JPH0366558B2 - - Google Patents
Info
- Publication number
- JPH0366558B2 JPH0366558B2 JP5591084A JP5591084A JPH0366558B2 JP H0366558 B2 JPH0366558 B2 JP H0366558B2 JP 5591084 A JP5591084 A JP 5591084A JP 5591084 A JP5591084 A JP 5591084A JP H0366558 B2 JPH0366558 B2 JP H0366558B2
- Authority
- JP
- Japan
- Prior art keywords
- heat exchanger
- heat
- low temperature
- refrigerator
- shield plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007789 gas Substances 0.000 claims description 40
- 238000001816 cooling Methods 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 9
- 239000001307 helium Substances 0.000 claims description 6
- 229910052734 helium Inorganic materials 0.000 claims description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 description 9
- 238000007906 compression Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は液体ヘリウム、水素、窒素などの低温
液化ガス（以下寒剤と称す）を用いた冷凍・寒剤
の貯蔵を効果的に行なう低温容器であり、特に低
温容器外にある冷凍機から低温液体又は低温気体
を移送させて低温容器の真空断熱層内にある２枚
以上の熱シールド板を冷却して内部への熱侵入を
減らすようにした低温容器の冷却装置に関するも
のである。[Detailed Description of the Invention] (Industrial Application Field) The present invention provides a low-temperature container for effectively freezing and storing cryogens using low-temperature liquefied gases (hereinafter referred to as cryogens) such as liquid helium, hydrogen, and nitrogen. Yes, in particular, by transferring low-temperature liquid or low-temperature gas from a refrigerator located outside the low-temperature container to cool two or more heat shield plates within the vacuum insulation layer of the low-temperature container to reduce heat intrusion into the interior. This invention relates to a cooling device for a low temperature container.
（従来技術）
従来の低温容器は第１図の様に二系統の冷却回
路を用いるか、第２図のように一系統の冷却回路
の中間部分の低温液体又は低温気体をそのまま用
いてそれぞれの温度レベルの熱シールド板の冷却
を行なつていた。(Prior art) Conventional cryogenic containers use two cooling circuits as shown in Figure 1, or use the low-temperature liquid or gas in the middle of one cooling circuit as is, as shown in Figure 2. Cooling of the heat shield plate was performed at the temperature level.
ここで先ず本発明と同様に一系統の冷却装置を
用いた第２図について回路構成を詳細に説明する
と、１は圧縮機、２は圧縮熱放熱器で、該放熱器
２は圧縮機１の吐出側に隣接して設けられてい
る。３，５は第１、第２熱交換器、４ａ，６は冷
凍機の低温発生部に設けられた冷凍機低温発生部
熱における第１，第２交換器で、それぞれ第１が
高温側、第２が低温側である。 First, the circuit configuration will be explained in detail with respect to FIG. 2, which uses a single cooling system like the present invention. 1 is a compressor, 2 is a compression heat radiator, and the radiator 2 is the compressor 1. It is provided adjacent to the discharge side. 3 and 5 are first and second heat exchangers; 4a and 6 are first and second exchangers for the heat of the refrigerator low temperature generation section provided in the low temperature generation section of the refrigerator; the first is the high temperature side; The second is the low temperature side.
７，８は第２、第１熱シールド板、９，１０は
第２、第１熱シールド板をそれぞれ冷却するため
の第２、第１熱シールド板冷却熱交換器である。
この場合も第１が高温側、第２が低温側である。
１１は液体ヘリウム等を入れる寒剤容器で、これ
らは低温容器外箱１２に包含されている。また第
１熱シールド板８は低温容器外箱１２と第２シー
ルド板７の間、第２熱シールド板７は第１熱シー
ルド板８と寒剤容器１１の間の真空断熱層空間
に、それぞれ第２熱シールド板７、寒剤容器１１
を覆い包むように配設されている。そしてこれら
の圧縮機１、圧縮熱放熱器２、第１、第２熱交換
器３，５、冷凍機低温発生部における第１、第２
熱交換器４ａ，６、第２、第１熱シールド板冷却
熱交換器９，１０が、往路管路１３ａ，１５ａ及
び復路管路１４ａ，１６ａによつて連結され、動
作気体循環回路が構成されている。 7 and 8 are second and first heat shield plates, and 9 and 10 are second and first heat shield plate cooling heat exchangers for cooling the second and first heat shield plates, respectively.
