JPH0372692A - Method of quality control for electronic board soldering - Google Patents
Method of quality control for electronic board solderingInfo
- Publication number
- JPH0372692A JPH0372692A JP20864589A JP20864589A JPH0372692A JP H0372692 A JPH0372692 A JP H0372692A JP 20864589 A JP20864589 A JP 20864589A JP 20864589 A JP20864589 A JP 20864589A JP H0372692 A JPH0372692 A JP H0372692A
- Authority
- JP
- Japan
- Prior art keywords
- detector
- temperature
- flux
- conveyor
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 21
- 238000003908 quality control method Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 title claims description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 34
- 230000004907 flux Effects 0.000 claims abstract description 27
- 238000001514 detection method Methods 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- 230000005484 gravity Effects 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 5
- 230000032258 transport Effects 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 235000011962 puddings Nutrition 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 239000011973 solid acid Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は電子基板、すなわち、プリント基板上にＩＣ
その他の多数の電子部品を装着し、ハンダ付けしたもの
を製造する際に用いるのに好適な品質管理方法に関する
ものである。[Detailed Description of the Invention] [Industrial Application Field] This invention provides an electronic substrate, that is, an IC on a printed circuit board.
The present invention relates to a quality control method suitable for use in manufacturing products to which a large number of other electronic components are mounted and soldered.
一般に電子基板上に電子部品をハンダ付けする作業は自
動ハンダ付け装置を用いて行う。すなわち、電子基板は
下面にプリント配線を施したプリント基板の上面から下
面に配したプリント配線に向けて上下を貫いて設けた小
孔に、電子部品から突出させた電線を挿通し、前記基板
の下面に溶融したハンダを接触させてプリント配線と電
子部品の電線とをハンダ付けしている。Generally, an automatic soldering device is used to solder electronic components onto an electronic board. That is, the electronic board has printed wiring on its bottom surface, and an electric wire protruding from the electronic component is inserted into a small hole that is made from the top surface of the printed circuit board that extends from the top surface to the printed wiring arranged on the bottom surface of the board. Printed wiring and electric wires of electronic components are soldered by bringing molten solder into contact with the bottom surface.
電子基板は同一の種類のものを多数生産することが多く
、そのような作業を正確に行うためハンダの温度やプリ
ント配線にフラックスを付着さ−Ｕ。Electronic boards are often produced in large numbers of the same type, and in order to perform such work accurately, the temperature of the solder and the amount of flux attached to the printed wiring are extremely high.
る作業も自動ハンダ付け機械を用いて自動的に行ってい
る。This work is also done automatically using an automatic soldering machine.
しかしながら、それに使用されるハンダの溶融温度や、
その溶融ハンダを電子基板に接触させる時間の多寡によ
り品質にばらつきを生しる。すなわち、ハンダにより電
子基板へ印加される熱量が多過ぎるときは基板上の電子
部品を損傷しその機能を損なうことがあり、印加される
熱量が少なすぎるとハンダ付けが不充分となって接触不
良その他の機能不良を発生することになり易い。更に、
ハンダ付け作業に先立ってプリント配線の酸化被膜除去
のためなされるフラックスに含まれる固形成分と溶剤成
分との割合が正しくないと、後日、プリント配線に腐食
を生じることがあり、その耐久性を減しる。すなわち、
固形成分が過多であると配線を腐食させやすくし、過少
であるとハンダ付け不良を生しやすい。However, the melting temperature of the solder used for it,
The quality varies depending on how long the molten solder is in contact with the electronic board. In other words, if too much heat is applied to the electronic board by soldering, it may damage the electronic components on the board and impair its functionality, whereas if too little heat is applied, the soldering will be insufficient and contact failure may occur. Other malfunctions are likely to occur. Furthermore,
If the ratio of solid and solvent components in the flux used to remove the oxide layer on printed wiring prior to soldering is incorrect, it may cause corrosion to the printed wiring later, reducing its durability. Sign. That is,
Too much solid component tends to corrode the wiring, while too little solid component tends to cause poor soldering.
従来、そのような不具合を解消するため多数の計測器を
用いてハンダやフラックスの温度、或いはそれらが基板
と接触している時間など多数の作業要素の動作状況を電
気的に把握し制御して不良品の発生を防いでいるが、そ
れに使用する計測器類が無闇と多く良品を不良品と判定
する誤動作が少なくなく、製品の歩留りを低下させてい
た。Conventionally, in order to eliminate such problems, a large number of measuring instruments were used to electrically grasp and control the operating status of many work elements, such as the temperature of the solder and flux, and the time that they were in contact with the board. Although this method prevents the production of defective products, the large number of measuring instruments used for this purpose frequently malfunctions and determines good products as defective, reducing product yields.
