JPH0368187A - Flexible circuit board - Google Patents
Flexible circuit boardInfo
- Publication number
- JPH0368187A JPH0368187A JP30408489A JP30408489A JPH0368187A JP H0368187 A JPH0368187 A JP H0368187A JP 30408489 A JP30408489 A JP 30408489A JP 30408489 A JP30408489 A JP 30408489A JP H0368187 A JPH0368187 A JP H0368187A
- Authority
- JP
- Japan
- Prior art keywords
- flexible
- section
- circuit pattern
- mounting
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 claims abstract description 26
- 230000007704 transition Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 abstract description 16
- 238000007747 plating Methods 0.000 abstract description 15
- 239000000126 substance Substances 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 9
- 238000000059 patterning Methods 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 238000005452 bending Methods 0.000 description 28
- 239000011888 foil Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、電子部品の為の実装部とこれに連設される屈
曲可撓部とを備えるようなフレキシブル回路基板に関す
る６ので、特には、上記実装部及び該実装部と屈曲可撓
部との移行部に対して所要の電解メッキを施すように構
成した新規なフレキシブル回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a flexible circuit board having a mounting section for electronic components and a bendable flexible section connected to the mounting section. The present invention relates to a novel flexible circuit board configured to apply required electrolytic plating to the mounting portion and the transition portion between the mounting portion and the bending and flexible portion.
「従来の技術」
この種のフレキシブル回路基板は、各種の電気電子機器
の効果的な配線手段として現今多方面に採用されており
、その或種の形態のものとしては、その一部に電子部品
を搭載できるようにした実装部を具備すると共に、この
実装部に連設して部品実装機能を有しない屈曲可撓部を
備えるようなフレキシブル回路基板が知られている。斯
かる実装部及び屈曲可撓部を有するフレキシブル回路基
板を製造する一般的な手法としては、適当なフレキシブ
ル絶縁ベース材の両面に銅箔等の導電箔を被着したフレ
キシブル回路基板素材を用意し、その所要個所にスルー
ホール導通用の穴を穿設してこの基板素材全体を無電解
化学メッキ処理に付すことによりスルーホールの導通化
を図り、更にこのスルーホール導通を確実にするために
電解メッキ処理を施して上記無電解化学メッキ層上に電
解メッキ層を形成した後、エツチング手段で所要の回路
パターンを形成することにより、実装部にはその両面に
スルーホール導通部を有する回路パターンが形成され、
又、該実装部に連設する屈曲可撓部にはその一方面又は
両面に上記回路パターンと連続する他の回路パターンが
形成される。"Prior Art" This type of flexible circuit board is currently being used in many fields as an effective wiring means for various electrical and electronic devices, and in some forms, it includes electronic components. A flexible circuit board is known that includes a mounting section on which a component can be mounted, and a bendable flexible section that is connected to the mounting section and does not have a component mounting function. A common method for manufacturing a flexible circuit board having such a mounting part and a bendable part is to prepare a flexible circuit board material in which conductive foil such as copper foil is coated on both sides of a suitable flexible insulating base material. By drilling holes for through-hole conduction at the required locations and subjecting the entire board material to electroless chemical plating treatment, the through-holes are made conductive by electrolytic plating. After plating is performed to form an electrolytic plating layer on the electroless chemical plating layer, a desired circuit pattern is formed by etching, so that the mounting part has a circuit pattern having through-hole conductive parts on both sides. formed,
Further, another circuit pattern that is continuous with the circuit pattern described above is formed on one or both surfaces of the bendable flexible section that is connected to the mounting section.
この様な周知の手段によれば、実装部及び屈曲可撓部の
回路パターンの全部に硬い組織を有する電解メッキが被
着している為、屈曲可撓部のフレキシビリティは極端に
低下するのみならず、屈曲動作によってその部分の回路
パターンが断線するという重大な問題が発生する。屈曲
可撓部に於けるこの様な問題を解消する手段として、こ
の可撓部にはその一方面にのみ回路パターンを設け、こ
れらの回路パターン上にはメッキ層を全く設けないよう
に構成することにより、屈曲可撓部のフレキシビリティ
を確保し且つ断線を阻止するようにしたちのは、例えば
、実公昭５６−５４６０７号及び特開昭５７−７９６９
７号公報等で知られている。According to such well-known means, the flexibility of the flexible bending part is only extremely reduced because electrolytic plating having a hard structure is applied to the entire circuit pattern of the mounting part and the flexible bending part. Otherwise, a serious problem arises in that the circuit pattern at that portion is disconnected due to the bending operation. As a means of solving this problem with the bending flexible part, the flexible part is configured so that circuit patterns are provided only on one side, and no plating layer is provided on these circuit patterns. For example, Japanese Utility Model Publication No. 56-54607 and Japanese Unexamined Patent Publication No. 57-7969 ensure the flexibility of the bending flexible portion and prevent wire breakage.
