JPH0376656U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａは本考案の実施例による挟持具によつ
てチツプ状電子部品をクランプしている状態を示
す縦断側面図、同図ｂはその底面図、第２図ａ〜
ｃは前記チツプ状電子部品の製造工程を説明する
ためのチツプ状電子部品の斜視図、第３図ａ，ｂ
は前記チツプ状電子部品の半田付け工程を示す縦
断側面図、第４図ａは他の実施例による挟持具に
よつてチツプ状電子部品をクランプしている状態
を示す縦断側面図、同図ｂはその底面図、第５図
ａはさらに他の実施例による挟持具によつてチツ
プ状電子部品をクランプしている状態を示す縦断
側面図、同図ｂはその底面図、第６図及び第７図
は前記本考案による半田付け治具によつて製造し
たチツプ状電子部品の短絡不良発生率を従来技術
に比較して示すグラフ、第８図は半田付け前のチ
ツプ状電子部品の斜視図、第９図は従来例による
挟持具によつてチツプ状電子部品をクランプして
いる状態を示す縦断側面図、第１０図はチツプ状
電子部品の要部断面図である。 １０……コア、１１……巻芯部、１２……鍔部
、１３……端子電極、１４……巻線、１５……巻
線の端部、１６……半田、２０……クランプ部、
２２，２２′……熱シールド部材。 FIG. 1a is a vertical side view showing a state in which a chip-shaped electronic component is clamped by a clamping tool according to an embodiment of the present invention, FIG. 1b is a bottom view thereof, and FIGS.
c is a perspective view of the chip-shaped electronic component for explaining the manufacturing process of the chip-shaped electronic component, FIGS. 3a and 3b
FIG. 4A is a longitudinal side view showing the process of soldering the chip-shaped electronic component, FIG. 5 is a bottom view of the same, FIG. Figure 7 is a graph showing the short-circuit failure rate of chip-shaped electronic components manufactured using the soldering jig according to the present invention in comparison with that of the prior art, and Figure 8 is a perspective view of the chip-shaped electronic component before soldering. 9 is a vertical side view showing a chip-shaped electronic component being clamped by a conventional clamping tool, and FIG. 10 is a sectional view of a main part of the chip-shaped electronic component. DESCRIPTION OF SYMBOLS 10... Core, 11... Winding core part, 12... Flange part, 13... Terminal electrode, 14... Winding wire, 15... End part of winding wire, 16... Solder, 20... Clamp part,
22, 22'...Heat shield member.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外装被覆を有する巻線が巻回されたドラム形の
コアを保持し、同コアの端面部分を半田槽に浸漬
して同コアの端面に形成された端子電極に前記巻
線の端部を半田付けするためのチツプ状電子部品
半田付用保持具であつて、巻線が半田付けされる
端面を下へ向けて前記半田槽に浸漬されるコアを
挟持するための一対のクランプ部材と、該クラン
プ部材に挟持されたコアと間隔をおいて同コアを
挟むように配置され、かつ巻線が半田付けされる
端面から半田浸漬深さより小さい寸法Ｈだけ下端
が高く設定された熱シールド部材とを有すること
を特徴とするチツプ状電子部品半田付用保持具。 A drum-shaped core around which a winding wire having an outer covering is wound is held, and the end face portion of the core is immersed in a solder bath, and the end face of the winding wire is soldered to a terminal electrode formed on the end face of the core. A holder for soldering chip-shaped electronic components, which comprises a pair of clamp members for clamping a core that is immersed in the solder bath with the end surface to which the winding is soldered facing downward; A heat shield member is arranged to sandwich the core at a distance from the core held by the clamp member, and has a lower end set higher by a dimension H smaller than the solder immersion depth from the end face to which the winding is soldered. 1. A holder for soldering chip-shaped electronic components, comprising: