JPH0342861A - Resin seal type semiconductor device - Google Patents
Resin seal type semiconductor deviceInfo
- Publication number
- JPH0342861A JPH0342861A JP17840389A JP17840389A JPH0342861A JP H0342861 A JPH0342861 A JP H0342861A JP 17840389 A JP17840389 A JP 17840389A JP 17840389 A JP17840389 A JP 17840389A JP H0342861 A JPH0342861 A JP H0342861A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- light
- resin
- die pad
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 239000011347 resin Substances 0.000 title claims abstract description 25
- 229920005989 resin Polymers 0.000 title claims abstract description 25
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 238000004891 communication Methods 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、樹脂によって半導体素子を封止する樹脂封止
型半導体装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealed semiconductor device in which a semiconductor element is sealed with a resin.
一般に、半導体装置としては、材料コストが安価である
ことあるいは作業性が良好であること等の理由から、樹
脂によって半導体素子を封止してなる樹脂封止型半導体
装置が広く知られている。Generally, as a semiconductor device, a resin-sealed semiconductor device in which a semiconductor element is sealed with resin is widely known because of low material costs and good workability.
従来、この種の半導体装置は第２図に示すように構成さ
れている。これを同図に基づいて説明すると、同図にお
いて、符号１で示すものはリードフレームのダイスパッ
ド２上に接着剤３によって接合された半導体素子、４は
この半導体素子ｌの電極（図示せず）にワイヤ５によっ
て接続されたインナリード、６はこのインナーリード４
に接続されかつめっき半田７で被覆されたアウターリー
ドである。８は前記半導体素子１．前記ワイヤ５および
前記インナーリード４を封止する樹脂である。Conventionally, this type of semiconductor device has been constructed as shown in FIG. To explain this based on the same figure, in the same figure, the reference numeral 1 denotes a semiconductor element bonded to the die pad 2 of the lead frame with an adhesive 3, and the reference numeral 4 denotes an electrode (not shown) of this semiconductor element l. ) is connected to the inner lead 4 by a wire 5, and 6 is connected to this inner lead 4.
This is an outer lead connected to the outer lead and covered with plating solder 7. 8 is the semiconductor element 1. This is a resin that seals the wire 5 and the inner lead 4.
このように構成された樹脂封止型半導体装置においては
、外部機器（図示せず）にアウターリード６を接続する
ことにより、情報の送受信が行われる。In the resin-sealed semiconductor device configured in this manner, information is transmitted and received by connecting the outer lead 6 to an external device (not shown).
なお、この種の樹脂封止型半導体装置を製造するには、
先ずリードフレームのダイスパッド２上に接着剤３によ
って半導体素子ｌを接合し、次にこの半導体素子ｌの電
極（図示せず）とインナーリード４をワイヤ５によって
接続した後、このワイヤ５．インナーリード４および半
導体素子１１を樹脂８によって封止してから、めっき処
理、タイバー切断加工およびリード曲げ加工等を施すこ
とにより行われる。Note that in order to manufacture this type of resin-sealed semiconductor device,
First, a semiconductor element 1 is bonded onto the die pad 2 of a lead frame with an adhesive 3, and then an electrode (not shown) of this semiconductor element 1 and an inner lead 4 are connected with a wire 5. After the inner leads 4 and the semiconductor element 11 are sealed with the resin 8, plating, tie bar cutting, lead bending, etc. are performed.
ところで、この種の樹脂封止型半導体装置においては、
半導体素子ｌにワイヤ５およびインナーリード４を介し
て接続するアウターリード６が樹脂８の外部に露呈する
構造であるため、アウターリード６と樹脂８との間にク
リアランスが形成される。この結果、アウターリード６
の界面を伝って樹脂８の外部から内部に水分が浸入し、
半導体素子１に悪影響を及ぼしデバイスとしての信頼性
が低下するという問題があった。By the way, in this type of resin-sealed semiconductor device,
Since the outer lead 6 connected to the semiconductor element 1 via the wire 5 and the inner lead 4 is exposed to the outside of the resin 8, a clearance is formed between the outer lead 6 and the resin 8. As a result, outer lead 6
Moisture infiltrates from the outside to the inside of the resin 8 along the interface of
There is a problem in that the semiconductor element 1 is adversely affected and reliability as a device is reduced.
