JPH0354884A - Through-hole printed wiring board and formation of through-hole - Google Patents

Through-hole printed wiring board and formation of through-hole

Info

Publication number
JPH0354884A
JPH0354884A JP1188974A JP18897489A JPH0354884A JP H0354884 A JPH0354884 A JP H0354884A JP 1188974 A JP1188974 A JP 1188974A JP 18897489 A JP18897489 A JP 18897489A JP H0354884 A JPH0354884 A JP H0354884A
Authority
JP
Japan
Prior art keywords
hole
circular
wiring board
printed wiring
irregularly shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1188974A
Other languages
Japanese (ja)
Inventor
Hideho Inagawa
秀穂 稲川
Shigenobu Noujiyou
能條　重信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP1188974A priority Critical patent/JPH0354884A/en
Publication of JPH0354884A publication Critical patent/JPH0354884A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Laser Beam Processing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To highly reliably form a through-hole by forming a uniform metal film and circulating a plating solution in penetration hole for the through-hole satisfactorily by providing a different shape part as the penetration hole. CONSTITUTION:A workpiece 8 on an X-Y stage 9 is irradiated with a circular beam spot 21 from a CO2 laser oscillator 7 via a focusing lens 6 and a rotating mirror 5 is rotated by 90 deg., the workpiece 8 as an object shape 22 is irradiated at the same position with a pulsed oscillation beam from an excimer laser oscillator 1. Control means 10 performs movement of the workpiece, inversion of the mirror, and switching of lasing completion, whereby a penetration hole 23 for the through-hole including the different shape provided thereon can be formed. Thus, a plating solution can be facilitated to be incorporated into the penetration hole, and air bubbles can be freed to the outside of the penetration hole to ease the formation of the metal film.

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、異形部を有する貫通孔（以下、異形貫通孔と
記す）によるスルでホールプリント配線板、及びそのス
ルーホールの形成方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a through hole printed wiring board formed by a through hole having an irregularly shaped portion (hereinafter referred to as an irregularly shaped through hole), and a method for forming the through hole.

［従来の技術】 従来、プリント基板に形成されたスルーホールは、ドリ
ルによる機械的な手段により貫通孔を形成し、この貫通
孔に触媒処理を施し、化学メッキ乃至電気メッキ行程を
経て、孔内壁に金属膜が被覆されることにより形成され
ていた。[Prior Art] Conventionally, through-holes formed on printed circuit boards are formed by mechanical means using a drill, and then the through-holes are treated with a catalyst and then subjected to chemical plating or electroplating to coat the inner wall of the hole. It was formed by coating the surface with a metal film.

ところで、上記のドリルによる機械的な孔加工法によれ
ば、孔形状は円形の径形状を鉛直方向に貫通したもので
あり、このような円形状は任意位置での応力集中が少な
く、曲げ、ねじれによる力の負荷、熱膨張、収縮による
力の負荷に対する信頼性が高いものとして評価されてい
た。By the way, according to the above-mentioned mechanical hole processing method using a drill, the hole shape is a circular diameter that penetrates in the vertical direction, and such a circular shape has less stress concentration at any arbitrary position, and is easy to bend, It was evaluated as having high reliability against loads of force due to torsion, thermal expansion, and contraction.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところが、近年、高密度化にともない、スルーホールと
して形成される貫通孔が小径化し、この小径孔にメッキ
により導体を形成するには、メッキ液が孔内に入りにく
く、均一な金属皮膜を形成するのが困難であるという問
題点があった。However, in recent years, with the increase in density, the diameter of through holes has become smaller, and when forming conductors in these small diameter holes by plating, it is difficult for the plating liquid to enter the holes, and it is difficult to form a uniform metal film. The problem was that it was difficult to do so.

本発明は、このような問題点を解消するために成された
ものである。The present invention has been made to solve these problems.

〔課題を解決するための手段］ 上記の課題は、本発明の、プリント基板の主口径として
の円部と該円部の内周又は外周方向に形成された異形部
との組み合わせからなる貫通孔を設け、該貫通孔を導体
化してスルーホールとじたことを特徴とするスルーホー
ルプリント配線板、及び、プリント基板の主口径として
の円部と該円部の内周又は外周方向に形成された異形部
との組み合わせからなる貫通孔を円形モードのものと非
円形モードのものとの組み合わせによるレーザービーム
照射により形成することを特徴とするスルーホール形成
方法により解決できる。[Means for Solving the Problems] The above-mentioned problems are solved by the through-hole of the present invention, which is a combination of a circular portion as the main diameter of a printed circuit board and an irregularly shaped portion formed on the inner circumference or outer circumference of the circular portion. A through-hole printed wiring board characterized in that the through-hole is made into a conductor and closed as a through-hole, and a through-hole printed wiring board is characterized in that the through-hole is made into a conductor and closed as a through-hole, and a circular part as the main diameter of the printed circuit board and a printed wiring board formed on the inner or outer circumference of the circular part. This problem can be solved by a through-hole forming method characterized in that a through-hole consisting of a combination of irregularly shaped parts is formed by laser beam irradiation using a combination of a circular mode and a non-circular mode.