It is known from Publication No. 7, etc.
なお、フレキシブルプリント板の屈曲部に於いて、ひず
み範囲が大きい領域ではその部分の銅箔の厚さを薄くし
且つその幅を広く形成して当該領域の断面積を一定に構
成し、この屈曲部の耐屈曲疲労性を改善するものとして
は実開昭５７−５５９７２号公報に記載の技術がある。In addition, in the bending part of the flexible printed board, in the area where the strain range is large, the thickness of the copper foil in that part is made thinner and its width is made wider to make the cross-sectional area of the area constant. There is a technique described in Japanese Utility Model Application Publication No. 57-55972 that improves the bending fatigue resistance of the parts.
しかし、斯かる耐屈曲疲労性の改善手段は非屈曲実装部
と屈曲可撓部との間の移行部に対しては有効ではなく１
．また銅箔の特定部分についてその厚さを薄く幅を広く
して所要電流容量を満たすべく当該領域の断面積を一定
に構成することは実用上困難である他、銅箔に対するパ
ターンニングでも厚さの異なる部分では問題となる。However, such measures for improving bending fatigue resistance are not effective for the transition area between the non-bending mounting part and the bending flexible part.
．． In addition, it is practically difficult to reduce the thickness and widen the width of a specific part of the copper foil to maintain a constant cross-sectional area in order to satisfy the required current capacity. This is a problem in different parts of the world.
「発明が解決しようとする問題点」
屈曲可撓部の回路パターンにメッキ層を被着させない様
に構成する上記従来手段の場合、実装部に該当する導電
箔領域には電解メッキ層が被着しており、これに対して
屈曲可撓部は素材の導電箔のみであるから、その境界に
は段差が形成される。"Problems to be Solved by the Invention" In the case of the above-mentioned conventional means configured so that the plating layer is not deposited on the circuit pattern of the bending and flexible part, the electrolytic plating layer is deposited on the conductive foil area corresponding to the mounting part. On the other hand, since the bendable flexible portion is made of only a conductive foil material, a step is formed at the boundary thereof.
この様な状態でフォトレジスト及びエツチング処理工程
を施して回路パターンを形成すると、上記の段差の影響
によりこの段差近傍の回路パターンを正確に形成するこ
とが困難であり、更に、この様な段差部分は応力集中に
よる断線の危険度も高くなるという問題がある。他方、
実装部のみに無電解化学メッキ及び電解メッキを施すた
めには、屈曲可撓部に対するマスキング処理を行なう必
要があるが、このマスキング工程には大幅な工数を要し
、又、終段に於いてこのマスクを除去しなければならな
いなど工程を煩雑化する要因となる。If a circuit pattern is formed by photoresist and etching processes in such a state, it is difficult to accurately form a circuit pattern in the vicinity of the step due to the effect of the step. However, there is a problem in that the risk of wire breakage due to stress concentration increases. On the other hand,
In order to perform electroless chemical plating and electrolytic plating only on the mounting part, it is necessary to mask the bending and flexible parts, but this masking process requires a large number of man-hours, and The need to remove this mask becomes a factor that complicates the process.
