JPH0371830A - Heat-sealable gas barrier film - Google Patents
Heat-sealable gas barrier filmInfo
- Publication number
- JPH0371830A JPH0371830A JP1209301A JP20930189A JPH0371830A JP H0371830 A JPH0371830 A JP H0371830A JP 1209301 A JP1209301 A JP 1209301A JP 20930189 A JP20930189 A JP 20930189A JP H0371830 A JPH0371830 A JP H0371830A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- gas barrier
- film
- layer
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004888 barrier function Effects 0.000 title claims abstract description 63
- 239000010410 layer Substances 0.000 claims description 50
- 239000012793 heat-sealing layer Substances 0.000 claims description 17
- 239000007789 gas Substances 0.000 abstract description 61
- -1 polypropylene Polymers 0.000 abstract description 34
- 239000004743 Polypropylene Substances 0.000 abstract description 10
- 229920001155 polypropylene Polymers 0.000 abstract description 10
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 abstract description 9
- 229910001882 dioxygen Inorganic materials 0.000 abstract description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 9
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 229920000728 polyester Polymers 0.000 abstract description 4
- 229920005672 polyolefin resin Polymers 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract 7
- 238000010030 laminating Methods 0.000 abstract 2
- 239000002994 raw material Substances 0.000 abstract 2
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 description 30
- 239000011248 coating agent Substances 0.000 description 28
- 238000000576 coating method Methods 0.000 description 26
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 24
- 239000002904 solvent Substances 0.000 description 22
- 229920001577 copolymer Polymers 0.000 description 15
- 239000001993 wax Substances 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 239000000314 lubricant Substances 0.000 description 12
- 239000000843 powder Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- 239000004698 Polyethylene Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 229920000573 polyethylene Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 229920005601 base polymer Polymers 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 3
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 3
- 235000009508 confectionery Nutrition 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229920001986 Vinylidene chloride-vinyl chloride copolymer Polymers 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920006280 packaging film Polymers 0.000 description 2
- 239000012785 packaging film Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- BVIUYHQPSZOHOV-UHFFFAOYSA-N 1,1-dichloroethene;2-methylprop-2-enoic acid Chemical compound ClC(Cl)=C.CC(=C)C(O)=O BVIUYHQPSZOHOV-UHFFFAOYSA-N 0.000 description 1
- STWZWUFRTQEEMW-UHFFFAOYSA-N 1,1-dichloroethene;prop-2-enoic acid Chemical compound ClC(Cl)=C.OC(=O)C=C STWZWUFRTQEEMW-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920012753 Ethylene Ionomers Polymers 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 229920001890 Novodur Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N beta-monoglyceryl stearate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- ZJOLCKGSXLIVAA-UHFFFAOYSA-N ethene;octadecanamide Chemical compound C=C.CCCCCCCCCCCCCCCCCC(N)=O.CCCCCCCCCCCCCCCCCC(N)=O ZJOLCKGSXLIVAA-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- FEEPBTVZSYQUDP-UHFFFAOYSA-N heptatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O FEEPBTVZSYQUDP-UHFFFAOYSA-N 0.000 description 1
- SCFQUKBBGYTJNC-UHFFFAOYSA-N heptyl prop-2-enoate Chemical compound CCCCCCCOC(=O)C=C SCFQUKBBGYTJNC-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
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- 239000005022 packaging material Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
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- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
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- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- DCXXMTOCNZCJGO-UHFFFAOYSA-N tristearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、食品等の個装、内装、外装等の包装フィルム
εして好適なヒートシール可能なガスバリア性フィルム
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a heat-sealable gas barrier film suitable for use as a packaging film ε for individual packaging, interior packaging, exterior packaging, etc. of foods, etc.
［従来の技術と発明が解決しようとする課題］従来、菓
子類等の包装材料として、ヒートシール可能なフィルム
が汰く使用されている。このヒートシール可能なフィル
ムとしては、通常、二軸延伸ポリプロビレ：／フィルム
や二袖延伸ポリエチレンテ１ノフタレートフィルム等の
基材フィルムに、無延伸ポリエチレン等からなるヒート
シール層をラミネートしたフィルムや、共押出しポリプ
ロピレンフィルム等が知られている。[Prior Art and Problems to be Solved by the Invention] Conventionally, heat-sealable films have often been used as packaging materials for confectionery and the like. This heat-sealable film is usually a film in which a heat-sealing layer made of unstretched polyethylene or the like is laminated onto a base film such as biaxially oriented polypropylene film or double-stretched polyethylene terephthalate film, or Coextruded polypropylene films and the like are known.
一方、菓子類等の食品用包装フィルムには、内容物の吸
湿や酸化等による変質等を防止するため、ガスバリア性
が要求される。しかしながら、従来のフィルムでは、上
記ガスバリア性を基材フィルムの種類により確保してい
るため、ガスバリア性が十分でない。すなわち、基材フ
ィルムがポリプロピレンフィルムである場合には、水蒸
気バリア性を確保できるものの、酸素ガスバリア性が十
分でなく、ポリエチレンテレフタレートフィルムである
場合には、酸素ガスバリア性を確保できるものの、水蒸
気バリア性が十分でない。このように、上記ヒートシー
ル可能なフィルムでは、水蒸気透過率及び酸素ガス透過
率の双方の特性を同時に満足させることが困難であり、
内容物の保護効果が十分でない。On the other hand, packaging films for foods such as confectionery are required to have gas barrier properties in order to prevent the contents from deteriorating due to moisture absorption and oxidation. However, in conventional films, the gas barrier properties are not sufficient because the gas barrier properties are ensured by the type of base film. In other words, when the base film is a polypropylene film, the water vapor barrier property can be ensured, but the oxygen gas barrier property is insufficient, and when the base film is a polyethylene terephthalate film, the oxygen gas barrier property can be ensured, but the water vapor barrier property is insufficient. is not enough. As described above, it is difficult for the above-mentioned heat-sealable film to simultaneously satisfy the characteristics of both water vapor permeability and oxygen gas permeability.
