JPH0377674A - Applying method - Google Patents
Applying methodInfo
- Publication number
- JPH0377674A JPH0377674A JP21074089A JP21074089A JPH0377674A JP H0377674 A JPH0377674 A JP H0377674A JP 21074089 A JP21074089 A JP 21074089A JP 21074089 A JP21074089 A JP 21074089A JP H0377674 A JPH0377674 A JP H0377674A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- base plate
- substrate
- resist
- rectilinearly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims description 40
- 238000000576 coating method Methods 0.000 claims description 16
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 5
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 6
- 238000004528 spin coating Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
見映曵且奴
（産業上の利用分野）
本発明は、方形状の基板表面に液体を塗布する塗布方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Application The present invention relates to a coating method for coating a liquid onto the surface of a rectangular substrate.
（従来の技術）
半導体装置の製造工程におけるレジスト塗布方法には、
一般に、スピンコーティング方式が多く採用されている
。この方式は、上方を大気に開放したスピンカップ内に
スピンチャックを回転可能に設け、このスピンチャック
上に吸着固定された円板状のウェハ表面にノズルよりレ
ジストを滴下し、ウニへの中心に滴下したレジストは、
スピンチャックによる遠心力によってウェハの周辺に拡
散してウェハの表面にレジスト膜を施す方式である。(Prior art) Resist coating methods in the manufacturing process of semiconductor devices include:
Generally, a spin coating method is often adopted. In this method, a spin chuck is rotatably installed in a spin cup whose upper side is open to the atmosphere, and resist is dripped from a nozzle onto the surface of a disc-shaped wafer that is suctioned and fixed onto the spin chuck, and the resist is applied to the center of the sea urchin. The dropped resist is
In this method, a resist film is applied to the surface of the wafer by spreading it around the wafer using centrifugal force from a spin chuck.
（発明が解決しようとする裸題）
しかしながら、上記の従来例によると、ウェハ等の基板
が円板状であるから均一に拡散して塗布されるが、プリ
ント基板や液晶基板等のように方形状の基板にレジスト
等を塗布するのに、上記のようなスピンコーティング方
式によると１次のような問題がある。(An open problem to be solved by the invention) However, according to the above-mentioned conventional example, since the substrate such as a wafer is disk-shaped, the coating is uniformly diffused, but when it is applied to a printed circuit board or a liquid crystal substrate, etc. When applying a resist or the like to a shaped substrate, the spin coating method described above has the following first-order problem.
方形状の基板をスピンチャックに吸着固定してスピンコ
ーティングを行なうと、方形状基板の周辺部がレジスト
液により盛り上がって厚く塗布されるので、基板の周辺
部を切り落して使用するか、或は液体の粘性を低くして
重ねて塗布する方法などが用いられていた。また、その
他の方式として。When a rectangular substrate is suctioned and fixed to a spin chuck and spin coating is performed, the periphery of the rectangular substrate is raised by the resist liquid and coated thickly. The method used was to reduce the viscosity of the compound and apply it in layers. Also, as other methods.
転写技術により基板状にローラで塗布する方式も島るが
、ピンホール等が発生するため、精密塗布工程に適する
ものではなかった。There is also a method of applying rollers to a substrate using transfer technology, but this method is not suitable for precision coating processes because it causes pinholes and the like.
本発明は、上記した従来の課題を解決するために開発し
たもので、方形状基板に液体を塗布する際に、基板全面
に均一に塗布することができ、しかも精密塗布に適する
塗布方法を提供することを目的としたものである。The present invention was developed to solve the above-mentioned conventional problems, and provides a coating method that can uniformly coat the entire surface of a rectangular substrate and is suitable for precision coating. It is intended to.
見豊立豊處
（課題を解決するための手段）
上記の目的を達成するため１本発明は、方形状の基板表
面に液体を塗布する方法において、上記基板の一方端側
に液体を直線状に供給した後、上記基板を上記液体供給
ラインと垂直方向に直線移動させて均一に塗布する塗布
方法である。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for applying a liquid to the surface of a rectangular substrate, in which the liquid is applied in a linear manner to one end of the substrate. This is a coating method in which the substrate is linearly moved in a direction perpendicular to the liquid supply line to uniformly coat the liquid.
