JPH0351223B2 - - Google Patents
Info
- Publication number
- JPH0351223B2 JPH0351223B2 JP21491283A JP21491283A JPH0351223B2 JP H0351223 B2 JPH0351223 B2 JP H0351223B2 JP 21491283 A JP21491283 A JP 21491283A JP 21491283 A JP21491283 A JP 21491283A JP H0351223 B2 JPH0351223 B2 JP H0351223B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- thermal head
- recording
- temperature sensing
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000012937 correction Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 description 15
- 230000020169 heat generation Effects 0.000 description 9
- 238000005259 measurement Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/35—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads providing current or voltage to the thermal head
- B41J2/355—Control circuits for heating-element selection
- B41J2/36—Print density control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/35—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads providing current or voltage to the thermal head
- B41J2/355—Control circuits for heating-element selection
- B41J2/36—Print density control
- B41J2/365—Print density control by compensation for variation in temperature
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
本発明は熱記録装置に係わり、特にサーマルヘ
ツドの蓄熱による記録濃度むらの補正手段に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal recording device, and more particularly to means for correcting recording density unevenness due to heat accumulation in a thermal head.
熱記録装置はサーマルヘツドを備え、該サーマ
ルヘツドは電気エネルギーをジユール熱に変換し
て、熱エネルギーによつて記録を行なう記録素子
である。サーマルヘツドによる記録において、直
接記録に係わるエネルギーは、サーマルヘツドに
よつて変換させられた熱エネルギーの量に対し小
さく、即ち、熱エネルギーの多くは、サーマルヘ
ツド基板に拡散してしまう。この余剰エネルギー
は、上記サーマルヘツド基板の温度を上昇させ、
従つて記録の覆歴による記録濃度の不均一さを生
ぜしめる。 A thermal recording device includes a thermal head, which is a recording element that converts electrical energy into Joule heat and performs recording using thermal energy. In recording with a thermal head, the energy involved in direct recording is small relative to the amount of thermal energy converted by the thermal head, ie, much of the thermal energy is diffused into the thermal head substrate. This surplus energy increases the temperature of the thermal head board,
Therefore, uneven recording density occurs due to the overlapping history of recording.
従来、上述のような濃度不均一を補正する方法
として以下に述べる方法があつた。 Conventionally, there has been a method described below as a method for correcting the density non-uniformity as described above.
第一は、サーマルヘツド基板にサーミスタ等の
感温素子を取り付け、該素子の温度による特性の
変化に応じて発熱要素に印加するエネルギーを印
加パルス幅又は電圧をもつて補正する方法であ
る。第二は、高速熱記録で第一の方法と併用され
る方法で、各発熱要素の発熱覆歴によつて、補正
パルスを印加、非印加する論理的補正の方法であ
る。 The first is a method in which a temperature sensing element such as a thermistor is attached to a thermal head substrate, and the energy applied to the heating element is corrected by the applied pulse width or voltage in accordance with changes in the characteristics of the element due to temperature. The second method is used in conjunction with the first method in high-speed thermal recording, and is a logical correction method in which a correction pulse is applied or not applied depending on the heat generation history of each heat generating element.
１ライン20ミリ秒以上という中低速の熱記録に
おいては、サーマルヘツド基板への蓄熱が極めて
ゆるやかであるので第一の方法で補正可能である
が、高速記録になるにつれ第二の方法をも必要と
なつてくる。第一の方法では、感温素子は発熱要
素の近傍に取り付けることが望ましいが、記録の
邪魔になるため発熱要素から離れたサーマルヘツ
ド基板端部や該基板を取り付けているヒートシン
クの裏面に取り付けられている。これら取付位置
では、発熱要素の発熱に対して、温度変化が数分
遅れるという欠点がある。即ち時定数が分オーダ
ーより速い変化をする濃度不均一性については第
一の方法では不充分なのである。 For medium-low speed thermal recording of 20 milliseconds or more per line, the heat buildup on the thermal head board is extremely gradual, so it can be corrected with the first method, but as the recording speed increases, the second method is also necessary. It's coming. In the first method, it is preferable to attach the temperature sensing element near the heat generating element, but since it will interfere with recording, it is not possible to attach the temperature sensing element to the edge of the thermal head board away from the heat generating element or to the back of the heat sink to which the board is attached. ing. These mounting positions have the disadvantage that temperature changes are delayed by several minutes relative to the heat generated by the heat generating elements. That is, the first method is insufficient for concentration non-uniformity where the time constant changes faster than on the order of minutes.
