JPH0377773A - Reflow soldering device - Google Patents
Reflow soldering deviceInfo
- Publication number
- JPH0377773A JPH0377773A JP20223889A JP20223889A JPH0377773A JP H0377773 A JPH0377773 A JP H0377773A JP 20223889 A JP20223889 A JP 20223889A JP 20223889 A JP20223889 A JP 20223889A JP H0377773 A JPH0377773 A JP H0377773A
- Authority
- JP
- Japan
- Prior art keywords
- inert gas
- blower
- gas chamber
- circulation passage
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 40
- 239000011261 inert gas Substances 0.000 claims abstract description 119
- 239000007789 gas Substances 0.000 claims abstract description 9
- 230000001174 ascending effect Effects 0.000 claims abstract description 6
- 238000004891 communication Methods 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 17
- 239000001301 oxygen Substances 0.000 abstract description 17
- 229910052760 oxygen Inorganic materials 0.000 abstract description 17
- 239000000758 substrate Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000006071 cream Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 206010011224 Cough Diseases 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、リフロー半田付は装置に係り、特に不活性ガ
スの雰囲気中で非常に高性能の半田付けを行うようにし
たリフロー半田付は装置において、不活性ガス室と外部
とに連通ずるわずかな隙間からも外部の空気が入り込ま
ないようにして、不活性ガス室内の酸素濃度を極めて低
く保持でき、しかも不活性ガスの消費量も極めて少なく
することができるようにしたリフロー半田付は装置に関
する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an apparatus for reflow soldering, and in particular to an apparatus for reflow soldering that performs extremely high-performance soldering in an inert gas atmosphere. By preventing outside air from entering even through the small gap that communicates between the inert gas chamber and the outside, the oxygen concentration in the inert gas chamber can be kept extremely low, and the amount of inert gas consumed is also extremely low. The present invention relates to a reflow soldering device that allows for reflow soldering.
従来の技術
リフロー半田付は装置は、ポリマ基板等の基板に電子部
品を搭載した要半田付は箇所にペースト状のクリーム半
田を塗り、該基板をコンベアにより搬送してブレヒータ
により予備加熱して徐々に温度を上げ、最終段階で半田
付はヒータにより短時間で半田付は温度（約２３０℃以
上）まで加熱してクリーム半田を溶融させて電子部品を
基板上の導電回路に半田付けする装置である。Conventional technology Reflow soldering equipment involves applying paste-like cream solder to the areas where electronic components are mounted on a board such as a polymer board, and then conveying the board using a conveyor and preheating it using a breech heater. In the final stage, soldering is performed using a heater that heats the cream solder in a short time to a temperature (about 230°C or higher) to melt the cream solder and solder the electronic components to the conductive circuit on the board. be.
従来のリフロー半田付は装置においては、空気中におい
て、ヒータから放射される赤外線を直接電子部品を搭載
した基板に照射して加熱するものが主流であり、基板の
温度は基板の搬送速度を調節して制御しければならず、
該基板の温度を所望の温度範囲内に制御することは非常
に困難である欠点があった。Conventional reflow soldering equipment heats the board on which electronic components are mounted by directly irradiating infrared rays emitted from a heater in the air, and the temperature of the board is controlled by adjusting the board transfer speed. must be controlled by
There is a drawback that it is very difficult to control the temperature of the substrate within a desired temperature range.
またこのような加熱方法の欠点を改良するものとして本
願出願人は加熱した空気を循環させて半田付けする加熱
空気循環方式を採用したリフロー半田付は方法及び装置
を開発して特許出願を行った（特願昭６２−１２０７１
及び特願昭６２１１５４５６）が、該発明においても、
またヒータから放射される赤外線による従来の基板加熱
方法においても、いずれも空気中で基板を高温（例えば
２３０℃）に加熱して半田を溶融させるので、空気中の
酸素が溶融した半田及び電子部品のリード線等に作用し
て酸化させてしまい、十分な半田付は性能が得られず、
航空機、ロケ・ノド及び医療機器等の人命に直接関係す
るような高度な機械の制御、又はコンピュータ等の超高
信頼性を必要とする機器に使用し得る完成基板を製作す
るには不十分であった。In order to improve the shortcomings of such heating methods, the applicant has developed a method and apparatus for reflow soldering that employs a heated air circulation method for soldering by circulating heated air, and has filed a patent application. (Patent application 1986-12071
and Japanese Patent Application No. 62115456), but also in the invention,
In addition, in conventional board heating methods using infrared rays emitted from a heater, the board is heated in the air to a high temperature (for example, 230°C) to melt the solder, so the oxygen in the air melts the solder and electronic components. It acts on the lead wires etc. and oxidizes them, making it impossible to obtain sufficient soldering performance.
It is insufficient to manufacture finished substrates that can be used to control advanced machinery that is directly related to human life, such as aircraft, location equipment, and medical equipment, or for equipment that requires ultra-high reliability such as computers. there were.
