JPH0344042A - Resin seal die for semiconductor device - Google Patents

Resin seal die for semiconductor device

Info

Publication number
JPH0344042A
JPH0344042A JP17925089A JP17925089A JPH0344042A JP H0344042 A JPH0344042 A JP H0344042A JP 17925089 A JP17925089 A JP 17925089A JP 17925089 A JP17925089 A JP 17925089A JP H0344042 A JPH0344042 A JP H0344042A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
mold
outer shell
cooling air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17925089A
Other languages
Japanese (ja)
Inventor
Yuji Matsubara
松原　祐司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP17925089A priority Critical patent/JPH0344042A/en
Publication of JPH0344042A publication Critical patent/JPH0344042A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1703—Introducing an auxiliary fluid into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C2045/7387—Heating or cooling of the mould jetting a cooling fluid onto the moulded article while still in the mould

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the generation of internal strain of an outer shell, and easily take out a semiconductor device from a resin seal die, by blowing the cooling air agaist the resin outer shell so as to rapidly cool it, after the semiconductor device is resin-sealed. CONSTITUTION:A resin seal die for a semiconductor device is provided with a nozzle 4 jetting the cooling air 5 to cool an outer shell 1 which is made to protrude by ejectors 3 when the mold is opened. The nozzle 4 is fixed to a lower die 2a or a punch 2b, and jets the cooling air at each time the die is opened. Freon or dried nitrogen can be used instead of the cooling air. Thereby the resin obtains strength to some extent, and the resin itself becomes hard to bend, so that the semiconductor device can be easily taken out from the die. The internal strain of the resin also is eliminated.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置の外郭体を形成する半導体装置用
樹脂封止金型に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a resin-sealing mold for a semiconductor device that forms an outer shell of the semiconductor device.

〔従来の技術〕[Conventional technology]

第２図（ａ）、（ｂ）及び（ｃ）は従来の半導体装置用
樹脂封止金型の一例を説明するための工程順に示した断
面図である。従来、この種の半導体樹脂封止金型で、半
導体装置の外郭体を成形する場合は、まず、第２図（ａ
）に示すように、リードフレーム８に搭載された半導体
チップ６を金属細線７で配線した後、この構成体を上型
２ｂと下型２ｂとの窪みからなるキャビティ４に挿入す
る。FIGS. 2(a), 2(b), and 2(c) are cross-sectional views showing an example of a conventional resin-sealed mold for a semiconductor device in order of steps. Conventionally, when molding the outer body of a semiconductor device using this type of semiconductor resin mold, first, the mold shown in FIG.
), after the semiconductor chip 6 mounted on the lead frame 8 is wired with thin metal wires 7, this structure is inserted into the cavity 4 formed by the recess of the upper mold 2b and the lower mold 2b.

次に、第２図（ｂ）に示すように、ランナを介してキャ
ビティ４内に溶融樹脂を注入する。その後、溶融樹脂が
硬化し、外郭体１を形成する。次に、第２図（ｃ）に示
すように、型開きして、エジェクタ３により外郭体１を
下型２ｂより付き出し、金型より取り外す。この後の工
程は、リード曲げ工程あるいは仕上げ工程を経て半導体
装置は製作されていた。Next, as shown in FIG. 2(b), molten resin is injected into the cavity 4 via the runner. Thereafter, the molten resin is hardened to form the outer shell 1. Next, as shown in FIG. 2(c), the mold is opened, and the outer shell 1 is ejected from the lower mold 2b by the ejector 3 and removed from the mold. In subsequent steps, the semiconductor device is manufactured through a lead bending step or a finishing step.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかさながら、上述した従来の半導体装置用樹脂封止金
型では、例えば、ＣＣＤのような撮像素子の場合は、樹
脂内に充填材が入っていないため、硬化後の機械的強度
が弱く、金型より取り出すときに、外郭体が変形し、型
より収り出せないという欠点がある。また、硬化しない
内に取り出すと、樹脂体に内部歪が生し、この樹脂体を
透過する光が内部歪に曲げられ、撮像素子としての機能
が果せないとうい欠点がある。However, with the above-mentioned conventional resin-sealing mold for semiconductor devices, for example, in the case of an image sensor such as a CCD, the resin does not contain a filler, so the mechanical strength after curing is weak, and the mold is difficult to mold. The disadvantage is that the outer shell deforms when removed from the mold and cannot be removed from the mold. Furthermore, if the resin body is taken out before it has hardened, internal distortion will occur in the resin body, and the light passing through this resin body will be bent by the internal distortion, resulting in a disadvantage that it will not be able to function as an image sensor.