The protection effect of the contents is not sufficient.
従って、本発明の目的は、水蒸気及び酸素ガスの双方に
対して優れたガスバリア性を示すだけでなく、ヒートシ
ール性に優れたヒートシール可能なガスバリア性フィル
ムを提供することにある。Therefore, an object of the present invention is to provide a heat-sealable gas barrier film that not only exhibits excellent gas barrier properties against both water vapor and oxygen gas but also has excellent heat sealability.
［発明の構成］
本発明は、基材フィルムにヒートシール層が形成された
フィルムであって、上記ヒートシール層が、ガスバリア
層を介して基材フィルムに積層されているヒートシール
可能なガスバリア性フィルムにより、上記課題を解決す
るものである。[Structure of the Invention] The present invention provides a film in which a heat-sealing layer is formed on a base film, and the heat-sealing layer has gas barrier properties that can be heat-sealed and is laminated on the base film via a gas barrier layer. The film solves the above problems.
基材フィルムとしては、例えば、ポリエチレン、エチレ
ン−アクリル酸エチル共重合体、アイオノマー ポリプ
ロピレン、エチレン−プロピレン共重合体、ポリ−４−
メチルペンテン−１等のオレフィン系樹脂；ポリ塩化ビ
ニル；ポリ塩化ビニリデン、塩化ビニリデン−塩化ビニ
ル共重合体、塩化ビニリデン−アクリロニトリル共重合
体等の塩化ビニリデン系樹脂；ポリスチレン、スチレン
−アクリロニトリル共重合体、スチレン−アクリロニト
リル−ブタジェン共重合体等のスチレン系樹脂；ポリエ
チレンテレフタレート、ポリブチレンテレフタレート等
のポリエステル；ナイロン６、ナイロン１１、ナイロン
６６等のナイロン又はポリアミド；ポリアクリロニトリ
ル；ポリカーボネート；ポリイミド；ポリビニルアルコ
ール；エチレン−酢酸ビニル共重合体やそのケン化物；
セロハン；塩酸ゴム等を素材とする種々のフィルムが使
用できる。Examples of the base film include polyethylene, ethylene-ethyl acrylate copolymer, ionomer polypropylene, ethylene-propylene copolymer, poly-4-
Olefin resins such as methylpentene-1; polyvinyl chloride; vinylidene chloride resins such as polyvinylidene chloride, vinylidene chloride-vinyl chloride copolymers, vinylidene chloride-acrylonitrile copolymers; polystyrene, styrene-acrylonitrile copolymers, Styrenic resins such as styrene-acrylonitrile-butadiene copolymer; polyesters such as polyethylene terephthalate and polybutylene terephthalate; nylons or polyamides such as nylon 6, nylon 11, and nylon 66; polyacrylonitrile; polycarbonate; polyimide; polyvinyl alcohol; ethylene- Vinyl acetate copolymers and their saponified products;
Various films made of cellophane; hydrochloric acid rubber, etc. can be used.
上記基材フィルムのうちオレフィン系樹脂を素材とする
フィルム、特にポリプロピレンフィルムや、ポリエステ
ルを素材とするフィルム、特にポリエチレンテレフタレ
ートフィルムは、透明性、機械的強度及び包装適性に優
れている。Among the above-mentioned base films, films made of olefin resins, particularly polypropylene films, and films made of polyester, particularly polyethylene terephthalate films, have excellent transparency, mechanical strength, and packaging suitability.
基材フィルムは、未延伸であってもよく、−軸又は二軸
延伸処理されていてもよい。延伸法としては、例えばロ
ール延伸、圧延延伸、ベルト延伸、テンター延伸、チュ
ーブ延伸や、これらを組合せた延伸等の慣用の延伸法が
適用できる。延伸倍率は、所望するフィルムの特性に応
じて適宜設定でき、例えば１．５〜２０倍、好ましくは
２〜１５倍程度である。延伸倍率が１．５倍未満である
と延伸効果が小さく、２０倍を越えると過剰な延伸とな
り生産性が低下する。The base film may be unstretched, or may be subjected to -axial or biaxial stretching treatment. As the stretching method, conventional stretching methods such as roll stretching, rolling stretching, belt stretching, tenter stretching, tube stretching, and a combination thereof can be used. The stretching ratio can be appropriately set depending on the desired characteristics of the film, and is, for example, about 1.5 to 20 times, preferably about 2 to 15 times. If the stretching ratio is less than 1.5 times, the stretching effect will be small, and if it exceeds 20 times, it will be excessively stretched and productivity will decrease.
なお、延伸処理は、フィルムを構成するポリマーの融点
以下であって、二次転移点以上の温度で行なわれる。ま
たフィルムの延伸後、緊張下で熱処理し、分子の配向を
固定させてもよい。The stretching process is carried out at a temperature below the melting point of the polymer constituting the film and above the secondary transition point. Further, after stretching the film, it may be heat-treated under tension to fix the molecular orientation.
また基材フィルムの少なくとも一方の面は、表面処理さ
れていてもよい。表面処理としては、慣用の表面処理、
例えば、コロナ放電処理、高周波処理、火炎処理、クロ
ム酸処理、溶剤処理等が例示される。これらの表面処理
のうちコロナ放電処理が好ましい。このコロナ放電処理
によると、基材フィルムの表面処理炭を簡便かつ容易に
制御できる。基材フィルムの処理炭は、密着性を確保で
きる範囲であれば特に制限されないが、通常３５〜５０
ｄｙｎ／Ｃ１１１、好ましくは３７〜４５ｄｙｎ ／ａ
ｍ程度である。なお、基材フィルムの面のうち表面処理
面にガスバリア層及びヒートシール層を形成すると、密
着性を高めることができる。またガスバリア層及びヒー
トシール層が形成されていない面を表面処理すると、該
表面処理面で印刷インキやラミネート層との密着性を確
保できる。Moreover, at least one surface of the base film may be surface-treated. As surface treatment, conventional surface treatment,
Examples include corona discharge treatment, high frequency treatment, flame treatment, chromic acid treatment, and solvent treatment. Among these surface treatments, corona discharge treatment is preferred. According to this corona discharge treatment, the surface-treated carbon of the base film can be simply and easily controlled. The treated carbon of the base film is not particularly limited as long as it can ensure adhesion, but it is usually 35 to 50.
dyn/C111, preferably 37-45 dyn/a
It is about m. Note that adhesion can be improved by forming a gas barrier layer and a heat seal layer on the surface-treated surface of the base film. Furthermore, by surface-treating the surface on which the gas barrier layer and heat seal layer are not formed, adhesion with the printing ink and the laminate layer can be ensured on the surface-treated surface.