［作用］ 従来のドリルによって形成された貫通孔が、メッキによ
り導体を形成する際、メッキ液が孔内に入りにくく、均
一な金属皮膜を形成するのが困難である原因としては、
孔径が小さく、しかも孔形状として力が均一に加わる円
形であるため、孔の外を流れる液の流動に対して、孔内
の液の表面又は裏面における表面張力が大きくなり、第
３図（ａ）に示すように、７夜は孔の開口表面をなめる
だけとなって孔内へ入りにくいためである。又、孔内部
で反応によって生成した気泡が孔内構内からも十反け難
いということも原因となっている。[Function] When a conductor is formed by plating a through hole formed by a conventional drill, it is difficult for the plating liquid to enter the hole, making it difficult to form a uniform metal film.
Since the pore diameter is small and the pore shape is circular, which applies force uniformly, the surface tension on the surface or back surface of the liquid inside the pore becomes large with respect to the flow of liquid flowing outside the pore, as shown in Figure 3 (a). ), this is because on the 7th night, they only lick the opening surface of the hole, making it difficult for them to enter the hole. Another cause is that bubbles generated by reaction inside the hole are difficult to remove from the inside of the hole.

そこで、本発明は、上記のような手段により、貫通孔の
円周の一部又は複数部分に異形部分を設けることにより
、第３図（ｂ）或は（Ｃ）に示すように、孔の表面又は
裏面における表面張力のバランスが崩れ、孔外周の溝が
液流のガイドとして機能し、液を孔内へ取り込むことが
できる。又、孔外周の溝は孔内部で発生した気泡を孔外
へ逃がすことができ、液は孔内へ流動しやすくなる。Therefore, the present invention uses the above-mentioned means to provide irregularly shaped portions on a portion or multiple portions of the circumference of the through hole, as shown in FIG. 3(b) or (C). The surface tension on the front or back surface is unbalanced, and the grooves around the pores function as liquid flow guides, allowing liquid to be drawn into the pores. Furthermore, the grooves around the outer periphery of the hole allow air bubbles generated inside the hole to escape to the outside of the hole, making it easier for liquid to flow into the hole.

上記により、貫通孔内への液の流動は良好となり、メッ
キによる均一な金属膜の形成が可能となる。As a result of the above, the liquid flows well into the through-hole, and a uniform metal film can be formed by plating.

【実施例〕【Example〕

以下、本発明の実施例について図面を参照しながら説明
する。Embodiments of the present invention will be described below with reference to the drawings.

第１図は、本発明による異形貫通孔の孔明けの加工装置
を模式的に示したものである。FIG. 1 schematically shows a processing device for drilling irregularly shaped through holes according to the present invention.

本実施例では、ＣＯ２レーザー発振機７からのレーザー
発振としてＴＥＭＯＯシングルモードビームをパルスタ
イム数１０〜数１０００ｎＳｅｃで数１０パルス発振し
、これをＧａＡｓの集光レンズ６を通し、さらに反転ミ
ラー５により進路な９０度曲げてＸ−Ｙステージ９上の
被加工物８（東芝ケミカルズ社製．ＴＬＣ−Ｗ−５５　
１ガラスエボキシ板）に照射する。一方反転ミラー５を
９０度回転すると、エキシマレーザー発振機ｌからの２
００Ｈｚパルス発振ビームをアバーチャ−２により目的
とする形状とし、これを石英からなる集光レンズ３を通
して反転ミラー５で反射して被加工物８のＣＯ２レーザ
ーの加工スポットと同位置に照射する。In this embodiment, a TEMOO single mode beam is oscillated as laser oscillation from a CO2 laser oscillator 7 in tens of pulses with a pulse time of several tens to several thousand nanoseconds, passed through a GaAs condensing lens 6, and then passed through a reversing mirror 5. Workpiece 8 (manufactured by Toshiba Chemicals Co., Ltd., TLC-W-55)
1 glass epoxy plate). On the other hand, when the reversing mirror 5 is rotated 90 degrees, the 2
A 00 Hz pulse oscillation beam is shaped into a desired shape by an aperture 2, passed through a condensing lens 3 made of quartz, reflected by a reversing mirror 5, and irradiated onto the workpiece 8 at the same position as the processing spot of the CO2 laser.