この発明は上記不具合４解消し、ハンダ付けの品質を安
定させる上で必要な最少の計測要素を見つけると共に、
その要素を用いて品質管理を行う装置を提供することを
目的とするもので、プリント基板を移送するコンベヤの
搬送速度を検出する速度検出器と、プリント基板を加熱
するブリヒタの温度を検出する第１温度検出器、溶融ハ
ンダの温度を検出する第２温度検出器、並びにフラック
スの比重を検出する比重検出器との少なくとも４個の検
出器を備え、それら検出器から発せられる検出信号をマ
イクロプロセッサで処理して、その出力側に接続された
警報器と記録手段によって各検出器の検出信号が特定の
管理幅を越えて変化したとき警告を発すると共に、各基
板毎に製造時刻と前記少なくとも４個の検出信号の数値
を記録可能に構成した点に特徴がある。This invention solves the above-mentioned problem 4, finds the minimum measurement element necessary to stabilize the quality of soldering, and
The purpose is to provide a device that performs quality control using these elements, including a speed detector that detects the conveyance speed of the conveyor that transports the printed circuit board, and a speed detector that detects the temperature of the conveyor that heats the printed circuit board. A second temperature detector detects the temperature of the molten solder, and a specific gravity detector detects the specific gravity of the flux. The alarm and recording means connected to the output side issue a warning when the detection signal of each detector changes beyond a specific control range. The feature is that it is configured so that the numerical values of each detection signal can be recorded.
電子基板のハンダ付けにおいて品質を維持する上で管理
必要な対象としてフラックスの比重とコンベヤの速度、
およびプリヒート温度と溶融ハンダの温度との４個のデ
ータを特定の管理範囲内に維持するだけで品質のすぐれ
たハンダ付けが可能となる。The specific gravity of the flux, the speed of the conveyor,
Excellent quality soldering can be achieved simply by maintaining four pieces of data: preheat temperature and molten solder temperature within specific control ranges.
すなわち、フラックスの比重の大小によりハンダの付着
性の良否や腐食性の有無が判断される。That is, the quality of solder adhesion and the presence or absence of corrosivity of the solder are determined by the specific gravity of the flux.
また、プリヒート温度の高低によりハンダの付着性の良
否が判定できる。また、コンベヤの速度と溶融ハンダの
温度によってハンダの流動性と基板上に取付けられた電
子部品への伝熱量が把握されその熱損傷の有無の目安と
なる上、それらの情報は全て記録手段に蓄積される。Furthermore, it is possible to judge whether the adhesion of solder is good or bad depending on the preheat temperature. In addition, the fluidity of the solder and the amount of heat transferred to the electronic components mounted on the board are determined by the speed of the conveyor and the temperature of the molten solder, which can be used as a guide to the presence or absence of thermal damage, and all of this information is stored in a recording medium. Accumulated.
以下、図示の実施例によってこの発明を説明すると、図
中、ｌはこの発明に係る電子基板の品質管理装置であり
、一般に市販されている公知の自動ハンダ付機械２に付
設されている。The present invention will be described below with reference to the illustrated embodiment. In the figure, l is a quality control device for electronic boards according to the present invention, which is attached to a known automatic soldering machine 2 that is generally available on the market.
前記自動ハンダ付機械２は第３図で示すように、溶融し
たフラックスやハンダなど３を入れた槽Ｂの直上にプリ
ント基板４をコンベヤＡで搬送し、フラックスやハンダ
など３を波立て＼プリント基板４に挿着したＩＣその他
の電子部品５の脚（リード線）と、プリント基板４にメ
ツキされたプリント配線４ａとの間をハンダ３ａにより
固着するようにしたものである。As shown in FIG. 3, the automatic soldering machine 2 conveys a printed circuit board 4 by a conveyor A directly above a tank B containing molten flux, solder, etc. 3, and ripples/prints the flux, solder, etc. 3. The legs (lead wires) of an IC or other electronic component 5 inserted into the board 4 and the printed wiring 4a plated on the printed board 4 are fixed by solder 3a.
