JPH0342195Y2 - - Google Patents
Info
- Publication number
- JPH0342195Y2 JPH0342195Y2 JP2943086U JP2943086U JPH0342195Y2 JP H0342195 Y2 JPH0342195 Y2 JP H0342195Y2 JP 2943086 U JP2943086 U JP 2943086U JP 2943086 U JP2943086 U JP 2943086U JP H0342195 Y2 JPH0342195 Y2 JP H0342195Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat insulating
- floor
- piping
- base material
- unjoined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 25
- 238000009413 insulation Methods 0.000 claims description 17
- 238000009408 flooring Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000011120 plywood Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 239000011094 fiberboard Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002984 plastic foam Substances 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Floor Finish (AREA)
- Building Environments (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、例えば、コンクリート造り住宅等に
おいて、コンクリート床スラブよりなる床面上に
配管スペースを設けて、断熱材を施工する床工法
に最適な断熱床下地材に関するものである。[Detailed description of the invention] (Industrial application field) This invention is ideal for floor construction methods in which, for example, in concrete houses, etc., piping space is provided on the floor surface made of concrete floor slabs and insulation material is installed. This relates to heat-insulating floor sub-materials.
（従来技術とその問題点）
近年、コンクリート造住宅において、メンテナ
ンス等の観点から、配管を部屋の床仕上げ材の下
に配設することが行われる。(Prior art and its problems) In recent years, in concrete houses, piping has been arranged under the floor finishing material of rooms from the viewpoint of maintenance and the like.
この場合、従来においては、コンクリート床
スラブ上に配管するとともに、根太を組み、その
上に合板等を敷設したり、前記根太の代わりに
脚付きパネルを使用する方法が採用されている。 In this case, the conventional methods have been to install piping on a concrete floor slab, assemble joists, and lay plywood or the like on top of the joists, or to use a panel with legs instead of the joists.
しかしながら、の根太組工法では、きしみ音
が発生しやすく、かつ、断熱性が悪く、では断
熱性が悪い、という問題を有する。 However, the joist construction method has problems in that it tends to generate squeak noise and has poor insulation properties.
本考案は、前記従来の問題点を解決すべく検討
の結果、インシユレーシヨンボード等の断熱板か
らなる下地材に、配管を埋設すれば、きしみ音が
なく、かつ、断熱性も図れることに着目し、配管
スペースを断熱板に容易に形成できるようにし
て、従来の問題点を解決する断熱床下地材を提供
することを目的とする。 The present invention was developed as a result of studies to solve the above-mentioned conventional problems.It was found that by burying the pipes in a base material made of a heat insulating board such as an insulation board, there would be no squeaks and the insulation would be improved. The purpose of the present invention is to provide a heat insulating floor underlayment material that solves the conventional problems by easily forming a piping space on a heat insulating board.
（問題点を解決すべき手段）
本考案は、前記目的を達成するために、インシ
ユレーシヨンボード等の断熱板を複数枚積層一体
化してなる断熱床下地材において、少なくとも最
上層の断熱板の少なくとも一縁部に、所定幅の切
断除去可能な未接合部を設けたものである。(Means to Solve the Problems) In order to achieve the above-mentioned object, the present invention provides a heat insulating flooring material made by laminating and integrating a plurality of heat insulating boards such as insulation boards. A removable unjoined portion of a predetermined width is provided on at least one edge of the wafer.
（実施例）
つぎに、本考案を一実施例である図面にしたが
つて説明する。(Example) Next, the present invention will be explained with reference to the drawings which are one example.
第１図は、本考案にかかる断熱床下地材１を示
し、インシユレーシヨンボード等の断熱板２を複
数枚（図では３枚）を接着剤３あるいは縫着する
ことにより一体化したものである。ただし、最上
層断熱板２ａと中層断熱板２ｂとは、その一縁部
に、所定幅ｌの未接合部４を残して一体化し、中
層断熱板２ｂと下層断熱板２ｃとは全面で接合し
ている。また、場合によつては、他の縁部にも未
接合部４を設けてもよい。 FIG. 1 shows a heat insulating floor base material 1 according to the present invention, which is made by integrating a plurality of heat insulating boards 2 such as insulation boards (three in the figure) with adhesive 3 or by sewing them together. It is. However, the top layer insulation board 2a and the middle layer insulation board 2b are integrated leaving an unjoined part 4 of a predetermined width l at one edge thereof, and the middle layer insulation board 2b and the lower layer insulation board 2c are joined on the entire surface. ing. Further, depending on the case, unjoined portions 4 may be provided on other edges as well.