In this case as well, the first side is the high temperature side and the second side is the low temperature side.
Reference numeral 11 denotes a cryogen container containing liquid helium, etc., which is included in the outer box 12 of the cryogenic container. Further, the first heat shield plate 8 is provided between the outer box 12 of the low temperature container and the second shield plate 7, and the second heat shield plate 7 is provided in the vacuum insulation layer space between the first heat shield plate 8 and the cryogen container 11. 2 Heat shield plate 7, cryogen container 11
It is arranged to cover and envelop the These compressor 1, compression heat radiator 2, first and second heat exchangers 3 and 5, and first and second
The heat exchangers 4a, 6 and the second and first heat shield plate cooling heat exchangers 9, 10 are connected by outgoing pipes 13a, 15a and return pipes 14a, 16a, forming an operating gas circulation circuit. ing.
次に第１図の二系統の冷却回路を用いた場合の
回路構成を説明すると、第２図の回路の他に、圧
縮機１７、圧縮熱放熱器１８、熱交換器１９、冷
凍機低温発生部熱交換器２０を往路管路２３、復
路管路２４で連結してなる動作気体循環回路を併
設してなるものである。 Next, to explain the circuit configuration when the two-system cooling circuit shown in Fig. 1 is used, in addition to the circuit shown in Fig. 2, the compressor 17, compression heat radiator 18, heat exchanger 19, refrigerator low temperature generator A working gas circulation circuit is also provided in which the partial heat exchanger 20 is connected by an outgoing pipe line 23 and a returning pipe line 24.
（発明が解決しようとする課題）
先ず第１図の二系統の冷却回路を用いた場合は
装置が複雑となり、かつ大型となる欠点があつ
た。また一系統の第２図の場合は、高温側の熱シ
ールド板の温度が高くなるか、又は低温側の熱交
換器入口の低温液体又は低温気体の温度が高くな
るかして、冷凍機の低温側の低温発生部への負荷
が大きくなるため、冷凍機を大型にする必要があ
つた。(Problems to be Solved by the Invention) First, when the two-system cooling circuit shown in FIG. 1 is used, there is a drawback that the device becomes complicated and large. In the case of one system shown in Figure 2, the temperature of the heat shield plate on the high temperature side increases, or the temperature of the low temperature liquid or low temperature gas at the inlet of the heat exchanger on the low temperature side increases, causing the refrigerator to cool down. Since the load on the low-temperature generating section on the low-temperature side increases, it was necessary to make the refrigerator larger.
本発明は前記従来の欠点を解消するために提案
されたもので、冷凍機低温側の低温発生部の負荷
を低減して装置を小型化することを目的とするも
のである。 The present invention was proposed in order to eliminate the above-mentioned conventional drawbacks, and aims to reduce the load on the low temperature generation section on the low temperature side of the refrigerator and downsize the device.
（課題を解決するための手段）
このため本発明は、液体ヘリウムなどの低温液
化ガスを用いた真空断熱層内に２層以上の熱シー
ルド板を有する低温容器の冷却装置において、該
熱シールド板の冷却回路を一系統にすると共に、
冷凍機低温発生部における高温側の第１熱交換器
で冷却した作動ガスで高温側の第１熱シールド板
を冷却し、この作動ガスを再び前記冷凍機低温発
生部における高温側の第１熱交換器で冷却した
後、次に冷凍機低温発生部における低温側の第２
熱交換器で冷却させ、この冷却された作動ガスで
低温側の第２熱シールド板を冷却する。(Means for Solving the Problem) Therefore, the present invention provides a cooling device for a low temperature container having two or more layers of heat shield plates within a vacuum insulation layer using low temperature liquefied gas such as liquid helium. In addition to integrating the cooling circuit into one system,
The first heat shield plate on the high temperature side is cooled with the working gas cooled by the first heat exchanger on the high temperature side in the low temperature generation section of the refrigerator, and this working gas is again transferred to the first heat exchanger on the high temperature side in the low temperature generation section of the refrigerator. After cooling in the exchanger, the second
It is cooled by a heat exchanger, and the cooled working gas cools the second heat shield plate on the low temperature side.