上記基材フィルムは酸化防止剤、紫外線吸収剤、結晶造
核剤、滑剤、染料顔料等の種々の添加剤を含有していて
もよい。The base film may contain various additives such as antioxidants, ultraviolet absorbers, crystal nucleating agents, lubricants, dyes and pigments.
基材フィルムは単層フィルムであってもよく、二種以上
のフィルムが積層された複合フィルムであってもよい。The base film may be a single layer film or a composite film in which two or more types of films are laminated.
基材フィルムの厚みは特に制限されず、例えば、厚み１
〜２５０μ、好ましくは５〜１００／ｆｆ程度の基材フ
ィルムが使用できる。The thickness of the base film is not particularly limited, and for example, the thickness is 1
A base film having a thickness of about 250μ, preferably about 5 to 100/ff can be used.
上記基材フィルムには、ガスバリア層を介してヒートシ
ール層が積層されている。従って、中間層としてのガス
バリア層でガスバリア性を確保でき、表面に位置するヒ
ートシール層でヒートシール性を確保できる。A heat seal layer is laminated on the base film with a gas barrier layer interposed therebetween. Therefore, the gas barrier layer as an intermediate layer can ensure gas barrier properties, and the heat sealing layer located on the surface can ensure heat sealing properties.
上記ガスバリア層は塩化ビニリデン系ポリマーを含有し
ている。塩化ビニリデン系ポリマーは、ポリ塩化ビニリ
デン単独重合体であってもよいが、耐熱安定性、耐候安
定性及び皮膜の柔軟性などの点から、塩化ビニリデンと
、他の重合性モノマーとの共重合体が好ましい。重合性
モノマーとしては、例えば、塩化ビニル、酢酸ビニル、
クロトン酸、アクリル酸、メチルアクリレート、エチル
アクリレート、プロピルアクリレート、イソプロピルア
クリレート、ブチルアクリレート、イソブチルアクリレ
ート、ｔｅｒｔ−ブチルアクリレート、ペンチルアクリ
レート、ヘキシルアクリレート、ヘプチルアクリレート
、オクチルアクリレート、２−エチルヘキシルアクリレ
ートなどの各種アクリレート、アクリロニトリル、メタ
クリレートリル、メタクリル酸や、上記アクリレートに
対応するメタクリレートなどが例示される。これらの重
合性モノマーは一種または二種以上使用される。上記共
重合体のうち塩化ビニリデン−アクリロニトリル共重合
体、塩化ビニリデン−塩化ビニル共重合体、塩化ビニリ
デン−酢酸ビニル共重合体、塩化ビニリデン−アクリル
酸共重合体、塩化ビニリデン−メタクリル酸共重合体、
塩化ビニリデン−アクリレート共重合体及び塩化ビニリ
デン−メタクリレート共重合体等の共重合体が好ましい
。これらの塩化ビニリデン系ポリマーは少なくとも一種
使用される。The gas barrier layer contains a vinylidene chloride polymer. The vinylidene chloride-based polymer may be a polyvinylidene chloride homopolymer, but from the viewpoint of heat resistance stability, weather resistance stability, flexibility of the film, etc., a copolymer of vinylidene chloride and other polymerizable monomers is preferable. is preferred. Examples of polymerizable monomers include vinyl chloride, vinyl acetate,
Various acrylates such as crotonic acid, acrylic acid, methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, tert-butyl acrylate, pentyl acrylate, hexyl acrylate, heptyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, Examples include acrylonitrile, methacrylate, methacrylic acid, and methacrylates corresponding to the above acrylates. One or more types of these polymerizable monomers may be used. Among the above copolymers, vinylidene chloride-acrylonitrile copolymer, vinylidene chloride-vinyl chloride copolymer, vinylidene chloride-vinyl acetate copolymer, vinylidene chloride-acrylic acid copolymer, vinylidene chloride-methacrylic acid copolymer,
Copolymers such as vinylidene chloride-acrylate copolymers and vinylidene chloride-methacrylate copolymers are preferred. At least one of these vinylidene chloride polymers is used.
またヒートシール層は、ヒートシール可能なポリマー、
例えば、ポリエチレン、ポリプロピレン、ナイロン等の
従来のヒートシール用ポリマーを含有していてもよいが
、前記ガスバリア層との密着性に優れる塩化ビニリデン
系ポリマーを含有するのが好ましい。In addition, the heat-sealing layer is made of heat-sealable polymer,
For example, it may contain conventional heat-sealing polymers such as polyethylene, polypropylene, and nylon, but it is preferable to contain a vinylidene chloride-based polymer that has excellent adhesion to the gas barrier layer.
