JPH0367471U - - Google Patents
Info
- Publication number
- JPH0367471U JPH0367471U JP12865589U JP12865589U JPH0367471U JP H0367471 U JPH0367471 U JP H0367471U JP 12865589 U JP12865589 U JP 12865589U JP 12865589 U JP12865589 U JP 12865589U JP H0367471 U JPH0367471 U JP H0367471U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductive via
- layer thin
- back sides
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000010410 layer Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12865589U JPH0367471U (xx) | 1989-11-02 | 1989-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12865589U JPH0367471U (xx) | 1989-11-02 | 1989-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367471U true JPH0367471U (xx) | 1991-07-01 |
Family
ID=31676347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12865589U Pending JPH0367471U (xx) | 1989-11-02 | 1989-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367471U (xx) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003218525A (ja) * | 2002-01-18 | 2003-07-31 | Fujitsu Ltd | 回路基板及びその製造方法 |
| JP2004219318A (ja) * | 2003-01-16 | 2004-08-05 | Hamamatsu Photonics Kk | 放射線検出器 |
| WO2004110116A1 (ja) * | 2003-06-03 | 2004-12-16 | Hitachi Metals, Ltd. | 貫通電極付き基板の製造方法 |
| JP2013098209A (ja) * | 2011-10-28 | 2013-05-20 | Seiko Epson Corp | 回路基板、電子デバイス、電子機器、及び回路基板の製造方法 |
| JP2020199748A (ja) * | 2019-06-13 | 2020-12-17 | セイコーエプソン株式会社 | 配線基板、配線基板の製造方法、インクジェットヘッド、ｍｅｍｓデバイスおよび発振器 |
-
1989
- 1989-11-02 JP JP12865589U patent/JPH0367471U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003218525A (ja) * | 2002-01-18 | 2003-07-31 | Fujitsu Ltd | 回路基板及びその製造方法 |
| JP2004219318A (ja) * | 2003-01-16 | 2004-08-05 | Hamamatsu Photonics Kk | 放射線検出器 |
| WO2004110116A1 (ja) * | 2003-06-03 | 2004-12-16 | Hitachi Metals, Ltd. | 貫通電極付き基板の製造方法 |
| JP2013098209A (ja) * | 2011-10-28 | 2013-05-20 | Seiko Epson Corp | 回路基板、電子デバイス、電子機器、及び回路基板の製造方法 |
| JP2020199748A (ja) * | 2019-06-13 | 2020-12-17 | セイコーエプソン株式会社 | 配線基板、配線基板の製造方法、インクジェットヘッド、ｍｅｍｓデバイスおよび発振器 |