一方第二の方法は、記録データをもとに論理的
に補正する方法であるので、数ミリ秒〜十数ミリ
秒という高速の濃度補正が可能であるが、該方法
は論理回路を実用的大きさにとどめるならば、
高々数ライン前までの記録覆歴を参照できるにす
ぎず、従つて、補正のレベルも２値か３値程度が
限界である。 On the other hand, the second method is a method of logical correction based on recorded data, so high-speed density correction of several milliseconds to tens of milliseconds is possible, but this method does not allow practical use of logic circuits. If you keep it to size,
It is only possible to refer to the recording history up to several lines ago at most, and therefore the correction level is limited to about two or three values.
即ち、第一、第二の方法を用いても数十ミリ秒
〜数十秒程度の最も実際的な時定数を有する濃度
変化を補正しにくいという問題を有している。さ
らに、第一、第二の両方法を用いるには、装置が
複雑にならざるを得ないのである。 That is, even if the first and second methods are used, there is a problem in that it is difficult to correct concentration changes that have the most practical time constant of several tens of milliseconds to several tens of seconds. Furthermore, in order to use both the first and second methods, the apparatus must become complicated.
本発明は、これら従来の欠点を鑑みなされたも
ので、発熱要素の記録時における発熱ベース温度
を極めて応答良くシミユレーシヨンでき、多値レ
ベルの補正を可能とし、従つて、記録濃度の変化
の高速成分から低速成分まで広く補正することが
可能な手段を提供するものである。 The present invention has been developed in view of these conventional drawbacks, and is capable of simulating the heat generation base temperature of the heat generating element during recording with extremely high responsiveness, making it possible to correct multi-level levels, and, therefore, making it possible to correct high-speed components of recording density changes. The present invention provides a means that can perform a wide range of corrections from low speed components to low speed components.
サーマルヘツドの発熱要素を駆動させるには、
トランジスタ等のスイツチング素子が用いられ
る。現在、サーマルヘツドは上記スイツチング素
子とラインバツフアメモリを具備したICをサー
マルヘツド基板上に搭載したものが多い。 To drive the heating element of the thermal head,
A switching element such as a transistor is used. Currently, many thermal heads have an IC equipped with the above-mentioned switching element and line buffer memory mounted on a thermal head substrate.
本発明の特徴は、上記スイツチング素子近傍に
該素子と熱的に絶縁されていない状態で感温素子
が設けられていることであり、上記スイツチング
素子の内部電力消費による自己発熱による温度上
昇を上記感温素子をもつて感知して、これを濃度
補正の基準に役立たせようというものである。 A feature of the present invention is that a temperature sensing element is provided in the vicinity of the switching element in a state that is not thermally insulated from the element, and the temperature rise due to self-heating due to internal power consumption of the switching element is suppressed. The idea is to sense this using a temperature-sensitive element and use this as a standard for density correction.
本発明の一実施例として、サーマルヘツドの駆
動回路と上記感温素子が一体化されたICを搭載
したサーマルヘツドを用いた熱記録装置について
説明する。 As an embodiment of the present invention, a thermal recording device using a thermal head equipped with an IC in which a thermal head drive circuit and the temperature sensing element described above are integrated will be described.