（作用）
多層の熱シールド板の冷却を、一系統の作動気
体循環回路で行ない、なおかつ比較的温度の高い
側の熱シールド板冷却熱交換器を通つた作動気体
を、再度同じ温度レベルの冷凍機低温発生部を通
過させることにより、冷凍機の負荷を低減させ
る。(Function) The multilayer heat shield plate is cooled by one working gas circulation circuit, and the working gas that has passed through the heat shield plate cooling heat exchanger on the relatively high temperature side is refrigerated to the same temperature level. By passing through the machine low temperature generating section, the load on the refrigerator is reduced.
本発明によると、冷凍機の低温側より高温側に
大きな負荷がかかるので、冷凍機の効率がよくな
り、消費電力が少なく、小さな冷凍機ですむ等の
効果がある。 According to the present invention, a larger load is applied to the high temperature side of the refrigerator than to the low temperature side, so that the efficiency of the refrigerator is improved, power consumption is low, and a small refrigerator can be used.
（実施例）
以下本発明の実施例を図面について説明する
と、第３図は本発明の第１実施例を示し、１は圧
縮機、３は圧縮機１の吐出側に隣接して設けられ
た圧縮熱放熱器である。３，５は第１、第２熱交
換器、４，６は冷凍機の低温発生部に設けられた
冷凍機低温発生部における第１、第２熱交換器
で、それぞれ第１が高温側、第２が低温側であ
る。７，８は第２、第１熱シールド板、９，１０
は第２、第１熱シールド板７，８をそれぞれ冷却
するための第２、第１熱シールド板冷却熱交換器
で、それぞれ第１が高温側、第２が低温側であ
る。(Embodiment) An embodiment of the present invention will be explained below with reference to the drawings. Fig. 3 shows a first embodiment of the present invention, in which 1 is a compressor, 3 is a compressor installed adjacent to the discharge side of the compressor 1. It is a compression heat radiator. 3 and 5 are first and second heat exchangers; 4 and 6 are first and second heat exchangers in the low temperature generation section of the refrigerator, the first being on the high temperature side; The second is the low temperature side. 7 and 8 are second and first heat shield plates, 9 and 10
are second and first heat shield plate cooling heat exchangers for cooling the second and first heat shield plates 7 and 8, respectively, the first being on the high temperature side and the second on the low temperature side.
１１は液体ヘリウム等を入れる寒剤容器で、こ
れらは低温容器外箱１２に包含されている。また
第１熱シールド板８は低温容器外箱１２と第２熱
シールド板７の間、第２熱シールド板７は第１熱
シールド板８と寒剤容器１１の間の真空断熱層空
間に、それぞれ第２熱シールド板７と寒剤容器１
１を覆い包むように配設されている。そしてこれ
ら圧縮機１、圧縮熱放熱器２、第１、第２熱交換
器３，５、冷凍機低温発生部における第１、第２
熱交換器４，６、第２、第１熱シールド板冷却熱
交換器９，１０が、第２、第１往路管路１３，１
５及び第２、第１復路管路１４，１６によつて連
結されて、動作気体循環回路が構成されている。
そして低温容器は低温容器外箱１２、第２、第１
熱シールド板７，８、寒剤容器１１、第２、第１
熱シールド板冷却熱交換器９，１０から構成され
ている。低温容器から離れて配設された圧縮機
１、該圧縮機１の吐出側に隣接した圧縮熱放熱器
２と同様に、低温容器から離れて配設された冷凍
機低温発生部における第１熱交換器４と、第１熱
シールド板冷却熱交換器１０とを直列に管路で連
絡して動作気体の第１往路管路１５を形成し、更
に第１熱シールド板冷却熱交換器１０と前記熱交
換器４とを管路で連絡して第１復路管路１６を形
成している。 Reference numeral 11 denotes a cryogen container containing liquid helium, etc., which is included in the outer box 12 of the cryogenic container. Further, the first heat shield plate 8 is placed between the low temperature container outer box 12 and the second heat shield plate 7, and the second heat shield plate 7 is placed in the vacuum insulation layer space between the first heat shield plate 8 and the cryogen container 11. Second heat shield plate 7 and cryogen container 1
It is arranged so as to cover 1. These compressor 1, compression heat radiator 2, first and second heat exchangers 3 and 5, and first and second
Heat exchangers 4, 6, second and first heat shield plate cooling heat exchangers 9, 10, second and first outgoing pipes 13, 1
5, and are connected by second and first return pipes 14 and 16 to form an operating gas circulation circuit.