ｒ問題点を解決するための手段」
本発明はそこで、所要の回路パターンを両面に有しかつ
それら回路パターンの所要個所にスルーホール導通部を
形成すると共に上記回路パターン及び該スルーホール導
通部に電解メッキ層を設けた実装部と、少なくとも上記
一方面の回路パターンと共に形成され電解メッキ層を有
しない他の回路パターンを設けるように上記実装部に連
設された屈曲可撓部とを具備するフレキシブル回路基板
に於いて、上記実装部の回路パターン上の電解メッキ層
からスロープ状に新減して上記屈曲可撓部の回路パター
ンに移行する電解メッキ部で形成した移行部を前記実装
部と屈曲可撓部との間に配設するように構成したフレキ
シブル回路基板を提供するものである。Therefore, the present invention has the required circuit patterns on both sides and through-hole conductive portions are formed in the required locations of the circuit patterns, and the circuit pattern and the through-hole conductive portions are provided with the required circuit patterns on both sides. It comprises a mounting part provided with an electrolytic plating layer, and a bending flexible part formed together with the circuit pattern on at least one side and connected to the mounting part so as to provide another circuit pattern not having an electrolytic plating layer. In the flexible circuit board, a transition part formed by an electrolytic plating layer that decreases in a slope shape from the electrolytic plating layer on the circuit pattern of the mounting part to the circuit pattern of the bending and flexible part is formed with the mounting part. The present invention provides a flexible circuit board configured to be disposed between the bending and flexible portion.
「作 用」
実装部と屈曲可撓部との間の移行部に於ける回路パター
ンは、その上にスロープ状の電解メッキ部を備え、該ス
ロープ状電解メッキ部は実装部の回路パターン上の電解
メッキ層に連続しているので、従来の如（電解メッキの
有無による段差の影響によってその部分の回路パターン
ニングが困難となるような問題は好適に解消され、又、
そのような段差部分に対する応力集中化も回避して断線
等の虞を阻止することが可能となる。"Function" The circuit pattern at the transition part between the mounting part and the bending flexible part has a slope-shaped electrolytic plated part thereon, and the slope-shaped electrolytic plated part is formed on the circuit pattern of the mounting part. Since it is continuous with the electrolytic plating layer, the conventional problem of difficulty in circuit patterning at that part due to the influence of steps due to the presence or absence of electrolytic plating is solved, and
It is also possible to avoid concentration of stress on such stepped portions, thereby preventing the risk of wire breakage and the like.
「実 施 例」
第１図は、本発明の一実施例に従って構成されたフレキ
シブル回路基板の要部を概念的に拡大して示す部分断面
構成図であり、１０は例えばボリアミドフィルムまたは
ポリイミドフィルム等のブラスヂ・・ノクフイルム若し
くはアルミニウム箔等の金属箔からなるフレキシブルベ
ース材を示し、このベース材１０の一方面には所要の回
路パターン１１が銅箔等の導電箔により形成され、また
ベース材１０の他方面の所定部位には他の回路パターン
１２が形成されるにの回路パターン１２を有Ｖる領域は
実装部Ａを構成し、該実装部Ａに連続１、′Ｃ本発明に
よる移行部Ｃが設けられ、この移行部Ｃを介して屈曲可
撓部Ｂが実装部Ａに連設されている。実装部Ａは電子部
品等の搭載機能を備えるようにスルーホール導通手段が
形成されるものｒ、１．３はその為のスルーホール、１
４は該スル・−ホール１３の内周面を導通化する為に導
電箔の全面に施される無電解化学メッキ層であって、図
のように回路パターン１１及び１２の全てに薄く被着さ
れている。１５は実装部Ａに於ける回路パターン１１及
び１２並びにスルーホール１３の内周面に所要の厚さで
形成された電解メッキ層を示し、この電解メッキ層１５
は移行部Ｃでの回路パターンｌｌ上のスロープ状の電解
メッキ部】６で終端し、屈曲可撓部Ｂに於ける回路パタ
ーン１１上には被着形成されていない。"Embodiment" FIG. 1 is a partial cross-sectional configuration diagram conceptually showing an enlarged main part of a flexible circuit board constructed according to an embodiment of the present invention. A flexible base material made of brass film or metal foil such as aluminum foil is shown, and a required circuit pattern 11 is formed on one side of the base material 10 using conductive foil such as copper foil. Another circuit pattern 12 is formed at a predetermined portion on the other side of the circuit.The area V having the circuit pattern 12 constitutes a mounting part A, and the transition part 1,'C according to the present invention is continuous to the mounting part A. C is provided, and the bendable flexible portion B is connected to the mounting portion A via this transition portion C. Mounting part A is formed with through-hole conduction means so as to have the function of mounting electronic components, etc., 1.3 is a through-hole for that purpose, 1
Reference numeral 4 denotes an electroless chemical plating layer applied to the entire surface of the conductive foil in order to make the inner peripheral surface of the through-hole 13 conductive, and is thinly applied to all of the circuit patterns 11 and 12 as shown in the figure. has been done. Reference numeral 15 indicates an electrolytic plating layer formed to a required thickness on the circuit patterns 11 and 12 and the inner circumferential surface of the through hole 13 in the mounting portion A.
terminates at a slope-shaped electrolytic plated portion ]6 on the circuit pattern 11 at the transition portion C, and is not deposited on the circuit pattern 11 at the bending and flexible portion B.