そこで本願出願人は、このような極めて高信頼性を要求
する機器に使用される基板の半田付けを十分に可能とし
得るリフロー半田付は装置を完成し、特許出願を行った
（特願平１−１４１４７９）。該発明は、不活性ガス（
例えば窒素ガス）を充満させた不活性ガス室内において
、該不活性ガスを加熱して基板に接触させて該基板を半
田付は温度まで加熱して半田付けした後、冷却した不活
性ガスを基板に接触させて冷却することにより、全半田
付は工程を不活性ガス中で行い、半田及び電子部品のリ
ード線の酸化を完全に防止するようにして超高信頼性の
半田付けを可能としたリフロー半田付は装置である。Therefore, the applicant of the present application has completed a reflow soldering device that can fully enable the soldering of circuit boards used in devices that require extremely high reliability, and has filed a patent application (Patent Application No. -141479). The invention provides an inert gas (
For example, in an inert gas chamber filled with nitrogen gas, the inert gas is heated and brought into contact with the board to solder the board.After the board is heated to a temperature and soldered, the cooled inert gas is All soldering processes are performed in an inert gas by contacting and cooling the solder, which completely prevents oxidation of the solder and electronic component lead wires, making it possible to achieve ultra-high reliability soldering. Reflow soldering is a device.
この発明においては、不活性ガス室と外部とに連通ずる
わずかな隙間、例えば送風機の軸受と軸との間の隙間か
らの外部空気の流入を防止するため、該軸受部分を囲繞
して周囲から仕切り、ここに予圧室を設け、該予圧室に
外部から不活性ガスを供給してここを増圧し、不活性ガ
スを該隙間から外部に少しずつ出しながら、不活性ガス
室内にも供給するように構成して不活性ガス室内の酸素
濃度が高まらないように構成した。In this invention, in order to prevent the inflow of external air from a small gap that communicates between the inert gas chamber and the outside, for example, the gap between the bearing and the shaft of a blower, the bearing part is surrounded and removed from the surroundings. A pre-pressure chamber is provided in the partition, and inert gas is supplied from the outside to the pre-pressure chamber to increase the pressure, and while the inert gas is gradually released outside through the gap, it is also supplied to the inert gas chamber. The structure was designed to prevent the oxygen concentration in the inert gas chamber from increasing.
しかしながらこの構成によると、不活性ガス室内の酸素
濃度が、送風機の回転が低い場合にはかなり低く、例え
ば１１０００ｐｐ程度に保持できるのであるが、１２０
０＝１４０Ｏｒｐｍの中、高速回転域では酸素濃度が１
％（１００００ｐｐｍ）にまで上昇してしまい、しかも
外部から供給する不活性ガスの消費量も極めて多くなり
、甚だ不経済であるということが判明した。その理由は
、送風機の軸受部は該送風機の吸引作用により負圧とな
る部分に位置するため、予圧室にかなりの量の不活性ガ
スを外部から供給しても不活性ガス室側に大量に吸引さ
れてしまい、送風機の回転が速くなるほどこの負圧が大
きくなるため、予圧室は増圧されるよりむしろ更に負圧
が大きくなり、ついには軸受の隙間から空気を吸い込ん
でしまい、これによって不活性ガス室内の酸素濃度が急
激に高まることになる、というものであり、上記構成で
はこの欠点を解消することはできなかった。However, according to this configuration, when the rotation of the blower is low, the oxygen concentration in the inert gas chamber can be kept quite low, for example, about 11,000 pp, but it can be maintained at about 120 pp.
At 0=140 rpm, the oxygen concentration is 1 in the high speed rotation range.
% (10,000 ppm), and the consumption of inert gas supplied from the outside also became extremely large, which turned out to be extremely uneconomical. The reason for this is that the bearing part of the blower is located in a part where negative pressure occurs due to the suction action of the blower. The faster the blower rotates, the greater this negative pressure becomes, so the negative pressure in the prepressure chamber becomes even greater rather than being increased, and eventually air is sucked in through the bearing gap, which causes undesirable damage. This means that the oxygen concentration in the active gas chamber will increase rapidly, and this drawback cannot be overcome with the above configuration.
