JPH0343143A - Both head flat grinding device - Google Patents
Both head flat grinding deviceInfo
- Publication number
- JPH0343143A JPH0343143A JP17583589A JP17583589A JPH0343143A JP H0343143 A JPH0343143 A JP H0343143A JP 17583589 A JP17583589 A JP 17583589A JP 17583589 A JP17583589 A JP 17583589A JP H0343143 A JPH0343143 A JP H0343143A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- grinding
- distance
- grinding stones
- work piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004575 stone Substances 0.000 abstract 7
- 238000003754 machining Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は被加工物の搬送ベルトを両射のスピンドルの砥
石が挟持するよう上下方向に配設し、前記被加工物の上
下両平面を同時に研削するスルーフィードタイプの両頭
平面研削装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides a method for simultaneously grinding both the upper and lower planes of the workpiece by arranging the conveyor belt of the workpiece in the vertical direction so that it is held between grinding wheels of double-shot spindles. This invention relates to a through-feed type double-head surface grinding device.
従来の技術
近年、両頭平面研削装置は、金属材料をはしめガラス、
セラミック、水晶などの硬脆材料など様々な素材を精密
かつ高速に研削する手段として利用されているが、時計
部品、電子部品、精密機器などに使用される薄い小片の
被加工物を両平面同時研削する場合は、一つの手段とし
て、被加工物より薄いベルトに保持孔を設け、被加工物
の側面を保持させた状態で、両射の砥石間に挟持させな
がら搬送することにより、加工が可能とされてきた。Conventional technology In recent years, double-headed surface grinding equipment has been used to grind metal materials, glass,
It is used as a means of precision and high speed grinding of various materials such as hard and brittle materials such as ceramics and crystal, but it is also used to grind thin small pieces of workpieces used for watch parts, electronic parts, precision equipment, etc. on both surfaces simultaneously. When grinding, one method is to provide holding holes in a belt that is thinner than the workpiece, and convey the workpiece while holding it between two grinding wheels while holding the side of the workpiece. It has been considered possible.
例えば、特公昭６０−２４９５６３号公報では、第４図
のように、エンドレスの搬送ベルト３３を左右のプーリ
ー３４．３５、で張設し、この搬送ベルト３３の保持孔
に被加工物３２を遊嵌し、ガイドレール３６に摺接させ
ながら上下砥石２２゜３１間に供給し加工実現できる示
唆を与えている。For example, in Japanese Patent Publication No. 60-249563, as shown in FIG. It is suggested that machining can be achieved by fitting the grinding wheel into the guide rail 36 and feeding it between the upper and lower grindstones 22 and 31 while sliding it in contact with the guide rail 36.
また両軸の砥石が平行平面では被加工物の供給が困難で
あるため特公昭６１−２３６４６７号公報では、厚板小
片の被加工物の研削最終寸法を得るため両軸を旋回させ
て、砥石面に勾配をつけ被加工物が砥石から出る時の砥
石間距離によって加エサ法設定を容易に行なう例もある
。例えば第５図のように、最終加工寸法Ｂ２はキャリア
プレート３３ａによって厚板小片の被加工物３２ａが砥
石から出る位置のクリアランスであるため、仕上がり寸
法が８２で設定される。In addition, since it is difficult to feed the workpiece when the grindstones on both axes are parallel planes, in Japanese Patent Publication No. 61-236467, in order to obtain the final dimensions of the workpiece, which is a small piece of thick plate, the grindstones are rotated to obtain the final dimensions of the workpiece. In some cases, the machining method can be easily set by sloping the surface and changing the distance between the grinding wheels when the workpiece leaves the grinding wheel. For example, as shown in FIG. 5, the final machining dimension B2 is the clearance at the position where the workpiece 32a, which is a small piece of thick plate, comes out of the grindstone by the carrier plate 33a, so the finished dimension is set as 82.
発明が解決しようとする課題
しかしながら、上記のような構成だけでは、薄形小片の
加工の場合は砥石間のクリアランスが狭く、砥石外部か
らの噴射による研削液の供給では加工位置にとどかない
。従って、一方もしくは両方のスピンドルの回転中心よ
り研削液を吐出させる方法が必要で砥石もカップ形を使
用する必要性がある。中空スピンドルを用いたカップ形
砥石の場合は、スピンドルの回転中心には被加工物の位
置を規正するものがなく被加工物を搬送できないため、
スピンドルの回転中心より一定の距離を隔てた位置Ａに
被加工物を供給せざるを得ない。Problems to be Solved by the Invention However, with only the above configuration, when processing thin small pieces, the clearance between the grinding wheels is narrow, and supply of grinding fluid by injection from the outside of the grinding wheel does not reach the processing position. Therefore, there is a need for a method of discharging the grinding fluid from the center of rotation of one or both spindles, and it is also necessary to use a cup-shaped grindstone. In the case of a cup-shaped grindstone that uses a hollow spindle, there is nothing at the rotation center of the spindle to regulate the position of the workpiece, so the workpiece cannot be conveyed.
