JPH0345141U - - Google Patents
Info
- Publication number
- JPH0345141U JPH0345141U JP10497089U JP10497089U JPH0345141U JP H0345141 U JPH0345141 U JP H0345141U JP 10497089 U JP10497089 U JP 10497089U JP 10497089 U JP10497089 U JP 10497089U JP H0345141 U JPH0345141 U JP H0345141U
- Authority
- JP
- Japan
- Prior art keywords
- parts
- board
- led array
- array board
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
Description
第1図は本考案に係るLEDアレイ基板の一実
施例を示す斜視図、第2図は第1図の−線に
沿う断面図、第3図はクロストーク発生の要因を
示す説明図、第4図は従来例を示す斜視図である
。 1……LEDアレイ基板、2……基板、3……
パツト、4……LEDチツプ、5……ダミーパタ
ーン、10……遮光板、t……板厚、d……間隙
。
施例を示す斜視図、第2図は第1図の−線に
沿う断面図、第3図はクロストーク発生の要因を
示す説明図、第4図は従来例を示す斜視図である
。 1……LEDアレイ基板、2……基板、3……
パツト、4……LEDチツプ、5……ダミーパタ
ーン、10……遮光板、t……板厚、d……間隙
。
Claims (1)
- プリント回路板上に複数のパツトが近接して設
けられ該パツトにLEDチツプがマウントされて
成るLEDアレイ基板において、前記基板の隣接
する前記パツト相互の中間の位置にはダミーパタ
ーンが設けられていることを特徴とするLEDア
レイ基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989104970U JP2529935Y2 (ja) | 1989-09-07 | 1989-09-07 | Ledアレイ基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989104970U JP2529935Y2 (ja) | 1989-09-07 | 1989-09-07 | Ledアレイ基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0345141U true JPH0345141U (ja) | 1991-04-25 |
JP2529935Y2 JP2529935Y2 (ja) | 1997-03-26 |
Family
ID=31653746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989104970U Expired - Lifetime JP2529935Y2 (ja) | 1989-09-07 | 1989-09-07 | Ledアレイ基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2529935Y2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015070158A (ja) * | 2013-09-30 | 2015-04-13 | ウシオ電機株式会社 | Led発光装置 |
JP2022524512A (ja) * | 2019-03-08 | 2022-05-06 | シラグ・ゲーエムベーハー・インターナショナル | 電動外科用ステープラのステープル高さのインジケータ |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01152080A (ja) * | 1987-12-09 | 1989-06-14 | Stanley Electric Co Ltd | Ledアレイ |
-
1989
- 1989-09-07 JP JP1989104970U patent/JP2529935Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01152080A (ja) * | 1987-12-09 | 1989-06-14 | Stanley Electric Co Ltd | Ledアレイ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015070158A (ja) * | 2013-09-30 | 2015-04-13 | ウシオ電機株式会社 | Led発光装置 |
JP2022524512A (ja) * | 2019-03-08 | 2022-05-06 | シラグ・ゲーエムベーハー・インターナショナル | 電動外科用ステープラのステープル高さのインジケータ |
Also Published As
Publication number | Publication date |
---|---|
JP2529935Y2 (ja) | 1997-03-26 |