JPH0353095A - Partial plating method - Google Patents
Partial plating methodInfo
- Publication number
- JPH0353095A JPH0353095A JP18717489A JP18717489A JPH0353095A JP H0353095 A JPH0353095 A JP H0353095A JP 18717489 A JP18717489 A JP 18717489A JP 18717489 A JP18717489 A JP 18717489A JP H0353095 A JPH0353095 A JP H0353095A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- plating
- insoluble
- coating
- coating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims description 12
- 239000000463 material Substances 0.000 claims abstract description 42
- 239000011248 coating agent Substances 0.000 claims abstract description 40
- 238000000576 coating method Methods 0.000 claims abstract description 40
- 238000004070 electrodeposition Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 230000000873 masking effect Effects 0.000 abstract description 5
- 239000012528 membrane Substances 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001800 Shellac Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】 【産業上の利用分野］ 本発明は部分メッキ方法に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a partial plating method.
［従来の技術Ｊ
従来から部分メッキ方法として、いくつかのものが採用
されているが、その代表例としては、彼メッキ部分のみ
をメッキ液に浸漬して、浸漬した部分だけをメッキする
方法、被メッキ面以外の面を絶縁テープや樹脂などでマ
スキングして、このマスキングした部分以外の部分にメ
ッキする方法などがある。[Conventional technology J] Several methods have been used as partial plating methods. Typical examples include a method in which only the plated part is immersed in a plating solution and only the immersed part is plated; There is a method of masking surfaces other than the surface to be plated with insulating tape or resin, and plating the portions other than the masked portions.
［解決しようとする課題］
上記従来例のうち前者では、コネクタの端子のように被
メッキ材の部品の端部にだけメッキを施すようなものに
は適する方広であるが、端部以外の部分にメッキを施す
場合には適しない。また後者では、彼メッキ面に比較し
て被メッキ面以外の面が大きい場合や複雑な形状をして
いる部品の場合などでは、被メッキ面以外の面に正確に
絶縁テープなどでマスキングすることが困難である。こ
の結果メッキをしてはならない個所にメッキされるなど
による不良品を生じ、メッキ製品の歩留りを低下させた
り、不必要な個所にメッキされることになって貴金属な
どを含む高価なメッキ材料を浪費し、メッキ処理のコス
トを高くする原因になったりしている。[Problem to be solved] Among the above conventional examples, in the former case, the square shape is suitable for plating only the ends of the parts to be plated, such as connector terminals, but Not suitable for plating parts. In addition, in the latter case, if the surface other than the plated surface is larger than the plated surface or the part has a complicated shape, it is necessary to accurately mask the surface other than the plated surface with insulating tape, etc. is difficult. This results in defective products due to plating being plated in areas that should not be plated, which reduces the yield of plated products, and in unnecessary areas being plated, requiring the use of expensive plating materials containing precious metals. This results in waste and increases the cost of plating.
本発明の目的は、簡単な工程でしかも必要とする被メッ
キ面に正確に部分メッキができるようにして、部分メッ
キ処理のコストを引下げることにある。SUMMARY OF THE INVENTION An object of the present invention is to reduce the cost of partial plating by making it possible to accurately perform partial plating on a required plated surface using a simple process.
［課題を解決するための手段］
上記の目的を達成するために本発明の部分メッキ方法は
、被メッキ材の被メッキ面に、第１材料からなる第１彼
膜を形成し、この第１披膜が非可溶性でありかつ第１被
膜に対するぬれ性が低く、しかもメッキ演に対して非可
溶性である第２材料の溶液中に、被メッキ材を浸漬して
彼メッキ面以外の面に第２材料からなる第２彼膜を形成
し、第１被膜が可溶性でありかつ第２被膜が非可溶性で
ある液体によって第１波膜を除去し、この第１被膜が除
去された上記の彼メッキ面にメッキを施すものである。[Means for Solving the Problems] In order to achieve the above object, the partial plating method of the present invention includes forming a first film made of a first material on the surface to be plated of a material to be plated; The material to be plated is immersed in a solution of a second material whose membrane is insoluble and has low wettability with respect to the first coating, and which is insoluble in plating. the first film is removed with a liquid in which the first film is soluble and the second film is insoluble, and the first film is removed. The surface is plated.