すなわち、本発明の好ましい態様は、ガスバリア層とヒ
ートシール層とが共に塩化ビニリデン系ポリマーを含有
する。ガスバリア性に優れた上記ガスバリア層は、塩化
ビニリデン系ポリマーを含有する溶剤型塗布液で形成で
きる。溶剤型塗布液中の有機溶媒は、均一な塗工性やガ
スバリア性を高めるため、良溶媒と貧溶媒とで構成され
るのが好ましい。またガスバリア性は、一般に塩化ビニ
リデン系ポリマーの結晶化度が大きくなるにつれて高く
なり、塩化ビニリデン系ポリマーの結晶化度は良溶媒の
割合と反比例関係にある。従って、塩化ビニリデン系ポ
リマーの種類、すなわち、ポリマーの構成単位等に起因
する結晶化速度等に応じて有機溶媒中の良溶媒と貧溶媒
との割合を調整することにより、ガスバリア性に優れた
層を形成できる。有機溶媒中の良溶媒の割合は、塗布液
の均−性及び塗布性を損わない範囲で少ないのが好まし
く、高いガスバリア性を付与するには、通常、４０〜９
０重量％、好ましくは５０〜７５重量％程度である。That is, in a preferred embodiment of the present invention, both the gas barrier layer and the heat seal layer contain a vinylidene chloride polymer. The gas barrier layer having excellent gas barrier properties can be formed using a solvent-based coating solution containing a vinylidene chloride polymer. The organic solvent in the solvent-based coating liquid is preferably composed of a good solvent and a poor solvent in order to improve uniform coating properties and gas barrier properties. Further, the gas barrier property generally increases as the crystallinity of the vinylidene chloride polymer increases, and the crystallinity of the vinylidene chloride polymer is inversely proportional to the proportion of a good solvent. Therefore, by adjusting the ratio of good solvent to poor solvent in the organic solvent according to the type of vinylidene chloride polymer, that is, the crystallization rate caused by the constituent units of the polymer, etc., it is possible to create a layer with excellent gas barrier properties. can be formed. The proportion of the good solvent in the organic solvent is preferably as low as possible without impairing the uniformity and coating properties of the coating solution.
It is about 0% by weight, preferably about 50 to 75% by weight.
なお、上記塩基ビニリデン系ポリマーに対する良溶媒及
び貧溶媒は、塩基ビニリデン系ポリマーの種類により異
なるので、ポリマーの種類に応じて適宜選択できる。良
溶媒としては、例えば、アセトン、メチルエチルケトン
、シクロヘキサノンなどのケトン類、ジオキサン、ジエ
チルエーテル、テトラヒドロフランなどのエーテル類や
これらの混合溶媒が例示できる。Note that the good solvent and poor solvent for the above-mentioned vinylidene base polymer vary depending on the type of vinylidene base polymer, so they can be appropriately selected depending on the type of polymer. Examples of good solvents include ketones such as acetone, methyl ethyl ketone, and cyclohexanone, ethers such as dioxane, diethyl ether, and tetrahydrofuran, and mixed solvents thereof.
塩基ビニリデン系ポリマーに対する貧溶媒としては、例
えば、メタノール、エタノール、プロパノール等のアル
コール煩、ヘキサン、シクロヘキサン等の脂環族炭化水
素、ベンゼン、トルエン、キシレン等の芳香族炭化水素
、メチレンクロライド、エチレンクロライドなどのハロ
ゲン化炭化水素、酢酸エチル等のエステル類、エチレン
グリコールモノメチルエーテル、エチレングリコールジ
メチルエーテル、エチレングリコールモノエチルエーテ
ル、エチレングリコールジエチルエーテル、やこれらの
混合溶媒が例示できる。Examples of poor solvents for vinylidene base polymers include alcohols such as methanol, ethanol, and propanol, alicyclic hydrocarbons such as hexane and cyclohexane, aromatic hydrocarbons such as benzene, toluene, and xylene, methylene chloride, and ethylene chloride. Examples include halogenated hydrocarbons such as esters such as ethyl acetate, ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol monoethyl ether, ethylene glycol diethyl ether, and mixed solvents thereof.
またヒートシール層は、ヒートシール性に優れた塩化ビ
ニリデン系ポリマーを含有する塗布液、例えば塩化ビニ
リデン系ポリマーを含有し、良溶媒の割合が大きな溶剤
型塗布液、好ましくはエマルジョン型塩化ビニリデン系
ポリマーの分散液で形成できる。なお、溶剤型塗布液を
用いてヒートシール層を形成する場合、有機溶媒中の良
溶媒の割合が大きい程、ヒートシール性がよくなる。従
って、前記ガスバリア層に含有される塩化ビニリデン系
ポリマーと同じポリマーを用いる場合、該溶剤型塗布液
中の良溶媒の割合は、前記ガスバリア層を形成する有機
溶媒中の良溶媒の割合よりも大きいのが好ましい。良溶
媒は、有機溶媒中、通常６５重量％以上である。The heat-sealing layer may be a coating solution containing a vinylidene chloride polymer with excellent heat-sealability, such as a solvent-based coating solution containing a vinylidene chloride polymer and having a large proportion of a good solvent, preferably an emulsion-type vinylidene chloride polymer. It can be formed from a dispersion of Note that when forming a heat-sealing layer using a solvent-based coating liquid, the higher the proportion of the good solvent in the organic solvent, the better the heat-sealability becomes. Therefore, when using the same polymer as the vinylidene chloride-based polymer contained in the gas barrier layer, the proportion of good solvent in the solvent-based coating solution is higher than the proportion of good solvent in the organic solvent forming the gas barrier layer. is preferable. A good solvent usually accounts for 65% by weight or more in an organic solvent.
