JPH0348742U - - Google Patents
Info
- Publication number
- JPH0348742U JPH0348742U JP1989110033U JP11003389U JPH0348742U JP H0348742 U JPH0348742 U JP H0348742U JP 1989110033 U JP1989110033 U JP 1989110033U JP 11003389 U JP11003389 U JP 11003389U JP H0348742 U JPH0348742 U JP H0348742U
- Authority
- JP
- Japan
- Prior art keywords
- base
- pressure
- sensor
- groove
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
Landscapes
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989110033U JPH0348742U (da) | 1989-09-20 | 1989-09-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989110033U JPH0348742U (da) | 1989-09-20 | 1989-09-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0348742U true JPH0348742U (da) | 1991-05-10 |
Family
ID=31658590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989110033U Pending JPH0348742U (da) | 1989-09-20 | 1989-09-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0348742U (da) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012073233A (ja) * | 2010-08-31 | 2012-04-12 | Mitsumi Electric Co Ltd | センサ装置及び半導体センサ素子の実装方法 |
KR200471279Y1 (ko) * | 2012-06-29 | 2014-02-12 | 허창인 | 쉬트의 길이 측정 및 재단이 가능한 권취기 |
-
1989
- 1989-09-20 JP JP1989110033U patent/JPH0348742U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012073233A (ja) * | 2010-08-31 | 2012-04-12 | Mitsumi Electric Co Ltd | センサ装置及び半導体センサ素子の実装方法 |
KR200471279Y1 (ko) * | 2012-06-29 | 2014-02-12 | 허창인 | 쉬트의 길이 측정 및 재단이 가능한 권취기 |