目 的
本発明は、上記した従来技術の欠点を除くためになされ
たものであって、その目的とするところは、不活性ガス
を充満させた不活性ガス室と、該不活性ガス室内の気体
を循環させる送風機と、該送風機の作用により前記不活
性ガスが上昇する上昇循環通路と、該送風機の作用によ
り不活性ガスが下降する下降循環通路と、該上昇循環通
路及び該下降循環通路のいずれかに配設され不活性ガス
を加熱するヒータと、電子部品が搭載された基板を不活
性ガス室内で搬送するコンベアとを備えたリフロー半田
付は装置において、不活性ガス室と外部とに連通ずるわ
ずかな隙間のうち送風機の吸引作用により負圧となる部
分を囲繞して周囲から仕切られた空間部を設け、該空間
部に送風機の吐出作用により増圧された不活性ガスを導
入して咳空間部を増圧させる連通管を備え、不活性ガス
室内を循環している不活性ガスを利用して該空間部を大
気圧よりも増圧し、外部からは絶対に空気が不活性ガス
室内に流入しないように、またむしろ隙間からは少しず
つ不活性ガスを外部に流出させることにより、不活性ガ
ス室内の酸素濃度を極めて低い状態、例えば１０ｐｐｍ
程度に抑制することであり、またこれによって高信頼性
の半田付けを可能とすることである。また他の目的は、
送風機の吐出作用により増圧された不活性ガスを用いる
ことにより、送風機の回転速度が増すにつれて隙間の周
囲の空間部の圧力を益々増大させ、送風機の高速回転を
可能として、リフロー半田付は装置の能力を向上させる
ことである。また他の目的は、外部から不活性ガスを供
給して不活性ガス室内部の酸素濃度を低く保持する必要
性をなくすことにより高価な不活性ガスの消費量を大幅
に削減し、リフロー半田付は装置のランニングコストを
低減させることである。Purpose The present invention was made in order to eliminate the drawbacks of the above-mentioned prior art, and its purpose is to provide an inert gas chamber filled with an inert gas, and a gas in the inert gas chamber. an air blower that circulates the inert gas, an upward circulation passage in which the inert gas rises due to the action of the blower, a downward circulation passage in which the inert gas descends due to the action of the blower, and either the upward circulation passage or the downward circulation passage. Reflow soldering is a device that is equipped with a heater that heats inert gas and a conveyor that transports the board with electronic components inside the inert gas chamber. A space is created that is separated from the surrounding area by surrounding the part of the small gap that leads to negative pressure due to the suction action of the blower, and an inert gas whose pressure is increased by the discharge action of the blower is introduced into the space. It is equipped with a communication pipe that increases the pressure in the cough space, and uses the inert gas circulating in the inert gas chamber to increase the pressure in the space above atmospheric pressure, ensuring that no air enters the inert gas chamber from outside. The oxygen concentration in the inert gas chamber is kept at an extremely low level, for example 10 ppm, by preventing the inert gas from flowing into the inert gas chamber, or rather by letting the inert gas flow out little by little from the gap.
The purpose is to suppress this to a certain extent, and thereby enable highly reliable soldering. In addition, other purposes are
By using inert gas that is pressurized by the blower's discharge action, as the rotational speed of the blower increases, the pressure in the space around the gap increases, allowing the blower to rotate at high speed. The aim is to improve the ability of Another objective is to significantly reduce the consumption of expensive inert gas by eliminating the need to maintain a low oxygen concentration inside the inert gas chamber by supplying inert gas from the outside, and to improve reflow soldering. The purpose is to reduce the running cost of the equipment.
構成
要するに本発明は、不活性ガスを充満させた不活性ガス
室と、該不活性ガス室内の気体を循環させる送風機と、
該送風機の作用により前記不活性ガスが上昇する上昇循
環通路と、該送風機の作用により前記不活性ガスが下降
する下降循環通路と、該上昇循環通路及び該下降循環通
路のいずれかに配設され前記不活性ガスを加熱するヒー
タと、電子部品が搭載された基板を前記不活性ガス室内
で搬送するコンベアとを備えたリフロー半田付は装置に
おいて、前記不活性ガス室と外部とに連通ずるわずかな
隙間のうち前記送風機の吸引作用により負圧となる部分
を囲繞して周囲から仕切られた空間部を設け、該空間部
に前記送風機の吐出作用により増圧された前記不活性ガ
スを導入して該空間部を増圧させる連通管を備えたこと
を特徴とするものである。Configuration In short, the present invention includes an inert gas chamber filled with an inert gas, a blower that circulates the gas in the inert gas chamber,
an upward circulation passage in which the inert gas rises due to the action of the blower, a downward circulation passage in which the inert gas descends due to the action of the blower, and disposed in either the upward circulation passage or the downward circulation passage. Reflow soldering is performed in an apparatus equipped with a heater that heats the inert gas and a conveyor that conveys a board on which electronic components are mounted within the inert gas chamber. A space partitioned off from the surroundings is provided surrounding a portion of the gap where the pressure becomes negative due to the suction action of the blower, and the inert gas whose pressure is increased by the discharge action of the blower is introduced into the space. The device is characterized in that it includes a communication pipe that increases the pressure in the space.