ヒートシール層は、上記溶剤型塗布液で形成してもよい
が、水性エマルジョン型分散液で形成するのが好ましい
。すなわち、水性エマルジョン型分散液をガスバリア層
上に塗布すると、ガスバリア層を溶解し浸蝕することな
く、均一なヒートシール層を形成できる。水性エマルジ
ョン型の塩化ビニリデン系ポリマーは、通常、カルボキ
シ基を有する重合性モノマー、例えば、クロトン酸、ア
クリル酸、メタクリル酸と、塩化ビニリデンとを必須の
成分とする共重合体が好ましい。なお、上記共重合体は
、必要に応じて他の共重合性モノマ、例えば、塩化ビニ
ル、酢酸ビニル、アクリレート、アクリロニトリル、メ
タクリレートリル、メタクリレート等の共重合性モノマ
ーとの共重合体であってもよい。Although the heat-sealing layer may be formed using the above-mentioned solvent-based coating liquid, it is preferably formed using an aqueous emulsion-type dispersion liquid. That is, when an aqueous emulsion-type dispersion is applied onto a gas barrier layer, a uniform heat-sealing layer can be formed without dissolving or corroding the gas barrier layer. The aqueous emulsion-type vinylidene chloride polymer is usually preferably a copolymer containing a polymerizable monomer having a carboxy group, such as crotonic acid, acrylic acid, or methacrylic acid, and vinylidene chloride as essential components. Note that the above copolymer may be a copolymer with other copolymerizable monomers, such as vinyl chloride, vinyl acetate, acrylate, acrylonitrile, methacrylate trile, methacrylate, etc., if necessary. good.
前記ガスバリア層及びヒートシール層は、塩化ビニリデ
ン系ポリマー以外の成分として、他のポリマーを含有し
ていてもよい。上記他のポリマーとしては、例えば、ポ
リエチレン、ポリプロピレン、エチレン−酢酸ビニル共
重合体、エチレン−アクリル酸エチル共重合体、アイオ
ノマー等のオレフィン系ポリマー；アクリル系ポリマー
；ポリスチレン、スチレン−アクリル酸エステル共重合
体等ノスチレン系ポリマー；ポリエチレンテレフタレー
ト〜ポリブチレンテレフタレート等のポリエステル；ポ
リアセタール；ポリ酢酸ビニル；ポリ塩化ビニル；塩化
ビニル−酢酸ビニル共重合体；ポリアミド；ポリウレタ
ン；ポリカーボネート；塩素化ポリプロピレン等の塩素
化ポリオレフィン；セルロース系ポリマー等が例示され
る。これらのポリマーは一種又は二種以上混合して用い
られる。The gas barrier layer and the heat seal layer may contain other polymers as components other than the vinylidene chloride polymer. Examples of the other polymers mentioned above include olefin polymers such as polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ionomer; acrylic polymer; polystyrene, styrene-acrylate copolymer, etc. Nostyrene polymers such as coalescence; polyesters such as polyethylene terephthalate to polybutylene terephthalate; polyacetals; polyvinyl acetate; polyvinyl chloride; vinyl chloride-vinyl acetate copolymers; polyamides; polyurethanes; polycarbonates; chlorinated polyolefins such as chlorinated polypropylene; Examples include cellulose polymers. These polymers may be used alone or in combination of two or more.
これらの他のポリマーは、塩化ビニリデン系ポリマーの
特性が低下しない範囲で使用でき、通常、塩化ビニリデ
ン系ポリマー１００重量部に対して０〜２５重量部程度
である。These other polymers can be used as long as the properties of the vinylidene chloride polymer are not deteriorated, and are usually used in an amount of about 0 to 25 parts by weight based on 100 parts by weight of the vinylidene chloride polymer.
また滑り性及び耐ブロッキング性を付与して作業性をよ
くするため、前記ガスバリア層及び／又はヒートシール
層は、滑剤を含有するのが好ましい。Further, in order to improve workability by imparting slipperiness and anti-blocking properties, the gas barrier layer and/or the heat seal layer preferably contains a lubricant.
滑剤としては、ワックスや微粉末状滑剤が好ましい。ワ
ックスとしては、例えば、パラフィンワックス、ポリエ
チレンワックス、マイクロクリスタリンワックス等の炭
化水素系ワックス、ステアリン酸、ステアリン酸モノグ
リセリド、ステアリン酸トリグリセリド、ステアリン酸
亜鉛、ステアリン酸カルシウム等の脂肪酸系ワックス、
オレイン酸アミド、ステアリン酸アミド、エルカ酸アミ
ド、メチレンビスステアリン酸アミド、エチレンビスス
テアリン酸アミド等の脂肪酸アミド系ワックス、カルナ
バワックス等のエステル系ワックス等の種々のワックス
が例示できる。上記ワックスは少なくとも一種使用され
る。ワックスの含有量は、前記塩基ビニリデン系ポリマ
ー１００重量部に対して、通常、０．１〜１０重量部、
好ましくは０．２５〜５重量部、さらに好ましくは０．
５〜２．５重量部程度である。ワックスの量が０゜１重
量部未満であると滑り性が十分でなく、１０重量部を越
えると塗膜の透明性等が低下し易い。As the lubricant, wax or finely powdered lubricant is preferable. Examples of the wax include hydrocarbon waxes such as paraffin wax, polyethylene wax, and microcrystalline wax; fatty acid waxes such as stearic acid, stearic acid monoglyceride, stearic acid triglyceride, zinc stearate, and calcium stearate;
Examples include various waxes such as fatty acid amide waxes such as oleic acid amide, stearic acid amide, erucic acid amide, methylene bis stearic acid amide, and ethylene bis stearic acid amide, and ester waxes such as carnauba wax. At least one of the above waxes is used. The wax content is usually 0.1 to 10 parts by weight based on 100 parts by weight of the vinylidene base polymer.
Preferably 0.25 to 5 parts by weight, more preferably 0.25 to 5 parts by weight.
It is about 5 to 2.5 parts by weight. If the amount of wax is less than 0.1 part by weight, the slipperiness will not be sufficient, and if it exceeds 10 parts by weight, the transparency of the coating film will tend to deteriorate.
