JPH0345697U - - Google Patents
Info
- Publication number
- JPH0345697U JPH0345697U JP10751689U JP10751689U JPH0345697U JP H0345697 U JPH0345697 U JP H0345697U JP 10751689 U JP10751689 U JP 10751689U JP 10751689 U JP10751689 U JP 10751689U JP H0345697 U JPH0345697 U JP H0345697U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- heat sink
- lead wires
- spacer
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図イは発光素子を示す斜視図、第１図ロは
この考案による電子部品取付用スペーサを示す斜
視図、第２図は実装状態を示す要部縦断面図、第
３図は第２図の側面図、第４図はこの考案におけ
る電子部品取付用スペーサの内部構造を示す図、
第５図イ，ロは、従来の電子部品取付方法による
半田付けの例を示す斜視図である。
図中、１，２……リード線、３……発光レンズ
、４……発光素子、５……放熱板、６……受金部
、７……半田付部、８……プリント配線基板、９
……プリント配線基板のスルーホール部、１０…
…リード線固定治具、１１……電子部品取付用ス
ペーサである。尚、図中同一符号は同一または相
当部分を示す。
FIG. 1A is a perspective view showing a light emitting element, FIG. 1B is a perspective view showing a spacer for mounting electronic components according to this invention, FIG. Figure 4 is a side view showing the internal structure of the spacer for mounting electronic components in this invention;
FIGS. 5A and 5B are perspective views showing an example of soldering by a conventional electronic component mounting method. In the figure, 1, 2...lead wire, 3...light emitting lens, 4...light emitting element, 5...heat sink, 6...metal receiver, 7...soldering part, 8...printed wiring board, 9
...Through hole part of printed wiring board, 10...
. . . Lead wire fixing jig, 11 . . . Spacer for mounting electronic components. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
うに上記２本のリード線と部品本体が挟まれるに
等しい間隔を有し、放熱性のよい絶縁材料で形成
された２つの板状片の放熱板と、この放熱板の底
部に設けられ、上記電子部品のリード線を嵌合す
る熱伝導性の良い金属材料で形成された受金部と
を具備したことを特徴とする電子部品取付用スペ
ーサ。 Two plate-like pieces made of an insulating material with good heat dissipation and having an interval equal to the distance between the two lead wires and the component body so that the two lead wires of the electronic component are mounted in parallel. For mounting an electronic component, comprising a heat sink and a receiving part made of a metal material with good thermal conductivity, which is provided at the bottom of the heat sink and into which the lead wire of the electronic component is fitted. Spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10751689U JPH0345697U (en) | 1989-09-13 | 1989-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10751689U JPH0345697U (en) | 1989-09-13 | 1989-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345697U true JPH0345697U (en) | 1991-04-26 |
Family
ID=31656207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10751689U Pending JPH0345697U (en) | 1989-09-13 | 1989-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345697U (en) |
-
1989
- 1989-09-13 JP JP10751689U patent/JPH0345697U/ja active Pending