JPH0345141U - - Google Patents

Info

Publication number
JPH0345141U
JPH0345141U JP10497089U JP10497089U JPH0345141U JP H0345141 U JPH0345141 U JP H0345141U JP 10497089 U JP10497089 U JP 10497089U JP 10497089 U JP10497089 U JP 10497089U JP H0345141 U JPH0345141 U JP H0345141U
Authority
JP
Japan
Prior art keywords
parts
board
led array
array board
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10497089U
Other languages
English (en)
Other versions
JP2529935Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989104970U priority Critical patent/JP2529935Y2/ja
Publication of JPH0345141U publication Critical patent/JPH0345141U/ja
Application granted granted Critical
Publication of JP2529935Y2 publication Critical patent/JP2529935Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るＬＥＤアレイ基板の一実
施例を示す斜視図、第２図は第１図の−線に
沿う断面図、第３図はクロストーク発生の要因を
示す説明図、第４図は従来例を示す斜視図である
。 １……ＬＥＤアレイ基板、２……基板、３……
パツト、４……ＬＥＤチツプ、５……ダミーパタ
ーン、１０……遮光板、ｔ……板厚、ｄ……間隙
。

Claims (1)

    【実用新案登録請求の範囲】
  1. プリント回路板上に複数のパツトが近接して設
    けられ該パツトにＬＥＤチツプがマウントされて
    成るＬＥＤアレイ基板において、前記基板の隣接
    する前記パツト相互の中間の位置にはダミーパタ
    ーンが設けられていることを特徴とするＬＥＤア
    レイ基板。
JP1989104970U 1989-09-07 1989-09-07 Ｌｅｄアレイ基板 Expired - Lifetime JP2529935Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989104970U JP2529935Y2 (ja) 1989-09-07 1989-09-07 Ｌｅｄアレイ基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989104970U JP2529935Y2 (ja) 1989-09-07 1989-09-07 Ｌｅｄアレイ基板

Publications (2)

Publication Number Publication Date
JPH0345141U true JPH0345141U (ja) 1991-04-25
JP2529935Y2 JP2529935Y2 (ja) 1997-03-26

Family

ID=31653746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989104970U Expired - Lifetime JP2529935Y2 (ja) 1989-09-07 1989-09-07 Ｌｅｄアレイ基板

Country Status (1)

Country Link
JP (1) JP2529935Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015070158A (ja) * 2013-09-30 2015-04-13 ウシオ電機株式会社 Ｌｅｄ発光装置
JP2022524512A (ja) * 2019-03-08 2022-05-06 シラグ・ゲーエムベーハー・インターナショナル 電動外科用ステープラのステープル高さのインジケータ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01152080A (ja) * 1987-12-09 1989-06-14 Stanley Electric Co Ltd Ｌｅｄアレイ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01152080A (ja) * 1987-12-09 1989-06-14 Stanley Electric Co Ltd Ｌｅｄアレイ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015070158A (ja) * 2013-09-30 2015-04-13 ウシオ電機株式会社 Ｌｅｄ発光装置
JP2022524512A (ja) * 2019-03-08 2022-05-06 シラグ・ゲーエムベーハー・インターナショナル 電動外科用ステープラのステープル高さのインジケータ

Also Published As

Publication number Publication date
JP2529935Y2 (ja) 1997-03-26

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