微粉末状滑剤としては、例えば、カオリン、タルク、ケ
イソウ土、酸化チタン、炭酸カルシウム、炭酸マグネシ
ウム、硫酸バリウム、シリカ、アルミナ等の無機滑剤；
ポリエチレン、ポリプロピレン、ポリスチレン、アクリ
ル樹脂、シリコーン樹脂、フェノール樹脂等の有機滑剤
；アルミナバルフ、シリカバルーン、発泡ガラス、マイ
クロバルーン）サランマイクロスフェア等の微小中空体
が例示される。これらの微粉末状滑剤のうちシリカ系微
粉末、アルミナ系微粉末、ポリエチレン系微粉末、アク
リル系微粉末等が好ましい。微粉末状滑剤は塗膜の透明
性やガスバリア性等を損わない範囲で適宜の粒径を有し
ていてもよいが、５μ以下であるのが好ましい。粒径が
５μｍを越えると滑剤が欠落し易くなり、作業性が低下
する。微粉末状滑剤の含有量は、塩化ビニリデン系ポリ
マー１００重量部に対して、通常、０．０１〜５重量部
、好ましくは０．０５〜２．５重量部である。微粉末状
滑剤の使用量が０．０１重量部未満であると滑り性が十
分でなく、５重量部を越えると塗膜の透明性等が低下し
易い。Examples of fine powder lubricants include inorganic lubricants such as kaolin, talc, diatomaceous earth, titanium oxide, calcium carbonate, magnesium carbonate, barium sulfate, silica, and alumina;
Examples include organic lubricants such as polyethylene, polypropylene, polystyrene, acrylic resins, silicone resins, and phenolic resins; micro hollow bodies such as alumina bulbs, silica balloons, foamed glass, microballoons, and Saran microspheres. Among these fine powder lubricants, silica-based fine powder, alumina-based fine powder, polyethylene-based fine powder, acrylic-based fine powder, etc. are preferred. The fine powder lubricant may have an appropriate particle size within a range that does not impair the transparency, gas barrier properties, etc. of the coating film, but it is preferably 5 μm or less. When the particle size exceeds 5 μm, the lubricant is likely to be lost, resulting in reduced workability. The content of the fine powder lubricant is usually 0.01 to 5 parts by weight, preferably 0.05 to 2.5 parts by weight, based on 100 parts by weight of the vinylidene chloride polymer. If the amount of the fine powder lubricant used is less than 0.01 part by weight, the slipperiness will not be sufficient, and if it exceeds 5 parts by weight, the transparency of the coating film will tend to deteriorate.
なお、ガスバリア層及び／又はヒートシール層は、酸化
防止剤、紫外線吸収剤、熱安定剤、可塑剤、帯電防止剤
、粘着付与剤、可塑剤、充填剤、染顔料等の種々の添加
剤を含有していてもよい。The gas barrier layer and/or heat seal layer may contain various additives such as antioxidants, ultraviolet absorbers, heat stabilizers, plasticizers, antistatic agents, tackifiers, plasticizers, fillers, dyes and pigments, etc. May contain.
上記ガスバリア層及びヒートシール層は、ガスバリア性
やヒートシール性を損わない範囲で適宜の膜厚に形成で
きるが、通常、それぞれ膜厚０゜０１〜５μ、好ましく
は０．１〜３μ程度である。The above gas barrier layer and heat sealing layer can be formed to have an appropriate thickness within a range that does not impair gas barrier properties or heat sealing properties, but usually each has a thickness of about 0.01 to 5μ, preferably about 0.1 to 3μ. be.
膜厚がｏ、ｏｉＩｔ＠未満であると高いガスバリア性及
びヒートシール性を付与するのが困難であり、５−を越
えると経済的でないばかりか、場合によっては基材フィ
ルムの特性が低下する虞がある。If the film thickness is less than o, oiIt@, it is difficult to provide high gas barrier properties and heat sealing properties, and if it exceeds 5-, it is not only uneconomical, but in some cases, the properties of the base film may deteriorate. There is.
むお、ガスバリア層及びヒートシール層は、基材フィル
ムの少なくとも一方の面に形成されていればよい。However, the gas barrier layer and the heat seal layer only need to be formed on at least one surface of the base film.
本発明のヒートシール可能なガスバリア性フィルムは、
表面にヒートシール層が位置するので、従来慣用の方法
、例えばビロー成形、四方シール等により容易に袋体を
形成できる。The heat-sealable gas barrier film of the present invention is
Since the heat-sealing layer is located on the surface, the bag can be easily formed by conventional methods such as billow molding, four-sided sealing, etc.
ガスバリア層及びヒートシール層は、基材フィルムに、
ガスバリア層用塗布剤とヒートシール層用塗布剤とを順
次塗布し、乾燥することにより形成できる。塗布手段と
しては、特に制限されず、従来慣用の手段、例えば、デ
ツプコーター ロールコータ−グラビアコーター、エア
ーナイフコーター スプレー等が使用できる。The gas barrier layer and the heat seal layer are made of a base film,
It can be formed by sequentially applying a gas barrier layer coating agent and a heat seal layer coating agent and drying them. The coating means is not particularly limited, and conventionally used means such as a dip coater, roll coater, gravure coater, air knife coater, and spray can be used.
［発明の効果］
以上のように、本発明のヒートシール可能なガスバリア
性フィルムによれば、ヒートシール層が、ガスバリア層
を介して基材フィルムに積層されているので、基材フィ
ルムに依存することなく、ガスバリア層により水蒸気及
び酸素ガスの双方に対して優れたガスバリア性を確保で
きるだけでなく、表面のヒートシール層により優れたヒ
ートシール性を確保できる。[Effects of the Invention] As described above, according to the heat-sealable gas barrier film of the present invention, since the heat-seal layer is laminated to the base film via the gas barrier layer, the heat-sealable layer does not depend on the base film. Not only can the gas barrier layer ensure excellent gas barrier properties against both water vapor and oxygen gas, but also the heat sealing layer on the surface can ensure excellent heat sealing properties.
［実施例］
以下に、実施例に基づいて本発明をより詳細に説明する
。[Examples] The present invention will be described in more detail below based on Examples.