前記品質管理装置ｌは、前記プリント基板４を移送する
コンベヤＡの搬送速度を検出する第１検出器１ａと、ハ
ンダ付けの初期工程に用いられる溶融フラソクスの槽に
付設された溶融フラックスの比重を検出する第２検出器
１ｂとが備えられている。The quality control device 1 includes a first detector 1a that detects the transport speed of the conveyor A that transports the printed circuit board 4, and a first detector 1a that detects the conveyance speed of the conveyor A that transports the printed circuit board 4, and a first detector 1a that detects the specific gravity of the molten flux attached to a tank of molten flux used in the initial process of soldering. A second detector 1b for detection is provided.
なお、フラックスは公知のように被ハンダ付け部を活性
化する固形酸分とそれに流動性を持たセるためのイソプ
ロピルアルコールその他の溶剤とからなっている。検出
器はその他に溶融フランクス巾の溶剤を気化させ、フラ
ックスの活性化を図るためのプリヒート槽の温度、ハン
ダ槽Ｂの温度を検出するための第３検出器１ｃと第４検
出Ｈｄとがそれぞれ設けられており、それらの検出信号
はそれぞれマイクロプロセッサ１ｅに印加される。この
実施例ではハンダ槽の温度は大略２４６°Ｃ前後に設定
され、これが高温側に大きく変化するとプリント基板４
に設けた電子部品５を損傷するおそれを生し、逆に低す
ぎるとツララその他のはんだ（ｊけ欠陥を生しる。また
、ハンダ槽ば必ずしも一工程のみ設けられるとは限らず
、ハンダ槽Ｂで付着した過剰なハンダを除去するめため
の補助ハンダ槽が設りられることもある。１．ｄｃｌは
その補助ハンダ槽に設けられた補助温度検出器であり、
第４検出器１ｄと同様にマイクロ１０セツザ１ｅへ接続
されている。１ｒと１ｈとはそれぞれマイクロプロセッ
サ１ｅの出力部に接続される機器であり、前者１ｆばブ
ザー・ランプなどの警音・警告装置、後者１ｈはプリン
タ・磁気記憶装置などマイクロプロセッサ１ｅの出力の
記録手段である。また、１ｊはマイクロプロセッサ１ｅ
の電源であり、ライン電源とパンクアップ用電源との２
種が用意されている。Incidentally, as is well known, the flux is composed of a solid acid component for activating the parts to be soldered and isopropyl alcohol or other solvent for giving it fluidity. In addition, the detectors include a third detector 1c and a fourth detector Hd for detecting the temperature of the preheat tank for vaporizing the solvent in the width of the molten flux and activating the flux, and the temperature of the solder tank B, respectively. and their detection signals are respectively applied to the microprocessor 1e. In this embodiment, the temperature of the solder bath is set at approximately 246°C, and if this temperature changes significantly to the high temperature side, the printed circuit board
On the other hand, if the temperature is too low, it may cause icicles and other solder defects.Also, a solder bath is not necessarily provided for only one process; An auxiliary solder tank may be provided to remove excess solder adhered in step B. 1. dcl is an auxiliary temperature detector installed in the auxiliary solder tank,
Like the fourth detector 1d, it is connected to the micro 10 setzer 1e. 1r and 1h are devices connected to the output section of the microprocessor 1e, respectively, with the former 1f being an alarm/warning device such as a buzzer and lamp, and the latter 1h being a printer, magnetic storage device, etc. for recording the output of the microprocessor 1e. It is a means. In addition, 1j is the microprocessor 1e
It is a power source with two power sources: a line power source and a power source for blow-up.
Seeds are available.
次に、この装置の動作を説明する。コンベヤ八が運転さ
れ、自動ハンダ付けが開始されると、まず、プリント基
板４がプリヒート槽或いは、ハンダ槽に達したとき、第
１検出器１ａによりコンベヤＡの搬送速度と、また、第
４検出器１ｄにより溶融したハンダ３ａの温度とが検出
され、それらの信号がマイクロプロセッサＩｅに入力さ
れる。マイクロプロセッサ１ｅはこれらの信号が所定の
管理幅の中にあるか否かを判断し、それが管理幅を越え
たとき警報装置Ｉｆを通して管理者に警報を発し、コン
ベヤＡの速度やハンダの温度或いはフラックスの比重を
増減し調整することを促す。警報装置１ｆに代え、或い
は警報と同時にプリント基板４や電子部品５に印加され
る熱量が所定の多量に達したときコンベヤＡの速度を自
動的に増し、逆に、印加される熱量が所定以下の少量で
あるときはコンベヤＡの速度を自動的に減してプリンｌ
−基板４や電子部品５に作用する熱を自動的に調節する
こともできる。Next, the operation of this device will be explained. When the conveyor 8 is operated and automatic soldering is started, first, when the printed circuit board 4 reaches the preheat tank or the solder tank, the conveyance speed of the conveyor A is detected by the first detector 1a, and the fourth detection The temperature of the melted solder 3a is detected by the device 1d, and these signals are input to the microprocessor Ie. The microprocessor 1e determines whether these signals are within a predetermined control range, and when the signals exceed the control range, it issues an alarm to the administrator through the alarm device If, and changes the speed of the conveyor A and the temperature of the solder. Alternatively, it is recommended to adjust the specific gravity of the flux by increasing or decreasing it. Instead of the alarm device 1f, or at the same time as the alarm, when the amount of heat applied to the printed circuit board 4 or electronic components 5 reaches a predetermined amount, the speed of the conveyor A is automatically increased, and conversely, the amount of heat applied is less than a predetermined amount. When the amount of pudding is small, the speed of conveyor A is automatically reduced to
- It is also possible to automatically adjust the heat acting on the board 4 and electronic components 5.