また別の方法では、被メッキ材の被メッキ面に、電着メ
ッキ液に対して非可溶性でかつ絶縁性を有する第１材料
からなる第１被膜を形成し、上記彼メノキ＋４に電着塗
装して彼メッキ面以外の面にメノキ液に対して非可溶性
の第２被膜を形成し，、第１披膜が可溶性でありかつ第
２彼膜が非可溶性である液体によって上記第１被膜を除
去し、第１被膜が除去された彼メッキ而にメッキを施す
ちのである。In another method, a first film made of a first material that is insoluble in an electrodeposition plating solution and has an insulating property is formed on the surface of the material to be plated, and the electrodeposited layer is coated on the surface of the material to be plated. to form a second coating that is insoluble in the agate liquid on the surface other than the plated surface, and remove the first coating with a liquid in which the first membrane is soluble and the second membrane is insoluble. After removing the first coating, plating is applied to the plated layer from which the first coating has been removed.
［作用］
彼メッキ材の被メッキ面に第１被膜を形成後にこれを第
２材料の溶液中に浸漬すると、第２材料の溶液に対して
は第１被膜は非可溶性で、また第２材料の溶液は第１被
膜に対するぬれ性が低いから、第１被膜はそのまま残留
し、披メッキ面以外の面には第２材料による第２被膜が
形成される。[Operation] When the first coating is formed on the plated surface of the plated material and then immersed in the solution of the second material, the first coating is insoluble in the solution of the second material, and the second coating is insoluble in the solution of the second material. Since the solution has low wettability to the first coating, the first coating remains as it is, and a second coating made of the second material is formed on the surface other than the plated surface.
次に第２被膜が非可溶性である液体によって第１彼膜を
除去すると彼メッキ面のみが露出し、彼メッキ面以外は
マスキングされた状態になり、波メッキ面のみを確実に
メッキすることができる。Next, when the first layer is removed using a liquid in which the second layer is insoluble, only the layer-plated surface is exposed, and the other surfaces are masked, making it possible to reliably plate only the wave-plated surface. can.
［実施例］ 以下本発明の実施例について図面を参照して説明する。[Example] Embodiments of the present invention will be described below with reference to the drawings.
第１図に示すように、彼メッキ材１は丸棒の中央部に細
径の部分が形成してあり、細径の部分にだけ部分メッキ
をするものである。すなわち、細径の部分を彼メッキ面
１ａとし、それ以外の部分すなわち大径の部分を彼メッ
キ而以外の而１ｂとする。As shown in FIG. 1, the plated material 1 has a narrow diameter part formed in the center of a round bar, and only the narrow diameter part is partially plated. That is, the small-diameter part is defined as the plated surface 1a, and the other part, that is, the large-diameter part, is defined as the plated surface 1b.
部分メッキをするための前処理は、まず第２図に示すよ
うに、被メッキ面１ａにマスキング材である第１材料Ａ
を筆その他の塗付手段によって塗付して第１披膜２を形
成する。第１材料Ａの具体例としては、ポリビニルアル
コール水溶液中にポリテトラフルオ口エタン粒子を分散
させたものが採用されている。In the pretreatment for partial plating, first, as shown in FIG. 2, a first material A as a masking material is applied to the surface 1a to be plated.
is applied with a brush or other application means to form the first laryngeal membrane 2. A specific example of the first material A is one in which polytetrafluoroethane particles are dispersed in an aqueous polyvinyl alcohol solution.
次に被メッキ材１を第１彼膜２が非可溶性でありかつ第
１被膜に対するぬれ性が低く、しかもメッキ液に対して
非可溶性を有する第２材料Ｂの溶液中に浸漬して、メッ
キ面以外の面１ｂに第３図に示すように第２材料Ｂによ
って第２彼ａ ３を形成する。この結果彼メッキ材１は
、彼メッキ而１ａは第１１Ｊ１膜２によってマスキング
され、彼メッキ面以外の面１ｂは第２１１ＪＥ膜３によ
って全体がマスキングされた状態になる。第２材料Ｂの
具体例としては、ポリカーボネートの１・２−ジクロ口
エタン溶液が用いられる。Next, the material to be plated 1 is immersed in a solution of a second material B in which the first film 2 is insoluble, has low wettability to the first film, and is insoluble in the plating solution, and is plated. As shown in FIG. 3, a second layer 3 is formed on the other surface 1b using the second material B. As a result, the plated material 1 is masked by the 11th JE film 2, and the surface 1b other than the plated surface is entirely masked by the 211th JE film 3. As a specific example of the second material B, a 1,2-dichloroethane solution of polycarbonate is used.