実施例１
塩化ビニリデン（９０重量％）−アクリル酸エステル（
１０重量％）共重合体１００重量部、融点７８℃のワッ
クス１重量部、及び平均粒径３μのシリカ微粉末０，１
重量部を、テトラヒドロフラン／トルエン−７０／３０
（重量比）の混合溶媒に混合しガスバリア要用塗布液
を調製した。Example 1 Vinylidene chloride (90% by weight)-acrylic ester (
100 parts by weight of copolymer (100 parts by weight), 1 part by weight of wax with a melting point of 78°C, and 0.1 part by weight of silica fine powder with an average particle size of 3 μm.
Part by weight: tetrahydrofuran/toluene-70/30
(weight ratio) was mixed with a mixed solvent to prepare a gas barrier-required coating liquid.
この塗布液を、厚み２０／ｆｆｉの二軸延伸ポリプロピ
レンフィルムの一方の面に、ロールコータ−を用いて、
乾燥後の塗布量３．０ｇ／〆となるように塗布し、乾燥
することによりガスバリア層を形成した。This coating liquid was applied to one side of a biaxially stretched polypropylene film having a thickness of 20/ffi using a roll coater.
A gas barrier layer was formed by applying the coating at a coating weight of 3.0 g/drying and drying.
次いで、塩化ビニリデン（８５重量％）−メタクリル酸
（１５重量％）共重合体を含む水性エマルジョンの固形
分１００重量部に対して、融点７８℃のワックス１重量
部、及び平均粒径３μのシリカ微粉末０．１重量部を添
加混合し、ヒートシール層用塗布液を調製した。このヒ
ートシール層用塗布液を、上記ガスバリア層上に、乾燥
後の塗布量３．０ｇ／ｍ’となるように塗布し、乾燥す
ることによりヒートシール層を形成した。Next, 1 part by weight of wax with a melting point of 78° C. and silica with an average particle size of 3 μm were added to 100 parts by weight of the solid content of the aqueous emulsion containing vinylidene chloride (85% by weight)-methacrylic acid (15% by weight) copolymer. 0.1 part by weight of fine powder was added and mixed to prepare a coating liquid for a heat seal layer. This heat-sealing layer coating liquid was applied onto the gas barrier layer at a coating weight of 3.0 g/m' after drying, and dried to form a heat-sealing layer.
実施例２
有機溶媒の組成をテトラヒドロフラン／トルエン−６０
／４０（重量比）とする以外、実施例１と同様にしてガ
スバリア要用塗布液を調製した。Example 2 The composition of the organic solvent was changed to tetrahydrofuran/toluene-60.
A gas barrier-required coating liquid was prepared in the same manner as in Example 1, except that the weight ratio was 0.1/40 (weight ratio).
上記ガスバリア要用塗布液と実施例１のヒートシール層
用塗布液とを用い、実施例１と同様にして、二軸延伸ポ
リプロピレンフィルムにガスバリア層とヒートシール層
とを順次形成した。A gas barrier layer and a heat seal layer were sequentially formed on a biaxially stretched polypropylene film in the same manner as in Example 1 using the above gas barrier coating solution and the heat seal layer coating solution of Example 1.
実施例３
実施例１のガスバリア要用塗布液に代えて、塩化ビニリ
デン（８９％重量）−アクリロニトリル（１１重量％）
１００重量部、融点７８℃のワックス１重量部、及び平
均粒径３μのシリカ微粉末０．１重量部を含有するカス
バリア要用塗布液を用いる以外、実施例１と同様にして
二軸延伸ポリプロピレンフィルムにガスバリア層とヒー
トシール層とを順次形成した。Example 3 Vinylidene chloride (89% by weight)-acrylonitrile (11% by weight) was substituted for the gas barrier required coating liquid of Example 1.
Biaxially oriented polypropylene was prepared in the same manner as in Example 1, except that a coating solution containing 100 parts by weight, 1 part by weight of wax with a melting point of 78° C., and 0.1 part by weight of fine silica powder with an average particle size of 3 μm was used. A gas barrier layer and a heat seal layer were sequentially formed on the film.
実施例４
実施例１の二軸延伸ポリプロピレンフィルムに代えて、
厚み１２μの二軸延伸ポリエチレンテレフタレートフィ
ルムを用いる以外、実施例１と同様にして、二軸延伸ポ
リエチレンテレフタレートフィルムにガスバリア層とヒ
ートシール層とを順次形成した。Example 4 Instead of the biaxially stretched polypropylene film of Example 1,
A gas barrier layer and a heat seal layer were sequentially formed on a biaxially stretched polyethylene terephthalate film in the same manner as in Example 1 except that a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was used.
比較例１
実施例１の二軸延伸ポリプロピレンに、無延伸ポリエチ
レンを溶融押出し、ポリエチレンからなる厚み２０μ量
のヒートシール層を形成した。Comparative Example 1 Unstretched polyethylene was melt-extruded onto the biaxially oriented polypropylene of Example 1 to form a heat seal layer of polyethylene with a thickness of 20 μm.
比較例２
実施例４の二軸延伸ポリエチレンテレフタレートフィル
ムに、ポリエチレンフィルムをドライラミネートにより
積層し、厚み２０μｍのヒートシール層を形成した。Comparative Example 2 A polyethylene film was laminated on the biaxially stretched polyethylene terephthalate film of Example 4 by dry lamination to form a heat seal layer with a thickness of 20 μm.
そして、各実施例及び比較例で得られたフィルムのヒー
トシール層同士を温度１１０℃、圧力１に９／ｃｊ、圧
着時間１秒の条件でヒートシールした。The heat-sealing layers of the films obtained in each Example and Comparative Example were heat-sealed together at a temperature of 110° C., a pressure of 1 to 9/cj, and a compression time of 1 second.
そして、ヒートシール部に対応する幅１５ｍｍの試料の
ヒートシール強度をテンシロン引張り試験機を用いて測
定した。Then, the heat seal strength of a sample having a width of 15 mm corresponding to the heat seal portion was measured using a Tensilon tensile tester.
