JPH0369248A - Telephone set - Google Patents

Telephone set

Info

Publication number
JPH0369248A
JPH0369248A JP20621789A JP20621789A JPH0369248A JP H0369248 A JPH0369248 A JP H0369248A JP 20621789 A JP20621789 A JP 20621789A JP 20621789 A JP20621789 A JP 20621789A JP H0369248 A JPH0369248 A JP H0369248A
Authority
JP
Japan
Prior art keywords
telephone
dialing
reader
telephone number
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20621789A
Other languages
Japanese (ja)
Inventor
Minoru Kataoka
実 片岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Office Systems Ltd
Original Assignee
NEC Office Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Office Systems Ltd filed Critical NEC Office Systems Ltd
Priority to JP20621789A priority Critical patent/JPH0369248A/en
Publication of JPH0369248A publication Critical patent/JPH0369248A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To perform an accurate dialing operation in a short period by using a reader to read the telephone number printed on a visiting card and converting read data to a numerical value to automatically dial a telephone. CONSTITUTION:A telephone system consists of a ten-key input device A, a reader C which reads the telephone number printed on a visiting card, a decoder B which decodes data fetched by the reader, a whole control device D which controls the input of the ten-key input device A and the decoder B, and a dialing device which controls dialing based on the inputted telephone number. When an operator performs the input operation and the reader is used as the input device, read data is converted to a numerical value to dial the telephone.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、自動ダイヤリング電話機に関する。[Detailed description of the invention] [Industrial application field] TECHNICAL FIELD This invention relates to automatic dialing telephones.

〔従来の技術〕[Conventional technology]

従来の電話の一例を図面を用いて説明する。 An example of a conventional telephone will be explained using drawings.

第３図、第５図において１通常電話をかける場合にはテ
ンキー人力装置Ａにて相手先の電話番号をタイプし、ダ
イヤリング装置Ｂによりダイヤルを行っていた。In FIGS. 3 and 5, when making a regular phone call, the telephone number of the other party is typed in using a numeric keypad (A), and the dialing device (B) is used to dial the number.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の手動による電話機においては、７桁程度の電話番
号が書かれている物を見ながら電話機のテンキ一部より
入力しなければならず、入力する時間がかかるとともに
、電話番号の見まちがいまたは、入力まちがえを起こす
欠点が有った。With conventional manual telephones, you have to look at the 7-digit phone number and enter it from part of the numeric keypad on the phone, which takes a lot of time, and also makes it difficult to read the phone number by mistake. It had the drawback of causing input errors.

そこで本発明の目的は、以上の欠点を解決し簡易的な入
力及びまちがえが無い自動ダイヤリング電話機を提供す
ることにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned drawbacks and to provide an automatic dialing telephone with simple input and no mistakes.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の電話機は、名刺に書かれている電話番号を読み
取り装置で読み取ることにより、自動的にダイヤリング
することを可能とする機能を有している。The telephone of the present invention has a function that allows automatic dialing by reading the telephone number written on a business card with a reading device.

〔実施例〕〔Example〕

以下図面を用いて本発明の詳細な説明する。 The present invention will be described in detail below using the drawings.

第１図、第４図は、本発明の実施例を示すブロック槽底
図、外観図を示したものであり、従来の手動による入力
を行う場合に使用するテンキー人力装置Ａと、名刺に印
刷された電話番号を読み取る読み取り装置Ｃと、読み取
り装置にて取り込まれたデータを解読する解読装置Ｂと
、テンキー人力装置Ａと解読装置Ｂとの入力を制御する
全体制御装置りと、入力された電話番号よりダイヤリン
グを制御するダイヤリング装置とに構成される。Figures 1 and 4 show a bottom view and an external view of a block tank showing an embodiment of the present invention, and show a numeric keypad device A used for conventional manual input and printing on a business card. A reading device C that reads the input telephone number, a decoding device B that decodes the data captured by the reading device, and an overall control device that controls the input of the numeric keypad manual device A and the decoding device B. and a dialing device that controls dialing based on the telephone number.

次に内部論理の流れ図を第２図に示し説明する。まずオ
ペレータにより入力が行われると、入力装置が何である
かを判断する。（ステップ２１）。入力装置がテンキー
人力装置であれば、従来の動作を行いダイヤリング（ス
テップ２３）する。また、入力装置が読み収り装置であ
れば、読み取りデータを数値に変換しくステップ２２）
ダイヤリングを行う。Next, a flowchart of the internal logic is shown in FIG. 2 and will be explained. First, when an operator makes an input, it is determined what the input device is. (Step 21). If the input device is a numeric keypad manual device, conventional operations are performed to dial (step 23). Also, if the input device is a reading device, convert the read data into numerical values (step 22).
Perform dialing.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、名刺に印刷されている電
話番号を読み取り装置を使用して読み取り、数値に変更
し自動的にダイヤリングすることにより、短時間かつ正
確なダイヤリング動作を可能にする効果がある。As explained above, the present invention enables quick and accurate dialing by reading the telephone number printed on a business card using a reading device, converting it to a numerical value, and automatically dialing. It has the effect of

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第２図、第４図は本発明の一実施例のブロック
図、流れ図、斜視図、第３図、第５図は従来例の斜視図
、ブロック図である。 Ａ・・・テンキー人力装値、Ｂ・・・解読装置、Ｃ・・
・読み取り装置、Ｄ・・・全体制御装置、Ｅ・・・ダイ
ヤリング装置。1, 2, and 4 are block diagrams, flowcharts, and perspective views of one embodiment of the present invention, and FIGS. 3 and 5 are perspective views and block diagrams of conventional examples. A...Numeric keypad manual display, B...Decoding device, C...
・Reading device, D...Overall control device, E...Dialing device.