さらに第３の工程として、被メッキ材１を第１彼膜２が
可后性で第２彼膜３が非可溶性である液体Ｃの液中に浸
漬して第１披膜２を除去し、第４図示のように被メッキ
面１ａだけを露出させる。Furthermore, as a third step, the material to be plated 1 is immersed in a liquid C in which the first membrane 2 is flexible and the second membrane 3 is insoluble to remove the first membrane 2, As shown in the fourth figure, only the surface 1a to be plated is exposed.
最後に、メッキに必要な処理をしてからメッキ処理をし
て、被メッキ面１ａにだけメッキする。Finally, after performing the necessary plating treatments, plating is performed to plate only the surface 1a to be plated.
次に他の実施例について説明する。本実施例では彼メッ
キ面以外の面１ｂに形成される第２被膜が電着塗装によ
り行われる例である。電着メッキ液としては、例えばア
クリル系、ポリエステル系、エポキシ系等が使用される
。Next, other embodiments will be described. In this embodiment, the second coating formed on the surface 1b other than the plated surface is performed by electrodeposition coating. As the electrodeposition plating solution, for example, acrylic, polyester, epoxy, etc. are used.
披メッキ材１の彼メッキ面１ａには、この電着メッキ液
に対して非可溶性でかつ絶縁性の第１材料Ｄによって第
１被膜２を形成する。第１材料Ｄの具体例としては、セ
ラック、酢酸ビニル等が適用可能である。A first film 2 is formed on the plating surface 1a of the plating material 1 using a first material D which is insoluble in the electrodeposition plating solution and is insulating. Specific examples of the first material D include shellac, vinyl acetate, and the like.
次にこの被メッキ材１を電着メッキ液に浸漬して、彼メ
ッキ面１ａ以外の面１ｂに電着塗装をし、メッキ岐に対
して非可溶性の第２彼膜３を形戊する。被メッキ面１ａ
に形成してある第１彼膜２は絶縁性を有するものである
ため、この面に対しては電着塗装は行われず、被メッキ
面１ａは第１被膜２によって、披メッキ而以外の面１ｂ
は第２彼膜３によってマスキングされた状態になる。第
２彼膜３である電着塗装膜はその後加熱して乾燥させる
。Next, the material 1 to be plated is immersed in an electrodeposition plating solution to apply electrodeposition coating to the surface 1b other than the plated surface 1a, thereby forming a second layer 3 that is insoluble to the plating surface. Plating surface 1a
Since the first film 2 formed on the surface has an insulating property, electrodeposition coating is not performed on this surface, and the surface 1a to be plated is covered with the first film 2, so that the surface other than the surface to be plated is 1b
is masked by the second hemidiaphragm 3. The second electrodeposited film 3 is then heated and dried.
さらにこの彼メッキ材１を第１波膜２が可溶性で第２彼
膜３が非可溶性である有機溶液中に浸漬し、第１披膜２
を除去して被メッキ面１ａを露出させる。最後に上記の
例と同様にメッキ処理し、被メッキ面１ａの部分にのみ
メッキする。第１被膜２が可溶性で第２被膜３が非可溶
性である有機溶液としては、アルコール類（エタノール
、ブタノール等）が適用可能である。Further, the plating material 1 is immersed in an organic solution in which the first membrane 2 is soluble and the second membrane 3 is insoluble.
is removed to expose the plated surface 1a. Finally, plating is performed in the same manner as in the above example, and only the portion of the surface to be plated 1a is plated. Alcohols (ethanol, butanol, etc.) can be used as the organic solution in which the first coating 2 is soluble and the second coating 3 is insoluble.
なお、被メッキ材の形状は本実施例に限られない。Note that the shape of the material to be plated is not limited to this example.
［効果コ
以上説明したように本発明は、全工程を第１彼膜の形成
，第２彼膜の形成，第１彼膜の除去，その部分のメッキ
により行うものであるため、正確で迅速な部分メッキ処
理が可能となる。[Effects] As explained above, in the present invention, the entire process is performed by forming the first histogram, forming the second histogram, removing the first histogram, and plating that part, so it is accurate and quick. This enables partial plating processing.