（作 用）
本発明は、上述のように構成したから、プリント基板や
液晶基板等の基板の一方端側にレジスト液等の液体を多
数のノズルより滴下、噴射或はスプレ等の供給手段によ
り直線状に供給した後、上記基板を上記液体供給ライン
と垂直方向に直線移動させると、この移動により供給し
た液体に慣性力が働き、移動方向と反対方向に液体が移
動して基板の表面に拡散して均一に塗布される。(Function) Since the present invention is configured as described above, a liquid such as a resist liquid is applied to one end side of a substrate such as a printed circuit board or a liquid crystal substrate by a supply means such as dropping, jetting or spraying from a number of nozzles. After supplying the liquid in a straight line, when the substrate is moved in a straight line in a direction perpendicular to the liquid supply line, this movement causes an inertial force to act on the supplied liquid, causing the liquid to move in the opposite direction to the direction of movement and onto the surface of the substrate. Diffuses and applies evenly.
（実施例）
以下に本発明をレジスト液の塗布方法に適用した一実施
例を図面に従って説明する。(Example) An example in which the present invention is applied to a resist liquid coating method will be described below with reference to the drawings.
第１図において、プリント基板、液晶基板の如く方形状
１例えば−辺が３００〜５００■程度の基板１の表面に
液体例えばレジスト液を塗布する際に。In FIG. 1, when a liquid such as a resist liquid is applied to the surface of a rectangular substrate 1 such as a printed circuit board or a liquid crystal substrate, the negative side is about 300 to 500 cm.
基板１の一方”端側例えば同図において、右端側にレジ
スト液を直線状に供給する手段を設ける１本例において
、この供給手段は、レジスト液を滴下。In one embodiment, means for linearly supplying the resist solution is provided on one end of the substrate 1, for example, on the right end in the figure, and this supply means drops the resist solution.
噴射又はスプレーするノズル２を基板１の右端上方位置
に列設する。そして、ノズル２を列設したラインと垂直
方向に基板１を直線移動させる移動手段を設ける。Nozzles 2 for ejecting or spraying are arranged in a row above the right end of the substrate 1. Then, a moving means for linearly moving the substrate 1 in a direction perpendicular to the line in which the nozzles 2 are arranged is provided.
この基板１を移動させる移動手段の各側を第２図乃至第
４図に従って説明する。Each side of the moving means for moving the substrate 1 will be explained according to FIGS. 2 to 4.
第２図は基板ｌを載置台３に水平状態に載置し。In FIG. 2, the substrate 1 is placed horizontally on the mounting table 3.
との載置台３をリニアモータ４により矢印に示すように
右方向に、例えば１００〜２００ｍ／ｓｅｃ程度の速度
で移動させる。この移動時に移動方向に対して垂直方向
にレジスト液をノズル２より供給すると、移動によりレ
ジスト液は、慣性の方向に拡散して方形状の基板ｌの全
表面に均一に塗布される。The mounting table 3 is moved by the linear motor 4 in the right direction as shown by the arrow at a speed of, for example, about 100 to 200 m/sec. When the resist liquid is supplied from the nozzle 2 in a direction perpendicular to the moving direction during this movement, the resist liquid is diffused in the direction of inertia due to the movement and is uniformly applied to the entire surface of the rectangular substrate l.
次に、第３図において、基板１の上面を中心方向に向け
、垂直面で一方向に適宜の円運動機構により円運動させ
る例を示したものである。この円運動の回転半径は、方
形基板１の長辺の５〜１０倍程度にする。この場合も上
記の例と同様に、移動方向に対して垂直位置に、ノズル
２を設け、このノズル２よりレジスト液を滴下して移動
による作用の慣性力によって、基板ｌの全面に均一にレ
ジスト液を塗布する。Next, FIG. 3 shows an example in which the upper surface of the substrate 1 is directed toward the center and is moved circularly in one direction on a vertical plane by an appropriate circular motion mechanism. The radius of rotation of this circular motion is approximately 5 to 10 times the long side of the rectangular substrate 1. In this case as well, similarly to the above example, a nozzle 2 is provided at a position perpendicular to the movement direction, and the resist solution is dropped from this nozzle 2, and the resist solution is applied uniformly over the entire surface of the substrate l by the inertial force exerted by the movement. Apply the liquid.