また、品質管理装置１ばプリンＩ・配線に付着したフラ
ックスを活性化するためのプリヒート工程を備え、その
工程のためプリヒート温度を検出する第３検出器１ｃが
付設され、前記第４検出器］ｄによるハンダ温度検出の
場合と同様にして、プリヒー ｌ−槽の温度を高低に調
節しフラックスの活性能力を安定させる。品質管理装置
１は更に溶融フラックスの比重を検出する第２検出器１
ｂを備えており、それから発せられる信ひは？８融フラ
ンクスの比重が所定値より濃厚になったときと、それよ
り希薄な所定値より更に希薄になったときに溶融フラッ
クスの濃度を管理範囲に収めるよう警報装置１ｆを通し
て管理者に警報される。また、それが人為的になされな
いときは自動的に濃度を調節するようにすることも可能
である。In addition, the quality control device 1 is provided with a preheating process for activating the flux attached to the pudding I and the wiring, and for this process, a third detector 1c is attached to detect the preheating temperature, and the fourth detector] In the same manner as in the case of detecting the solder temperature by d, the temperature of the pre-heat l-tank is adjusted to high or low to stabilize the activation ability of the flux. The quality control device 1 further includes a second detector 1 that detects the specific gravity of the molten flux.
What is the belief that comes from having B? 8. When the specific gravity of the molten flux becomes richer than a predetermined value, or when it becomes even more dilute than a predetermined value, an alarm is sent to the administrator via the alarm device 1f to keep the concentration of the molten flux within a control range. . It is also possible to automatically adjust the concentration when it is not done manually.
また、前記検出された各検出器からの信号は、各プリン
ト基板４毎に品質の管理範囲内に有るか否かに関係なく
、すべてハンダ付ｚ′ｌが施された時間と共に記録装置
１ｈたるプリンタ（図示してない）から印刷し出力され
る。よって、後日にハンダ付けの品質不良が発見された
場合であっても、その原因や数量の把握を容易に行うこ
とができる、品質保証を容易にする。In addition, the signals from each of the detected detectors are recorded in the recording device 1h along with the time at which the soldering z'l was applied, regardless of whether or not the signals are within the quality control range for each printed circuit board 4. It is printed and output from a printer (not shown). Therefore, even if a quality defect in soldering is discovered later, the cause and quantity can be easily ascertained, thereby facilitating quality assurance.
この発明は以上のように、電子基板を搬送するコンベヤ
の搬送速度とフラックスの比重、およびプリヒート工程
の加熱温度と溶融ハンダの温度を検出する検出器の検出
信号が所定の管理幅内にあるか否かをマイクロプロセッ
サによって判別し、管理範囲を外れようとするとき作業
者に警報を発し、また、そのときの情報はプリンタによ
って印刷される。よって、比較的簡単な装置により自動
的にハンダ付けの品質維持を図り得ると共に、そ０
４゜
の作業情報が記録され長期に亘って品質の保証をするこ
とができる効果がある。As described above, this invention makes it possible to check whether the detection signals of the detector that detects the conveyance speed of the conveyor that conveys the electronic board, the specific gravity of the flux, the heating temperature in the preheating process, and the temperature of the molten solder are within a predetermined control range. A microprocessor determines whether or not the device is outside the control range, and a warning is issued to the operator when the control range is about to be exceeded.In addition, the information at that time is printed out by a printer. Therefore, it is possible to automatically maintain the quality of soldering with a relatively simple device, and the work information of 0.4 degrees is recorded, thereby making it possible to guarantee the quality over a long period of time.