以下本発明を図面に示す実施例に基いて説明する。第１
図において、本発明に係るリフロー半田付は装置１は、
不活性ガスを充満させた不活性ガス室２と、該不活性ガ
ス室内の気体を循環させる送風機３と、該送風機の作用
により不活性ガスが上昇する上昇循環通路７Ｕと、送風
機３の作用により不活性ガスが下降する下降循環通路７
Ｄと、上昇循環通路７Ｕ及び下降循環通路７Ｄのいずれ
かに配設され前記不活性ガスを加熱するヒータ５と、電
子部品６が搭載された基板８を不活性ガス室２内で搬送
するコンベア９とを備えたリフロー半田付は装置におい
て、不活性ガス室２と外部１０とに連通ずるわずかな隙
間１１のうち送風機３の吸引作用により負圧となる部分
を囲繞して周囲から仕切られた空間部１２を設け、該空
間部に送風機３の吐出作用により増圧された不活性ガス
を導入して該空間部を増圧させる連通管１３を備えたも
のである。The present invention will be explained below based on embodiments shown in the drawings. 1st
In the figure, the reflow soldering apparatus 1 according to the present invention is
An inert gas chamber 2 filled with inert gas, a blower 3 that circulates the gas in the inert gas chamber, an upward circulation passage 7U in which the inert gas rises due to the action of the blower, and Descending circulation passage 7 in which inert gas descends
D, a heater 5 disposed in either the ascending circulation passage 7U or the descending circulation passage 7D and heating the inert gas, and a conveyor that conveys the board 8 on which the electronic component 6 is mounted within the inert gas chamber 2. 9, the reflow soldering device is equipped with a small gap 11 that communicates with the inert gas chamber 2 and the outside 10, which surrounds and partitions off the part that becomes negative pressure due to the suction action of the blower 3. A space 12 is provided, and a communication pipe 13 is provided for introducing an inert gas whose pressure has been increased by the discharge action of the blower 3 into the space to increase the pressure of the space.
第１図において、送風機３は、例えばシロッコファン等
の遠心送風機であり、予備加熱室及び半田付は室に夫々
配設されている。該送風機は複数のブレード３ａを上部
のドーナツ形円板３ｂと下部の円板３Ｃとに固定して形
成されており、円板３Ｃは回転軸１４の上端１４ａに固
着されており、回転軸１４は不活性ガス室２のケーシン
グ１５が固定されている基台１６に固定された一対の軸
受１８にまり回動自在に支承されており、ケーシング１
５を貫通して不活性ガス室２内と外部１０との間にわた
って回動自在に配設されている。ケーシング１５から外
部１０に回転軸１４が突出す″る部分及び囲い１９から
不活性ガス室２内に回転軸１４が突出する部分にはシー
ル部材２０．２１が夫々装着されているが、それでも該
部分には必ずわずかな隙間１１が存在することになる。In FIG. 1, the blower 3 is a centrifugal blower such as a sirocco fan, and a preheating chamber and a soldering chamber are respectively provided. The blower is formed by fixing a plurality of blades 3a to an upper donut-shaped disk 3b and a lower disk 3C, and the disk 3C is fixed to the upper end 14a of a rotating shaft 14. is rotatably supported by a pair of bearings 18 fixed to a base 16 to which the casing 15 of the inert gas chamber 2 is fixed.
5 and is rotatably disposed between the inside of the inert gas chamber 2 and the outside 10. Although sealing members 20 and 21 are installed at the portion where the rotating shaft 14 projects from the casing 15 to the outside 10 and from the enclosure 19 into the inert gas chamber 2, sealing members 20 and 21 are installed, respectively. There will always be a slight gap 11 between the parts.
回転軸１４の下端１４ｂに固定されたプーリ２２には■
ベルト２３が巻き掛けられ、該Ｖベルトは送風機３を駆
動するための電動モータ２４の回転軸２４ａに固定され
たブー＋７２５に巻き掛けられ、電動モータ２４はプラ
ケット２６を介して基台１６に固定されている。The pulley 22 fixed to the lower end 14b of the rotating shaft 14 has ■
A belt 23 is wound around the V-belt, and the V-belt is wound around a boot +725 fixed to the rotating shaft 24a of an electric motor 24 for driving the blower 3, and the electric motor 24 is fixed to the base 16 via a placket 26. has been done.
囲い１９は隙間１１の部分を囲繞して周囲と仕切るため
に配設されており、ケーシング１５の内側に固着され、
その−側面１９ａには連通穴１９ｂが形成され、該連通
穴に連通管１３が連通接続されている。連通管１３は、
第２図から第４図も参照して、囲い１つから上方に立ち
上がり、その開口部１３ｂは送風機３のブレード３ａの
厚さ方向の中央部の上昇循環通路７Ｕに位置し、最も圧
力の高い不活性ガスを該連通管内に取り入れ、囲い１９
の空間部１２を増圧するようにしたものである。The enclosure 19 is arranged to surround the gap 11 and separate it from the surroundings, and is fixed to the inside of the casing 15.
A communication hole 19b is formed in the negative side surface 19a, and a communication pipe 13 is connected to the communication hole. The communication pipe 13 is
2 to 4, it rises upward from one enclosure, and its opening 13b is located in the ascending circulation passage 7U at the center in the thickness direction of the blades 3a of the blower 3, and has the highest pressure. An inert gas is introduced into the communication pipe, and the enclosure 19
The pressure in the space 12 is increased.
またケーシング１５の上部１５ａは断熱材２８で構成さ
れているため、該断熱材とケーシング１５の下部１５ｂ
とは隙間１１の部分でリベット２９等を用いて継ぎ合わ
されており、該隙間からも外部の空気が流入するので、
囲い１９により隙間１１を囲繞し、空間部１２を形成し
て、該空間部を周囲から仕切ってあり、囲い１９の一側
面１９ａには連通穴１９ｂが形成され、連通管１３は該
連通穴に連通接続されている。Further, since the upper part 15a of the casing 15 is made of a heat insulating material 28, the lower part 15b of the casing 15 is
and are joined together using rivets 29 etc. at the gap 11, and outside air also flows in from the gap, so
The enclosure 19 surrounds the gap 11 to form a space 12 and partition the space from the surroundings, and a communication hole 19b is formed in one side 19a of the enclosure 19, and the communication pipe 13 is inserted into the communication hole. It is connected in communication.
