JPH0341470Y2 - - Google Patents
Info
- Publication number
- JPH0341470Y2 JPH0341470Y2 JP17787686U JP17787686U JPH0341470Y2 JP H0341470 Y2 JPH0341470 Y2 JP H0341470Y2 JP 17787686 U JP17787686 U JP 17787686U JP 17787686 U JP17787686 U JP 17787686U JP H0341470 Y2 JPH0341470 Y2 JP H0341470Y2
- Authority
- JP
- Japan
- Prior art keywords
- dicing tape
- semiconductor element
- support pin
- vacuum suction
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 53
- 238000005192 partition Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 1
Description
【考案の詳細な説明】
〔概要〕
フルカツト用のダイシングテープルの上面に貼
付けられた半導体素子を、ダイシングテープの下
から支える支持ピンと、支持ピンの周囲のダイシ
ングテープを、その表面のすりばち状の凹面に真
空吸着して半導体素子をダイシングテープから剥
離させる真空吸着板とを備えた半導体素子剥離装
置。[Detailed explanation of the invention] [Summary] A support pin that supports the semiconductor element attached to the upper surface of the dicing tape for full cutting from below the dicing tape, and a concave concave surface of the dicing tape around the support pin. and a vacuum suction plate for peeling semiconductor elements from a dicing tape by vacuum suction.
本考案は、半導体素子付け機に係り、特にフル
カツト用のダイシングテープ上面に貼付けられた
半導体素子をダイシングテープから剥離する装置
の改良に関するものである。
The present invention relates to a semiconductor device attaching machine, and more particularly to an improvement in an apparatus for peeling off semiconductor devices attached to the upper surface of a full-cut dicing tape from the dicing tape.
半導体装置製造のアセンブリ工程の半導体素子
付け機において、フルカツト用のダイシングテー
プの上面に貼付けられた半導体素子を安定した状
態で剥離し、コレツトに吸着させることは非常に
重要なことであり、これが不安定な場合には半導
体素子付け機の安定した稼動に支障をきたすの
で、ダイシングテープ上面に貼付けられた半導体
素子を安定して剥離できる装置の考案が要求され
ている。 In a semiconductor device attaching machine used in the assembly process of semiconductor device manufacturing, it is extremely important to stably peel off the semiconductor devices attached to the top surface of the full-cut dicing tape and have them adsorbed to the collet. If this is not the case, it will interfere with the stable operation of the semiconductor device attaching machine, so there is a need to devise a device that can stably peel off the semiconductor devices attached to the top surface of the dicing tape.
従来の半導体素子剥離装置は、第３図に示すよ
うな本体１６の周囲に柔軟な材料からなる吸盤状
の隔壁７の一端を固定したものであり、本体１６
の中心部には半導体素子１を突き上げる支持ピン
３が４本内蔵されている。
In the conventional semiconductor device stripping apparatus, one end of a suction cup-shaped partition wall 7 made of a flexible material is fixed around a main body 16 as shown in FIG.
Four support pins 3 for pushing up the semiconductor element 1 are built into the center.
半導体素子１を剥離する工程は、第３図ａに示
すように先ず半導体素子１の位置を認識し、半導
体素子１を支持ピン３の真上に位置決めする。 In the step of peeling off the semiconductor element 1, the position of the semiconductor element 1 is first recognized, and the semiconductor element 1 is positioned directly above the support pin 3, as shown in FIG. 3a.
次に第３図ｂに示すように支持ピン３を上昇さ
せてダイシングテープ２を介して半導体素子１に
当てる。その状態で本体１６に設けた孔１６ａか
ら真空排気して、第３図ｃに示すように隔壁７が
外方に倒れダイシングテープ２が本体１６に吸着
されるようにする。この際にはコレツト５は半導
体素子１のすぐ上方の所定の位置まで降下して半
導体素子１を吸着できるようになつている。 Next, as shown in FIG. 3B, the support pins 3 are raised and applied to the semiconductor element 1 through the dicing tape 2. In this state, the main body 16 is evacuated through the hole 16a, so that the partition wall 7 falls outward and the dicing tape 2 is attracted to the main body 16, as shown in FIG. 3c. At this time, the collet 5 descends to a predetermined position immediately above the semiconductor element 1 so that it can attract the semiconductor element 1.