上記構造のフレキシブル回路基板は、屈曲可撓部Ｂの回
路パターン１１上には無電解化学メッキ層１４のみが被
着し、硬い組織からなる電解メッキ層を有しないので、
屈曲可撓部Ｂのフレキシビリティは良好に確保される。In the flexible circuit board having the above structure, only the electroless chemical plating layer 14 is deposited on the circuit pattern 11 of the bendable portion B, and there is no electrolytic plating layer consisting of a hard structure.
Flexibility of the bending flexible portion B is ensured satisfactorily.
そして、この屈曲可撓部Ｂと実装部Ａとの間には、該実
装部Ａの回路パターン上の電解メッキ層１５からスロー
プ状に斬減して上記屈曲可撓部Ｂの回路パターン１１に
移行する電解メッキ部１６を有する移行部Ｃを配設しで
ある為、このスロープ状電解メッキ部１６の無いものと
比較した場合、屈曲動作などによる応力の集中化が好適
に低減されてこの移行部Ｃにおける回路パターン１１の
断線等の問題が良好に解消されることとなる。Then, between the bending flexible part B and the mounting part A, the electrolytic plating layer 15 on the circuit pattern of the mounting part A is cut in a slope shape to form the circuit pattern 11 of the bending flexible part B. Since the transition part C having the electrolytic plated part 16 to be transferred is provided, stress concentration due to bending motion etc. is suitably reduced when compared with a case without this slope-shaped electrolytic plated part 16, and this transition Problems such as disconnection of the circuit pattern 11 in the portion C can be satisfactorily solved.
このようなフレキシブル回路基板を製造するには、ベー
ス材１０の両面に導電箔を貼付けたフレキシブル回路基
板素材を用意し、先ず、実装部Ａに該当する所要のスル
ーホール１３を穿設し、次いで常法に従って無電解化学
メッキ手段により、スルーホール１３の内周面及び導電
箔の全面に厚さ０．２μｍ以上の無電解化学メッキ層１
４を形成する。そして、第２図又は第３図に示すように
、屈曲可撓部Ｂに該当する領域に遮蔽板１７または２０
を装着して実装部Ａ及び移行部Ｃにのみ電解メッキ層１
５及びスロープ状電解メッキ部１６を一様に被着させた
段階で遮蔽板１７又は２０を取り外し、その後、フォト
レジスト工程及びエツチング工程を施して所要の回路パ
ターン１１と１２を形成する。In order to manufacture such a flexible circuit board, a flexible circuit board material with conductive foil pasted on both sides of the base material 10 is prepared, first, the required through holes 13 corresponding to the mounting part A are bored, and then An electroless chemical plating layer 1 with a thickness of 0.2 μm or more is applied to the inner peripheral surface of the through hole 13 and the entire surface of the conductive foil by electroless chemical plating according to a conventional method.
form 4. Then, as shown in FIG. 2 or 3, a shielding plate 17 or 20 is placed in the area corresponding to the bending flexible portion
electrolytic plating layer 1 only on mounting area A and transition area C.
5 and the slope-shaped electrolytic plated portion 16 are uniformly deposited, the shielding plate 17 or 20 is removed, and then a photoresist process and an etching process are performed to form the required circuit patterns 11 and 12.