本発明の目的は、かかる欠点を解消する半導体装置用樹
脂封止金型を提供することにある。An object of the present invention is to provide a resin-sealing mold for semiconductor devices that eliminates such drawbacks.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の半導体装置用樹脂金型は、半導体装置の外郭体
を形成するキャビティか形成された上型及び下型と、こ
の下型に設けられているとともに前記外郭体を突き上け
るエジェクタと、前記金型が型開きしたときに前記外郭
体に冷気を吹き付ける冷却機構とを有している。The resin mold for a semiconductor device of the present invention includes an upper mold and a lower mold in which a cavity is formed to form an outer shell of a semiconductor device, an ejector provided on the lower mold and for pushing up the outer shell. The mold has a cooling mechanism that blows cold air onto the outer shell when the mold is opened.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例を示す半導体装置用樹脂封止
金型の断面図である。この半導体装置用樹脂封止金型は
、同図に示すように、型開きしたときに、エジェクタに
突き出された外郭体１を冷却する冷却空気５を含き出す
ノズル４を設けたことである。FIG. 1 is a sectional view of a resin-sealing mold for a semiconductor device showing one embodiment of the present invention. As shown in the figure, this resin-sealed mold for a semiconductor device is provided with a nozzle 4 that pumps out cooling air 5 to cool the outer shell 1 projected by the ejector when the mold is opened. .

また、このノズル４は下型２ａあるいは上型２ｂに取付
げられており、型開きする毎に冷却空気を含き出すよう
になっている。さらに、この冷却空気の代りにフレオン
あるいは乾燥窒素を使用してもよい。このようにするこ
とによって、樹脂はある程度の強度を得、樹脂自体が曲
ることがなくなるので、金型から容易に取り出すことが
出来る。Further, this nozzle 4 is attached to the lower mold 2a or the upper mold 2b, and is designed to blow out cooling air every time the mold is opened. Furthermore, Freon or dry nitrogen may be used instead of this cooling air. By doing this, the resin gains a certain degree of strength and the resin itself does not bend, so it can be easily taken out from the mold.

また、樹脂の内部歪もなくなる。Also, internal distortion of the resin is eliminated.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、半導体装置を樹脂封止後
、その樹脂外郭体を急冷するように冷却空気を吹き出す
ノズルを設けることによって、外郭体に内部歪みのない
とともに収り出し易い半導体装置用樹脂封止金型が得ら
れるという効果がある。As explained above, the present invention provides a nozzle that blows out cooling air to rapidly cool the resin outer shell after the semiconductor device is sealed with resin, so that the semiconductor device can be easily stored without internal distortion in the outer shell. This has the effect that a resin-sealed mold for use can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示す半導体装置用樹脂封止
金型の断面図、第２図（ａ＞、（ｂ）及び（ｃ）は従来
の半導体装置用樹脂封止金型の一例を説明するための工
程順に示した断面図である。 １・・・外郭体、２ａ・・・下型、２ｂ・・・上型、３
・・・エジェクタ、４・ノズル、５・冷却空気、６・・
半導体チップ、７・・・金属細線、８・　リードフレー
ム。FIG. 1 is a sectional view of a resin-sealing mold for semiconductor devices showing an embodiment of the present invention, and FIGS. 2(a), (b), and (c) are cross-sectional views of a conventional resin-sealing mold for semiconductor devices It is a sectional view shown in process order for explaining an example. 1... Outer body, 2a... Lower mold, 2b... Upper mold, 3
...Ejector, 4. Nozzle, 5. Cooling air, 6..
Semiconductor chip, 7... Metal thin wire, 8. Lead frame.

Claims (1)

【特許請求の範囲】[Claims] 半導体装置の外郭体を形成するキャビティが形成された
上型及び下型と、この下型に設けられているとともに前
記外郭体を突き上げるエジェクタと、前記金型が型開き
したときに前記外郭体に冷気を吹き付ける冷却機構とを
有することを特徴とする半導体装置用樹脂封止金型。An upper mold and a lower mold in which cavities forming an outer shell of a semiconductor device are formed; an ejector provided on the lower mold and pushing up the outer shell; and an ejector that pushes up the outer shell when the mold is opened. A resin sealing mold for a semiconductor device, characterized by having a cooling mechanism that blows cold air.
JP17925089A 1989-07-11 1989-07-11 Resin seal die for semiconductor device Pending JPH0344042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17925089A JPH0344042A (en) 1989-07-11 1989-07-11 Resin seal die for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17925089A JPH0344042A (en) 1989-07-11 1989-07-11 Resin seal die for semiconductor device

Publications (1)

Publication Number Publication Date
JPH0344042A true JPH0344042A (en) 1991-02-25

Family

ID=16062562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17925089A Pending JPH0344042A (en) 1989-07-11 1989-07-11 Resin seal die for semiconductor device

Country Status (1)

Country Link
JP (1) JPH0344042A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6587045B2 (en) 2000-10-13 2003-07-01 Yazaki Corporation Winker lever canceling apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6587045B2 (en) 2000-10-13 2003-07-01 Yazaki Corporation Winker lever canceling apparatus

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