次いで第３図ｄに示すように隔壁７が広がり、
ダイシングテープ２を本体１６の上面近くに吸着
させて半導体素子１をダイシングテープ２から剥
離し、コレツト５の真空吸引を行い半導体素子１
を吸着する。この際に支持ピン３の先端部がダイ
シングテープ２を突き破るが直径が0.1〜0.2mm程
度の微小な孔の場合は元通りになり、その後に空
気がリークすることはない。 Then, as shown in FIG. 3d, the partition wall 7 expands,
The dicing tape 2 is attracted near the top surface of the main body 16, the semiconductor element 1 is peeled off from the dicing tape 2, and the collet 5 is vacuum-suctioned to remove the semiconductor element 1.
adsorbs. At this time, the tip of the support pin 3 breaks through the dicing tape 2, but if it is a minute hole with a diameter of about 0.1 to 0.2 mm, it will return to its original state and no air will leak afterwards.
その後支持ピン３を降下し、第３図ｅに示すよ
うに本体１６からの真空吸引を止めて初期状態に
戻し、ダイシングテープ２を半導体素子１の１個
分移動し、次の半導体素子１の位置認識を行い、
作業を続行する。 Thereafter, the support pin 3 is lowered, the vacuum suction from the main body 16 is stopped and the initial state is returned as shown in FIG. Performs location recognition,
Continue working.
以上説明の従来の半導体素子剥離装置で問題と
なるのは、
(1) 柔軟な材質からなる吸盤状の隔壁７を用いて
ダイシングテープ２を支持しているために、小
さい半導体素子（１〜２mm角）の場合にチツプ
位置認識が安定しない。
The problems with the conventional semiconductor device peeling apparatus described above are as follows: (1) Since the dicing tape 2 is supported using the suction cup-shaped partition wall 7 made of a flexible material, small semiconductor devices (1 to 2 mm chip position recognition is unstable when the
(2) 半導体素子吸着時のコレツト５の位置と半導
体素子１の位置の精度が要求されるが、柔軟な
材質からなる吸盤状の隔壁７のために半導体素
子１の位置が不安定になることである。(2) Accuracy in the position of the collet 5 and the position of the semiconductor element 1 is required when the semiconductor element is attracted, but the position of the semiconductor element 1 becomes unstable due to the suction cup-shaped partition wall 7 made of a flexible material. It is.
特にダイシングテープ２の周辺部においては、
ダイシングテープ２の引つ張り力の左右のアンバ
ランスのために一層不安定さが増幅されるように
なつている。 Especially in the periphery of the dicing tape 2,
The instability is further amplified due to the imbalance between the left and right tensile forces of the dicing tape 2.
本考案は以上のような状況を改良し、支持され
た半導体素子１とコレツト５の位置の精度を向上
させる手段の提供を目的としたものである。 The present invention aims to improve the above-mentioned situation and provide a means for improving the positional accuracy of the supported semiconductor element 1 and collet 5.
上記問題点は、フルカツト用のダイシングテー
プの上面に貼付けられた半導体素子を、ダイシン
グテープを介して下面側から支える支持ピンと、
支持ピンの周囲のダイシングテープを、その表
面のすりばち状の凹面に真空で吸引して引き下
げ、半導体素子をダイシングテープから剥離させ
る本考案による真空吸着板とを備えた半導体素子
剥離装置によつて解決される。
The above problem is caused by the support pin that supports the semiconductor element attached to the top surface of the dicing tape for full cut from the bottom side through the dicing tape, and the dicing tape around the support pin that is vacuum-circuited to the concave concave surface of the support pin. This problem is solved by a semiconductor element peeling apparatus equipped with a vacuum suction plate according to the present invention which peels the semiconductor elements from the dicing tape by suctioning and lowering the semiconductor elements from the dicing tape.