循環通路７は、送風機３によって吸引された不活性ガス
がヒータ５に流入して加熱され基板８に接触する下降循
環通路７Ｄと、送風機３から吐出される不活性ガスが上
昇してヒータ５の上方に戻される上昇循環通路７Ｕとが
連通しｔ形成されており、基板８の搬送方向に対して左
右両方向にケーシング１５と内部ケーシング３０との間
に上昇循環ｉＩｌ路７Ｕが形成されている。The circulation passage 7 is divided into a descending circulation passage 7D in which the inert gas sucked by the blower 3 flows into the heater 5 to be heated and comes into contact with the substrate 8, and a descending circulation passage 7D in which the inert gas discharged from the blower 3 rises and flows into the heater 5. An upward circulation path 7U to be returned upward is connected to the upper circulation path 7U, and an upward circulation path 7U is formed between the casing 15 and the internal casing 30 in both left and right directions with respect to the conveyance direction of the substrate 8.
ヒータ５は、不活性ガスを流入させながら加熱するもの
であって、所定の間隔で配設された電熱器３１を熱伝導
性の良好な金属、例えばアルミニウムからなる金属板３
２でサントイフチ構造に上下から挟圧保持し、金属板３
２には不活性ガスがその板厚方向に流れて熱交換が行わ
れるようにした多数の穴３２ａが設けられている。そし
て電熱器３１は外部の電源（図示せず）に電気的に接続
されて電力を供給されるようになっている。またヒータ
５の下方には温度センサ３３が下降循環通路７Ｄの略中
央部に設置され、図示しないコンピュータに接続されて
いる。The heater 5 heats while inert gas flows in, and connects electric heaters 31 arranged at predetermined intervals to metal plates 3 made of a metal with good thermal conductivity, such as aluminum.
2, press and hold the metal plate 3 from above and below in the Santoifti structure.
2 is provided with a large number of holes 32a through which inert gas flows in the thickness direction of the plate for heat exchange. The electric heater 31 is electrically connected to an external power source (not shown) and is supplied with power. Further, below the heater 5, a temperature sensor 33 is installed approximately at the center of the descending circulation passage 7D, and is connected to a computer (not shown).
基板排出コンベア３４は、例えばエンドレスのメツシュ
チェーン３５を図示しないガイドローラに巻き掛けて構
成されており、上側のメツシュチェーン３５を図示しな
い電動モータにより基Ｆｉ８の搬送方向と逆方向に移動
させるようになっている。The substrate discharge conveyor 34 is configured by, for example, an endless mesh chain 35 wound around a guide roller (not shown), and the upper mesh chain 35 is moved by an electric motor (not shown) in a direction opposite to the conveying direction of the substrate Fi8. It looks like this.
なお、不活性ガスとしては、窒素ガスが最も安価で実用
的であるが、アルゴンガスその他の不活性ガスを用いる
ことも勿論可能である。Note that nitrogen gas is the cheapest and most practical inert gas, but it is of course possible to use argon gas or other inert gases.
作用
本発明は、上記のように構成されており、以下その作用
について説明する。モータ２４が回転することにより、
その回転軸２４ａ及びプーリ２５を介してＶベルト２３
がプーリ２２を駆動し、これによって回転軸２４が一方
向に回転して送風機３の各ブレード３ａが高速度で回転
する。すると下降循環通路７Ｄ内は負圧となるため不活
性ガス室２上方の不活性ガスは矢印Ａ方向に金属板３２
の穴３２ａに流入し、ヒータ５により加熱された金属板
３２と熱交換して加熱された後更に下降して搬送装置９
によって搬送される基板８に接触して該基板及び搭載さ
れた電子部品６を加熱する。Function The present invention is constructed as described above, and its function will be explained below. As the motor 24 rotates,
V-belt 23 via its rotating shaft 24a and pulley 25
drives the pulley 22, which causes the rotating shaft 24 to rotate in one direction, causing each blade 3a of the blower 3 to rotate at high speed. Then, since the inside of the descending circulation passage 7D becomes negative pressure, the inert gas above the inert gas chamber 2 moves toward the metal plate 32 in the direction of arrow A.
It flows into the hole 32a, exchanges heat with the metal plate 32 heated by the heater 5, is heated, and then further descends to the conveying device 9.
The substrate 8 is brought into contact with the substrate 8 and the electronic components 6 mounted thereon are heated.