The workpiece must be supplied to a position A that is a certain distance away from the center of rotation of the spindle.
つまり、従来のような厚板小片の例では砥石中心で被加
工物を搬送できるため搬送方向の勾配を容易に調整でき
たが薄板小片を加工する場合、第２図に示すように最終
加工寸法は８１〜Ｂ２の２次曲線を持つ形状となり、加
工された平面度、平行度はＢ１と８２の差であり、著し
く低下するという問題点を有していた。In other words, in the conventional example of a small piece of thick plate, the workpiece could be conveyed with the center of the grinding wheel, so the gradient in the conveying direction could be easily adjusted. However, when processing a small piece of thin plate, the final machining dimensions are different, as shown in Figure 2. has a shape having a quadratic curve of 81 to B2, and the processed flatness and parallelism are the difference between B1 and 82, and have a problem that they are significantly reduced.
本発明は上記問題点に鑑み、薄板小片の最終加工寸法の
設定を容易にするとともに、加工面の平面度、平行度の
精度向上を可能にする両頭平面研削装置の提供を目的と
する。In view of the above-mentioned problems, the present invention aims to provide a double-head surface grinding device that facilitates setting of the final machining dimensions of a small thin plate piece and improves the accuracy of the flatness and parallelism of the machined surface.
課題を解決するための手段
本発明は上記目的を達成するため、一方のスピンドルは
回転軸方向に移動が可能な移動手段と、被加工物の搬送
方向で砥石間距離が任意の勾配を持つように設定できる
調整手段と、前記被加工物の搬送方向に対して垂直方向
にスピンドルの回転軸を設定できる調整手段と、もう一
方のスピンドルは回転軸方向に移動が可能な移動手段と
を備えたことを特徴とする。Means for Solving the Problems In order to achieve the above object, the present invention includes a moving means that allows one spindle to move in the direction of the rotation axis, and a distance between the grinding wheels that has an arbitrary gradient in the conveying direction of the workpiece. an adjustment means that can set the rotational axis of the spindle in a direction perpendicular to the conveying direction of the workpiece, and a movement means that can move the other spindle in the rotational axis direction. It is characterized by
作 用
本発明は上記した構成によって、第３図に示したように
回転中心Ｏよりある一定の距１ＩＩＡを隔てた位置にお
いて被加工物を搬送しながら加工する場合でも、前記搬
送位置の中心で砥石間距離を最小Ｂ２ｂに設定すること
が可能となるため、被加工物３２の中心で最小加工寸法
Ｂ２ｂを設定でき、砥石の最大曲率すなわち、最も平坦
な部分で加工することになり、加工面の平面度、平行度
の精度向上の実現に適応できることになる。Effects The present invention has the above-described configuration, so that even when the workpiece is processed while being transported at a position separated by a certain distance 1IIA from the center of rotation O as shown in FIG. Since it is possible to set the distance between the grinding wheels to the minimum B2b, the minimum machining dimension B2b can be set at the center of the workpiece 32, and the machining is performed at the maximum curvature of the grinding wheel, that is, the flattest part, and the machining surface This means that it can be applied to improve the accuracy of flatness and parallelism.
実施例
以下本発明の一実施例の両頭平面研削装置について図面
を参照しながら説明する。EXAMPLE Hereinafter, a double-head surface grinding apparatus according to an example of the present invention will be described with reference to the drawings.
第１図は本実施例における両頭平面研削装置の構成を示
したものである。FIG. 1 shows the configuration of a double-head surface grinding device in this embodiment.
