JPH0362797B2 - - Google Patents
Info
- Publication number
- JPH0362797B2 JPH0362797B2 JP59096075A JP9607584A JPH0362797B2 JP H0362797 B2 JPH0362797 B2 JP H0362797B2 JP 59096075 A JP59096075 A JP 59096075A JP 9607584 A JP9607584 A JP 9607584A JP H0362797 B2 JPH0362797 B2 JP H0362797B2
- Authority
- JP
- Japan
- Prior art keywords
- copper strip
- mixture
- strip
- powder
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052802 copper Inorganic materials 0.000 claims description 30
- 239000010949 copper Substances 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 230000004907 flux Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 13
- 150000002739 metals Chemical class 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910017755 Cu-Sn Inorganic materials 0.000 description 2
- 229910017927 Cu—Sn Inorganic materials 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- -1 Zn and Sn Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、銅条材の少くともか他面に異種金属
を被覆する方法に関するもので、例えば半導体装
置用リードフレーム材、ラジエータ用フイン材等
の製造に適している。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for coating at least one surface of a copper strip with a dissimilar metal, such as a lead frame material for a semiconductor device or a fin material for a radiator. Suitable for manufacturing etc.
［従来の技術］
金属条材の表面に異種金属を被覆する方法とし
ては、電気メツキ、溶融メツキ、蒸着、クラツ
ド、溶射等の方法がある。この中で数10μｍ以下
の極めて薄い被覆層を得ようとするときは、前３
者の方法が取られている。しかし何れも夫々次の
ような欠点を有している。[Prior Art] Methods for coating the surface of a metal strip with different metals include electroplating, hot-dip plating, vapor deposition, cladding, thermal spraying, and the like. When trying to obtain an extremely thin coating layer of several tens of micrometers or less,
method has been adopted. However, each of them has the following drawbacks.
電気メツキでは液組成の抑制、電解の条件の厳
密な制御等が必要で、被覆しようとする金属によ
つては廃液処理も含め多大な設備費を要する。ま
た溶融メツキはZn、Snの限られた金属しか被覆
することができず、蒸着では多大な設備費要す
る。 Electroplating requires suppression of liquid composition, strict control of electrolytic conditions, etc., and depending on the metal to be coated, a large amount of equipment costs are required, including waste liquid treatment. Furthermore, hot-dip plating can coat only a limited number of metals, such as Zn and Sn, and vapor deposition requires a large amount of equipment cost.
［発明が解決しようとする問題点］
本発明の目的は、少なくとも片面に異種金属が
被覆された表面処理銅条材を簡単に得ることので
きる方法を提供することにある。[Problems to be Solved by the Invention] An object of the present invention is to provide a method for easily obtaining a surface-treated copper strip coated with a different metal on at least one side.
［課題を解決するための手段］
本発明の要旨は、銅の条材の表面に異種金属を
被覆する方法として、銅条材より低融点の金属の
粉粒体とフラツクス作用を有する液状ないしはペ
ースト状の物質との混合物を塗布した後、加熱す
る方法を採用したことにある。[Means for Solving the Problems] The gist of the present invention is to provide a method for coating the surface of a copper strip with a dissimilar metal by using powder or granules of a metal having a lower melting point than the copper strip and a liquid or paste having a flux action. The method used is to apply a mixture of substances and then heat it.
［作用］
条材としてCuおよびCu合金を対象とすると、
被覆材として実用上有効な金属としてはSn、Pb、
Zn、Al、Te、Bi、Cd、Ga、lnが選ばれる。し
かしこれらの中の１種または２種以上を主成分と
するものであれば実用上被覆の効果を発揮するの
で、そのような組成物を用いても差し支えない。[Function] When Cu and Cu alloys are used as strips,
Metals that are practically effective as coating materials include Sn, Pb,
Zn, Al, Te, Bi, Cd, Ga, and ln are selected. However, a composition containing one or more of these as a main component can provide a practical coating effect, so there is no problem in using such a composition.