The low-temperature containers are the low-temperature container outer box 12, the second, and the first
Heat shield plates 7, 8, cryogen container 11, second, first
It is composed of heat shield plate cooling heat exchangers 9 and 10. Similar to the compressor 1 located away from the low temperature container and the compression heat radiator 2 adjacent to the discharge side of the compressor 1, the first heat in the refrigerator low temperature generation section located away from the low temperature container The exchanger 4 and the first heat shield plate cooling heat exchanger 10 are connected in series through a pipe line to form a first outgoing pipe line 15 for working gas, and the first heat shield plate cooling heat exchanger 10 and the first heat shield plate cooling heat exchanger 10 are connected in series. A first return pipe line 16 is formed by connecting the heat exchanger 4 with a pipe line.
また前記熱交換器４，６，９を直列に管路で連
絡して第２往路管路１３を、前記熱交換器９と圧
縮機１の吸入口とを管路で連絡して第２復路管路
１４を形成する。更に圧縮熱放熱器２と前記熱交
換器４とを連絡する第１往路管路１５と、前記熱
交換器９と圧縮機１の吸入側を連絡する第２往路
管路１４相互間で、第１往路管路１５と第２往路
管路１４とを熱的に連結する第１熱交換器３を、
また前記熱交換器４と６を連絡する第２往路管路
１３と、前記熱交換器９と第１熱交換器３とを連
絡する第２往路管路１４相互間で、第２往路管路
１３と第２往路管路１４とを熱的に連結する第２
熱交換器５をそれぞれ配設して前記動作気体循環
回路を構成している。なお、以上の構成におい
て、熱交換器３，５，４，６、熱シールド板７，
８、熱シールド板冷却熱交換器９，１０、寒剤容
器１１及びこれらを連絡している往路管路１３，
１５、復路管路１４，１６等は全て真空容器又は
真空配管中に置かれて真空断熱されていることは
言うまでもない。 Further, the heat exchangers 4, 6, and 9 are connected in series through a pipe line to form a second outgoing line 13, and the heat exchanger 9 and the suction port of the compressor 1 are connected via a line to form a second return line. A conduit 14 is formed. Furthermore, a first outgoing pipe line 15 that connects the compression heat radiator 2 and the heat exchanger 4 and a second outgoing pipe line 14 that connects the heat exchanger 9 and the suction side of the compressor 1 are connected to each other. The first heat exchanger 3 thermally connects the first outgoing pipe line 15 and the second outgoing pipe line 14,
Further, between a second outgoing pipe line 13 that connects the heat exchangers 4 and 6 and a second outgoing pipe line 14 that connects the heat exchanger 9 and the first heat exchanger 3, a second outgoing pipe line 13 and the second outgoing pipe line 14 thermally connected to each other.
Heat exchangers 5 are respectively arranged to constitute the working gas circulation circuit. In addition, in the above configuration, the heat exchangers 3, 5, 4, 6, the heat shield plate 7,
8, heat shield plate cooling heat exchangers 9, 10, cryogen container 11, and outgoing pipe line 13 connecting these;
Needless to say, all of the return pipes 14, 16, etc. are placed in a vacuum container or vacuum piping and are vacuum insulated.