つぎに、前記断熱床下地材１の施工法を説明す
る。 Next, a method of constructing the heat insulating floor base material 1 will be explained.
まず、断熱床下地材１を所定寸法に切断し、そ
の未接合部４を対向させて、配管スペース６を形
成してコンクリート床スラブからなる床面７上に
載置あるいは接着固定する。 First, the heat insulating floor base material 1 is cut to a predetermined size, the unjoined parts 4 thereof are placed facing each other to form a piping space 6, and the cut material is placed or adhesively fixed on a floor surface 7 made of a concrete floor slab.
なお、他の床面７上には断熱床下地材１をその
まま敷設する。 Note that the heat insulating floor base material 1 is laid on the other floor surface 7 as it is.
そして、前記配管スペース６内に配管８を行う
とともに、前記対向する未接合部４をカツター等
で切断除去し（第２図参照）、段部５を形成する。
その後、この対向する段部５，５間に、最上層断
熱板２ａと同一厚みのパーテイクルボードあるい
は合板９を載置（場合によつては接着、釘打）
し、配管８を収納する。 Then, piping 8 is installed in the piping space 6, and the opposing unjoined portions 4 are cut and removed using a cutter or the like (see FIG. 2) to form a stepped portion 5.
After that, a particle board or plywood 9 having the same thickness as the top layer insulation board 2a is placed between the facing step parts 5 and 5 (glued or nailed in some cases).
Then, the piping 8 is stored.
なお、切断容易なように、表面に未接合部ない
しは切断部を示す線等を表示しておくと、切断作
業は容易にできるし、合板９を前以て用意してお
くことができる。 Note that if a line or the like indicating an unjoined portion or a cut portion is displayed on the surface to facilitate cutting, the cutting operation can be facilitated and the plywood 9 can be prepared in advance.
このように、配管８を被覆したのち、第３図に
示すように、断熱床下地材１の上に薄物の合板１
０を捨張りし、クツシヨンフロアーや木質フロア
ー仕上げをすればよい。なお、合板１０を捨張り
することなく、直接畳やカーペツトを敷設しても
よい。 After covering the piping 8 in this way, as shown in FIG.
All you have to do is remove the 0 and finish it with a cushion floor or wood floor. Note that tatami mats or carpets may be directly laid down without plywood 10 being stretched.
なお、上層断熱板２ａはその中央部分にも縁部
と同様な未接合部を設けておいて、下地材を中央
部分で切断使用したときに、該切断縁部にも段部
５を形成可能としてもよい。 In addition, the upper layer heat insulating board 2a has an unjoined part similar to the edge at the center thereof, and when the base material is cut at the center, a step 5 can be formed at the cut edge. You can also use it as
また、断熱下地材１の上層及び中層の断熱板２
ａ，２ｂをインシユレーシヨンボード等の吸放湿
性を有する繊維板にするとともに、下層断熱板２
ｃをプラスチツクフオーム等の防湿性の高い材料
とすると、床下での結露の発生がなくなるととも
にコンクリート床からの湿気の侵入防止をも図る
ことができる。さらに、断熱下地材１は、配管部
がない場所では未接合部３を切断することなく、
従来の下地材としても使用することは勿論であ
る。 In addition, the upper layer and middle layer insulation board 2 of the insulation base material 1
A and 2b are made of fiberboard with moisture absorption and desorption properties such as insulation board, and the lower layer insulation board 2 is used.
If c is made of a highly moisture-proof material such as plastic foam, it is possible to eliminate condensation under the floor and also to prevent moisture from entering from the concrete floor. Furthermore, the heat insulating base material 1 can be used without cutting the unjoined parts 3 in places where there are no piping parts.