このような金属粉粒体と混合する液状ないしは
ペースト状の物質は、粉粒体を銅条材の表面に塗
布する際に粘着剤として働き、酸化被覆を除去
し、銅条材表面と溶融金属との汚れ性を促進する
機能を有する、所謂フラツクスが主として用いら
れている。なお、前記混合物における粉粒体成分
は、これが少いと条材表面に均一に異種金属を被
覆することが困難となるので、30％以上とするこ
とが望ましい。 A liquid or paste substance mixed with such metal powder acts as an adhesive when the powder is applied to the surface of the copper strip, removes the oxidized coating, and bonds the surface of the copper strip with the molten metal. So-called flux is mainly used, which has the function of promoting staining properties. Note that the powder component in the mixture is desirably 30% or more, since if the powder component is small, it becomes difficult to uniformly coat the surface of the strip with a dissimilar metal.
また、前記混合物を塗布する方法としては様々
な方法が考えられるが、例えばロール表面に紺戸
食う物を連続的に付着させながらロール間に条材
をつおすことにより塗布する方法、または条材の
上に適当なクリアランスをもつた堰を設け、そこ
に混合物を溜めておき、条材を適当な速度で動か
しながら塗布する方法でもよい。 In addition, various methods can be considered for applying the mixture, such as a method in which a strip material is passed between rolls while continuously adhering to the surface of the roll, or a method in which a strip material is passed between rolls; It is also possible to provide a weir with an appropriate clearance above the weir, store the mixture there, and apply the mixture while moving the strip at an appropriate speed.
銅の条材の表面をテープ等でマスクしたり、塗
布装置を分割することにより部分的にストライプ
状、スポツト状に被覆層を形成されることも可能
である。 It is also possible to partially form a coating layer in the form of stripes or spots by masking the surface of the copper strip with tape or by dividing the coating device.
加熱温度の上限は、理論的には銅条材の融点以
下であればよいが、実用的にはこれに被覆させる
金属の粉粒体の融点以上であつて、銅条材の融点
より50℃程度低い温度以下であることが望まし
い。加熱雰囲気としては、大気及びN2、CO2、
CO、H2、Arガス等が有効である。大気以外の
雰囲気の場合、前記ガス成分の中の１種または２
種以上が50％以上含有されていれば実用上有効で
ある。 The upper limit of the heating temperature should theoretically be below the melting point of the copper strip, but in practice it should be above the melting point of the metal powder to be coated, and 50°C below the melting point of the copper strip. It is desirable that the temperature be below a moderately low temperature. The heating atmosphere includes air, N2, CO2,
CO, H2, Ar gas, etc. are effective. In the case of an atmosphere other than air, one or two of the above gas components
It is practically effective if it contains 50% or more of seeds or more.
以上のような条件下で塗布、加熱処理すれば、
銅条材の表面に塗布された混合物の層に混入され
ていたフラツクスにより条材表面が清浄にされて
溶融金属との濡れ性が促進され、銅条材表面に異
種金属の被覆層が形成される。この場合、一部拡
散層も生成する。拡散を促進し表面層の合金化を
り進めるためには、別途加熱工程を付加すること
が望ましい。 If applied and heat treated under the above conditions,
The flux mixed in the layer of the mixture applied to the surface of the copper strip cleans the surface of the strip, promoting wettability with molten metal, and forming a coating layer of a dissimilar metal on the surface of the copper strip. Ru. In this case, a part of the diffusion layer is also formed. In order to promote diffusion and advance alloying of the surface layer, it is desirable to add a separate heating step.
［実施例］ 以下本発明の実施例について説明する。[Example] Examples of the present invention will be described below.
第１図は、銅条材１の片面に連続的に異種金属
の被覆層８を形成する場合の例を示し、条材１は
上下ロール２の間を通してその表面に、液状フラ
ツクスと金属粉粒体との混合物の薄い層４が塗布
されている。ロール２の上側には混合物送給装置
３が設置され、前記混合物はここからロール２を
介して銅条材１に塗布される。混合物の層４の厚
さはロール２のギヤツプにより調整することがで
きる。このようにして混合物の薄い層４が塗布さ
れた銅条材は、その後不活性ガス雰囲気の加熱装
置５で加熱され、引続き水洗装置６及び乾燥装置
７を通して巻取機９に巻き取られる。 FIG. 1 shows an example in which a coating layer 8 of different metals is continuously formed on one side of a copper strip 1. The strip 1 is passed between upper and lower rolls 2, and its surface is coated with liquid flux and metal A thin layer 4 of the mixture with the body is applied. A mixture feeding device 3 is installed above the roll 2, from which the mixture is applied to the copper strip 1 via the roll 2. The thickness of the layer 4 of the mixture can be adjusted by the gap of the rolls 2. The copper strip coated with a thin layer 4 of the mixture in this way is then heated in a heating device 5 in an inert gas atmosphere and subsequently passed through a washing device 6 and a drying device 7 and wound up in a winder 9.