即ち本考案においては、従来の隔壁に変わるも
のとして、非常に浅いすりばち状の吸着面を持つ
真空吸着板を用いるので、ダイシングテープをこ
の真空吸着板の浅いすりばち状の吸着面に吸着し
た場合にも、ダイシングテープが平面度を維持し
ているので、隣接する半導体素子が干渉して半導
体素子の上面側が衝突し合うこともなく、半導体
素子が支持ピンによつて確実に精度の高い位置に
支持されて、コレツトに安定して吸引させること
が可能となる。
That is, in the present invention, a vacuum suction plate with a very shallow pin-shaped suction surface is used as an alternative to the conventional partition wall, so that when the dicing tape is adsorbed to the shallow pin-shaped suction surface of this vacuum suction plate, In addition, since the dicing tape maintains its flatness, there is no interference between adjacent semiconductor devices and the top surfaces of the semiconductor devices collide with each other, and the semiconductor devices are reliably supported in highly accurate positions by the support pins. As a result, it becomes possible to stably draw the suction into the collector.
以下第１図〜第２図について本考案の一実施例
を説明する。
An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
第１図に本考案の真空吸着板４の詳細図を示
す。外形は32mmであり、すりばち状の吸着面の中
央部のへこみ量を1.2mm以下にすることにより、
吸着時にも半導体素子１が隣と互いに干渉しな
い。 FIG. 1 shows a detailed view of the vacuum suction plate 4 of the present invention. The outer diameter is 32mm, and by making the dent in the center of the suction surface 1.2mm or less,
The semiconductor elements 1 do not interfere with their neighbors even during adsorption.
中央部の十字形孔４ａはピツチの異なる支持ピ
ン３でも通るようになつている。ダイシングテー
プ２を吸着させる時の空気の排気もこの孔４ａに
より行つている。 The cross-shaped hole 4a in the center is designed to allow support pins 3 of different pitches to pass through. The holes 4a are also used to exhaust air when the dicing tape 2 is attracted.
第２図ａにおいて、半導体素子１を貼付けたダ
イシングテープ２が、本体６と結合した真空吸着
板４の上に、半導体素子１が支持ピン３の真上に
くるように位置を認識されて置かれ、支持ピン３
は本体６の内部に配設されている。 In FIG. 2a, the dicing tape 2 with the semiconductor element 1 pasted thereon is placed on the vacuum suction plate 4 combined with the main body 6, with the position recognized so that the semiconductor element 1 is directly above the support pin 3. He, support pin 3
is arranged inside the main body 6.
次に第２図ｂに示すように支持ピン３が上昇し
てダイシングテープ２に当たり半導体素子１の四
隅の近傍で支持し、初期の位置より少し高い位置
に突き上げる。 Next, as shown in FIG. 2B, the support pins 3 rise, hit the dicing tape 2, support the semiconductor element 1 near the four corners, and push it up to a position slightly higher than the initial position.
次いで第２図ｃに示すようにコレツト５が半導
体素子１を吸着すべき位置まで降下する。 Next, as shown in FIG. 2c, the collet 5 descends to the position where the semiconductor element 1 is to be picked up.
次いで、第２図ｄに示すように本体６の側壁に
設けた孔６ａから真空排気すると、第１図に示す
真空吸着板の詳細図の支持ピン３が通る十字形孔
４ａを通つて真空吸着板４とダイシングテープ２
の間の空気が排気され、ダイシングテープ２が真
空吸着板４のすりばち状の吸着面に密着する。こ
の時支持ピン３が更に上昇して半導体素子１をダ
イシングテープ２から剥離し、半導体素子１をコ
レツト５に吸着させる。 Next, as shown in FIG. 2d, when the vacuum is evacuated through the hole 6a provided in the side wall of the main body 6, the vacuum suction is carried out through the cross-shaped hole 4a through which the support pin 3 in the detailed view of the vacuum suction plate shown in FIG. 1 passes. Board 4 and dicing tape 2
The air between them is exhausted, and the dicing tape 2 is brought into close contact with the mortar-shaped suction surface of the vacuum suction plate 4. At this time, the support pins 3 further rise to separate the semiconductor element 1 from the dicing tape 2 and cause the semiconductor element 1 to be attracted to the collet 5.
