JPH0369255U - - Google Patents

Info

Publication number
JPH0369255U
JPH0369255U JP1989130874U JP13087489U JPH0369255U JP H0369255 U JPH0369255 U JP H0369255U JP 1989130874 U JP1989130874 U JP 1989130874U JP 13087489 U JP13087489 U JP 13087489U JP H0369255 U JPH0369255 U JP H0369255U
Authority
JP
Japan
Prior art keywords
cavity
cover glass
image sensor
state image
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989130874U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989130874U priority Critical patent/JPH0369255U/ja
Publication of JPH0369255U publication Critical patent/JPH0369255U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図aは本考案の一実施例に係るカバーガラ
スの平面図、同図bは同図aのカバーガラスを有
する本考案の一実施例の断面図、第2図は従来の
CCD固体撮像素子の断面図である。 1……パツケージ基体(ケース)、2……CC
Dチツプ、3……フイルタ、4……ボンデイング
ワイヤ、5……遮光板、6……カバーガラス、7
……光透過部、8……遮光膜。
FIG. 1a is a plan view of a cover glass according to an embodiment of the present invention, FIG. 1b is a sectional view of an embodiment of the present invention having the cover glass of FIG. FIG. 3 is a cross-sectional view of the element. 1...Package base (case), 2...CC
D chip, 3... Filter, 4... Bonding wire, 5... Light shielding plate, 6... Cover glass, 7
. . . Light transmission portion, 8 . . . Light shielding film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パツケージ基体のキヤビテイにCCDチツプが
収容固着され、前記キヤビテイ開口をカバーガラ
スにより蓋をしたCCD固体撮像素子において、
前記カバーガラス周辺部には前記チツプの電極パ
ツドとキヤビテイ周壁の肩部の導体膜配線との間
を接続するボンデイングワイヤを入射光から遮蔽
するための遮光膜が形成されていることを特徴と
するCCD固体撮像素子。
A CCD solid-state image sensor in which a CCD chip is housed and fixed in a cavity of a package base, and the cavity opening is covered with a cover glass,
A light shielding film is formed around the cover glass to shield bonding wires connecting between the electrode pads of the chip and the conductor film wiring on the shoulder of the cavity peripheral wall from incident light. CCD solid-state image sensor.
JP1989130874U 1989-11-08 1989-11-08 Pending JPH0369255U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989130874U JPH0369255U (en) 1989-11-08 1989-11-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989130874U JPH0369255U (en) 1989-11-08 1989-11-08

Publications (1)

Publication Number Publication Date
JPH0369255U true JPH0369255U (en) 1991-07-09

Family

ID=31678418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989130874U Pending JPH0369255U (en) 1989-11-08 1989-11-08

Country Status (1)

Country Link
JP (1) JPH0369255U (en)

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