本発明はこのような事情に鑑みてなされたもので、樹脂
の外部から内部への水分の浸入を阻止することができ、
デバイスとしての信頼性を高めることができる樹脂封止
型半導体装置を提供するものである。The present invention was made in view of these circumstances, and can prevent moisture from entering from the outside of the resin to the inside.
The present invention provides a resin-sealed semiconductor device that can improve reliability as a device.
本発明に係る樹脂封止型半導体装置は、ダイスパッド上
に光信号によって送受信する受発光部を有する光通信半
導体素子を接合し、この半導体素子およびダイスバンド
を透明樹脂によって封止したものである。The resin-sealed semiconductor device according to the present invention is one in which an optical communication semiconductor element having a light receiving and emitting part that transmits and receives optical signals is bonded onto a die pad, and the semiconductor element and the die band are sealed with a transparent resin. .
本発明においては、光通信半導体素子の受発光部と外部
機器との間で情報の送受信を直接行うことができる。In the present invention, information can be directly transmitted and received between the light receiving and emitting parts of the optical communication semiconductor device and external equipment.
以下、本発明の構成等を図に示す実施例によって詳細に
説明する。EMBODIMENT OF THE INVENTION Hereinafter, the structure etc. of this invention will be explained in detail by the Example shown in the figure.
第１図は本発明に係る樹脂封止型半導体装置を示す断面
図である。同図において、符号１１で示すものは光信号
によって送受信する受光部１２と発光部１３を有する光
通信半導体素子で、ダイスパッド１４上に接着剤１５を
介して接合されている。１６は前記半導体素子１１と前
記ダイスパッド１４を封止する透明樹脂である。FIG. 1 is a sectional view showing a resin-sealed semiconductor device according to the present invention. In the figure, the reference numeral 11 denotes an optical communication semiconductor element having a light receiving section 12 and a light emitting section 13 that transmit and receive optical signals, and is bonded onto a die pad 14 via an adhesive 15. 16 is a transparent resin that seals the semiconductor element 11 and the die pad 14.
このように構成された樹脂封止型半導体装置においては
、光通信半導体素子１１の受光部１２１発光部１３と外
部機器（図示せず）との間で情報の送受信を直接行うこ
とができる。すなわち、光通信半導体素子１１の発光部
１３からの情報は外部機器（図示せず）の受光部（図示
せず〉に送信され、外部機器〈図示せず〉の発光部（図
示せず）からの情報が光通信半導体素子１１の受光部１
２に受信されるのである。In the resin-sealed semiconductor device configured in this manner, information can be directly transmitted and received between the light receiving section 121 and the light emitting section 13 of the optical communication semiconductor element 11 and an external device (not shown). That is, information from the light emitting section 13 of the optical communication semiconductor device 11 is transmitted to the light receiving section (not shown) of an external device (not shown), and from the light emitting section (not shown) of the external device (not shown). The information is transmitted to the light receiving section 1 of the optical communication semiconductor device 11.
It is received by 2.
したがって、本実施例においては、情報の送受信に従来
必要とした外部機器（図示せず〉に接続するリードが不
要になるから、透明樹脂１６の外部から内部への水分の
浸入を阻止することができ、透明樹脂１６内の光通信半
導体素子１１に与える水分による悪影響かなくなる。Therefore, in this embodiment, since there is no need for a lead to connect to an external device (not shown) which is conventionally required for transmitting and receiving information, it is possible to prevent moisture from entering from the outside of the transparent resin 16 into the inside. This eliminates the adverse effects of moisture on the optical communication semiconductor element 11 within the transparent resin 16.
また、本実施例においてはり一ドレスであることから、
樹脂封止後のめっき処理やリード曲げ加工等が不要にな
り、半導体装置の製造加工をきわめて簡単に行うことも
できる。In addition, since it is a beam dress in this example,
Plating processing, lead bending processing, etc. after resin sealing are no longer necessary, and the manufacturing process of the semiconductor device can be performed extremely easily.
なお、本実施例においては、光通信半導体素子１１が単
数個である場合を示したが、本発明はこれに限定されず
、複数個であってもよく、その個数は適宜変更すること
ができる。In addition, in this embodiment, the case where the optical communication semiconductor element 11 is a single piece is shown, but the present invention is not limited to this, and there may be a plurality of pieces, and the number can be changed as appropriate. .