なお、Ｘ−Ｙテーブル９による被加工物８の移動、ミラ
ーの反転、レーザーの発振、終了のスイッチング等の信
号のやり取りは制御手段１ｏによって行なうようにする
。The control means 1o controls the movement of the workpiece 8 by the XY table 9, the mirror reversal, the laser oscillation, the end switching, and other signals.

以上のようにして得られた貫通孔の孔形状の一例を第２
図に示してある。An example of the hole shape of the through hole obtained as described above is shown in the second example.
It is shown in the figure.

第２図（ａ）に示すものは、ＣＯ２レーザーによる円形
ビームスポット２１とエキシマレーザーによる矩形ビー
ムスポット２２との組み合わせにより形成された異形貫
通孔２３である。What is shown in FIG. 2(a) is an irregularly shaped through hole 23 formed by a combination of a circular beam spot 21 by a CO2 laser and a rectangular beam spot 22 by an excimer laser.

第２図（ｂ）に示すものは、ＣＯ２レーザーによる円形
ビームスポット２１とエキシマレーザーによる星形ビー
ムスポット２２゛との組み合わせにより形成された異形
貫通孔２３゜である。What is shown in FIG. 2(b) is an irregularly shaped through hole 23° formed by a combination of a circular beam spot 21 from a CO2 laser and a star-shaped beam spot 22′ from an excimer laser.

なお、以上の実施例では、ＣＯ２レーザーとエキシマレ
ーザーとの組み合わせによる加工方法を記したが、その
他のレーザーとして、ＹＡＧレーザー、ＣＯレーザー、
ガラスレーザー等の高出力レーザーを用いることもでき
る。In addition, in the above example, a processing method using a combination of a CO2 laser and an excimer laser was described, but other lasers such as YAG laser, CO laser,
High power lasers such as glass lasers can also be used.

又、装置の構造として、上記実施例では回転ミラーを用
いてあるが、ミラーは直線駆動のものでもよく、集光レ
ンズはミラーで進路を変える前にある必要はなく、２種
の同軸行路上に切換え出入りする形式のものでもよい。In addition, as for the structure of the device, although a rotating mirror is used in the above embodiment, the mirror may be linearly driven, and the condensing lens does not need to be placed before changing the course with the mirror. It may be of a type that switches in and out.

次に、上記本実施例による孔形状に対する評価を、導体
化のしやすさという観点からメッキ付き性によって評価
したものを次表に示してある。Next, the following table shows the evaluation of the hole shape according to the above-described present example, which was evaluated based on the plating property from the viewpoint of ease of making the hole into a conductor.

なお、次表に示す孔形状としては、第３図（ａ）〜（Ｃ
）に示すものを用いてある。第３図（ａ）に示す孔は、
従来の円形のものであり、第３図（ｂ）に示す孔は、上
記円形孔の周囲一か所にくさび形が形成されたものであ
り、第３図（ｃ）に示す孔は、上記円形孔の周囲径方向
に二か所にくさび形が形成されたものである。Note that the hole shapes shown in the following table are as shown in Figures 3(a) to (C).
) is used. The hole shown in Figure 3(a) is
The hole shown in FIG. 3(b) is a conventional circular hole with a wedge shape formed around the circular hole, and the hole shown in FIG. 3(c) is similar to the hole shown in FIG. Wedge shapes are formed at two locations in the radial direction of the circular hole.

又、各基板５０孔中，任意の３孔を抽出して測定し、孔
径として円周径で０．１ｍｍのものを用いた。Furthermore, out of the 50 holes of each substrate, three arbitrary holes were extracted and measured, and those having a circumferential diameter of 0.1 mm were used as the hole diameter.