Of course, it can also be used as a conventional base material.
（効果）
以上の説明で明らかなように、本考案にかかる
断熱床下地材によれば、全体がインシユレーシヨ
ンボード等の断熱板からなる複合体であるから、
床衝撃音防止効果を有するとともに断熱性がよ
く、かつ、配管を床面上を敷設する場合には、前
記断熱下地材を任意の間隔をおいて配置して対向
する未接合部を、表面からカツター等で切断する
だけで対向部分の表面側に一定高さの段部が簡単
に形成されるため、該段部間に適宜の板材を載置
するだけで配管を収容することが可能であり、施
工性は極めて良好である。また、このとき、段部
の高さが一定となるため、段部間に載置した板材
にガタつきが生じることがなく安定しており、板
材の上部を踏んでもきしみの発生がない。(Effects) As is clear from the above explanation, the insulating floor underlayment material according to the present invention is a composite body made of insulating boards such as insulation boards, so that
It has the effect of preventing floor impact noise and has good insulation properties, and when laying piping on the floor, the insulating base material is placed at an arbitrary interval and the opposing unjoined parts are separated from the surface. A stepped portion of a certain height can be easily formed on the surface side of the facing portion by simply cutting with a cutter, etc., so piping can be accommodated simply by placing an appropriate plate material between the stepped portions. , the workability is extremely good. Further, at this time, since the height of the stepped portions is constant, the plate material placed between the stepped portions is stable without wobbling, and there is no creaking even if the upper part of the plate material is stepped on.
第１図は本考案にかかる断熱床下地材の正面
図、第２図は第１図の未接合部を除去した状態を
示す正面図で、第３図は本考案にかかる断熱床下
地材を使用して、配管スペースを形成した状態の
断面図である。
１……断熱床下地材、２……断熱板、２ａ……
最上層断熱板、２ｂ……中層断熱板、２ｃ……下
層断熱板、３……接着剤、４……未接合部、５…
…段部、６……配管スペース、７……床面、８…
…配管、９……合板。
Figure 1 is a front view of the heat insulating floor base material according to the present invention, Figure 2 is a front view showing the state in which the unjoined parts of Figure 1 have been removed, and Figure 3 is a front view of the heat insulating floor base material according to the present invention. FIG. 3 is a cross-sectional view of a state in which a piping space is formed using the device. 1...Insulating floor base material, 2...Insulating board, 2a...
Top layer heat insulating board, 2b...Middle layer heat insulating board, 2c...Lower layer heat insulating board, 3...Adhesive, 4...Unjoined portion, 5...
...Stepped portion, 6...Piping space, 7...Floor surface, 8...
...Piping, 9...Plywood.
Claims (1)
積層一体化してなる断熱床下地材において、少な
くとも最上層の断熱板の少なくとも一縁部に、所
定幅の切断除去可能な未接合部を設けてたことを
特徴とする断熱床下地材。 In an insulating flooring material made by laminating and integrating a plurality of heat insulating boards such as insulation boards, at least one edge of the top layer of insulating boards is provided with an unjoined part of a predetermined width that can be cut and removed. A heat insulating floor underlayment material characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2943086U JPH0342195Y2 (en) | 1986-02-28 | 1986-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2943086U JPH0342195Y2 (en) | 1986-02-28 | 1986-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62151340U JPS62151340U (en) | 1987-09-25 |
| JPH0342195Y2 true JPH0342195Y2 (en) | 1991-09-04 |
Family
ID=30833301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2943086U Expired JPH0342195Y2 (en) | 1986-02-28 | 1986-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0342195Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2842556B2 (en) * | 1989-01-27 | 1999-01-06 | 株式会社ブリヂストン | Floor structure |
| JP4633610B2 (en) * | 2005-11-22 | 2011-02-16 | 株式会社チユーオー | Roofing material |
-
1986
- 1986-02-28 JP JP2943086U patent/JPH0342195Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62151340U (en) | 1987-09-25 |
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