また、本発明における透明樹脂１６の種類としては、耐
湿性が良好であるものなら、特に限定されるものではい
。Further, the type of transparent resin 16 in the present invention is not particularly limited as long as it has good moisture resistance.
因に、本発明における半導体装置の製造方法は次に示す
手順を経て行われる。すなわち、接着剤１５によってダ
イスパッド１４上に光通信半導体素子１１を接合した後
、透明樹脂１６によって光通信半導体素子１１およびダ
イスパッド１４を封止するのである。Incidentally, the method for manufacturing a semiconductor device according to the present invention is performed through the following steps. That is, after the optical communication semiconductor element 11 is bonded onto the die pad 14 with the adhesive 15, the optical communication semiconductor element 11 and the die pad 14 are sealed with the transparent resin 16.
以上説明したように本発明によれば、光信号によって送
受信する受発光部を有する光通信半導体素子をダイスパ
ッド上に接合し、この半導体素子およびダイスパッドを
透明樹脂によって封止したので、光通信半導体素子の受
発光部と外部機器との間で情報の送受信を直接行うこと
ができる。したがって、情報の送受信に従来必要とした
外部機器に接続するリードが不要になるから、透明樹脂
の外部から内部への水分の浸入を阻止することができ、
デバイスとしての信頼性を確実に高めることができる。As explained above, according to the present invention, an optical communication semiconductor element having a light receiving and emitting part that transmits and receives optical signals is bonded onto a die pad, and this semiconductor element and die pad are sealed with a transparent resin. Information can be directly transmitted and received between the light receiving and emitting parts of the semiconductor element and external equipment. This eliminates the need for leads to connect to external devices that were conventionally required for transmitting and receiving information, making it possible to prevent moisture from entering from the outside of the transparent resin into the inside.
The reliability of the device can be surely improved.
また、リードが不要であることは、樹脂封止後のめっき
処理やリード曲げ加工等が不要になるから、製造加工の
簡素化が図れるといった利点もある。Further, the fact that no leads are required eliminates the need for plating, lead bending, etc. after resin sealing, which has the advantage of simplifying the manufacturing process.
第１図は本発明に係る樹脂封止型半導体装置を示す断面
図、第２図は従来の樹脂封止型半導体装置を示す断面図
である。
１１・・・・光通信半導体素子、１２・・・・受光部、
１３・・・・発光部、１４・・・・ダイスパッド、１６
・ ・ ・ ・透吋樹脂。
代 理 人 大 岩 増 雄第１
図
１３：裕り岬。
第２図FIG. 1 is a sectional view showing a resin-sealed semiconductor device according to the present invention, and FIG. 2 is a sectional view showing a conventional resin-sealed semiconductor device. 11... Optical communication semiconductor element, 12... Light receiving section,
13... Light emitting part, 14... Dice pad, 16
・ ・ ・ ・Transparent resin. Agent Masuo Oiwa 1st Figure 13: Cape Yuri. Figure 2
Claims (1)
有する光通信半導体素子を接合し、この光通信半導体素
子およびダイスパッドを透明樹脂によって封止したこと
を特徴とする樹脂封止型半導体装置。1. A resin-sealed semiconductor device characterized in that an optical communication semiconductor element having a light receiving and emitting part that transmits and receives optical signals is bonded onto a die pad, and the optical communication semiconductor element and the die pad are sealed with a transparent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17840389A JPH0342861A (en) | 1989-07-11 | 1989-07-11 | Resin seal type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17840389A JPH0342861A (en) | 1989-07-11 | 1989-07-11 | Resin seal type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0342861A true JPH0342861A (en) | 1991-02-25 |
Family
ID=16047890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17840389A Pending JPH0342861A (en) | 1989-07-11 | 1989-07-11 | Resin seal type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0342861A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100528763B1 (en) * | 1999-02-09 | 2005-11-15 | 가부시키가이샤 와코르 | Garment with figure control function |
| KR100685522B1 (en) * | 2005-12-31 | 2007-02-26 | 이철성 | Underwear for correction |
-
1989
- 1989-07-11 JP JP17840389A patent/JPH0342861A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100528763B1 (en) * | 1999-02-09 | 2005-11-15 | 가부시키가이샤 와코르 | Garment with figure control function |
| KR100685522B1 (en) * | 2005-12-31 | 2007-02-26 | 이철성 | Underwear for correction |
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