第１図において、ベース１に立設固定された支柱ベース
のＢ軸３を中心に、軸受４を介してビン５で規正されな
がらサブプレート６が回動可能となり、前記Ｂ角度を設
定する。このサブプレート６にα軸７がナツト８で固定
され、軸受９とカバー１０、カラー１１、ナツト１２を
介して、サブベース１３がα軸７のまわりに回動可能と
して、α角度を設定する。ここで図には示さない固定手
段で前記支柱ベース２とサブプレート６及びサブベース
１３を調整後固定可能とする。サブベース１３にはガイ
ド固定部１４とガイド摺動部１５が付設され、調整手段
１６によって上軸砥石２２の送り量を設定できる。この
ガイド摺動部１５には中空軸タイプのスピンドル１７を
設け、プーリー１８、ベルト１９、モータ側プーリー２
０を介してモータ２１の動力を伝達し、上軸砥石２２を
回転させることができる。In FIG. 1, a sub-plate 6 is rotatable through a bearing 4 and regulated by a pin 5 around a B-axis 3 of a column base erected and fixed on a base 1, thereby setting the above-mentioned B angle. An α-axis 7 is fixed to this sub-plate 6 with a nut 8, and a sub-base 13 is rotatable around the α-axis 7 via a bearing 9, a cover 10, a collar 11, and a nut 12 to set an α angle. . Here, the column base 2, the sub-plate 6, and the sub-base 13 can be fixed after adjustment by a fixing means not shown in the drawings. A guide fixing part 14 and a guide sliding part 15 are attached to the sub-base 13, and the feed amount of the upper shaft grindstone 22 can be set by an adjusting means 16. This guide sliding part 15 is provided with a hollow shaft type spindle 17, which includes a pulley 18, a belt 19, and a motor side pulley 2.
0, the power of the motor 21 can be transmitted to rotate the upper shaft grindstone 22.
一方、ベース１の下部に固定された下軸用のガイド固定
部２３には、ガイド摺動部２４、送り量の調整手段２５
を付設し、下軸用スピンドル２６を設け、プーリー２７
、ベルト２８、モータ側プーリー２９を介してモータ３
０の動力伝達を行ない、下軸砥石３１を回転させるとと
もに送り量の設定が行なわれる。被加工物３２は両軸の
中心よりある一定の距離だけ隔てた位置でキャリア３３
と図には示さないがキャリア３３を駆動する手段と被加
工物３２を供給する供給手段により供給、搬送される。On the other hand, the guide fixing part 23 for the lower shaft fixed to the lower part of the base 1 includes a guide sliding part 24 and a feed amount adjusting means 25.
, a spindle 26 for the lower shaft, and a pulley 27
, the motor 3 via the belt 28 and the motor side pulley 29.
0 power is transmitted, the lower shaft grindstone 31 is rotated, and the feed amount is set. The workpiece 32 is placed on a carrier 33 at a certain distance apart from the center of both axes.
Although not shown in the figure, the workpiece 32 is supplied and transported by a means for driving the carrier 33 and a supply means for supplying the workpiece 32.
以上のように構成された両頭平面研削装置について以下
、動作を説明する。第１図において、第４図に示したよ
うな被加工物の供給装置により第１図の紙面に対して、
垂直方向に被加工物３２を砥石２２．３１間に供給する
場合、図中のα軸７により砥石出口間隔を最終加工寸法
とし、砥石入口間隔をより大きくして設定すれば被加工
物３２はスムーズに搬送できる。更に、第３図でも説明
したようにβ軸３を中心に回動させ、さらに上軸、下軸
の各送り量の調整手段１６．２５の調整で搬送方向の中
心で最終加工寸法となるように設定することができる。The operation of the double-head surface grinding apparatus configured as described above will be described below. In FIG. 1, the feeder for the workpiece as shown in FIG.
When feeding the workpiece 32 vertically between the grinding wheels 22 and 31, the final machining dimension is set to the grindstone outlet interval using the α axis 7 in the figure, and the workpiece 32 is set to be larger than the grindstone inlet interval. Can be transported smoothly. Furthermore, as explained in Fig. 3, it is rotated around the β-axis 3, and the final machining dimensions are set at the center in the conveying direction by adjusting the feed rate adjustment means 16 and 25 of the upper and lower axes. Can be set to .
以上のように本実施例によれば、一方のスピンドル１７
は回転軸方向に移動が可能な移動手段と、被加工物３２
の搬送方向で砥石２２．３１間距離が任意の勾配を持つ
ようにして被加工物３２の供給を容易にする調整手段と
、前記被加工物３２の搬送方向に対して垂直方向にスピ
ンドル１７の回転軸を設定できる調整手段と、さらにも
う一方のスピンドル２６は回転軸方向に移動が可能な移
動手段とを設けることにより、薄板小片加工に必要なカ
ップ形砥石の両面同時研削における加工面の平面度、平
行度の精度向上を実現することができる。As described above, according to this embodiment, one spindle 17
is a moving means capable of moving in the direction of the rotation axis, and a workpiece 32.
adjustment means for facilitating the feeding of the workpiece 32 by making the distance between the grinding wheels 22 and 31 have an arbitrary slope in the conveyance direction of the workpiece 32; By providing an adjusting means that can set the rotational axis and a moving means that can move the other spindle 26 in the direction of the rotational axis, the flatness of the machined surface can be improved in simultaneous grinding of both sides of a cup-shaped grindstone necessary for processing small thin plates. It is possible to improve the precision of parallelism and parallelism.