第１図は、上記感温素子を具備した駆動用IC
であり、３は画信号を転送、メモリするシフトレ
ジスタ、２は該シフトレジスタの内容をラツチす
るラツチ回路、１はラツチされた情報をもとに発
熱要素を駆動するスイツチング素子群である。４
は該スイツチング素子近傍に設けられた感温素子
で、トランジスタの温度に敏感なベース・エミツ
タ間電圧を出力とする素子であり、温度変化のな
い定電流回路を具備している。該感温素子はIC
基板５を熱的通路として上記スイツチング素子と
接続一体化されている。スイツチング素子は発熱
要素を駆動するときに、該発熱要素で消費する電
力の５〜15％程度を自己消費し、該電力消費によ
り自己発熱をし上記スイツチング素子を温度のピ
ークとしてIC全体が温度上昇をする。該IC基板
の温度上昇はスイツチング素子の温度上昇に対し
十ミリ秒のオーダーの時間遅れの極めて速い応答
を示す。一方、スイツチング素子の自己発熱は、
発熱要素の発熱と全く同時に行なわれるものであ
るから、発熱要素の記録時における発熱ベース温
度の変化に対して、上記IC基板の温度変化は十
ミリ秒程度で追従しているのである。 Figure 1 shows a driving IC equipped with the above temperature sensing element.
3 is a shift register for transferring and storing image signals, 2 is a latch circuit for latching the contents of the shift register, and 1 is a group of switching elements for driving heating elements based on the latched information. 4
is a temperature sensing element provided near the switching element, which outputs a voltage between the base and emitter which is sensitive to the temperature of the transistor, and is equipped with a constant current circuit that does not change with temperature. The temperature sensing element is an IC
It is connected and integrated with the switching element using the substrate 5 as a thermal path. When a switching element drives a heating element, it self-consumes about 5 to 15% of the power consumed by the heating element, and this power consumption generates self-heating, causing the temperature of the switching element to peak and the temperature of the entire IC to rise. do. The temperature rise of the IC substrate shows an extremely fast response to the temperature rise of the switching element with a time delay on the order of 10 milliseconds. On the other hand, the self-heating of the switching element is
Since the heat generation occurs completely simultaneously with the heat generation of the heat generating element, the temperature change of the IC board follows the change in the heat generation base temperature of the heat generating element during recording in about 10 milliseconds.
上記発熱要素を連続的に長時間駆動しつづけれ
ば、IC基板の温度は上記自己発熱により上昇を
しつづけ、ICを載せたサーマルヘツド基板への
熱拡散量と、上記ICの自己発熱量とが平衡に達
するまで温度上昇を続ける。該平衡温度は、発熱
要素からの流出熱によるサーマルヘツド基板の蓄
熱温度によつても変わる。 If the above heating element is continuously driven for a long time, the temperature of the IC board will continue to rise due to the above self-heating, and the amount of heat diffused to the thermal head board on which the IC is mounted will be equal to the self-heating amount of the above IC. The temperature continues to rise until equilibrium is reached. The equilibrium temperature also changes depending on the heat storage temperature of the thermal head substrate due to the heat flowing out from the heat generating element.
第２図はサーマルヘツドの発熱要素の発熱ベー
ス温度、駆動用ICの温度及びサーマルヘツド基
板の温度を、記録開始から測定した結果を示して
いる。第３図は上記測定を長時間にわたつて行な
つた結果を示している。 FIG. 2 shows the results of measuring the heat generation base temperature of the heat generating element of the thermal head, the temperature of the driving IC, and the temperature of the thermal head substrate from the start of recording. FIG. 3 shows the results of the above measurements carried out over a long period of time.
前述の説明及び上記測定結果から明らかなよう
に、IC温度は発熱要素の発熱ベース温度の変化
に対し極めて忠実に追従し、該発熱ベース温度の
短時間での急速な変化から長時間にわたるゆるや
かな変化をシミユレートできるものであり、従つ
て、前記IC内に組み入れられた感温素子の出力
を参照した記録濃度補正は、温度変化の高速成分
から低速成分までを広く実施でき、その精度も極
めて高いものである。 As is clear from the above explanation and the above measurement results, the IC temperature extremely faithfully follows changes in the heat generation base temperature of the heat generation element, and changes from rapid changes in the heat generation base temperature over a short period of time to gradual changes over a long period of time. It is possible to simulate changes in temperature, and therefore, recording density correction that refers to the output of the temperature sensing element incorporated in the IC can be performed over a wide range of temperature changes, from high-speed components to low-speed components, and its accuracy is extremely high. It is something.
