JPH0356561A - Thermoplastic resin composition - Google Patents

Thermoplastic resin composition

Info

Publication number
JPH0356561A
JPH0356561A JP19151389A JP19151389A JPH0356561A JP H0356561 A JPH0356561 A JP H0356561A JP 19151389 A JP19151389 A JP 19151389A JP 19151389 A JP19151389 A JP 19151389A JP H0356561 A JPH0356561 A JP H0356561A
Authority
JP
Japan
Prior art keywords
resin composition
nylon
thermoplastic resin
resin
polyphenylene sulfide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19151389A
Other languages
Japanese (ja)
Inventor
Sadafumi Furukawa
禎史 古川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP19151389A priority Critical patent/JPH0356561A/en
Publication of JPH0356561A publication Critical patent/JPH0356561A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a thermoplastic resin composition providing products having excellently balanced physical properties, uniform appearance and excellent smoothness by blending a polyphenylene sulfide resin and polyamide resin with epoxy group-containing copolymer. CONSTITUTION:100 pst. wt. resin composition comprising (A) 10-90 wt.% polyphenylene sulfide resin having preferably >=270 deg.C softening temperature and (B) 90-10 wt.% polyamide resin (e.g. nylon 66 or nylon 6/66) is blended with (C) 2-50 pst. wt. epoxy group-containing copolymer (e.g. ethylene-glycidyl methacrylate-vinyl acetate copolymer) comprising an unsaturated epoxy compound and an ethylene-based unsaturated compound and optionally a reinforcing composite material, inorganic filler, flame-retardant auxiliary and other additives to give a thermoplastic resin composition having excellent balanced physical properties and appearance.