そして排出コンベア３４を通過した不活性ガスは送風機
３により吸引され、矢印Ｂ方向に左右に流れて上昇循環
通路７Ｕ内を矢印Ｃの如く上昇してヒータ５の上方に戻
る。このときヒータ５によって加熱された不活性ガスの
温度は、温度センサ３３により検出されてその検出結果
がコンピュータに送られ、該コンピュータが所定の温度
の不活性ガスが得られるように常時電熱器３Ｉに供給す
る電力の調節を行い、予備加熱室の温度は約１５０℃に
、半田付は室の温度は約２３０’Ｃに夫々保たれる。The inert gas that has passed through the discharge conveyor 34 is sucked by the blower 3, flows left and right in the direction of arrow B, rises in the upward circulation passage 7U as shown by arrow C, and returns above the heater 5. At this time, the temperature of the inert gas heated by the heater 5 is detected by the temperature sensor 33, and the detection result is sent to the computer. The temperature of the preheating chamber is maintained at approximately 150°C, and the temperature of the soldering chamber is maintained at approximately 230'C.
予備加熱室の不活性ガス室２に搬入された基板８は、約
１５０℃に加熱されて循環している不活性ガスに接触し
て加熱されるが、該循環する不活性ガスの流速は、３ｍ
／ｓｅｃ程度であるので、クリーム半田によって小さな
力で基板８に固定された電子部品６が動いたりすること
はなく、また加熱された不活性ガスによって加熱される
ので、該不活性ガスの温度以上には加熱されることがな
く、徐々に基板８が均一に加熱される。The substrate 8 carried into the inert gas chamber 2 of the preheating chamber is heated to about 150° C. and is heated by contacting the circulating inert gas, but the flow rate of the circulating inert gas is as follows. 3m
/sec, so the electronic component 6 fixed to the board 8 will not move due to small force by the cream solder, and since it is heated by the heated inert gas, the temperature will be higher than the temperature of the inert gas. The substrate 8 is gradually and uniformly heated without being heated.
半田付は室の不活性ガス室２に搬入された基板８は、こ
こで約２３０℃に加熱された不活性ガスと接触して加熱
され、クリーム半田が溶融して電子部品６が基板８に半
田付けされる。The board 8 is carried into the inert gas chamber 2 of the soldering chamber, where it comes into contact with inert gas heated to about 230°C and is heated, melting the cream solder and attaching the electronic component 6 to the board 8. be soldered.
予備加熱室及び半田付は室においては、基板８及び電子
部品６が上述した如く加熱されて金属部分が露出して周
囲の酸素と結合して酸化し易い状態となるが、該予備加
熱室及び半田付は室内には不活性ガス、例えば窒素ガス
が充満しており、酸素濃度はわずか１００〜１１０００
ｐｐ、好ましくはｌＱｐｐｍ程度に保たれているので、
溶融半田、電子部品６のリード線が酸化することがなく
、理想的な半田付けが行われる。In the preheating chamber and soldering chamber, the board 8 and the electronic components 6 are heated as described above, and the metal parts are exposed and combine with surrounding oxygen to become easily oxidized. During soldering, the room is filled with an inert gas, such as nitrogen gas, and the oxygen concentration is only 100 to 11,000.
pp, preferably about lQppm, so
Ideal soldering is performed without oxidizing the molten solder or the lead wires of the electronic components 6.
しかしながら、回転軸１４とシール部材２０との間の隙
間ｔｔ、該回転回転軸−ル部材２１との間の隙間１１及
びケーシング１５の上部１５ａと下部１５ｂとの間の隙
間１１は、送風機３の吸引作用により負圧となっている
ため、従来ではこれらの部分から外部１０の空気が吸い
込まれて不活性ガス室２内の酸素濃度が上昇し、試験に
よると、送風機３の回転速度が１２００−１４０Ｏｒｐ
ｍの中、高速回転域では回転軸１４の周囲の圧力は、−
３１〜−３５ｍｍＡｑの負圧となるため、該酸素濃度は
１％（１００００ｐｐｍ）にもなってしまったが、本発
明装置では、このような欠点が兄事に改善された。However, the gap tt between the rotation shaft 14 and the seal member 20, the gap 11 between the rotation shaft and the seal member 21, and the gap 11 between the upper part 15a and the lower part 15b of the casing 15 are Since the suction action creates a negative pressure, conventionally the air from the outside 10 is sucked in from these parts, increasing the oxygen concentration in the inert gas chamber 2, and according to tests, the rotational speed of the blower 3 is 1200 - 140Orp
m, the pressure around the rotating shaft 14 in the high speed rotation range is -
Since the negative pressure was 31 to -35 mmAq, the oxygen concentration was as high as 1% (10,000 ppm), but in the device of the present invention, such drawbacks have been significantly improved.
即ち、送風機３が１４００ｒｐｍの高速回転をしても、
高圧の不活性ガスが連通管１３の開口部１３ｂから矢印
り、 Ｈの如く導入されて囲い１９内に入り、空間部
１２内が３１〜３５ｍｍＡｑの正圧に保たれ、外部１０
から空気が吸引されることが皆無となった。この結果、
不活性ガス室２内の酸素濃度は１０ｐｐｍ以下に保持で
きることが判明した。That is, even if the blower 3 rotates at a high speed of 1400 rpm,
High-pressure inert gas is introduced from the opening 13b of the communication pipe 13 as indicated by the arrow H and enters the enclosure 19, and the inside of the space 12 is maintained at a positive pressure of 31 to 35 mmAq, and the outside 10
No more air was sucked in. As a result,
It has been found that the oxygen concentration within the inert gas chamber 2 can be maintained at 10 ppm or less.