発明の効果
以上のように本発明は、一方のスピンドルを回転軸方向
に移動させる手段と、被加工物の搬送方向で砥石間距離
が任意の勾配を持つように設定する手段と、前記被加工
物の搬送方向に対して垂直方向に前記スピンドルの回転
軸を設定する手段と、他方のスピンドルを回転軸方向に
移動させる手段とを備えたことにより、砥石の寿命やメ
ンテナンスにおいても薄板小片の最終加工寸法の設定が
容易であり、両頭を同時に加工し、スルーフィードタイ
プであるため自動化、量産化が可能で、被加工物の加工
面の平面度、平行度の精度向上にも大なる効果を発揮す
る。Effects of the Invention As described above, the present invention provides means for moving one spindle in the direction of the rotation axis, means for setting the distance between grinding wheels to have an arbitrary gradient in the conveyance direction of the workpiece, and By providing means for setting the rotational axis of the spindle in a direction perpendicular to the conveyance direction of the object, and means for moving the other spindle in the direction of the rotational axis, it is possible to improve the final grinding of small thin plate pieces in terms of the lifespan and maintenance of the grindstone. It is easy to set machining dimensions, both heads are machined at the same time, and as it is a through-feed type, automation and mass production are possible, and it is also very effective in improving the accuracy of the flatness and parallelism of the machined surface of the workpiece. Demonstrate.
第１図は本発明の一実施例における両頭平面研削装置の
主要構成を示す側面図、第２図は従来のカップ形砥石を
使用した場合の薄板小片被加工物の加工寸法を示す図、
第３図は本実施例の加工寸法を示す図、第４図は従来の
薄板小片の両頭平面研削装置の主要構成図、第５図は従
来の厚板小片の両頭平面研削装置の主要構成図である。
１７．２６・・・・・・スピンドル、２２・・・・・・
上軸砥石、３１・・・・・・下軸砥石、３２・・・・・
・被加工物。FIG. 1 is a side view showing the main structure of a double-head surface grinding device according to an embodiment of the present invention, FIG. 2 is a diagram showing the machining dimensions of a small thin plate workpiece when a conventional cup-shaped grindstone is used,
Fig. 3 is a diagram showing the machining dimensions of this embodiment, Fig. 4 is a main configuration diagram of a conventional double-disc surface grinding device for small thin plate pieces, and Fig. 5 is a main configuration diagram of a conventional double-disc surface grinding device for small thick plate pieces. It is. 17.26...Spindle, 22...
Upper shaft grindstone, 31...Lower shaft grindstone, 32...
・Workpiece.
Claims (1)
加工物の搬送方向で砥石間距離が任意の勾配を持つよう
に設定する手段と、前記被加工物の搬送方向に対して垂
直方向に前記スピンドルの回転軸を設定する手段と、他
方のスピンドルを回転軸方向に移動させる手段とを備え
たことを特徴とする両頭平面研削装置。means for moving one of the spindles in the direction of the rotation axis; means for setting the distance between the grinding wheels to have an arbitrary gradient in the conveyance direction of the workpiece; A double-head surface grinding device comprising means for setting the rotation axis of a spindle and means for moving the other spindle in the direction of the rotation axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17583589A JPH0343143A (en) | 1989-07-07 | 1989-07-07 | Both head flat grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17583589A JPH0343143A (en) | 1989-07-07 | 1989-07-07 | Both head flat grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0343143A true JPH0343143A (en) | 1991-02-25 |
Family
ID=16003051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17583589A Pending JPH0343143A (en) | 1989-07-07 | 1989-07-07 | Both head flat grinding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343143A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010076047A (en) * | 2008-09-26 | 2010-04-08 | Hoya Corp | Method for manufacturing substrate for mask blank and substrate for mask blank |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60249563A (en) * | 1984-05-22 | 1985-12-10 | Motoi Nishimura | Vertical surface grinding machine |
-
1989
- 1989-07-07 JP JP17583589A patent/JPH0343143A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60249563A (en) * | 1984-05-22 | 1985-12-10 | Motoi Nishimura | Vertical surface grinding machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010076047A (en) * | 2008-09-26 | 2010-04-08 | Hoya Corp | Method for manufacturing substrate for mask blank and substrate for mask blank |
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