図面はこの発明の一実施例を示すもので、第１図は装置
の機能を示す機能構成図、第２図は装置の外観図、第３
図は基板の一部を破断して示す断面図である。The drawings show an embodiment of the present invention; FIG. 1 is a functional configuration diagram showing the functions of the device, FIG. 2 is an external view of the device, and FIG. 3 is a functional configuration diagram showing the functions of the device.
The figure is a cross-sectional view showing a part of the substrate broken away.
Claims (2)
検出する速度検出器と、プリント基板を加熱するプリヒ
ータの温度を検出する第１温度検出器、溶融ハンダの温
度を検出する第２温度検出器、並びにフラックスの比重
を検出する比重検出器との少なくとも４個の検出器を備
え、それら検出器から発せられる検出信号をマイクロプ
ロセッサで処理して、その出力側に接続された警報器と
記録手段によって各検出器の検出信号が特定の管理幅を
越えて変化したとき警告を発すると共に、製造時刻の他
前記少なくとも４個の検出信号の数値を記録可能に構成
してなる電子基板のハンダ付け品質管理方法。(1) A speed detector that detects the conveyance speed of the conveyor that transfers the printed circuit board, a first temperature detector that detects the temperature of the preheater that heats the printed circuit board, and a second temperature detector that detects the temperature of the molten solder. and a specific gravity detector for detecting the specific gravity of the flux, the detection signals emitted from these detectors are processed by a microprocessor, and an alarm and a recording means connected to the output side are used. Soldering quality control for electronic boards configured to issue a warning when the detection signal of each detector changes beyond a specific control range, and record the manufacturing time as well as the numerical values of the at least four detection signals. Method.
なくとも１個の溶融ハンダ槽とを備え、それらの間に基
板を移送するためのコンベヤを架設すると共に、前記コ
ンベヤにその移送速度を検出する速度検出器と、溶融フ
ラックスの槽にフラックスの比重を検出する比重検出器
と、また、プリヒート槽に第１温度検出器と溶融ハンダ
槽に第２温度検出器とをそれぞれ設け、前記コンベヤを
一定の速度で移送させつゝ電子基板にハンダ付けを行い
、前記各検出器を記録手段に接続して所定の時間毎にそ
れらの出力を記録可能に構成してなる電子基板のハンダ
付け品質管理方法。(2) A speed detection system that includes a molten flux tank, a preheat tank, and at least one molten solder tank, and installs a conveyor between them for transferring the substrate, and detects the transfer speed of the conveyor. a specific gravity detector for detecting the specific gravity of the flux in the molten flux tank, a first temperature detector in the preheat tank, and a second temperature detector in the molten solder tank, and the conveyor is operated at a constant speed. 1. A method for controlling soldering quality of an electronic board, comprising: soldering the electronic board while transporting the electronic board; and connecting each of the detectors to a recording means to record their outputs at predetermined time intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20864589A JPH0372692A (en) | 1989-08-11 | 1989-08-11 | Method of quality control for electronic board soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20864589A JPH0372692A (en) | 1989-08-11 | 1989-08-11 | Method of quality control for electronic board soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0372692A true JPH0372692A (en) | 1991-03-27 |
Family
ID=16559676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20864589A Pending JPH0372692A (en) | 1989-08-11 | 1989-08-11 | Method of quality control for electronic board soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0372692A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631173U (en) * | 1992-09-24 | 1994-04-22 | 富士通テン株式会社 | Solder bath management device |
| CN108029200A (en) * | 2015-06-23 | 2018-05-11 | 富士机械制造株式会社 | estimating device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6186069A (en) * | 1984-10-02 | 1986-05-01 | Tamura Seisakusho Co Ltd | Control device for automatic soldering system |
| JPS63137568A (en) * | 1986-11-27 | 1988-06-09 | Toshiba Corp | Method and device for jet soldering |
-
1989
- 1989-08-11 JP JP20864589A patent/JPH0372692A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6186069A (en) * | 1984-10-02 | 1986-05-01 | Tamura Seisakusho Co Ltd | Control device for automatic soldering system |
| JPS63137568A (en) * | 1986-11-27 | 1988-06-09 | Toshiba Corp | Method and device for jet soldering |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631173U (en) * | 1992-09-24 | 1994-04-22 | 富士通テン株式会社 | Solder bath management device |
| CN108029200A (en) * | 2015-06-23 | 2018-05-11 | 富士机械制造株式会社 | estimating device |
| CN108029200B (en) * | 2015-06-23 | 2020-04-14 | 株式会社富士 | Estimation device |
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