次に第３図の実施例について作用を説明する
と、動作気体循環回路内には、例えば動作気体と
して液体ヘリウムなどが封入されるが、この動作
気体は、先ず圧縮機１で圧縮され、圧縮機１の吐
出口より第１往路管路１５へ吐出されるが、その
前に第１熱交換器３を通過し、更に冷凍機低温発
生部における第１熱交換器４を通過して第１熱シ
ールド板冷却熱交換器１０へ送られる。この時先
ず第１熱交換器３では、第２熱交換器５から圧縮
機１の吸入口側へ低温、例えば80K以下の温度で
戻つて来る動作気体によつて、圧縮機１の吐出口
から冷凍機低温発生部における第１熱交換器４へ
送り込む。なお、圧縮機１で発生する圧縮熱は、
圧縮熱放熱器２で除去されるので、第１熱交換器
３へ流入する動作気体の温度は０〜50℃位であ
る。 Next, to explain the operation of the embodiment shown in FIG. 3, for example, liquid helium or the like is sealed as a working gas in the working gas circulation circuit.This working gas is first compressed by the compressor 1, and It is discharged from the discharge port 1 to the first outgoing pipe line 15, but before that, it passes through the first heat exchanger 3, and then passes through the first heat exchanger 4 in the refrigerator low temperature generating section to generate the first heat. It is sent to the shield plate cooling heat exchanger 10. At this time, first, in the first heat exchanger 3, the working gas returns from the second heat exchanger 5 to the suction port side of the compressor 1 at a low temperature, for example, 80K or less, from the discharge port of the compressor 1. It is sent to the first heat exchanger 4 in the refrigerator low temperature generating section. In addition, the compression heat generated in the compressor 1 is
Since the compression heat is removed by the radiator 2, the temperature of the working gas flowing into the first heat exchanger 3 is about 0 to 50°C.
次に冷凍機低温発生部における第１熱交換器４
では、冷凍機で発生した冷凍によつて、第１熱交
換器３で予じめ冷却された動作気体は、更に冷却
されて第１往路管路１５に送り出され、前記の如
く熱交換器１０に至る。ここで第１熱シールド板
８で冷却した動作気体は、第１往路管路１５を通
過した時より温度が上昇して、該熱交換器１０か
ら前記熱交換器４へ第１復路管路１６を通して送
られる。また動作気体は該熱交換器４で再度冷却
されて、第２熱交換器５を通り、冷凍機低温発生
部における第２熱交換器６へ送られる。第２熱交
換器５では、第２熱シールド板冷却熱交換器９か
ら第１熱交換器３へ、更に低温、例えば30K以下
の温度で戻つて来る動作気体によつて、前記熱交
換器４から前記熱交換器６へ流出する動作気体を
冷却し、この冷却した動作気体を該熱交換器６へ
送り込む。 Next, the first heat exchanger 4 in the refrigerator low temperature generation section
In this case, the working gas that has been pre-cooled in the first heat exchanger 3 by the refrigeration generated in the refrigerator is further cooled and sent to the first outgoing pipe line 15, and is then sent to the heat exchanger 10 as described above. leading to. Here, the temperature of the working gas cooled by the first heat shield plate 8 increases from when it passes through the first outgoing pipe line 15, and the working gas passes from the heat exchanger 10 to the heat exchanger 4 through the first return pipe line 16. sent through. Further, the working gas is cooled again by the heat exchanger 4, passes through the second heat exchanger 5, and is sent to the second heat exchanger 6 in the low temperature generating section of the refrigerator. In the second heat exchanger 5, the working gas that returns from the second heat shield plate cooling heat exchanger 9 to the first heat exchanger 3 at a lower temperature, for example, 30K or lower, The working gas flowing out from the heat exchanger 6 is cooled, and the cooled working gas is fed into the heat exchanger 6.
次に冷凍機低温発生部における第２熱交換器６
では、冷凍機で発生した冷凍によつて第２熱交換
器５で冷却された動作気体は、更に冷却されて第
２往路管路１３に送り出され、前記熱交換器９に
至る。また動作ガスは第２熱シールド板７を冷却
して第２往路管路１３を通つた時より温度上昇し
て、該熱交換器９から第２熱交換器５へ第２復路
管路１４を通つて送られる。そして第２熱交換器
５で第２往路管路１３の動作気体と熱交換し、更
に第１熱交換器３に送られ、ここで第１往路管路
１５の動作気体と熱交換して常温近傍の温度に戻
され、圧縮機１の吸入側へ送り込まれて１サイク
ルが終了する。 Next, the second heat exchanger 6 in the refrigerator low temperature generation section
Then, the working gas cooled in the second heat exchanger 5 by the refrigeration generated by the refrigerator is further cooled and sent to the second outgoing pipe line 13, and reaches the heat exchanger 9. Further, the temperature of the working gas increases after cooling the second heat shield plate 7 and passing through the second outgoing pipe line 13, and the working gas passes through the second return pipe line 14 from the heat exchanger 9 to the second heat exchanger 5. sent through. The second heat exchanger 5 exchanges heat with the working gas in the second outgoing pipe line 13, and the gas is further sent to the first heat exchanger 3, where it exchanges heat with the working gas in the first outgoing pipe line 15 to bring it to room temperature. It is returned to a nearby temperature and sent to the suction side of the compressor 1, completing one cycle.