半導体素子１がコレツト５に吸着されて次工程
に移動すると、第２図ｅに示すように本体６の真
空排気を停止し、支持ピン３が元の位置に降下す
る。その後は従来通り次の半導体素子１の位置認
識を行い作業を続行する。 When the semiconductor element 1 is attracted to the collet 5 and moved to the next step, evacuation of the main body 6 is stopped and the support pins 3 are lowered to their original positions, as shown in FIG. 2e. Thereafter, the position of the next semiconductor element 1 is recognized as before, and the work continues.
このように真空吸着板４にダイシングテープ２
を吸着した状態で半導体素子１を支持ピン３で突
き上げるから、ダイシングテープ２に加わる引つ
張り力のアンバランスな状態の影響を受けずに半
導体素子１を定位置に突き上げ得るので、コレツ
ト５の降下位置との関係が一定になり、半導体素
子１の安定したコレツト５への吸着が可能とな
る。 In this way, attach the dicing tape 2 to the vacuum suction plate 4.
Since the semiconductor element 1 is pushed up with the support pin 3 while the dicing tape 2 is attracted, the semiconductor element 1 can be pushed up to a fixed position without being affected by the unbalanced state of the tensile force applied to the dicing tape 2. The relationship with the lowering position becomes constant, and the semiconductor element 1 can be stably attracted to the collect 5.
以上説明したように本考案によれば、極めて簡
単な構造の真空吸着板を用いることにより、半導
体素子の位置認識精度が向上し、半導体素子を精
度の高い位置に安定して支持ピンにより突き上げ
得るから、コレツトによる安定した吸着が可能と
なるので、半導体装置の製造工程における実用的
効果は著しい。
As explained above, according to the present invention, by using a vacuum suction plate with an extremely simple structure, the position recognition accuracy of the semiconductor element is improved, and the semiconductor element can be stably pushed up to a highly accurate position by the support pin. Therefore, stable adsorption by the collect is possible, which has a significant practical effect in the manufacturing process of semiconductor devices.
第１図は本考案による一実施例の真空吸着板の
詳細図、第２図は本考案による一実施例の半導体
素子吸着の工程順の側断面図、第３図は従来の半
導体素子吸着の工程順の側断面図、である。
図において、１は半導体素子、２はダイシング
テープ、３は支持ピン、４は真空吸着板、４ａは
十字形孔、５はコレツト、６は本体、６ａは孔、
を示す。
Fig. 1 is a detailed view of a vacuum suction plate according to an embodiment of the present invention, Fig. 2 is a side cross-sectional view of the process order of semiconductor device adsorption according to an embodiment of the present invention, and Fig. 3 is a detailed view of a vacuum suction plate according to an embodiment of the present invention. It is a side sectional view of process order. In the figure, 1 is a semiconductor element, 2 is a dicing tape, 3 is a support pin, 4 is a vacuum suction plate, 4a is a cross-shaped hole, 5 is a collet, 6 is a main body, 6a is a hole,
shows.
Claims (1)
付けられた半導体素子１を、前記ダイシングテー
プ２を介して下面側から支える支持ピン３と、 前記支持ピン３の周囲のダイシングテープ２
を、その表面のすりばち状の凹面に真空で吸引し
て引き下げ、前記半導体素子１を前記ダイシング
テープ２から剥離させる真空吸着板４とを有する
ことを特徴とする半導体素子剥離装置。[Claims for Utility Model Registration] A support pin 3 that supports a semiconductor element 1 attached to the upper surface of a full-cut dicing tape 2 from the lower surface side via the dicing tape 2, and a dicing tape around the support pin 3. 2
A semiconductor element peeling apparatus comprising: a vacuum suction plate 4 that peels the semiconductor element 1 from the dicing tape 2 by suctioning and lowering the semiconductor element 1 to the concave surface of the dicing tape 2 using a vacuum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17787686U JPH0341470Y2 (en) | 1986-11-18 | 1986-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17787686U JPH0341470Y2 (en) | 1986-11-18 | 1986-11-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6382941U JPS6382941U (en) | 1988-05-31 |
| JPH0341470Y2 true JPH0341470Y2 (en) | 1991-08-30 |
Family
ID=31119487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17787686U Expired JPH0341470Y2 (en) | 1986-11-18 | 1986-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341470Y2 (en) |
-
1986
- 1986-11-18 JP JP17787686U patent/JPH0341470Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6382941U (en) | 1988-05-31 |
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