Claims (1)

【特許請求の範囲】[Claims] 名刺に書かれている電話番号を読み取り装置で読み取る
ことにより、自動的にダイヤリングすることを可能とし
たことを特徴とする電話機。A telephone characterized in that it is capable of automatically dialing by reading the telephone number written on a business card with a reading device.
JP20621789A 1989-08-08 1989-08-08 Telephone set Pending JPH0369248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20621789A JPH0369248A (en) 1989-08-08 1989-08-08 Telephone set

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20621789A JPH0369248A (en) 1989-08-08 1989-08-08 Telephone set

Publications (1)

Publication Number Publication Date
JPH0369248A true JPH0369248A (en) 1991-03-25

Family

ID=16519708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20621789A Pending JPH0369248A (en) 1989-08-08 1989-08-08 Telephone set

Country Status (1)

Country Link
JP (1) JPH0369248A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208023B1 (en) 1997-07-31 2001-03-27 Matsushita Electronics Corporation Lead frame for use with an RF powered semiconductor
US6867483B2 (en) 2000-09-13 2005-03-15 Carsen Semiconductor Sdn. Bhd. Stress-free lead frame
JP2005123383A (en) * 2003-10-16 2005-05-12 Asahi Kasei Electronics Co Ltd Electromagnetic transducer element
US6977431B1 (en) 2003-11-05 2005-12-20 Amkor Technology, Inc. Stackable semiconductor package and manufacturing method thereof
US7288833B2 (en) 2000-09-13 2007-10-30 Carsem (M) Sdn. Bhd. Stress-free lead frame
US7741161B2 (en) 2003-12-31 2010-06-22 Carsem (M) Sdn. Bhd. Method of making integrated circuit package with transparent encapsulant
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9871015B1 (en) 2002-11-08 2018-01-16 Amkor Technology, Inc. Wafer level package and fabrication method
US9947623B1 (en) 2011-11-29 2018-04-17 Amkor Technology, Inc. Semiconductor device comprising a conductive pad on a protruding-through electrode
US10014240B1 (en) 2012-03-29 2018-07-03 Amkor Technology, Inc. Embedded component package and fabrication method
US20190348348A1 (en) * 2000-10-06 2019-11-14 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US10811341B2 (en) 2009-01-05 2020-10-20 Amkor Technology Singapore Holding Pte Ltd. Semiconductor device with through-mold via

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208023B1 (en) 1997-07-31 2001-03-27 Matsushita Electronics Corporation Lead frame for use with an RF powered semiconductor
US7288833B2 (en) 2000-09-13 2007-10-30 Carsem (M) Sdn. Bhd. Stress-free lead frame
US6867483B2 (en) 2000-09-13 2005-03-15 Carsen Semiconductor Sdn. Bhd. Stress-free lead frame
US7786554B2 (en) 2000-09-13 2010-08-31 Carsem (M) Sdn. Bhd. Stress-free lead frame
US20190348348A1 (en) * 2000-10-06 2019-11-14 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US9871015B1 (en) 2002-11-08 2018-01-16 Amkor Technology, Inc. Wafer level package and fabrication method
US10665567B1 (en) 2002-11-08 2020-05-26 Amkor Technology, Inc. Wafer level package and fabrication method
JP2005123383A (en) * 2003-10-16 2005-05-12 Asahi Kasei Electronics Co Ltd Electromagnetic transducer element
US6977431B1 (en) 2003-11-05 2005-12-20 Amkor Technology, Inc. Stackable semiconductor package and manufacturing method thereof
US7741161B2 (en) 2003-12-31 2010-06-22 Carsem (M) Sdn. Bhd. Method of making integrated circuit package with transparent encapsulant
US11869829B2 (en) 2009-01-05 2024-01-09 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device with through-mold via
US10811341B2 (en) 2009-01-05 2020-10-20 Amkor Technology Singapore Holding Pte Ltd. Semiconductor device with through-mold via
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US10546833B2 (en) 2009-12-07 2020-01-28 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9978695B1 (en) 2011-01-27 2018-05-22 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US10410967B1 (en) 2011-11-29 2019-09-10 Amkor Technology, Inc. Electronic device comprising a conductive pad on a protruding-through electrode
US9947623B1 (en) 2011-11-29 2018-04-17 Amkor Technology, Inc. Semiconductor device comprising a conductive pad on a protruding-through electrode
US11043458B2 (en) 2011-11-29 2021-06-22 Amkor Technology Singapore Holding Pte. Ltd. Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode
US10090228B1 (en) 2012-03-06 2018-10-02 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10014240B1 (en) 2012-03-29 2018-07-03 Amkor Technology, Inc. Embedded component package and fabrication method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method

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