実施例 １
厚さ0.5mm、幅450mmの銅条のコイル材を用意
し、第１図に示す方法により、銅の半田付に使わ
れる普通の液状フラツクスとSnの粉末とを３：
７の割合で混合してペースト状にした混合物を塗
布し、片面に厚さ約20μｍの混合物の層４を形成
した。引き続き不活性ガス雰囲気の加熱装置５を
連続的に通板させ、500℃×90秒に相当する熱処
理を加え、水洗装置６及び乾燥装置７を通して巻
き取つた。Example 1 A copper strip coil material with a thickness of 0.5 mm and a width of 450 mm was prepared, and by the method shown in Fig. 1, ordinary liquid flux used for copper soldering and Sn powder were mixed in 3 parts.
A mixture made into a paste by mixing at a ratio of 7 to 7 was applied to form a layer 4 of the mixture with a thickness of about 20 μm on one side. Subsequently, the sheet was continuously passed through a heating device 5 in an inert gas atmosphere, subjected to a heat treatment of 500° C. for 90 seconds, passed through a water washing device 6 and a drying device 7, and wound up.
得られた銅条の表面を詳細に調整した結果、
Cu−Sn合金層とSnの皮膜が２〜3μｍにわたつて
形成されていることが確認された。 As a result of detailed adjustment of the surface of the obtained copper strip,
It was confirmed that a Cu-Sn alloy layer and a Sn film were formed over a thickness of 2 to 3 μm.
実施例 ２
実施例１と同様の方法で、実施例１と同様の銅
条の片面に、PbとSnが１：１の粉粒体と液状フ
ラツクスとを７：３の割合で混合したペースト状
の混合物の層４を形成し、500℃×90秒に相当す
る熱処理を加えて巻き取つた。Example 2 Using the same method as in Example 1, a paste made by mixing powder and liquid flux containing 1:1 of Pb and Sn in a ratio of 7:3 was applied to one side of the same copper strip as in Example 1. A layer 4 of the mixture was formed, heat treated at 500° C. for 90 seconds, and then rolled up.
得られた銅条の片面には、Pb−Sn合金層が約
3μｍの厚さで形成されていることが確認された。 On one side of the obtained copper strip, there is a Pb-Sn alloy layer of approximately
It was confirmed that the film was formed with a thickness of 3 μm.
実施例 ３
第１図に示す下側のロール部にも混合物送給装
置を配置し、実施例１と同様の銅条と、混合物と
を用いて実施例１と同様に処理し、両面に被覆層
を有する銅条を得た。Example 3 A mixture feeding device was also arranged in the lower roll part shown in FIG. A copper strip with layers was obtained.
得られた銅条の両面には、Cu−Sn合金層とSn
の被膜が２〜3μｍの厚さで形成されていること
が確認された。 Both sides of the obtained copper strip have a Cu-Sn alloy layer and a Sn
It was confirmed that a film with a thickness of 2 to 3 μm was formed.
［発明の効果］
本発明は、金属粉粒体とフラツクス作用を有す
る液状ないしペースト状の物質を銅条材の表面に
塗布した後加熱して前記金属粉粒体を溶融させる
方法であるから、表面に異種金属又は合金の被膜
をもつた銅条材を安価、容易に得ることができ、
合金の皮膜を得る場合でも混合中の粉粒体の組成
を制御することにより容易に実施可能である。[Effects of the Invention] The present invention is a method in which a liquid or paste-like substance that has a flux effect with metal powder is applied to the surface of a copper strip and then heated to melt the metal powder. Copper strips with a coating of different metals or alloys on the surface can be obtained easily and inexpensively.