第４図は、上記感温素子の出力を参照し、該出
力値に応じて、発熱要素へ印加するパルス幅を多
値制御した記録の濃度を示したものであり、精度
の高いことが判る。 Figure 4 shows the density of the recording obtained by referring to the output of the temperature sensing element and controlling the pulse width applied to the heat generating element in multiple values according to the output value, and it can be seen that the accuracy is high. .
以上述べたように、本発明によれば、発熱要素
を駆動するスイツチング素子の内部電力消費によ
る該スイツチング素子の温度上昇を参照すること
により、単一の手段で急激な濃度変化から緩やか
な濃度変化を高精度で補正することが可能となり
従つて、構造の簡単な高品質の熱記録装置を提供
できる。 As described above, according to the present invention, by referring to the temperature rise of the switching element due to the internal power consumption of the switching element that drives the heat generating element, a rapid concentration change to a gradual concentration change can be achieved by a single means. can be corrected with high precision, and therefore a high-quality thermal recording device with a simple structure can be provided.
第１図は本発明によるサーマルヘツド駆動用
ICの一実施例、第２図、第３図は、サーマルヘ
ツドの各要部温度変化の測定結果、第４図は、本
発明による熱記録装置の記録濃度測定結果であ
る。
１……スイツチング素子群、２……ラツチ回
路、３……シフトレジスタ、４……感温素子、５
……IC基板。
Figure 1 shows a thermal head drive according to the present invention.
One example of IC, FIGS. 2 and 3 show the measurement results of temperature changes in each main part of the thermal head, and FIG. 4 shows the measurement results of the recording density of the thermal recording device according to the present invention. 1... Switching element group, 2... Latch circuit, 3... Shift register, 4... Temperature sensing element, 5
...IC board.
Claims (1)
基板上に設けられたスイツチング素子と、該スイ
ツチング素子近傍に設けられ、スイツチング素子
の自己発熱による温度上昇を感知する感温素子
と、該感温素子の特性変化に応じて前記発熱要素
に印加する電圧またはパルス幅を補正する補正手
段とから成る熱記録装置。 ２ 感温素子は、発熱要素を駆動するスイツチン
グ素子を含んだ素子に一体集積化されて、該素子
がサーマルヘツド基板上に搭載されていることを
特徴とする特許請求の範囲第１項記載の熱記録装
置。[Claims] 1. A switching element provided on a substrate to drive a heat generating element such as a thermal head, and a temperature sensing element provided near the switching element to sense a temperature rise due to self-heating of the switching element. and a correction means for correcting the voltage or pulse width applied to the heat generating element according to a change in the characteristics of the temperature sensing element. 2. The temperature sensing element according to claim 1, wherein the temperature sensing element is integrally integrated with an element including a switching element that drives a heat generating element, and the element is mounted on a thermal head substrate. Thermal recording device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21491283A JPS60107368A (en) | 1983-11-15 | 1983-11-15 | Thermal recorder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21491283A JPS60107368A (en) | 1983-11-15 | 1983-11-15 | Thermal recorder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60107368A JPS60107368A (en) | 1985-06-12 |
| JPH0351223B2 true JPH0351223B2 (en) | 1991-08-06 |
Family
ID=16663627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21491283A Granted JPS60107368A (en) | 1983-11-15 | 1983-11-15 | Thermal recorder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60107368A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS629533U (en) * | 1985-07-01 | 1987-01-21 | ||
| KR930011862B1 (en) * | 1989-09-18 | 1993-12-21 | 캐논 가부시끼가이샤 | Ink-jet recording apparatus and temperature control method therefor |
| JP2974487B2 (en) * | 1991-03-20 | 1999-11-10 | キヤノン株式会社 | Recording device |
| CA2074906C (en) * | 1991-08-01 | 2000-09-12 | Hiromitsu Hirabayashi | Ink jet recording apparatus having temperature control function |
| KR100476950B1 (en) * | 2002-12-06 | 2005-03-17 | 삼성전자주식회사 | Head driving device of ink jet printer and control method thereof |
-
1983
- 1983-11-15 JP JP21491283A patent/JPS60107368A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60107368A (en) | 1985-06-12 |
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