またこのことはケーシング１５の隙間１１についても同
様で、上昇循環通路７Ｕを上昇する高圧の不活性ガスが
連通管工３から囲い１９内の空間部１２内に矢印り、Ｈ
の如く導入されて該空間部が正圧に保持され、この部分
からも外部の空気が不活性ガス室２内に吸引されること
が全くなく、酸素濃度が上昇するおそれがない。The same applies to the gap 11 of the casing 15, and the high-pressure inert gas rising in the ascending circulation passage 7U flows from the communicating pipework 3 into the space 12 in the enclosure 19, causing H
The space is maintained at a positive pressure by being introduced as shown in FIG.
また本発明では、送風機３の回転速度が高くなればなる
ほど隙間１１の部分の圧力が高くなるので、送風機３の
回転速度に比例して不活性ガス室２内の密封度が良好と
なることがわかった。Furthermore, in the present invention, the higher the rotational speed of the blower 3, the higher the pressure in the gap 11, so the degree of sealing in the inert gas chamber 2 can be improved in proportion to the rotational speed of the blower 3. Understood.
なお、隙間１１からはわずかに不活性ガスが矢印Ｆの如
く外部１０に流出するが、この隙間１１は非常に小さい
ので、不活性ガスの流出量は微々たるものであり、内部
の酸素濃度を上昇させることによる半田付は性能の低下
の損失に比べれば問題にならない程度のものである。Note that a small amount of inert gas flows out from the gap 11 to the outside 10 as shown by arrow F, but since this gap 11 is very small, the amount of inert gas flowing out is minute, and the oxygen concentration inside is reduced. The soldering caused by the elevation is negligible compared to the loss in performance.
効果
本発明は、上記のように不活性ガスを充満させた不活性
ガス室と、該不活性ガス室内の気体を循環させる送風機
と、該送風機の作用により前記不活性ガスが上昇する上
昇循環通路と、該送風機の作用により不活性ガスが下降
する下降循環通路と、該上昇循環通路及び該下降循環通
路のいずれかに配設され不活性ガスを加熱するヒータと
、電子部品が搭載された基板を不活性ガス室内で搬送す
るコンベアとを備えたリフロー半田付は装置において、
不活性ガス室と外部とに連通ずるわずかな隙間のうち送
風機の吸引作用により負圧となる部分を囲繞して周囲か
ら仕切られた空間部を設け、該空間部に送風機の吐出作
用により増圧された不活性ガスを導入して該空間部を増
圧させる連通管を備え、不活性ガス室内を循環している
不活性ガスを利用して該空間部を大気圧よりも増圧し、
外部からは絶対に空気が不活性ガス室内に流入しないよ
うに、またむしろ隙間からは少しずつ不活性ガスを外部
に流出させるようにしたので、不活性ガス室内の酸素濃
度を極めて低い状態、例えば１０ｐｐｍ程度に抑制する
ことができる効果があり、またこの結果高信頼性の半田
付けを可能し得る効果が得られる。また送風機の吐出作
用により増圧された不活性ガスを用いるため、送風機の
回転速度が増すにつれて隙間の周囲の空間部の圧力を益
々増大させ、送風機の高速回転を可能として、リフロー
半田付は装置の能力を向上させることができる効果があ
る。また外部から不活性ガスを供給して不活性ガス室内
部の酸素濃度を低く保持する必要性がなくなるため、高
価な不活性ガスの消費量を大幅に削減し、リフロー半田
付は装置のランニングコストを低減させることができる
効果がある。Effects The present invention provides an inert gas chamber filled with an inert gas as described above, a blower that circulates the gas in the inert gas chamber, and an upward circulation passageway in which the inert gas rises due to the action of the blower. a descending circulation passage in which the inert gas descends by the action of the blower; a heater disposed in either the ascending circulation passage or the descending circulation passage to heat the inert gas; and a board on which electronic components are mounted. The reflow soldering equipment is equipped with a conveyor that transports the
In the small gap that communicates between the inert gas chamber and the outside, a space is created that surrounds the part that becomes negative pressure due to the suction action of the blower and is partitioned off from the surroundings, and the pressure in this space is increased by the discharge action of the blower. a communication pipe for introducing an inert gas into the space to increase the pressure in the space, and using the inert gas circulating in the inert gas chamber to increase the pressure in the space above atmospheric pressure,
By making sure that no air enters the inert gas chamber from outside, and rather allowing the inert gas to flow out little by little through the gaps, the oxygen concentration inside the inert gas chamber can be kept at an extremely low level, e.g. This has the effect of suppressing the amount to about 10 ppm, and as a result, it is possible to achieve highly reliable soldering. In addition, since inert gas that is pressurized by the blower's discharge action is used, as the rotational speed of the blower increases, the pressure in the space around the gap increases, enabling the blower to rotate at high speed. It has the effect of improving the ability of In addition, since there is no need to supply inert gas from the outside to maintain a low oxygen concentration inside the inert gas chamber, the consumption of expensive inert gas is significantly reduced, and reflow soldering reduces equipment running costs. It has the effect of reducing