このような手段に代えて、スルーホール導通の為の無電
解化学メッキ処理工程後、直ちにフォトレジスト工程及
びエツチング工程を行なって所要の回路パターン１１及
び１２を形成し、次に第２図又は第３図のような遮蔽板
１７又は２０の屈曲可撓部Ｂに対する装着を行った状態
で電解メッキ処理工程を施して実装部Ａ及び移行部Ｃの
回路パターン１１並びにスルーホール部に電解メッキ層
１５、スロープ状電解メッキ部１６を同時に設けるよう
にすることも可能である。Instead of such means, after the electroless chemical plating process for through-hole conduction, a photoresist process and an etching process are immediately performed to form the required circuit patterns 11 and 12, and then the process shown in FIG. With the shielding plate 17 or 20 attached to the bending and flexible portion B as shown in Fig. 3, an electrolytic plating process is performed to form an electrolytic plating layer 15 on the circuit pattern 11 and through-hole portions of the mounting portion A and transition portion C. It is also possible to provide the slope-shaped electrolytic plated portion 16 at the same time.
屈曲可撓部Ｂに装着される遮蔽板１７は、第２図の場合
、この屈曲可撓部Ｂの無電解化学メッキ層１４に接する
部分１８を有し、この段状の部分１８により移行部Ｃと
の間に所要のギャップ１９を形成するように構成されて
おり、このギャップ１９の部分に於いて移行部Ｃにはス
ロープ状の電解メッキ部１６が形成される。このような
電解メッキ部１６のスロープを更に良好に形成するには
、第３図のように、移行部Ｃから実装部Ａの方向に上向
きの角度で斜傾する部分２１を有する遮蔽板２０を使用
するのが好適であって、斜傾部２１の角度を種々変更す
ることによってスロープの度合いを変えることが可能で
ある１例えば、電解メッキ層１５の厚さが１２μｍの場
合に於ける斜傾部２１の角度は、約２０°程度のものと
なる。これらの遮蔽板１７又は２０は、屈曲可撓部Ｂに
対して適当なりリップ等の挟み付は具を使用して取り付
けるか、又はこのような手段と併用して屈曲可境部Ｂに
軽く接着するようにしても良い。いずれにしても、遮蔽
板１７又は２０は、屈曲可撓部Ｂに簡単に着脱できるよ
うに装着されるものであって、その着脱工程は簡単に処
理できる。In the case of FIG. 2, the shielding plate 17 attached to the bending flexible portion B has a portion 18 that is in contact with the electroless chemical plating layer 14 of the bending flexible portion B, and this step-like portion 18 forms a transition portion. A slope-shaped electrolytic plated portion 16 is formed in the transition portion C at this gap 19. In order to form such a slope of the electrolytic plating part 16 even better, as shown in FIG. The degree of slope can be changed by variously changing the angle of the inclined portion 21. For example, when the thickness of the electroplated layer 15 is 12 μm, The angle of the portion 21 is about 20°. These shielding plates 17 or 20 are attached to the bendable portion B using a suitable clip such as a lip, or are lightly glued to the bendable portion B in combination with such means. You may also do so. In any case, the shielding plate 17 or 20 is attached to the bendable flexible portion B so that it can be easily attached and detached, and the process of attaching and detaching it can be easily performed.
なお、図面に於ける屈曲可撓部Ｂは、その一方面にのみ
回路パターンを有する例を示したが、上記の如き構造の
移行部Ｃを介在させてその両面に回路パターンを形成す
るようにち適宜変更することができる。Although the bendable flexible portion B in the drawings has a circuit pattern only on one side, it is possible to form a circuit pattern on both sides by interposing a transition portion C having the above-described structure. It can be changed as appropriate.
「発明の効果」
本発明に係るフレキシブル回路基板は、上記の如く、実
装部と屈曲可撓部との間に実装部の電解メッキ層と共に
形成され、この電解メッキ層からスロープ状に漸減して
屈曲可撓部の回路パターンに移行する電解メッキ部を有
する移行部を設けるように構成されているので、実装部
の電解メッキ部と屈曲可撓部の回路パターンとは何んら
の段差を生ずることなく連設されるようになり、これに
よって回路パターンニング処理の確実化と応力集中によ
る回路パターンの断線等を好適に阻止しかつ屈曲可撓性
の優れた高い品質の製品を提供できる。"Effects of the Invention" As described above, the flexible circuit board according to the present invention is formed between the mounting part and the bending flexible part together with the electrolytic plated layer of the mounting part, and the electrolytic plated layer gradually decreases in a slope shape from this electrolytic plated layer. Since it is configured to provide a transition part having an electrolytic plated part that transitions to the circuit pattern of the bendable flexible part, there is no difference in level between the electrolytic plated part of the mounting part and the circuit pattern of the bendable flexible part. This makes it possible to ensure the circuit patterning process, suitably prevent circuit pattern breakage due to stress concentration, and provide a high quality product with excellent bending flexibility.