第４図は第３図と異なる本発明の第２実施例を
示し、第３図における冷凍機低温発生部における
第２熱交換器６と、第２熱シールド板冷却熱交換
器９を連絡する第２往路管路１３中に、冷凍機低
温発生部における第３熱交換器２２を追設すると
共に、冷凍機低温発生部における第２熱交換器６
と該熱交換器２２を連絡する第２往路管路１３
と、前記熱交換器９と第２熱交換器５とを連絡す
る往路管路１４の相互間で第２往路管路１３と第
２往路管路１４とを熱的に連絡する第３熱交換器
２１をそれぞれ追設したものであるが、第３図の
実施例と作用効果において差異はない。 FIG. 4 shows a second embodiment of the present invention, which is different from FIG. 3, in which the second heat exchanger 6 in the low temperature generating section of the refrigerator in FIG. 3 is connected to the second heat shield plate cooling heat exchanger 9. A third heat exchanger 22 in the refrigerator low temperature generating section is additionally installed in the second outgoing pipe line 13, and a second heat exchanger 6 in the refrigerator low temperature generating section is additionally installed.
and a second outgoing pipe line 13 that communicates with the heat exchanger 22.
and a third heat exchanger that thermally communicates the second outgoing pipe line 13 and the second outgoing pipe line 14 between the outgoing pipe line 14 that connects the heat exchanger 9 and the second heat exchanger 5. Although a container 21 is added, there is no difference in operation and effect from the embodiment shown in FIG.
（発明の効果）
以上詳細に説明した如く本発明は構成されてい
るので、同一の作動ガス流量、同一の冷凍機出力
及び同一の熱交換器温度効率を用いたものに比
べ、熱シールド板の温度をより低くすることがで
きる。即ち、本発明は作動ガスを再び高温側の冷
凍機低温発生部における第１熱交換器で冷却した
後、次に低温側の冷凍機低温発生部における第２
熱交換器で冷却させ、この冷却された作動ガスで
低温側の第２熱シールド板を冷却するようにした
もので、第２冷凍機低温発生部への負荷を減らす
ことにより、第２熱シールド板の温度も下げ、寒
剤容器への熱の侵入を減らすことができる。また
第１冷凍機低温発生部側に負荷を偏らせることに
より、冷凍機の効率を向上できる。従つて本発明
によると、冷凍機の低温側より高温側に大きな負
荷がかかるので、冷凍機の効率がよくなり、消費
電力が少なくてよく、かつ小さな冷凍機ですむ等
の効果を奏するものである。(Effects of the Invention) Since the present invention is configured as explained in detail above, the heat shield plate Temperatures can be lower. That is, the present invention cools the working gas again in the first heat exchanger in the low temperature generation section of the refrigerator on the high temperature side, and then cools the working gas in the second heat exchanger in the low temperature generation section of the refrigerator on the low temperature side.
It is cooled by a heat exchanger, and the second heat shield plate on the low temperature side is cooled with this cooled working gas.By reducing the load on the low temperature generation part of the second refrigerator, the second heat shield plate It also lowers the temperature of the board and reduces the amount of heat entering the cryogen container. Further, by biasing the load toward the first refrigerator low temperature generating section, the efficiency of the refrigerator can be improved. Therefore, according to the present invention, a larger load is applied to the high temperature side of the refrigerator than to the low temperature side, so the efficiency of the refrigerator is improved, power consumption is reduced, and a small refrigerator is required. be.
第１図及び第２図はそれぞれ従来の低温容器の
冷却器の異なる構成の回路図、第３図及び第４図
はそれぞれ本発明の第１、第２実施例を示す低温
容器の回路図である。
図の主要部分の説明 １……圧縮機、４……冷
凍機低温発生部における第１熱交換器、７……第
２熱シールド板、８……第１熱シールド板、９…
…第２熱シールド板冷却熱交換器、１０……第１
熱シールド板冷却熱交換器、１１……寒剤容器、
１２……低温容器外箱、１３……第２往路管路、
１４……第２往路管路、１５……第１往路管路、
１６……第１復路管路。
FIGS. 1 and 2 are circuit diagrams of different configurations of a conventional cooler for a cryogenic container, and FIGS. 3 and 4 are circuit diagrams of a cryogenic container showing the first and second embodiments of the present invention, respectively. be. Explanation of main parts of the diagram 1... Compressor, 4... First heat exchanger in the refrigerator low temperature generating section, 7... Second heat shield plate, 8... First heat shield plate, 9...