図面は本発明の実施例に係り、第１図は基板の搬送方向
から見たリフロー半田付は装置の縦断面図、第２図は要
部横断面図、第３図は囲い及び連通管の斜視図、第４図
は要部縦断面図、第５図は要部破談斜視図である。
１はリフロー半田付は装置、２は不活性ガス室、３は送
風機、５はヒータ、６は電子部品、７は循環通路、７Ｕ
は上昇循環通路、７Ｄは下降循環通路、８は基板、ｌＯ
は外部、１１は隙間、１２は空間部、１３は連通管であ
る。The drawings relate to embodiments of the present invention, and FIG. 1 is a vertical cross-sectional view of the reflow soldering device viewed from the board conveyance direction, FIG. 2 is a cross-sectional view of the main part, and FIG. FIG. 4 is a longitudinal sectional view of the main part, and FIG. 5 is a perspective view of the main part. 1 is a reflow soldering device, 2 is an inert gas chamber, 3 is a blower, 5 is a heater, 6 is an electronic component, 7 is a circulation path, 7U
is an upward circulation passage, 7D is a downward circulation passage, 8 is a substrate, IO
11 is a gap, 12 is a space, and 13 is a communicating pipe.
Claims (1)
ス室内の気体を循環させる送風機と、該送風機の作用に
より前記不活性ガスが上昇する上昇循環通路と、該送風
機の作用により前記不活性ガスが下降する下降循環通路
と、該上昇循環通路及び該下降循環通路のいずれかに配
設され前記不活性ガスを加熱するヒータと、電子部品が
搭載された基板を前記不活性ガス室内で搬送するコンベ
アとを備えたリフロー半田付け装置において、前記不活
性ガス室と外部とに連通するわずかな隙間のうち前記送
風機の吸引作用により負圧となる部分を囲繞して周囲か
ら仕切られた空間部を設け、該空間部に前記送風機の吐
出作用により増圧された前記不活性ガスを導入して該空
間部を増圧させる連通管を備えたことを特徴とするリフ
ロー半田付け装置。an inert gas chamber filled with an inert gas; a blower that circulates the gas in the inert gas chamber; an upward circulation passage in which the inert gas rises due to the action of the blower; A descending circulation passage through which the active gas descends, a heater disposed in either the ascending circulation passage or the descending circulation passage to heat the inert gas, and a board on which electronic components are mounted are placed in the inert gas chamber. In a reflow soldering apparatus equipped with a conveyor, a space partitioned off from the surroundings by surrounding a part of the small gap communicating between the inert gas chamber and the outside that becomes negative pressure due to the suction action of the blower. 1. A reflow soldering apparatus, characterized in that the reflow soldering apparatus is provided with a communication pipe that introduces the inert gas whose pressure has been increased by the discharge action of the blower into the space and increases the pressure of the space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20223889A JPH0377773A (en) | 1989-08-02 | 1989-08-02 | Reflow soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20223889A JPH0377773A (en) | 1989-08-02 | 1989-08-02 | Reflow soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377773A true JPH0377773A (en) | 1991-04-03 |
Family
ID=16454245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20223889A Pending JPH0377773A (en) | 1989-08-02 | 1989-08-02 | Reflow soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377773A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0576680U (en) * | 1992-03-04 | 1993-10-19 | 千住金属工業株式会社 | Preheater for automatic soldering equipment |
| US5358166A (en) * | 1992-04-16 | 1994-10-25 | Hitachi Techno Engineering Co. Ltd. | Reflow soldering apparatus |
| US5467912A (en) * | 1992-11-27 | 1995-11-21 | Hitachi Techno Engineering Co., Ltd. | Reflow soldering apparatus for soldering electronic parts to circuit substrate |
| CN105345193A (en) * | 2015-11-02 | 2016-02-24 | 苏州威兹泰克自动化科技有限公司 | Automatic tin welding line |
-
1989
- 1989-08-02 JP JP20223889A patent/JPH0377773A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0576680U (en) * | 1992-03-04 | 1993-10-19 | 千住金属工業株式会社 | Preheater for automatic soldering equipment |
| US5358166A (en) * | 1992-04-16 | 1994-10-25 | Hitachi Techno Engineering Co. Ltd. | Reflow soldering apparatus |
| US5467912A (en) * | 1992-11-27 | 1995-11-21 | Hitachi Techno Engineering Co., Ltd. | Reflow soldering apparatus for soldering electronic parts to circuit substrate |
| CN105345193A (en) * | 2015-11-02 | 2016-02-24 | 苏州威兹泰克自动化科技有限公司 | Automatic tin welding line |
| CN105345193B (en) * | 2015-11-02 | 2017-12-01 | 苏州威兹泰克自动化科技有限公司 | Automatic soldering line |
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