JPH0369201U - - Google Patents
Info
- Publication number
- JPH0369201U JPH0369201U JP13068689U JP13068689U JPH0369201U JP H0369201 U JPH0369201 U JP H0369201U JP 13068689 U JP13068689 U JP 13068689U JP 13068689 U JP13068689 U JP 13068689U JP H0369201 U JPH0369201 U JP H0369201U
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- resistive film
- chamfering
- chamfered
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
第1図は本考案に係るチツプ抵抗を示す斜視図
、第2図はこのチツプ抵抗をプリント基板に実装
した状態を示す図、第3図a〜dは本考案に係る
チツプ抵抗の製造方法を示す図、第4図は従来の
チツプ抵抗を示す斜視図、第5図a〜dは従来の
チツプ抵抗の製造方法を示す図である。
1……部品素体、2……厚膜抵抗体、3,3…
…電極、4……主表面、4a,4b……斜面、5
,5……半田メツキ層、40……マザーボード、
41……V字溝。
FIG. 1 is a perspective view showing a chip resistor according to the present invention, FIG. 2 is a diagram showing a state in which this chip resistor is mounted on a printed circuit board, and FIGS. 4 is a perspective view showing a conventional chip resistor, and FIGS. 5 a to 5 d are diagrams showing a conventional method of manufacturing a chip resistor. 1... Component element body, 2... Thick film resistor, 3, 3...
...Electrode, 4...Main surface, 4a, 4b...Slope, 5
, 5... Solder plating layer, 40... Motherboard,
41...V-shaped groove.
Claims (1)
つた主表面上に抵抗膜が形成されると共に、面取
りにより形成された傾斜面と前記抵抗膜の端部に
亘つて電極が被着されていることを特徴とするチ
ツプ抵抗。 Both corners of the main surface of the component body are chamfered, a resistive film is formed on the remaining main surface, and electrodes are adhered to the inclined surface formed by the chamfering and the ends of the resistive film. Chip resistance characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13068689U JPH0369201U (en) | 1989-11-09 | 1989-11-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13068689U JPH0369201U (en) | 1989-11-09 | 1989-11-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0369201U true JPH0369201U (en) | 1991-07-09 |
Family
ID=31678242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13068689U Pending JPH0369201U (en) | 1989-11-09 | 1989-11-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0369201U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006027148A (en) * | 2004-07-16 | 2006-02-02 | Hisaaki Iwanuma | Seal |
JP2006027147A (en) * | 2004-07-16 | 2006-02-02 | Hisaaki Iwanuma | Seal |
-
1989
- 1989-11-09 JP JP13068689U patent/JPH0369201U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006027148A (en) * | 2004-07-16 | 2006-02-02 | Hisaaki Iwanuma | Seal |
JP2006027147A (en) * | 2004-07-16 | 2006-02-02 | Hisaaki Iwanuma | Seal |
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