（抵抗値（ｍΩ） 〔発明の効果〕 以上説明したように、本発明によれば、スルーホール用
貫通孔として異形部分を設けることにより、貫通孔内に
液流が流動しゃすくなるため、メッキｌ夜が孔内を良好
に循環することができ、メッキによる均一な金属膜の形
成が可能となり、信頼性の高いスルーホール形成可能と
なる。(Resistance value (mΩ) [Effect of the invention] As explained above, according to the present invention, by providing an irregularly shaped part as a through hole, the liquid flow becomes difficult to flow in the through hole. The metal can circulate well inside the hole, making it possible to form a uniform metal film by plating, and making it possible to form highly reliable through-holes.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明による異形部を有する貫通孔明けの加
工装置を模式的に示したものである。 第２図（ａ）、（ｂ）は、本発明による貫通孔の孔形状
の一例を示した図である。 第３図（ａ）〜（ｃ）は、各種孔形状による孔内への７
夜の流通状況を示す図である。 ｌ・・・エキシマレーザー発振機 ７・・・ＣＯ．レーザー発振機 ８・・・被加工物FIG. 1 schematically shows a processing device for drilling a through hole having an irregularly shaped portion according to the present invention. FIGS. 2(a) and 2(b) are diagrams showing an example of the hole shape of the through hole according to the present invention. Figures 3(a) to (c) show 7 holes into the hole due to various hole shapes.
It is a diagram showing the distribution situation at night. l...Excimer laser oscillator 7...CO. Laser oscillator 8...workpiece

Claims (5)

【特許請求の範囲】[Claims] （１）プリント基板の主口径としての円部と該円部の内
周又は外周方向に形成された異形部との組み合わせから
なる貫通孔を設け、該貫通孔を導体化してスルーホール
としたことを特徴とするスルーホールプリント配線板。(1) A through hole is provided which is a combination of a circular part as the main diameter of the printed circuit board and an irregularly shaped part formed on the inner or outer circumference of the circular part, and the through hole is made into a conductor to form a through hole. A through-hole printed wiring board featuring （２）前記プリント配線板のスルーホールは、前記貫通
孔をメッキにより金属膜を被覆することにより導体化さ
れたことを特徴とする請求項１記載のスルーホールプリ
ント配線板。(2) The through-hole printed wiring board according to claim 1, wherein the through-holes of the printed wiring board are made conductive by coating the through-holes with a metal film by plating. （３）前記貫通孔として形成された異形部は、該異形部
の内周又は外周への侵出が前記貫通孔の孔径に対して充
分小さく形成されたことを特徴とする請求項１記載のス
ルーホールプリント配線板。(3) The irregularly shaped part formed as the through hole is formed such that the penetration of the irregularly shaped part into the inner periphery or the outer periphery is sufficiently smaller than the hole diameter of the through hole. Through-hole printed wiring board. （４）プリント基板の主口径としての円部と該円部の内
周又は外周方向に形成された異形部との組み合わせから
なる貫通孔を円形モードのものと非円形モードのものと
の組み合わせによるレーザービーム照射により形成する
ことを特徴とするスルーホール形成方法。(4) A through hole consisting of a combination of a circular part as the main diameter of the printed circuit board and an irregularly shaped part formed on the inner or outer periphery of the circular part is formed in a combination of a circular mode and a non-circular mode. A through hole forming method characterized by forming through laser beam irradiation. （５）前記異形部を有する貫通孔のレーザービーム照射
による加工方法において、前記レーザービームとして、
遠赤外のＣＯ＿２レーザーと紫外のエキシマレーザーと
を組み合わせて用いることを特徴とする請求項４記載の
スルーホール形成方法。(5) In the method for processing a through hole having an irregularly shaped portion by laser beam irradiation, the laser beam may include:
5. The through-hole forming method according to claim 4, characterized in that a far-infrared CO_2 laser and an ultraviolet excimer laser are used in combination.
JP1188974A 1989-07-24 1989-07-24 Through-hole printed wiring board and formation of through-hole Pending JPH0354884A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1188974A JPH0354884A (en) 1989-07-24 1989-07-24 Through-hole printed wiring board and formation of through-hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1188974A JPH0354884A (en) 1989-07-24 1989-07-24 Through-hole printed wiring board and formation of through-hole

Publications (1)

Publication Number Publication Date
JPH0354884A true JPH0354884A (en) 1991-03-08

Family

ID=16233186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1188974A Pending JPH0354884A (en) 1989-07-24 1989-07-24 Through-hole printed wiring board and formation of through-hole

Country Status (1)