...Second heat shield plate cooling heat exchanger, 10...First
Heat shield plate cooling heat exchanger, 11...Cryogen container,
12... Low temperature container outer box, 13... Second outgoing pipe line,
14... Second outgoing pipe line, 15... First outgoing pipe line,
16...First return pipeline.
Claims (1)
空断熱層内に２層以上の熱シールド板を有する低
温容器の冷却装置において、該熱シールド板の冷
却回路を一系統にすると共に、冷凍機低温発生部
における高温側の第１熱交換器で冷却した作動ガ
スで高温側の第１熱シールド板を冷却し、この作
動ガスを再び前記冷凍機低温発生部における高温
側の第１熱交換器で冷却した後、次に冷凍機低温
発生部における低温側の第２熱交換器で冷却さ
せ、この冷却された作動ガスで低温側の第２熱シ
ールド板を冷却することを特徴とする低温容器の
冷却装置。1. In a cooling device for a low-temperature container that has two or more layers of heat shield plates within a vacuum insulation layer using low-temperature liquefied gas such as liquid helium, the cooling circuit for the heat shield plates is integrated into one system, and the refrigerator low temperature generation The working gas cooled by the first heat exchanger on the high temperature side in the section cools the first heat shield plate on the high temperature side, and this working gas is cooled again in the first heat exchanger on the high temperature side in the low temperature generation section of the refrigerator. Cooling of a low temperature container, characterized in that the second heat exchanger on the low temperature side in the low temperature generating section of the refrigerator cools the second heat shield plate on the low temperature side with the cooled working gas. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5591084A JPS60201199A (en) | 1984-03-23 | 1984-03-23 | Low-temperature receptacle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5591084A JPS60201199A (en) | 1984-03-23 | 1984-03-23 | Low-temperature receptacle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60201199A JPS60201199A (en) | 1985-10-11 |
| JPH0366558B2 true JPH0366558B2 (en) | 1991-10-17 |
Family
ID=13012264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5591084A Granted JPS60201199A (en) | 1984-03-23 | 1984-03-23 | Low-temperature receptacle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60201199A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121497A (en) * | 1973-03-19 | 1974-11-20 |
-
1984
- 1984-03-23 JP JP5591084A patent/JPS60201199A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60201199A (en) | 1985-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5880474A (en) | Cryogenic cooling device | |
| US6679066B1 (en) | Cryogenic cooling system for superconductive electric machines | |
| JPH0515764A (en) | Vacuum container with cooling device | |
| JPH0366558B2 (en) | ||
| JPS63302259A (en) | Cryogenic generator | |
| JP3669911B2 (en) | Liquefied gas storage device | |
| Gifford et al. | A new refrigeration system for 4.2 K | |
| JPS60104899A (en) | Low temperature vessel connected to refrigerator | |
| JPS5951155B2 (en) | superconducting device | |
| JPS62299005A (en) | Superconducting magnet device | |
| JP2574815B2 (en) | Cryogenic refrigeration equipment | |
| JPH0349019B2 (en) | ||
| JPH0221497B2 (en) | ||
| JP3213451B2 (en) | Refrigeration equipment condenser | |
| JP3448327B2 (en) | Cooling system | |
| JPS61110851A (en) | Joule-thomson refrigerator | |
| JPH02203162A (en) | Heat accumulating refrigerator | |
| JPS62261868A (en) | Helium cooling device | |
| JPS61225556A (en) | Cryogenic cooling device | |
| JPH11108476A (en) | Cryostatic cooling device | |
| JPS60104898A (en) | Low temperature vessel | |
| JPH09106906A (en) | Conductive cooling superconducting magnet | |
| Stearns et al. | The Refrigerated Transport Dewar | |
| JPS61225558A (en) | Cryogenic cooling device | |
| JPS604775A (en) | Cryogenic device with refrigerator |