JPH0353874U - - Google Patents

Info

Publication number
JPH0353874U
JPH0353874U JP11530389U JP11530389U JPH0353874U JP H0353874 U JPH0353874 U JP H0353874U JP 11530389 U JP11530389 U JP 11530389U JP 11530389 U JP11530389 U JP 11530389U JP H0353874 U JPH0353874 U JP H0353874U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
electronic components
circuit device
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11530389U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11530389U priority Critical patent/JPH0353874U/ja
Publication of JPH0353874U publication Critical patent/JPH0353874U/ja
Pending legal-status Critical Current

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Landscapes

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Description

【図面の簡単な説明】
第1図は、本考案の実施例である混成集積回路
基板を示す斜視図、第2図は、従来の混成集積回
路基板の例を示す斜視図である。 1…回路基板、4,5,6…電子部品、7′,
8′…表示。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板1の上に電子部品4,5,6を搭載し
    てなる混成集積回路装置において、前記電子部品
    4,5,6のうち、任意のものの上面に当該混成
    集積回路に関する表示7′,8′を施してなるこ
    とを特徴とする混成集積回路装置。
JP11530389U 1989-09-30 1989-09-30 Pending JPH0353874U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11530389U JPH0353874U (ja) 1989-09-30 1989-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11530389U JPH0353874U (ja) 1989-09-30 1989-09-30

Publications (1)

Publication Number Publication Date
JPH0353874U true JPH0353874U (ja) 1991-05-24

Family

ID=31663635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11530389U Pending JPH0353874U (ja) 1989-09-30 1989-09-30

Country Status (1)

Country Link
JP (1) JPH0353874U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012042668A1 (ja) * 2010-10-01 2012-04-05 株式会社メイコー 部品内蔵基板及び部品内蔵基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012042668A1 (ja) * 2010-10-01 2012-04-05 株式会社メイコー 部品内蔵基板及び部品内蔵基板の製造方法
JP5444473B2 (ja) * 2010-10-01 2014-03-19 株式会社メイコー 部品内蔵基板及び部品内蔵基板の製造方法

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