Even when obtaining an alloy film, it can be easily achieved by controlling the composition of the powder during mixing.
第１図は本発明に係る方法の一実施例を示す説
明図である。
１：銅条材、２：塗布ロール、３：混合物送給
装置、４：混合物の層、５：加熱装置、８：被覆
層。
FIG. 1 is an explanatory diagram showing an embodiment of the method according to the present invention. 1: Copper strip, 2: Coating roll, 3: Mixture feeding device, 4: Mixture layer, 5: Heating device, 8: Covering layer.
Claims (1)
る方法であつて、被覆しようとする金属または合
金の粉末体とフラツクス作用を有する液状ないし
はペースト条の物質との混合物を前記銅条材の表
面に連続的に塗布する工程と、前記混合物が塗布
された銅条材を前記粉粒体の融点以上で、且つ銅
条材の融点以下の温度で加熱して前記粉粒体を溶
融させる工程とを含むことを特徴とする銅条材の
表面処理方法。1 A method of coating the surface of a copper strip with a dissimilar metal or alloy, in which a mixture of a powder of the metal or alloy to be coated and a liquid or paste strip material having a flux effect is applied to the surface of the copper strip. and heating the copper strip coated with the mixture at a temperature above the melting point of the powder and below the melting point of the copper strip to melt the powder. A method for surface treatment of a copper strip, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9607584A JPS60238487A (en) | 1984-05-14 | 1984-05-14 | Surface treatment of metallic wire rod |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9607584A JPS60238487A (en) | 1984-05-14 | 1984-05-14 | Surface treatment of metallic wire rod |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27746485A Division JPS61179880A (en) | 1985-12-10 | 1985-12-10 | Production of fin material for radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60238487A JPS60238487A (en) | 1985-11-27 |
| JPH0362797B2 true JPH0362797B2 (en) | 1991-09-27 |
Family
ID=14155279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9607584A Granted JPS60238487A (en) | 1984-05-14 | 1984-05-14 | Surface treatment of metallic wire rod |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60238487A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU604462B2 (en) * | 1986-07-28 | 1990-12-20 | Furukawa Electric Co. Ltd., The | Fin of heat exchanger and method of making it |
| JP4434669B2 (en) | 2003-09-11 | 2010-03-17 | Ｎｅｃエレクトロニクス株式会社 | Electronic components |
| JP4700537B2 (en) * | 2005-03-24 | 2011-06-15 | 新日本製鐵株式会社 | Metal strip plating method |
| JP5531179B2 (en) * | 2011-03-24 | 2014-06-25 | 日本碍子株式会社 | Cu sheet processing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49106920A (en) * | 1973-02-17 | 1974-10-11 | ||
| JPS5121377A (en) * | 1974-08-14 | 1976-02-20 | Hitachi Ltd | HODENTO |
| JPS54137439A (en) * | 1978-04-18 | 1979-10-25 | Minoru Isono | Formation of hardened layer on metal surface |
| JPS54147135A (en) * | 1978-05-12 | 1979-11-17 | Minoru Isono | Formation of saw teeth hard quality chips and apparatus therefor |
| JPS5638456A (en) * | 1979-09-04 | 1981-04-13 | Senjiyu Kinzoku Kogyo Kk | Zinc plating method |
-
1984
- 1984-05-14 JP JP9607584A patent/JPS60238487A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49106920A (en) * | 1973-02-17 | 1974-10-11 | ||
| JPS5121377A (en) * | 1974-08-14 | 1976-02-20 | Hitachi Ltd | HODENTO |
| JPS54137439A (en) * | 1978-04-18 | 1979-10-25 | Minoru Isono | Formation of hardened layer on metal surface |
| JPS54147135A (en) * | 1978-05-12 | 1979-11-17 | Minoru Isono | Formation of saw teeth hard quality chips and apparatus therefor |
| JPS5638456A (en) * | 1979-09-04 | 1981-04-13 | Senjiyu Kinzoku Kogyo Kk | Zinc plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60238487A (en) | 1985-11-27 |
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