また各実施例及び比較例で得られたフィルムの水蒸気透
過率及び酸素ガス透過率を下記の条件で測定した。Further, the water vapor permeability and oxygen gas permeability of the films obtained in each Example and Comparative Example were measured under the following conditions.
酸素ガス透過率：ガスクロマト法（測定器Ｌｙｓｓｙ
Ｇａｓ Ｐｅｒｓｅａｂｌｉｔｙ Ｔｅｓｔｌｎｇ Ａ
ｐｐａｒａｔｕｓ Ｌ−８６）により、湿度８０％の酸
素ガスと、補償ガスとしてのヘリウムガスとを用いて、
温度２０℃で測定した。単位はｃｃ／ｎ？／２４時間で
ある。Oxygen gas permeability: Gas chromatography method (measuring device Lyssy
Gas Perseability Test A
pparatus L-86) using oxygen gas with a humidity of 80% and helium gas as a compensation gas.
Measurements were made at a temperature of 20°C. Is the unit cc/n? /24 hours.
水蒸気透過率：ＪＩＳ Ｚ ０２０８に準拠し、温
度４０℃、相対湿度９′０％ＲＨの条件で測定した。単
位はｇ／ｙｎ’／２４時間である。Water vapor transmission rate: Measured in accordance with JIS Z 0208 at a temperature of 40° C. and a relative humidity of 9'0% RH. The unit is g/yn'/24 hours.
結果を表に示す。The results are shown in the table.
また実施例１及び比較例１のフィルムを用い、四方シー
ルにより菓子を包装した袋体を作製した。Furthermore, using the films of Example 1 and Comparative Example 1, bags in which confectionery was packaged with four-sided seals were produced.
この袋体を温度３０℃、相対湿度８０％の雰囲気中に放
置し、該袋体内の水分量を吸水率として測定した。結果
を図に示す。This bag was left in an atmosphere at a temperature of 30° C. and a relative humidity of 80%, and the amount of water inside the bag was measured as the water absorption rate. The results are shown in the figure.
（以下、余白）
表より明らかなように、比較例１及び比較例２のフィル
ムでは、ガスバリア性が十分でなかった。(Hereafter, blank space) As is clear from the table, the films of Comparative Example 1 and Comparative Example 2 did not have sufficient gas barrier properties.
これに対して、実施例１〜４のフィルムでは、ヒートシ
ール性及びガスバリア性に優れていた。On the other hand, the films of Examples 1 to 4 had excellent heat sealing properties and gas barrier properties.
また図より明らかなように、比較例１のフィルムよりも
実施例１のフィルムで作製した袋体は、吸水率が著しく
小さかった。Furthermore, as is clear from the figure, the water absorption rate of the bag made of the film of Example 1 was significantly lower than that of the film of Comparative Example 1.
図は実施例と比較例１のフィルムで作製した袋体の吸水
率と経過日数との関係を示すグラフである。The figure is a graph showing the relationship between the water absorption rate and the number of days elapsed for bags made using the films of Examples and Comparative Example 1.
Claims (1)
であって、上記ヒートシール層が、ガスバリア層を介し
て基材フィルムに積層されていることを特徴とするヒー
トシール可能なガスバリア性フィルム。1. A heat-sealable gas barrier film, which is a film in which a heat-sealing layer is formed on a base film, the heat-sealing layer being laminated on the base film via a gas barrier layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1209301A JP2940947B2 (en) | 1989-08-10 | 1989-08-10 | Method for producing heat-sealable gas barrier film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1209301A JP2940947B2 (en) | 1989-08-10 | 1989-08-10 | Method for producing heat-sealable gas barrier film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0371830A true JPH0371830A (en) | 1991-03-27 |
| JP2940947B2 JP2940947B2 (en) | 1999-08-25 |
Family
ID=16570687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1209301A Expired - Fee Related JP2940947B2 (en) | 1989-08-10 | 1989-08-10 | Method for producing heat-sealable gas barrier film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2940947B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495246B1 (en) | 1993-07-26 | 2002-12-17 | Daicel Chemical Industries, Ltd. | Heat-sealable composite films |
| JP2015530441A (en) * | 2012-09-11 | 2015-10-15 | バクスター・インターナショナル・インコーポレイテッドＢａｘｔｅｒ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃｏｒｐ０Ｒａｔｅｄ | Polymer film containing microspheres |
| WO2021241427A1 (en) * | 2020-05-27 | 2021-12-02 | 王子ホールディングス株式会社 | Heat-sealable paper and packaging bag |
| CN114701224A (en) * | 2022-02-16 | 2022-07-05 | 江阴宝柏包装有限公司 | Recyclable high-barrier forming base film and preparation method thereof |
-
1989
- 1989-08-10 JP JP1209301A patent/JP2940947B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495246B1 (en) | 1993-07-26 | 2002-12-17 | Daicel Chemical Industries, Ltd. | Heat-sealable composite films |
| JP2015530441A (en) * | 2012-09-11 | 2015-10-15 | バクスター・インターナショナル・インコーポレイテッドＢａｘｔｅｒ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃｏｒｐ０Ｒａｔｅｄ | Polymer film containing microspheres |
| WO2021241427A1 (en) * | 2020-05-27 | 2021-12-02 | 王子ホールディングス株式会社 | Heat-sealable paper and packaging bag |
| CN115667629A (en) * | 2020-05-27 | 2023-01-31 | 王子控股株式会社 | Heat sealing paper and packaging bag |
| CN115667629B (en) * | 2020-05-27 | 2024-01-16 | 王子控股株式会社 | Heat-sealing paper and packaging bag |
| CN114701224A (en) * | 2022-02-16 | 2022-07-05 | 江阴宝柏包装有限公司 | Recyclable high-barrier forming base film and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2940947B2 (en) | 1999-08-25 |
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