Description

【発明の詳細な説明】 《産業上の利用分野) 本発明は、射出戒形や押出戒形等により、戒形品、シー
トあるいはフィルム等として利用できる新規な熱可塑性
樹脂組成物に関する. 更に詳しくは、ポリフェニレンサルファイド樹脂とポリ
アξド樹脂にエボキシ基含有共重合体を配合してなる物
性バランス及び外観の優れた新規な熱可塑性樹脂m戊物
に関するものである.《従来の技術} ポリフェニレンサルファイドは、その特性として耐熱性
、耐薬品性に優れ、各用途に広く使用されている. しかし、靭性が低く、脆いため金属を圧入、タップ加工
など後加工を必要とする用途には難しいという欠点があ
った. この欠点を改善するために、他の樹脂を添加することを
行っているが、ポリフエニレンサルファイドとの相溶性
が悪いために強度の低下、戒形性の低下、耐熱性の低下
などがおき、実用化されるものは殆ど無かった. 一方、ポリアミド樹脂は耐熱性、剛性、強度、耐油性等
に特長をもったエンジニアリング樹脂として自動車部品
や電気、電子部品の分野などで広汎に使用されているが
、威形加工性、耐衝撃性、耐水性及び耐薬品性等におい
て一層の改良が望まれている. かかる観点よりボリフェニレンサルフ1イド樹脂とポリ
アミドとを配合し、ボリフエニレンサルファイド樹脂及
びポリアミド樹脂双方の特長を有する熱可塑性樹脂が得
られたならば、広汎な新規用途の可能性が期待される.
しかし、単純に混合しただけでは、極端な不均一性を呈
し、また機械的物性も低く、実際上使用に耐えないもの
しか得られていない. (発明が解決しようとする課題) 本発明は、ポリフェニレンサルファイド樹脂とポリアミ
ド樹脂に、エポキシ基含有共重合体を配合することによ
り、威形加工性、剛性、耐熱性、耐衝撃性、耐油性、耐
薬品性、耐水性等の物性バランスがきわめて良好でかつ
外観の均一性及び平滑性の優れた新規な熱可塑性樹脂組
底物を提供することを目的とするものである. 《諜題を解決するための手段} 本発明は、 (A)ポリフェニレンサルファイド樹脂10〜90重量
% (B)ボリアミド樹脂     90〜101i量%か
らなる樹脂組戒物100重量部に対して(C)エポキシ
基含有共重合体 2〜50重量部配合することを特徴と
す熱可塑性樹脂組成物に関するものである. 本発明に用いられるポリフェニレンサルファイド樹脂(
A)としては、軟化温度270’C以上のものが良く、
例えば特公昭45 − 3368号公報に記載のような
方法で製造される. 市販されているものとしては「ライトン」の商標の下に
、米国フィリップスペトロリアム・カンパニー製のもの
がある. 本発明に用いられるボリアξド樹脂(B)としては、 ナイロン−6、ナイロン−11,ナイロン−12などの
ポリラクタム類、ナイロン−6.6、ナイロン−6.1
0、ナイロン−6.12などのジカルボン酸とジア逅ン
とから得られるポリアミド類、ナイロン−6/6.6、
ナイロン−6/6.10、ナイロン−6/6.11、ナ
イロン−6/6.12 、ナイロン−6/6.6/6.
10 、ナイロン−6/6.6/6.12、ナイロン−
6/6T (T :テレフタル酸成分)などの共重合尿
リアミド類、またこれらの混合物などの高アもノ末端ボ
リアミドが挙げられる.本発明におけるエポキシ基含有
共重合体(C)とは、不飽和エポキシ化合物とエチレン
系不飽和化合物とからなる共重合体である. エポキシ基含有共重合体(C)の&Il或比に特に制限
はない.不飽和エポキシ化合物としては分子中にエチレ
ン系不飽和化合物と共重合しうる不飽和基と、それにエ
ポキシ基をそれぞれ有する化合物である, 例えば、下記一般式(1)、(2)等で表されるような
不飽和グリシジルエステル類、不飽和グリシジルエーテ
ル類等が挙げられる. (Rはエチレン系不飽和結合を有する炭素数2〜l8の
炭化水素基である.) (Rはエチレン系不飽和結合を有する炭素数2〜l8の
炭化水素基であり、Xは一CHz  O−また具体的に
は、グリシジルアクリレート、グリシジルメタクリレー
ト、イタコン酸グリシジルエステル類、アリルグリシジ
ルエーテル、2−メチルアリルグリシジルエーテル、ス
チレンーP−グリシジルエーテル等が例示される. エチレン系不飽和化合物とは、オレフィン類、炭素数2
〜6の飽和カルボン酸のビニルエステル類、炭素数1〜
8の飽和アルコール威分とアクリル酸またはメタクリル
酸とのエステル類及びマレイン酸エステル類及びメタク
リル酸エステル類及びフマル酸エステル類、ハロゲン化
ビニル類、スチレン類、ニトリル類、ビニルエーテル類
及びアクリルアミド類などが挙げられる. 具体的には、エチレン、プロピレン、プテンーl1酢酸
ビニル、アクリル酸メチル、アクリル酸エチル、メタク
リル酸メチル、マレイン酸ジェチル、フマル酸ジエチル
、塩化ビニル、塩化ビニリデン、スチレン、アクリロニ
トリル、イソプチルビニルエーテル及びアクリルアミド
等が例示される.これらのうちでも特にエチレ,ンが好
ましい.エポキシ基含有共重合体は種々の方法でつくる
ことができる.不飽和エボキシ化合物が共重合体の主鎖
中に導入されるグラフト共重合方法のいずれをも採りう
る. 本発明による熱可塑性樹脂組或物において、ポリフェニ
レンサルファイド樹脂(A)は10〜90重量%、ボリ
アミド樹脂(B)は90〜10重量%、更にエポキシ基
含有共重合体(C)は、(A)lffl分と(B)戒分
からなる樹脂組戒物100重量部に対して2〜50重量
部配合しなければならない.(A)戒分の含量が10重
量%より少ない場合は、耐水性及び耐薬品性等が十分で
な<、90TL量%より多い場合は、戒形加工性、靭性
等において好ましい性質は得られない. また(B)戒分の含量が10重量%より少ない場合は、
剛性、及び強度等が十分でなく、90重量%より多い場
合は、戒形加工性、靭性、耐水性、耐薬品性等において
好ましい性質が得られない.また(C)威分については
、含量が2重量部より少ない場合は、樹脂組戒物の相溶
分散性に問題があり、靭性、耐衝撃性が十分でなく、ま
た、50重量部より多い場合は、戒形品に層はくりが発
生し、剛性、靭性、耐衝撃性等の低下が著しく、好まし
い結果が得られない. 本発明の樹脂m戒物は、上記配合物以外にさらにガラス
繊維、カーボン繊維、ボリアミド1asi及び金属ウイ
スカーなどの繊維による強化複合材、シリカ、アル藁ナ
、炭酸カルシウム、タルク、マイカ、カーボンプラック
、Ti−o!及びz.0のような無機充填剤または、難
燃助剤、その他滑剤、核剤、可塑剤、染料、顔料、帯電
防止剤、酸化防止剤、耐候性付与剤等を添加した複合材
として使うことも可能である. 《実施例》 以下実施例により本発明を説明するが、これらは単なる
例示であり、本発明はこれに限定されることはない. なお、実施例中の引張試験はASTM−0638に従っ
て実施した.アイゾット衝撃強度は、ASTM−025
6による試験結果である.また、外観は、目視により判
定した. 耐溶剤性については、試験片を30℃のガソリン中に2
4時間浸漬したのち表面の肌荒れ状態等を肉眼で観察し
た. 実施例1〜4 (A)戒分としては、フィリップスペトロリアム製のM
 2888を使用し、(B)戒分としては、ナイo ン
−6,6、(C) 戒分としては、エチレンーグリシジ
ルメタクリレートー酢酸ビニル共重合体を使用した. 比較例1〜3 (A)成分としては、フィリップスペトロリアム製のM
 2888、(B)tc分としては、ナイロン,6,6
を使用した. 以上の結果を第1表に示した. 《発明の効果〉 本発明による熱可塑性樹脂組底物は、単に成形加工性が
良いだけでなく、戚形晶諸物性についても良好である. そして、本発明による熱可塑性樹脂組威吻は、通常の熱
可塑性樹脂に用いられている加工方法、例えば射出威形
、押出戒形等により容易に戒形品、フィルムシ一ト等に
加工され、剛性、耐熱性、耐衝撃性、耐油性、耐薬品性
、耐水性等の物性バランスが極めて良好で、且つ外観の
均一性及び平滑性の優れた製品を与える.
DETAILED DESCRIPTION OF THE INVENTION <<Industrial Application Field> The present invention relates to a novel thermoplastic resin composition that can be used as shaped products, sheets, films, etc. by injection molding or extrusion molding. More specifically, the present invention relates to a novel thermoplastic resin having an excellent balance of physical properties and an excellent appearance, which is made by blending an epoxy group-containing copolymer with a polyphenylene sulfide resin and a polyamide resin. [Prior art] Polyphenylene sulfide has excellent heat resistance and chemical resistance, and is widely used in various applications. However, its low toughness and brittleness make it difficult to use in applications that require post-processing, such as press-fitting or tapping metal. In order to improve this drawback, other resins are added, but due to poor compatibility with polyphenylene sulfide, there are problems such as a decrease in strength, a decrease in formability, and a decrease in heat resistance. However, almost nothing was put into practical use. On the other hand, polyamide resin is widely used in the fields of automobile parts, electrical, and electronic parts as an engineering resin with features such as heat resistance, rigidity, strength, and oil resistance. Further improvements are desired in terms of water resistance, chemical resistance, etc. From this point of view, if polyphenylene sulfide resin and polyamide are blended to obtain a thermoplastic resin that has the features of both polyphenylene sulfide resin and polyamide resin, the possibility of a wide range of new applications is expected. ..
However, simply mixing them results in extreme non-uniformity and poor mechanical properties, resulting in products that cannot be used in practice. (Problems to be Solved by the Invention) The present invention achieves excellent shape processability, rigidity, heat resistance, impact resistance, oil resistance, and The purpose of this invention is to provide a new thermoplastic resin composite sole that has an extremely good balance of physical properties such as chemical resistance and water resistance, and has excellent uniformity and smoothness in appearance. <<Means for Solving the Problems>> The present invention provides (C) for 100 parts by weight of a resin compound consisting of (A) 10 to 90% by weight of polyphenylene sulfide resin (B) 90 to 101% by weight of polyamide resin. This invention relates to a thermoplastic resin composition characterized in that it contains 2 to 50 parts by weight of an epoxy group-containing copolymer. Polyphenylene sulfide resin used in the present invention (
A) is preferably one with a softening temperature of 270'C or higher;
For example, it is manufactured by the method described in Japanese Patent Publication No. 45-3368. Commercially available products include those manufactured by Phillips Petroleum Company in the United States under the trademark ``Ryton''. The boria ξ-do resin (B) used in the present invention includes polylactams such as nylon-6, nylon-11, and nylon-12, nylon-6.6, and nylon-6.1.
0, polyamides obtained from dicarboxylic acids and diamines such as nylon-6.12, nylon-6/6.6,
Nylon-6/6.10, Nylon-6/6.11, Nylon-6/6.12, Nylon-6/6.6/6.
10, nylon-6/6.6/6.12, nylon-
Examples include copolymerized urinary amide such as 6/6T (T: terephthalic acid component), and highly amorphous terminal polyamides such as mixtures thereof. The epoxy group-containing copolymer (C) in the present invention is a copolymer consisting of an unsaturated epoxy compound and an ethylenically unsaturated compound. There is no particular restriction on the &Il ratio of the epoxy group-containing copolymer (C). Unsaturated epoxy compounds are compounds that have an unsaturated group that can be copolymerized with an ethylenically unsaturated compound and an epoxy group in the molecule. For example, they are represented by the following general formulas (1) and (2), etc. Examples include unsaturated glycidyl esters, unsaturated glycidyl ethers, etc. (R is a hydrocarbon group having 2 to 18 carbon atoms and having an ethylenically unsaturated bond.) (R is a hydrocarbon group having 2 to 18 carbon atoms having an ethylenically unsaturated bond, and X is 1 CHz O - Specific examples include glycidyl acrylate, glycidyl methacrylate, itaconic acid glycidyl esters, allyl glycidyl ether, 2-methylallyl glycidyl ether, styrene-P-glycidyl ether, etc. Ethylenically unsaturated compounds are olefins. class, carbon number 2
Vinyl esters of ~6 saturated carboxylic acids, carbon number 1~
Esters of 8 saturated alcohols and acrylic acid or methacrylic acid, maleic esters, methacrylic esters, fumaric esters, vinyl halides, styrenes, nitriles, vinyl ethers, acrylamides, etc. Listed below. Specifically, ethylene, propylene, pten-l1 vinyl acetate, methyl acrylate, ethyl acrylate, methyl methacrylate, diethyl maleate, diethyl fumarate, vinyl chloride, vinylidene chloride, styrene, acrylonitrile, isoptyl vinyl ether, acrylamide, etc. is exemplified. Among these, ethylene is particularly preferred. Epoxy group-containing copolymers can be made by various methods. Any graft copolymerization method in which an unsaturated epoxy compound is introduced into the main chain of the copolymer can be used. In the thermoplastic resin composition according to the present invention, the polyphenylene sulfide resin (A) is 10 to 90% by weight, the polyamide resin (B) is 90 to 10% by weight, and the epoxy group-containing copolymer (C) is (A). 2 to 50 parts by weight must be added to 100 parts by weight of the resin composition consisting of lffl and (B) precepts. (A) If the content of the precepts is less than 10% by weight, water resistance and chemical resistance may not be sufficient; if the content is more than 90% by weight, favorable properties such as preformability and toughness may not be obtained. do not have. (B) If the content of precepts is less than 10% by weight,
If the rigidity, strength, etc. are insufficient, and the amount exceeds 90% by weight, favorable properties such as formability, toughness, water resistance, chemical resistance, etc. cannot be obtained. Regarding (C) content, if the content is less than 2 parts by weight, there will be a problem with the compatibility and dispersibility of the resin composition, and the toughness and impact resistance will be insufficient, and if the content is more than 50 parts by weight. In this case, layer peeling occurs in the shaped product, and the rigidity, toughness, impact resistance, etc. are significantly reduced, and favorable results cannot be obtained. In addition to the above-mentioned compounds, the resin compound of the present invention further includes a reinforced composite material made of fibers such as glass fiber, carbon fiber, polyamide 1asi, and metal whiskers, silica, alumina, calcium carbonate, talc, mica, carbon plaque, Ti-o! and z. It can also be used as a composite material with the addition of inorganic fillers such as 0, flame retardant aids, other lubricants, nucleating agents, plasticizers, dyes, pigments, antistatic agents, antioxidants, weather resistance agents, etc. It is. <<Examples>> The present invention will be explained below with reference to Examples, but these are merely illustrative and the present invention is not limited thereto. The tensile tests in the examples were conducted in accordance with ASTM-0638. Izod impact strength is ASTM-025
These are the test results based on 6. In addition, the appearance was determined visually. Regarding solvent resistance, test pieces were placed in gasoline at 30℃ for 2 hours.
After soaking for 4 hours, the surface roughness etc. was observed with the naked eye. Examples 1 to 4 (A) As a precept, M manufactured by Phillips Petroleum
2888, nine-6,6 was used as the component (B), and ethylene-glycidyl methacrylate-vinyl acetate copolymer was used as the component (C). Comparative Examples 1 to 3 Component (A) was M manufactured by Phillips Petroleum.
2888, (B) tc content is nylon, 6,6
It was used. The above results are shown in Table 1. <<Effects of the Invention>> The thermoplastic resin composite sole according to the present invention not only has good moldability but also good physical properties of crystals. The thermoplastic resin assembly according to the present invention can be easily processed into molded products, film sheets, etc. by processing methods used for ordinary thermoplastic resins, such as injection molding and extrusion molding. It provides a product with an extremely good balance of physical properties such as rigidity, heat resistance, impact resistance, oil resistance, chemical resistance, and water resistance, as well as excellent uniformity and smoothness in appearance.

Claims (1)

【特許請求の範囲】[Claims] (1)(A)ポリフェニレンサルファイド樹脂10〜9
0重量% (B)ポリアミド樹脂90〜10重量% からなる樹脂組成物100重量部に対して (C)エポキシ基含有共重合体2〜50重量部配合する
ことを特徴とする熱可塑性樹脂組成物。
(1) (A) Polyphenylene sulfide resin 10-9
0% by weight (B) A thermoplastic resin composition characterized in that 2 to 50 parts by weight of an epoxy group-containing copolymer is blended to 100 parts by weight of a resin composition consisting of 90 to 10% by weight of a polyamide resin. .
JP19151389A 1989-07-26 1989-07-26 Thermoplastic resin composition Pending JPH0356561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19151389A JPH0356561A (en) 1989-07-26 1989-07-26 Thermoplastic resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19151389A JPH0356561A (en) 1989-07-26 1989-07-26 Thermoplastic resin composition

Publications (1)

Publication Number Publication Date
JPH0356561A true JPH0356561A (en) 1991-03-12

Family

ID=16275907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19151389A Pending JPH0356561A (en) 1989-07-26 1989-07-26 Thermoplastic resin composition

Country Status (1)

Country Link
JP (1) JPH0356561A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8076423B2 (en) 2004-09-17 2011-12-13 Toray Industries, Inc. Polyphenylene sulfide resin composition
CN109415562A (en) * 2016-06-29 2019-03-01 东丽株式会社 Polyphenyl thioether resin composition and the hollow molded article for having used the polyphenyl thioether resin composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6153356A (en) * 1984-08-22 1986-03-17 Dainippon Ink & Chem Inc Polyphenylene sulfide resin composition
JPS63301252A (en) * 1987-05-30 1988-12-08 Unitika Ltd Thermoplastic resin composition
JPH0337260A (en) * 1989-07-05 1991-02-18 Asahi Chem Ind Co Ltd Resin composition
JPH0337262A (en) * 1989-07-05 1991-02-18 Asahi Chem Ind Co Ltd Resin composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6153356A (en) * 1984-08-22 1986-03-17 Dainippon Ink & Chem Inc Polyphenylene sulfide resin composition
JPS63301252A (en) * 1987-05-30 1988-12-08 Unitika Ltd Thermoplastic resin composition
JPH0337260A (en) * 1989-07-05 1991-02-18 Asahi Chem Ind Co Ltd Resin composition
JPH0337262A (en) * 1989-07-05 1991-02-18 Asahi Chem Ind Co Ltd Resin composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8076423B2 (en) 2004-09-17 2011-12-13 Toray Industries, Inc. Polyphenylene sulfide resin composition
CN109415562A (en) * 2016-06-29 2019-03-01 东丽株式会社 Polyphenyl thioether resin composition and the hollow molded article for having used the polyphenyl thioether resin composition
KR20190022470A (en) 2016-06-29 2019-03-06 도레이 카부시키가이샤 Polyphenylsulfide resin composition and hollow molded article using the same
EP3480257A4 (en) * 2016-06-29 2020-01-01 Toray Industries, Inc. Polyphenylene sulfide resin composition and hollow molding therefrom
US10577501B2 (en) 2016-06-29 2020-03-03 Toray Industries, Inc. Polyphenylene sulfide resin composition and hollow forming products using the same

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