さらに彼メッキ而以外の而を電着塗装による第２被膜で
マスキングすることにより、ピンホールなどのない均一
なマスキングが可能で、かつ彼メッキ面と被メッキ面以
外の面との境界が明確化し、良好なメッキ製品が得られ
るなど部分メッキ製品の品質向上およびコストの引下げ
に貢献するなどの顕著な効果がある。Furthermore, by masking the surfaces other than the plated surface with a second layer formed by electrodeposition coating, uniform masking without pinholes is possible, and the boundary between the surface plated and the surface other than the surface to be plated becomes clear. It has remarkable effects, such as contributing to improving the quality of partially plated products and reducing costs, such as obtaining good plated products.
第１図ないし第４図は本発明の工程を示す斜視図である
。
１・ ・被メッキ材、
１ａ・・・被メッキ面、
１ｂ・ ・被メッキ面以外の面、
２・・・第１被膜、
３・ ・第２披膜。
以上1 to 4 are perspective views showing the steps of the present invention. 1. - Material to be plated, 1a... Surface to be plated, 1b. - Surface other than the surface to be plated, 2... First coating, 3. - Second membrane. that's all
Claims (2)
１被膜を形成し、 上記第１被膜が非可溶性でありかつ上記第１被膜に対す
るぬれ性が低く、しかもメッキ液に対して非可溶性であ
る第２材料の溶液中に、上記被メッキ材を浸漬して上記
被メッキ面以外の面に上記第２材料からなる第２被膜を
形成し、 上記第１被膜が可溶性でありかつ上記第２被膜が非可溶
性である液体によって上記第１被膜を除去し、 上記第１被膜が除去された上記被メッキ面にメッキを施
す ことを特徴とする部分メッキ方法。(1) A first film made of a first material is formed on the surface to be plated of the material to be plated, and the first film is insoluble and has low wettability to the first film, and is resistant to the plating solution. The material to be plated is immersed in a solution of a second material that is insoluble to form a second coating made of the second material on a surface other than the surface to be plated, and the first coating is soluble and A partial plating method comprising: removing the first coating using a liquid in which the second coating is insoluble; and plating the surface from which the first coating has been removed.
て非可溶性でかつ絶縁性の第１材料からなる第１被膜を
形成し、 上記被メッキ材に電着塗装して上記被メッキ面以外の面
にメッキ液に対して非可溶性の第２被膜を形成し、 上記第１被膜が可溶性でありかつ上記第２被膜が非可溶
性である液体によって上記第１被膜を除去し、 上記第１被膜が除去された上記被メッキ面にメッキを施
す ことを特徴とする部分メッキ方法。(2) A first coating made of a first material that is insoluble in the electrodeposition plating solution and insulating is formed on the surface of the material to be plated, and the material is electrodeposited and coated. forming a second coating insoluble in the plating solution on a surface other than the plating surface; removing the first coating with a liquid in which the first coating is soluble and the second coating is insoluble; A partial plating method characterized by plating the surface to be plated from which the first coating has been removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18717489A JPH0353095A (en) | 1989-07-19 | 1989-07-19 | Partial plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18717489A JPH0353095A (en) | 1989-07-19 | 1989-07-19 | Partial plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353095A true JPH0353095A (en) | 1991-03-07 |
Family
ID=16201402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18717489A Pending JPH0353095A (en) | 1989-07-19 | 1989-07-19 | Partial plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353095A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041154A (en) * | 1983-08-16 | 1985-03-04 | Fujitsu Ltd | Channel interruption control system |
| JPS6213437A (en) * | 1985-07-09 | 1987-01-22 | ワツカ−−ケミ−・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | Production of linear organopolysiloxane having triorganosiloxane group as terminal group |
-
1989
- 1989-07-19 JP JP18717489A patent/JPH0353095A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041154A (en) * | 1983-08-16 | 1985-03-04 | Fujitsu Ltd | Channel interruption control system |
| JPS6213437A (en) * | 1985-07-09 | 1987-01-22 | ワツカ−−ケミ−・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | Production of linear organopolysiloxane having triorganosiloxane group as terminal group |
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