第１図は本発明の一実施例に従って構成されたフレキシ
ブル回路基板の概念的な要部拡大断面構成図、第２図及
び第３図は本発明のフレキシブル回路基板を製作する際
に使用する遮蔽板の構成例を示す説明図である。
０
１
２
３
４
５
６
７
０
１
・ ・ ・ ・ ・ ・ フ し キ シ ブ
ル ベ ＝・・・・・・回 路 バ タ
・・・・・・回 路 バ タ
・・・・・・ス ル − ホ
・・・・・無電解化学メツ
・・・ ・・電 解 メ ッ キ・
・・・ ・スロープ状電解メッキ
・・・・・遮 蔽
・・・・・・遮 蔽
・・・・・・斜 傾FIG. 1 is a conceptual enlarged cross-sectional configuration diagram of essential parts of a flexible circuit board constructed according to an embodiment of the present invention, and FIGS. 2 and 3 are shields used in manufacturing the flexible circuit board of the present invention. It is an explanatory view showing an example of composition of a board. 0 1 2 3 4 5 6 7 0 1 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ． Through-hole... Electroless chemical plating... Electrolytic plating...
・・・・Slope electrolytic plating・・shielding・・shielding・・・slanting slope
Claims (1)
ターンの所要個所にスルーホール導通部を形成すると共
に上記回路パターン及び該スルーホール導通部に電解メ
ッキ層を設けた実装部と、少なくとも上記一方面の回路
パターンと共に形成され電解メッキ層を有しない他の回
路パターンを設けるように上記実装部に連設された屈曲
可撓部とを具備するフレキシブル回路基板に於いて、上
記実装部の回路パターン上の電解メッキ層からスロープ
状に斬減して上記屈曲可撓部の回路パターンに移行する
電解メッキ部で形成した移行部を前記実装部と屈曲可撓
部との間に配設するように構成したことを特徴とするフ
レキシブル回路基板。a mounting portion having required circuit patterns on both sides, forming through-hole conductive portions at required locations of the circuit patterns, and providing an electrolytic plating layer on the circuit patterns and the through-hole conductive portions; and at least one side of the mounting portion. In a flexible circuit board, the flexible circuit board is provided with a bendable flexible part connected to the mounting part so as to provide another circuit pattern formed together with the circuit pattern and having no electrolytic plating layer. A transition part formed of an electrolytic plated part that is cut in a slope shape from the electrolytic plated layer and transitions to the circuit pattern of the bendable flexible part is disposed between the mounting part and the bendable flexible part. A flexible circuit board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30408489A JPH0368187A (en) | 1989-11-22 | 1989-11-22 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30408489A JPH0368187A (en) | 1989-11-22 | 1989-11-22 | Flexible circuit board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59132253A Division JPS6112094A (en) | 1984-06-27 | 1984-06-27 | Flexible circuit board and method of producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0368187A true JPH0368187A (en) | 1991-03-25 |
| JPH0346992B2 JPH0346992B2 (en) | 1991-07-17 |
Family
ID=17928837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30408489A Granted JPH0368187A (en) | 1989-11-22 | 1989-11-22 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0368187A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183740A (en) * | 2003-12-19 | 2005-07-07 | Mitsui Mining & Smelting Co Ltd | Printed wiring board and semiconductor device |
| WO2008035416A1 (en) * | 2006-09-21 | 2008-03-27 | Daisho Denshi Co., Ltd. | Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
-
1989
- 1989-11-22 JP JP30408489A patent/JPH0368187A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183740A (en) * | 2003-12-19 | 2005-07-07 | Mitsui Mining & Smelting Co Ltd | Printed wiring board and semiconductor device |
| WO2008035416A1 (en) * | 2006-09-21 | 2008-03-27 | Daisho Denshi Co., Ltd. | Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
| US8188372B2 (en) | 2006-09-21 | 2012-05-29 | Daisho Denshi Co., Ltd. | Flex-rigid printed wiring board and manufacturing method thereof |
| US9155209B2 (en) | 2006-09-21 | 2015-10-06 | Daisho Denshi Co., Ltd. | Flex-rigid printed wiring board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0346992B2 (en) | 1991-07-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |