JPH0355814A - Chip type electronic part and manufacture thereof - Google Patents
Chip type electronic part and manufacture thereofInfo
- Publication number
- JPH0355814A JPH0355814A JP1192986A JP19298689A JPH0355814A JP H0355814 A JPH0355814 A JP H0355814A JP 1192986 A JP1192986 A JP 1192986A JP 19298689 A JP19298689 A JP 19298689A JP H0355814 A JPH0355814 A JP H0355814A
- Authority
- JP
- Japan
- Prior art keywords
- group
- circuit board
- type electronic
- chip
- substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000000126 substance Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000002344 surface layer Substances 0.000 claims abstract description 6
- 125000000896 monocarboxylic acid group Chemical group 0.000 claims abstract description 4
- 125000005037 alkyl phenyl group Chemical group 0.000 claims abstract description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 description 11
- 239000002985 plastic film Substances 0.000 description 8
- 229920006255 plastic film Polymers 0.000 description 8
- 238000005507 spraying Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子機器、電気機器等に用いられるチップ型
電子部品およびその製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-type electronic component used in electronic equipment, electrical equipment, etc., and a method for manufacturing the same.
近年、電子機器の小型化、回路基板の生産性の向上など
を図るため、電子部品のチップ化が急速に進展しており
、これらの機器に使用されるチップ型電子部品にも機器
の小型化に対応したより小型のものが要請されている。In recent years, in order to miniaturize electronic devices and improve the productivity of circuit boards, the use of chips in electronic components has rapidly progressed, and the chip-type electronic components used in these devices are also becoming smaller. There is a demand for a smaller version that can accommodate the
このような状況下にあって、例えばチップ型プラスチッ
クフィルムコンデンサは、部品全容積に対して外装部の
占める割合が大であることから、外装の簡易化、または
無外装化を実現することにより大幅な小型化が可能であ
り、現在一部実施されるに至っている。Under these circumstances, for example, in chip-type plastic film capacitors, the exterior portion occupies a large proportion of the total volume of the component. Miniaturization is possible and is currently being implemented in some cases.
一般に、金属化プラスチックフィルムコンデンサは誘電
体フィルムの両面もしくは片面に蒸着電極を形成してな
る金属化プラスチックフイルムを巻回するか、あるいは
複数枚積層し、その両端面に金属材料を溶射して電極引
き出し部を形成している。このようにチップ型プラスチ
ックフイルムコンデンサでは、前述の外装の簡易化、ま
たは無外装化を実現するため、電極引き出し部、すなわ
ち部品電極を金属溶射方法により形成していることにな
る。In general, metallized plastic film capacitors are made by winding a dielectric film with vapor-deposited electrodes on either side or one side, or by laminating multiple films and thermally spraying a metal material on both ends of the film to form electrodes. It forms a drawer part. In this manner, in chip-type plastic film capacitors, in order to simplify the exterior or eliminate the exterior as described above, the electrode extension portions, that is, the component electrodes are formed by a metal spraying method.
上記のような製造方法は、生産性も極めて良い上、これ
によって得られたコンデンサの特性並びに信頼性も十分
に満足できる点で重要なものである。The above-described manufacturing method is important because it not only has extremely high productivity, but also the characteristics and reliability of the capacitor obtained using this method are fully satisfactory.
しかしながら、表面実装技術の発達に伴って高密度実装
が急速に進展していく中で、金属溶射方法を用いたチッ
プ部品には、次のような重大な問題点があった。However, while high-density mounting has rapidly progressed with the development of surface mounting technology, chip components using the metal spraying method have had the following serious problems.
まず、一つの問題点は、金属溶射中に溶融金属が酸化す
るにも拘わらず、その酸化状態のまま部品電極を形成し
てしまうことにあり、もう一つの問題点は、電極を形成
する際に生じる金属の内部応力を緩和するために熱処理
を行う必要があり、この熱処理中に電極表面の酸化を進
行させてしまうことにある。このように電極表面の酸化
が進んだ状態では、電子部品を回路基板上に半田付けす
る際、半田と電極との接合状態も不安定で、回路基板と
しての信頼性が著しく低下してしまう。First, one problem is that even though the molten metal is oxidized during metal spraying, component electrodes are formed in that oxidized state.Another problem is that when forming the electrodes, It is necessary to perform heat treatment to relieve the internal stress of the metal that occurs in the metal, and oxidation of the electrode surface progresses during this heat treatment. In such a state where the oxidation of the electrode surface has progressed, when an electronic component is soldered onto a circuit board, the bonding state between the solder and the electrode is unstable, and the reliability of the circuit board is significantly reduced.
本発明は、このような問題点に鑑みてなされたもので、
小型化並びに良好な生産性を兼ね備えたチップ型電子部
品およびその製造方法を提供することを目的とするもの
である。The present invention was made in view of these problems, and
The object of the present invention is to provide a chip-type electronic component that is compact and has good productivity, and a method for manufacturing the same.
上記のような目的を達成するために本発明のチップ型電
子部品は、部品本体の外面に形成される溶射金属からな
る金属電極の表層が、
Ａ群
Ｉ ＣＨ２ （ＯＨ）ＣＯＯＨ
ＩＩ Ｈ Ｏ Ｏ Ｃ Ｃ Ｈ ２ Ｃ Ｈ Ｃ Ｏ
Ｏ Ｈ●
ＯＨ
ＩＩＩＨＣＩ
中の少なくとも１種以上の物質と、
Ｂ群
■ アルキルフェニルポリオキシエーテルＶ （ＣＨ
３ ）２ ＣＨＯＨ
ＶＩ ｎ Ｃ４ Ｈｅ ＯＣ２ Ｈ４ ０Ｈ■ Ｈ
２０
中の少なくとも１種以上の物質とを混合した溶液により
表面処理されていることを特徴とするものである。In order to achieve the above object, the chip-type electronic component of the present invention has a surface layer of a metal electrode made of sprayed metal formed on the outer surface of the component body, which has the following properties: Group A I CH2 (OH) COOH II H O O C C H 2 C H C O
O H● OH IIIHCI and at least one substance in Group B ■ Alkylphenyl polyoxyether V (CH
3)2 CHOH VI n C4 He OC2 H4 0H■ H
It is characterized by being surface-treated with a solution containing at least one of the following substances.
また、本発明のチップ型電子部品の製造方法は、部品本
体の外面に形成される溶射金属からなる金属電極の表層
に前記Ａ群Ｉ〜ＩＩＩ中の少なくとも１種以上の物質と
、Ｂ群ＩＶ〜ＶＩＩ中の少なくともＩＮ以上の物質とを
混合した溶液により表面処理を施すことを特徴とするも
のである。In addition, the method for manufacturing a chip-type electronic component of the present invention is characterized in that at least one substance from Group A to III is added to the surface layer of a metal electrode made of sprayed metal formed on the outer surface of the component body; This method is characterized in that the surface treatment is performed using a solution mixed with at least IN or higher substances in -VII.
前記Ａ群Ｉ〜■中の少なくとも１種以上の物質と、Ｂ群
ＩＶ〜ＶＩＩ中の少なくとも１種以上の物質とを混合し
た溶液により表面処理を施すことにより、電子部品を回
路基板上に半田付けする際の半田と電極との接合状態が
良好となり、回路基板としての信頼性が確保される。Electronic components can be soldered onto a circuit board by surface treatment with a solution containing a mixture of at least one substance from groups A to I and at least one substance from groups IV to VII. The bonding state between the solder and the electrode during attachment is good, and the reliability of the circuit board is ensured.
以下、本発明の実施例を図面を参照しながら詳細に説明
する。図面はこの実施例として作成したチップ型プラス
チックフィルムコンデンサを示す斜視図である。なお、
比較例のコンデンサは実施例のものと共通の構造を備え
ているので、図示省略する。図面において、（ｌ）は金
属化プラスチックフィルムを複数枚積層した部品本体と
してのコンデンサ素子、（２）はコンデンサ素子（１）
の両端面にＣｕ−Ｚｎ合金を溶射してなる蒸着電極引き
出し部、すなわち部品電極である。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The drawing is a perspective view showing a chip-type plastic film capacitor produced as this example. In addition,
The capacitor of the comparative example has the same structure as that of the example, so illustration thereof is omitted. In the drawings, (l) is a capacitor element as a component body made by laminating multiple metalized plastic films, and (2) is a capacitor element (1).
This is a vapor-deposited electrode extension portion, that is, a component electrode, which is formed by thermally spraying a Cu-Zn alloy on both end faces of the vapor-deposited electrode.
第１表に、この実施例で使用した混合溶液の組成を示し
ている。また、第２表には、第１表に示した溶液によっ
て部品電極（２）を表面処理した実施例および比較例の
チップ型プラスチックフィルムコンデンサを半田槽ディ
１プ方式により実装し、部品電極（２）と回路基板との
接合状態を目視により良否判定を行い、不良率として数
値化したものを示している。Table 1 shows the composition of the mixed solution used in this example. Table 2 also shows that chip-type plastic film capacitors of Examples and Comparative Examples in which the component electrodes (2) were surface-treated with the solutions shown in Table 1 were mounted using the solder bath dip method. 2) and the circuit board were visually judged to be good or bad, and the result is expressed numerically as a defective rate.
なお、実装条件は半田温度２４０℃で、ディップ時間１
０秒とし、また、プリヒートは１２０℃で、予熱時間は
５０秒とした。The mounting conditions are a solder temperature of 240°C and a dip time of 1.
The preheating time was 0 seconds, and the preheating temperature was 120° C., and the preheating time was 50 seconds.
第１表 注）第１表中、 数値の単位は Ｃｇ／ｌコ である。Table 1 Note) In Table 1, The unit of numerical value is Cg/l It is.
第２表
また、この実施例ではチップ型プラスチックフィルムコ
ンデンサを一例として掲げたが、本発明はこれに限られ
るものではなく、端子電極形成方法として金属溶射方法
を用いたチソプ型電子部品全ゆる種類のものに適用でき
ることはいうまでもない。Table 2 Also, in this embodiment, a chip-type plastic film capacitor was cited as an example, but the present invention is not limited to this, and all types of Chisop-type electronic components using the metal spraying method as the terminal electrode forming method. Needless to say, it can be applied to anything.
以上の結果から明らかなように、本発明のチップ型電子
部品およびその製造方法によるときは、回路基板上に半
田付けされる際に、半田と電極との接合状態が良好とな
り、回路基板としての信頼性が確保されると共に、電子
機器の小型化、回路基板の生産性の向上に大きく寄与す
るものとなった。As is clear from the above results, when the chip-type electronic component and its manufacturing method of the present invention are used, the bonding state between the solder and the electrode is good when it is soldered onto a circuit board, and it can be used as a circuit board. This not only ensures reliability, but also greatly contributes to the miniaturization of electronic devices and improved productivity of circuit boards.
図面は本発明の実施例に係るチ）プ型プラスチックフィ
ルムコンデンサを示す斜視図である。
（１）・・・部品本体、（２）・・・金属電極。
７ ： ａｌｓ晶本体
２：金＆電梧The drawing is a perspective view showing a chip-type plastic film capacitor according to an embodiment of the present invention. (1)...Part body, (2)...Metal electrode. 7: ALS crystal body 2: Gold & Dengo
Claims (2)
属電極の表層が下記Ａ群 I 〜III中の少なくとも１種以
上の物質と、下記Ｂ群IV〜VII中の少なくとも１種以上
の物質とを混合した溶液により表面処理されていること
を特徴とするチップ型電子部品。 Ａ群 I ＣＨ＿２（ＯＨ）ＣＯＯＨ IIＨＯＯＣＣＨ＿２ＣＨＣＯＯＨ ＯＨ IIIＨＣｌ Ｂ群 IVアルキルフェニルポリオキシエーテル Ｖ（ＣＨ＿３）＿２ＣＨＯＨ VIｎ−Ｃ＿４Ｈ＿８ＯＣ＿２Ｈ＿４ＯＨ VIIＨ＿２Ｏ(1) The surface layer of the metal electrode made of sprayed metal formed on the outer surface of the component body is made of at least one substance from Group A I to III below and at least one substance from Group B IV to VII below. A chip-type electronic component characterized in that its surface is treated with a solution mixed with. Group A I CH_2(OH)COOH IIHOOCCH_2CHCOOH OH IIIHCl Group B IV Alkylphenyl polyoxyether V(CH_3)_2CHOH VIIn-C_4H_8OC_2H_4OH VIIH_2O
属電極の表層に請求項（１）記載のＡ群 I 〜III中の少
なくとも１種以上の物質と、Ｂ群IV〜VII中の少なくと
も１種以上の物質とを混合した溶液により表面処理を施
すことを特徴とするチップ型電子部品の製造方法。(2) At least one substance from Group A I to III according to claim (1) and at least one substance from Group B IV to VII are added to the surface layer of a metal electrode made of sprayed metal formed on the outer surface of the component body. A method for manufacturing a chip-type electronic component, characterized by performing surface treatment with a solution mixed with one or more types of substances.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1192986A JPH0355814A (en) | 1989-07-25 | 1989-07-25 | Chip type electronic part and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1192986A JPH0355814A (en) | 1989-07-25 | 1989-07-25 | Chip type electronic part and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0355814A true JPH0355814A (en) | 1991-03-11 |
Family
ID=16300332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1192986A Pending JPH0355814A (en) | 1989-07-25 | 1989-07-25 | Chip type electronic part and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0355814A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01173614A (en) * | 1987-12-28 | 1989-07-10 | Nitsuko Corp | Manufacture of chip-type film capacitor |
-
1989
- 1989-07-25 JP JP1192986A patent/JPH0355814A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01173614A (en) * | 1987-12-28 | 1989-07-10 | Nitsuko Corp | Manufacture of chip-type film capacitor |
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