Country Link
JP (1) JPH0354884A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5441569A (en) * 1993-11-29 1995-08-15 The United States Of America As Represented By The United States Department Of Energy Apparatus and method for laser deposition of durable coatings
US7127812B2 (en) 1997-12-11 2006-10-31 Ibiden Co., Ltd. Process for producing a multi-layer printed wiring board
US7732732B2 (en) 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
JP2013175504A (en) * 2012-02-23 2013-09-05 Murata Mfg Co Ltd Electronic component and method of manufacturing the same
WO2019039237A1 (en) * 2017-08-21 2019-02-28 住友電工プリントサーキット株式会社 Printed wiring board
CN109600937A (en) * 2018-12-07 2019-04-09 张超 A kind of integrated circuit board and preparation method thereof
JP2019114722A (en) * 2017-12-25 2019-07-11 住友電工プリントサーキット株式会社 Printed wiring board and method of manufacturing printed wiring board
WO2023042659A1 (en) * 2021-09-16 2023-03-23 株式会社片岡製作所 Laser processing apparatus, probe card production method, and laser processing method

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5441569A (en) * 1993-11-29 1995-08-15 The United States Of America As Represented By The United States Department Of Energy Apparatus and method for laser deposition of durable coatings
US7732732B2 (en) 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7127812B2 (en) 1997-12-11 2006-10-31 Ibiden Co., Ltd. Process for producing a multi-layer printed wiring board
US7375289B2 (en) 1997-12-11 2008-05-20 Ibiden Co., Ltd. Multi-layer printed wiring board including an alignment mark as an index for a position of via holes
US7761984B2 (en) 1997-12-11 2010-07-27 Ibiden Co., Ltd. Process for producing multi-layer printed wiring board
JP2013175504A (en) * 2012-02-23 2013-09-05 Murata Mfg Co Ltd Electronic component and method of manufacturing the same
US8975996B2 (en) 2012-02-23 2015-03-10 Murata Manufacturing Co., Ltd. Electronic component and method of manufacturing the same
US10887989B2 (en) 2017-08-21 2021-01-05 Sumitomo Electric Printed Circuits, Inc. Printed wiring board
CN110999547A (en) * 2017-08-21 2020-04-10 住友电工印刷电路株式会社 Printed wiring board
JPWO2019039237A1 (en) * 2017-08-21 2020-07-30 住友電工プリントサーキット株式会社 Printed wiring board
WO2019039237A1 (en) * 2017-08-21 2019-02-28 住友電工プリントサーキット株式会社 Printed wiring board
CN110999547B (en) * 2017-08-21 2023-04-18 住友电工印刷电路株式会社 Printed wiring board
JP2019114722A (en) * 2017-12-25 2019-07-11 住友電工プリントサーキット株式会社 Printed wiring board and method of manufacturing printed wiring board
CN109600937A (en) * 2018-12-07 2019-04-09 张超 A kind of integrated circuit board and preparation method thereof
CN109600937B (en) * 2018-12-07 2021-01-22 江门市江海区科诺微电子有限公司 Integrated circuit board and preparation method thereof
WO2023042659A1 (en) * 2021-09-16 2023-03-23 株式会社片岡製作所 Laser processing apparatus, probe card production method, and laser processing method

Similar Documents

Publication Publication Date Title
US6649864B2 (en) Method of laser drilling
KR100265578B1 (en) Laser machining method
US20030047545A1 (en) Method for laser drilling
KR20070037404A (en) Laser machining method and laser machining apparatus
EP1231013A4 (en) Method and apparatus for laser drilling
JPH0354884A (en) Through-hole printed wiring board and formation of through-hole
US20040112881A1 (en) Circle laser trepanning
KR20210015918A (en) Patterning and removal of circuit board material using ultrafast lasers
JP2008049383A (en) Beam irradiation method and beam irradiation apparatus
JP2002517315A (en) Apparatus and method for drilling micro via holes in electrical circuit wiring package
JP2020109820A (en) Laser processing method for printed circuit board and laser processing machine for printed circuit board
KR20040083546A (en) Laser machining method
JP2004351513A (en) Method for machining material by super-short pulse laser beam, printed circuit board, and method for manufacturing the same
JPH11103150A (en) Laser beam machining apparatus
JPH11192571A (en) Laser processing method and apparatus therefor
JPH11333575A (en) Laser beam machine
JPH11309594A (en) Laser beam machining device and its working parts
JP2000202664A (en) Lasder drilling method
JPH0327885A (en) Working method by laser
WO2002083355A1 (en) Circle laser trepanning
JP2002321079A (en) Laser processing method
JP3967156B2 (en) Laser processing method
JPH0354885A (en) Forming method for hole in printed board
JPS63212085A (en) Laser beam machining and treating method and its device
JP2002144060A (en) Method for laser beam machining