ブレンド系なども使用し得る。Further, the wave tube formation of the conductor circuit by electroplating on the injection molding surface of the mold having the reverse pattern is not limited to the three-layer mold as exemplified above. In other words, if the injection molding surface of the mold is first formed with a layer of a noble metal with good releasability, such as gold, then a conductive metal layer other than the multilayer system of nickel and copper can be formed. A conductive circuit may be formed using only the noble metal plating layer. On the other hand, the resin used for injection molding is not limited to the above-mentioned polycarbonate resin, but may also be used, for example, a blend system of polycarbonate resin and polybutadiene nitrile rubber.
［発明の効果］
上記の如く本発明によれば、所要の導体回路は、射出成
形用金型の少くとも一方の型の射出成形面に剥離性のよ
い貴金属の電気めっきにより予め形成されており、−こ
の型内に所要の樹脂を射出し成形することにより、前記
導体回路が金型の射出成形面から容易に剥離して、樹脂
成形品の所定面に転着乃至埋め込まれて成る立体配線基
板を再現性よく得ることができる。つまり、従来の立体
配線基板の製造方法に比べて繁雑な操作、工程を要せず
に、所要の導体回路が強固に密告一体化した立体配線基
板を、射出成形の工程で同時に得ることができ量産的で
ある。しかも導体回路の露出面は貴金属層であるため、
安定性に優れかっ、そのままワイヤボンディングも適用
できるなど多くの利点がある。[Effects of the Invention] As described above, according to the present invention, the required conductor circuit is formed in advance on the injection molding surface of at least one of the injection molds by electroplating a noble metal with good releasability. , - Three-dimensional wiring in which the conductor circuit is easily peeled off from the injection molding surface of the mold and is transferred or embedded in a predetermined surface of the resin molded product by injection molding the required resin in this mold. A substrate can be obtained with good reproducibility. In other words, a three-dimensional wiring board in which the required conductor circuits are tightly integrated can be obtained at the same time through the injection molding process without requiring complicated operations and processes compared to conventional manufacturing methods for three-dimensional wiring boards. Mass-produced. Moreover, since the exposed surface of the conductor circuit is a noble metal layer,
It has many advantages, including excellent stability and the ability to be directly applied to wire bonding.
第１図乃至第５図は、本発明に係る立体配線基板の製造
方法における各工程の態様をそれぞれ模式的に示す断面
図である。
１・・・・・・雄型の金型
ｌａ・・・・・・雄型の成形面
２・・・・・・雌型の金型
２ａ・・・・・・雌型の成形面
３・・・・・・射出成形金型
４・・・・・・絶縁性無機被膜（アルミナ層）４ａ・・
・・・・逆パターン
５・・・・・・導体回路
６・・・・・・成形品1 to 5 are cross-sectional views schematically showing aspects of each step in the method for manufacturing a three-dimensional wiring board according to the present invention. 1...Male mold la...Male molding surface 2...Female mold 2a...Female molding surface 3. ... Injection mold 4 ... Insulating inorganic coating (alumina layer) 4a ...
... Reverse pattern 5 ... Conductor circuit 6 ... Molded product
Claims (1)
方の型の射出成形面に、所要の導体回路と逆パターンの
絶縁性無機被膜を被着形成する工程と、 前記逆パターンの絶縁性無機被膜を被着形成した型の射
出成形面に少なくとも貴金属の電気めっき処理を施して
導体回路を被着形成する工程と、前記導体回路を被着形
成した型を射出成形用金型に組立て、この型内に所要の
樹脂を射出し成形する一方、前記導体回路の貴金属面を
型の射出成形面から離型し樹脂成形面に転着させる工程
とを具備することを特徴とする立体配線基板の製造方法
。[Scope of Claims] A step of forming an insulating inorganic coating with a pattern opposite to a desired conductor circuit on the injection molding surface of at least one of the injection molds consisting of a male mold and a female mold; a step of electroplating at least a precious metal on the injection molding surface of the mold on which the insulating inorganic coating of the reverse pattern has been deposited to form a conductor circuit; and injection molding of the mold with the conductor circuit deposited thereon. and injecting and molding the required resin into the mold, while releasing the noble metal surface of the conductor circuit from the injection molding surface of the mold and transferring it to the resin molding surface. A method for manufacturing a three-dimensional wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21465389A JPH0378289A (en) | 1989-08-21 | 1989-08-21 | Manufacture of solid wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21465389A JPH0378289A (en) | 1989-08-21 | 1989-08-21 | Manufacture of solid wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0378289A true JPH0378289A (en) | 1991-04-03 |
Family
ID=16659332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21465389A Pending JPH0378289A (en) | 1989-08-21 | 1989-08-21 | Manufacture of solid wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0378289A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5333379A (en) * | 1991-04-08 | 1994-08-02 | Kabushiki Kaisha Toshiba | Method of producing a three-dimensional wiring board |
| JP2002192500A (en) * | 2000-12-22 | 2002-07-10 | Ricoh Opt Ind Co Ltd | Manufacturing method for article having micro surface structure |
-
1989
- 1989-08-21 JP JP21465389A patent/JPH0378289A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5333379A (en) * | 1991-04-08 | 1994-08-02 | Kabushiki Kaisha Toshiba | Method of producing a three-dimensional wiring board |
| JP2002192500A (en) * | 2000-12-22 | 2002-07-10 | Ricoh Opt Ind Co Ltd | Manufacturing method for article having micro surface structure |
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