更に、第４図において、基板ｌを回転部材５の内側又は
外側面に、垂直状層に保持し、基板１の面を中心方向に
向け、第３図と異なり水平面で円運動させる例を示した
ものである。Further, FIG. 4 shows an example in which the substrate 1 is held in a vertical layer on the inner or outer surface of the rotating member 5, the surface of the substrate 1 is directed toward the center, and the substrate 1 is moved circularly in a horizontal plane unlike in FIG. 3. It is something that
本例においても、移動方向に対して垂直位置にノズル２
を設ける。同図において、矢印のノズル６の如くレジス
ト液を噴射して上記と同様に、基板１の全面に均一で、
かつ精密なレジスト塗布が行なわれる。In this example as well, the nozzle 2 is positioned perpendicular to the moving direction.
will be established. In the same figure, the resist liquid is sprayed as shown by the nozzle 6 shown by the arrow, and the resist liquid is uniformly distributed over the entire surface of the substrate 1 in the same way as above.
Moreover, precise resist coating is performed.
次に、上記した実施例の作用を説明する。Next, the operation of the above embodiment will be explained.
載置台３に固着したプリント基板や液晶基板或はその他
の基板１の一方端側にレジスト液を多数のノズル２より
滴下、噴射或はスプレー等の供給手段により直線状に供
給した後、上記基板ｌを液体供給ラインと垂直方向に直
線移動させると、この移動により供給したレジスト液に
慣性力が働き。After the resist solution is supplied in a linear manner to one end side of the printed circuit board, liquid crystal substrate, or other substrate 1 fixed on the mounting table 3 by a supply means such as dropping, jetting, or spraying from a number of nozzles 2, the above substrate is When l is moved linearly in a direction perpendicular to the liquid supply line, inertial force acts on the supplied resist liquid due to this movement.
移動方向と反対方向にレジスト液が移動して基板１の表
面に拡散して均一に塗布される。The resist solution moves in the opposite direction to the direction of movement and is spread and uniformly applied to the surface of the substrate 1.
なお、上記の例は、レジスト塗布について説明したが、
その他、方形状基板に適用することができる現像工程、
洗浄工程にも応用できることは勿論である。Note that the above example describes resist coating, but
In addition, a developing process that can be applied to a rectangular substrate,
Of course, it can also be applied to cleaning processes.
見豊立羞果
以上のことから明らかなように、本発明による次のよう
な有用な効果がある。As is clear from the above, the present invention has the following useful effects.
方形状基板に液体を塗布する際に、基板全面域に均一に
液体を塗布することができ、精密塗布に極めて好適な塗
布方法を提供することができる。When applying a liquid to a rectangular substrate, the liquid can be applied uniformly over the entire surface of the substrate, making it possible to provide a coating method that is extremely suitable for precision coating.
第１図は本発明における塗布方法の原理を説明した説明
図、第２図乃至第４図は本発明における塗布方法の各実
施例を示した説明図である。
１・・・・基板 ２・・・・ノズル３・・・・
載置台 ４・・・・リニアモータ５・・−・回転
部材 ６・・・・ノズル７・・・・円運動機構FIG. 1 is an explanatory diagram illustrating the principle of the coating method according to the present invention, and FIGS. 2 to 4 are explanatory diagrams showing each embodiment of the coating method according to the present invention. 1... Board 2... Nozzle 3...
Mounting table 4...Linear motor 5...Rotating member 6...Nozzle 7...Circular motion mechanism
Claims (1)
、上記基板の一方端側に液体を直線状に供給した後、上
記基板を上記液体供給ラインと垂直方向に直線移動させ
て均一に塗布することを特徴とする塗布方法。(1) In a method of applying a liquid to the surface of a rectangular substrate, the liquid is supplied linearly to one end of the substrate, and then the substrate is moved linearly in a direction perpendicular to the liquid supply line to uniformly apply the liquid. A coating method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1210740A JP2681133B2 (en) | 1989-08-17 | 1989-08-17 | Processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1210740A JP2681133B2 (en) | 1989-08-17 | 1989-08-17 | Processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377674A true JPH0377674A (en) | 1991-04-03 |
| JP2681133B2 JP2681133B2 (en) | 1997-11-26 |
Family
ID=16594330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1210740A Expired - Fee Related JP2681133B2 (en) | 1989-08-17 | 1989-08-17 | Processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2681133B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6523979B1 (en) | 1999-02-09 | 2003-02-25 | Nakanishi, Inc. | Lighting device |
| WO2007069313A1 (en) * | 2005-12-14 | 2007-06-21 | Fujitsu Limited | Resist application method |
-
1989
- 1989-08-17 JP JP1210740A patent/JP2681133B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6523979B1 (en) | 1999-02-09 | 2003-02-25 | Nakanishi, Inc. | Lighting device |
| WO2007069313A1 (en) * | 2005-12-14 | 2007-06-21 | Fujitsu Limited | Resist application method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2681133B2 (en) | 1997-11-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |