JPH033778A - Flexible polishing material - Google Patents
Flexible polishing materialInfo
- Publication number
- JPH033778A JPH033778A JP13967489A JP13967489A JPH033778A JP H033778 A JPH033778 A JP H033778A JP 13967489 A JP13967489 A JP 13967489A JP 13967489 A JP13967489 A JP 13967489A JP H033778 A JPH033778 A JP H033778A
- Authority
- JP
- Japan
- Prior art keywords
- fibers
- diamond
- raw material
- gas
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title abstract description 19
- 239000000463 material Substances 0.000 title abstract description 18
- 239000010432 diamond Substances 0.000 claims abstract description 39
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 14
- 239000002759 woven fabric Substances 0.000 claims abstract description 13
- 239000012808 vapor phase Substances 0.000 claims abstract description 12
- 239000000835 fiber Substances 0.000 claims description 58
- 239000003082 abrasive agent Substances 0.000 claims description 23
- 230000001376 precipitating effect Effects 0.000 abstract description 5
- 239000007789 gas Substances 0.000 description 29
- 239000002994 raw material Substances 0.000 description 26
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 9
- -1 olefin hydrocarbons Chemical class 0.000 description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 229930195733 hydrocarbon Natural products 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 150000002430 hydrocarbons Chemical class 0.000 description 4
- 239000003208 petroleum Substances 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910002090 carbon oxide Inorganic materials 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229910003481 amorphous carbon Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- GZUXJHMPEANEGY-UHFFFAOYSA-N bromomethane Chemical compound BrC GZUXJHMPEANEGY-UHFFFAOYSA-N 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- NVJUHMXYKCUMQA-UHFFFAOYSA-N 1-ethoxypropane Chemical compound CCCOCC NVJUHMXYKCUMQA-UHFFFAOYSA-N 0.000 description 1
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- LVZWSLJZHVFIQJ-UHFFFAOYSA-N Cyclopropane Chemical compound C1CC1 LVZWSLJZHVFIQJ-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000001293 FEMA 3089 Substances 0.000 description 1
- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 239000002199 base oil Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 229950005499 carbon tetrachloride Drugs 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- NEHMKBQYUWJMIP-NJFSPNSNSA-N chloro(114C)methane Chemical compound [14CH3]Cl NEHMKBQYUWJMIP-NJFSPNSNSA-N 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 239000010727 cylinder oil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 239000003502 gasoline Substances 0.000 description 1
- 239000010649 ginger oil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 230000029052 metamorphosis Effects 0.000 description 1
- VNKYTQGIUYNRMY-UHFFFAOYSA-N methoxypropane Chemical compound CCCOC VNKYTQGIUYNRMY-UHFFFAOYSA-N 0.000 description 1
- 229940102396 methyl bromide Drugs 0.000 description 1
- 229940073584 methylene chloride Drugs 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- GRVDJDISBSALJP-UHFFFAOYSA-N methyloxidanyl Chemical group [O]C GRVDJDISBSALJP-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000010665 pine oil Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 239000012264 purified product Substances 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000002525 ultrasonication Methods 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は可撓性研磨材料に関し、さらに詳しく言うと、
可撓性を有するものであって、研磨性能に優れるととも
に目詰りかなく、被研磨材が局面や起伏面等の複雑な形
状を有していても効率良く研磨することのできる可撓性
研磨材料に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to flexible abrasive materials, and more specifically:
Flexible polishing that has excellent polishing performance, does not cause clogging, and can polish efficiently even if the material to be polished has a complex shape such as a curved or undulating surface. Regarding materials.
［従来技術および発明が解決しようとする課題］可撓性
研磨材としては、従来より研磨紙か広く知られている。[Prior Art and Problems to be Solved by the Invention] Abrasive paper has been widely known as a flexible abrasive material.
しかしなから、この研磨紙における砥粒には、専らガラ
スやＳｉＣ粉末が用いられているので、たとえば超硬合
金、セラミックス等の高硬度材料からなる被研磨材を効
率良く研磨することは殆ど不可能であるという問題があ
る。However, since the abrasive grains in this abrasive paper are exclusively made of glass or SiC powder, it is almost impossible to efficiently polish materials to be polished made of high hardness materials such as cemented carbide and ceramics. The problem is that it is possible.
そこて、高硬度材料からなる被研磨材を効率良く研磨す
ることのてきる可撓性研磨材か望まれており、またいく
つかの提案かなされている。Therefore, there is a need for a flexible abrasive material that can efficiently polish materials to be polished made of highly hard materials, and several proposals have been made.
たとえば特開昭６０−２５５：１６５号公報においては
、砥粒であるタイヤモント粒子を気相合成法により薄板
上に生成させるダイヤモンド研磨紙の製造方法か開示さ
れており、また、特開昭６２−２１８０７１号公報にお
いては、可撓性を有する金属シートの周辺から中央部に
向けて複数の切欠部を設け、このシートの表面に気相法
ダイヤモンド薄膜を設けてなるダイヤモンド研磨シート
か開示されている。For example, JP-A No. 60-255:165 discloses a method for producing diamond abrasive paper in which Tiemon particles, which are abrasive grains, are formed on a thin plate by vapor phase synthesis. Publication No. 218071 discloses a diamond polishing sheet in which a plurality of notches are provided from the periphery to the center of a flexible metal sheet, and a vapor phase diamond thin film is provided on the surface of the sheet. There is.
しかしながら、これらにおいては、いずれも研磨粉の除
去か困難であるという欠点かあるとともに、研磨精度の
異なるものの製造か困難であるという問題かある。However, all of these have the disadvantage that it is difficult to remove polishing powder, and it is difficult to manufacture products with different polishing precisions.
また、特開昭６３−１４４９６８号公報においては、炭
素繊維またはガラス繊維を主材料とする網状基体上に電
着された砥粒層を含む砥石か開示されている。Furthermore, Japanese Patent Application Laid-Open No. 63-144968 discloses a grindstone including an abrasive grain layer electrodeposited on a net-like substrate mainly made of carbon fiber or glass fiber.
しかしなから、この砥石においては可撓性か充分てはな
いとともに、砥粒層か砥粒の電着により形成されている
のて耐久性も充分てはないという欠点かある。However, this grindstone does not have sufficient flexibility, and since the abrasive grain layer is formed by electrodeposition of abrasive grains, it does not have sufficient durability.
さらに、特開昭６３−１８５５７９号公報においては、
多結晶ダイヤモンドを含む研磨剤と結合剤とを含む研磨
層を可撓性支持体上に塗設してなる研磨テープか開示さ
れている。Furthermore, in Japanese Patent Application Laid-Open No. 63-185579,
An abrasive tape is disclosed in which an abrasive layer containing an abrasive containing polycrystalline diamond and a binder is coated on a flexible support.
しかしなから、この研磨テープにおいても、依然として
研磨粉の除去か困難であるという欠点がある。また、多
結晶ダイヤモンドを含む研磨剤を結合剤を用いて可撓性
支持体上に塗設してなるのて、特に多結晶ダイヤモンド
の粒径か小さいと、ダイヤモンド粒子の脱粒か生し易い
という問題がある。However, this abrasive tape still has the disadvantage that it is difficult to remove abrasive powder. In addition, since an abrasive containing polycrystalline diamond is coated on a flexible support using a binder, it is said that diamond particles are likely to shed, especially if the polycrystalline diamond has a small particle size. There's a problem.
したかって、可撓性を有し、しかも研磨性能に優れると
ともに目詰りのない可撓性研磨材か望まれているのか実
状である。Therefore, there is a need for a flexible abrasive material that is flexible, has excellent polishing performance, and is free from clogging.
本発明は前記の事情に基いてなされたものである。The present invention has been made based on the above circumstances.
本発明の目的は、可撓性を有するものてあって、研磨性
能に優れるとともに目詰りかなく、被研磨材か局面や起
伏面等の複雑な形状を有していても効率良く研磨するこ
とのてきる可撓性研磨材を提供することにある。The object of the present invention is to provide a flexible material that has excellent polishing performance and is free from clogging, and can efficiently polish materials to be polished even if they have complex shapes such as curved surfaces and undulating surfaces. The object of the present invention is to provide a flexible abrasive material that is flexible.
［課題を解決するだめの手段］
前記課題を解決するために、本発明者らが鋭意検討を重
ねた結果、気相法により表面にダイヤモンドおよび／ま
たはタイヤセント状炭素（この両者をダイヤモンド類と
総称することがある。）を析出させてなる繊維を用いた
特定の研磨材料は、可撓性を有するものてあって、研磨
性７１に優れるとともに目詰りかなく、被研磨材か局面
や起伏面等の複雑な形状を有していても効率良く研磨す
ることのできる可撓性研磨材を好適に形成することかて
きることを見い出して、本発明に到達した。[Means for Solving the Problems] In order to solve the above problems, the inventors of the present invention have made intensive studies and found that diamond and/or tire-cent carbon (both of which are similar to diamonds) are added to the surface by a vapor phase method. A specific abrasive material using fibers made by precipitating abrasive materials (sometimes referred to collectively as The present invention was achieved by discovering that it is possible to suitably form a flexible abrasive material that can efficiently polish even surfaces with complex shapes.
本発明の構成は、気相法により析出したダイヤモンドお
よび／またはダイヤモンド状炭素を表面に有する繊維を
含む織布または不織布を用いてなることを特徴とする可
撓性研磨材料である。The structure of the present invention is a flexible abrasive material characterized by using a woven or nonwoven fabric containing fibers having diamond and/or diamond-like carbon on the surface deposited by a vapor phase method.
本発明の可撓性研磨材料は、気相法により析出したダイ
ヤモンド類を表面に有する繊維（以下、これをダイヤモ
ンド類析出繊維と称することかある。）を含むものであ
る。The flexible abrasive material of the present invention includes fibers having diamonds precipitated by a vapor phase method on their surfaces (hereinafter sometimes referred to as diamond-precipitated fibers).
前記ダイヤモンド類析出繊維は、原料繊維の表面に気相
法によりタイヤセン１〜類を析出させることにより得る
ことかてきる。The diamond-precipitated fibers can be obtained by precipitating Tiasens 1 to 1 on the surface of raw material fibers by a vapor phase method.
前記原料繊維としては、たとえば気相法によりダイヤモ
ンドを析出させる際の耐熱性に富むものであればよく、
具体的には、ガラス繊維、高ケイ酸質繊維、アルミナケ
イ酸繊維等のガラス質繊ＡＩ：ボロン繊維、炭化ケイ素
繊維、アルミナ繊維、チッ化ケイ素繊維、ジルコニア繊
維等のセラミック繊維；銅繊維、黄銅繊維、鋼繊維、ス
テンレス繊維、アルミ繊維、アルミニウム合金繊維、モ
リブデン繊維、タングステン繊維等の金属繊維；アルミ
ナウィスカー、マクネシアウイスカー、黒鉛ウィスカー
、炭化ケイ素ウィスカー窒化ケイ素ウィスカー等の各種
ウィスカーなどか挙げられる。The raw material fiber may be one that has high heat resistance when precipitating diamond by a vapor phase method, for example.
Specifically, glass fibers such as glass fibers, high silicic acid fibers, and alumina silicate fibers; ceramic fibers such as boron fibers, silicon carbide fibers, alumina fibers, silicon nitride fibers, and zirconia fibers; copper fibers; Metal fibers such as brass fibers, steel fibers, stainless steel fibers, aluminum fibers, aluminum alloy fibers, molybdenum fibers, tungsten fibers; Various whiskers such as alumina whiskers, manesia whiskers, graphite whiskers, silicon carbide whiskers, silicon nitride whiskers, etc. .
また、前記各種の原料繊維は、その表面にたとえば金属
やケイ素等を蒸着して使用に供することもてきる。Further, the various raw material fibers described above can be used by depositing, for example, metal, silicon, etc. on their surfaces.
これらの中ても、好ましいのは金属繊維、セラミックＩ
Ｕ＆なとてあり、特に好ましいのは５００℃以上の耐熱
性を有する金属繊維、セラミックス繊維である。Among these, metal fibers, ceramic I
Particularly preferred are metal fibers and ceramic fibers having heat resistance of 500° C. or higher.
前記原料繊維の形状については特に制限はなく、長繊維
、短繊維、ウィスカー、クロス、ローピンクマット、チ
ョツプドストランドマットなどのいずれてあってもよい
。The shape of the raw material fibers is not particularly limited, and may be any of long fibers, short fibers, whiskers, cloths, low pink mats, chopped strand mats, and the like.
すなわち、本発明の可撓性研磨材料は、前記原料繊維が
、たとえば長繊維、短繊維、ウィスカー等であるときに
は、たとえばこれらを、織布化あるいは不織布化するこ
とにより可撓性研磨材として用いることかてきるし、前
記原料繊維が、たとえばクロス、チョツプドストランド
マット、ロービングマット等であるときには、これらを
そのまま可撓性研磨材として用いることかてきる。That is, when the raw material fibers are, for example, long fibers, short fibers, whiskers, etc., the flexible abrasive material of the present invention can be used as a flexible abrasive material by making these into a woven or non-woven fabric. In addition, when the raw material fibers are, for example, cloth, chopped strand mats, roving mats, etc., they can be used as they are as a flexible abrasive material.
前記原料繊維の繊維径およびアスペクト比は、用途に応
して最適なものをそれぞれ適宜に選定すればよいのであ
るか、繊維径は、通常、１〜５０ｇｍ、好ましくは２〜
２０ｇｍてあり、アスペクト比は、通常、１０以上、好
ましくは５０以」二である。また、ウィスカーと呼ばれ
るものは、直径０゜１〜５ｇｍ、アスペクト比１０〜５
０（）のものである。The fiber diameter and aspect ratio of the raw material fibers may be appropriately selected depending on the application.The fiber diameter is usually 1 to 50 gm, preferably 2 to 50 gm.
20 gm, and the aspect ratio is usually 10 or more, preferably 50 or more. Also, whiskers have a diameter of 0°1~5gm and an aspect ratio of 10~5.
0().
なお、前記原料繊維は前処理を行なうことなくそのまま
、次に詳述する気相法によるダイヤモンドの析出に使用
することかてきるか、ダイヤモンドの核発生密度を増す
ためには、たとえば超音波法ダイヤモンド、ＳｉＣ，Ｂ
４Ｃなどのａ微粒子法による傷付処理等の前処理を行な
ってから使用してもよい。It should be noted that the raw material fibers can be used as they are without pretreatment for diamond precipitation by the vapor phase method described in detail below, or can be used, for example, by ultrasonic method to increase the diamond nucleation density. Diamond, SiC, B
It may be used after performing pre-treatment such as scratching treatment by a particle method such as 4C.
前記原料繊維の表面にタイヤセント類を析出させる方法
には気相法を好適に採用することかてきる。A vapor phase method can be suitably employed as a method for precipitating tire cents on the surface of the raw material fiber.
具体的には、炭素源ガスを含有する原料ガスを励起して
得られるガスを、反応室内に設置した前記原料ｆａｍに
接触させることにより、前記原料繊維の表面にダイヤモ
ンドを析出させることかてきる。Specifically, diamond can be precipitated on the surface of the raw material fiber by bringing a gas obtained by exciting a raw material gas containing a carbon source gas into contact with the raw material fam installed in the reaction chamber. .
前記原料ガスは、少なくとも炭素源ガスを含有する。The raw material gas contains at least a carbon source gas.
具体的には、前記原料ガスとして、たとえば炭素源ガス
と水素ガスとの混合ガスか好ましく、あるいはさらに酸
素ガス、ハロゲンガス等を含有する混合ガスを使用する
こともてきる。Specifically, the raw material gas is preferably a mixed gas of a carbon source gas and a hydrogen gas, or a mixed gas further containing oxygen gas, halogen gas, etc. may also be used.
また、所望により、前記原料ガスとともに、不活性ガス
等のキャリヤーガスを用いることもてきる。Further, if desired, a carrier gas such as an inert gas may be used together with the raw material gas.
前記炭素源ガスとしては、各種炭化水素、含酸素化合物
、含ハロゲン化合物、含窒素化合物等のガスを使用する
ことかてきる。As the carbon source gas, gases such as various hydrocarbons, oxygen-containing compounds, halogen-containing compounds, and nitrogen-containing compounds can be used.
炭化水素化合物としては、例えばメタン、エタン、プロ
パン、メタン等のパラフィン系炭化水素、エチレン、プ
ロピレン、メチレン等のオレフィン系炭化水素：アセチ
レン、アリレン等のアセチレン系炭化水素；ツタジエン
等のジオレフィン系炭化水素；シクロプロパン、シクロ
メタン、シクロペンタン、シクロヘキサン等の脂環式炭
化水素；シクロツタジエン、ベンゼン、トルエン、キシ
レン、ナフタレン等の芳香族炭化水素：塩化メチル、臭
化メチル、塩化メチレン、四塩化炭素等のハロゲン化炭
化水素などを挙げることがてきる。Examples of hydrocarbon compounds include paraffin hydrocarbons such as methane, ethane, propane, and methane; olefin hydrocarbons such as ethylene, propylene, and methylene; acetylene hydrocarbons such as acetylene and arylene; diolefin hydrocarbons such as tutadiene; Hydrogen: Alicyclic hydrocarbons such as cyclopropane, cyclomethane, cyclopentane, and cyclohexane; Aromatic hydrocarbons such as cyclotutadiene, benzene, toluene, xylene, and naphthalene: Methyl chloride, methyl bromide, methylene chloride, carbon tetrachloride Examples include halogenated hydrocarbons such as.
含酸素化合物としては、例えばアセ１〜ン、ジエチルケ
トン、ベンゾフェノン等のケトン類：メタノール、エタ
ノール、プロパツール、フタノール等のアルコール類：
メチルエーテル、エチルエーテル、エチルメチルエーテ
ル、メチルプロピルエーテル、エチルプロピルエーテル
、フェノールエーテル、アセタール、環式エーテル（ジ
オキサン、エチレンオキシド等）のエーテル類：アセト
ン、ビナコリン、メチルオキシ１〜、芳香族ケトン（ア
セトフェノン、ベンゾフェノン等）、シケＩ〜ン、環式
ケトン等のケトン類：ホルムアルデヒド、アセトアルデ
ヒド、プチルアルデヒ１〜、ヘンズアルデヒド等のアル
デヒド類；ギ酸、酢酸、プロピオン酸、コハク酩、酪酸
、シュウ酸、酒石酸、ステアリン酸等の有機酸類：酢酸
メチル、酢酸エチル等の酸エステル類；エチレングリコ
ール、ジエチレングリコール等の二価アルコール類；−
酸化炭素、二酸化炭素などを挙げることがてきる。Examples of oxygen-containing compounds include ketones such as acetone, diethyl ketone, and benzophenone; alcohols such as methanol, ethanol, propatool, and phthanol;
Methyl ether, ethyl ether, ethyl methyl ether, methyl propyl ether, ethyl propyl ether, phenol ether, acetal, ethers of cyclic ethers (dioxane, ethylene oxide, etc.): acetone, vinacolin, methyloxy 1~, aromatic ketones (acetophenone) Ketones such as aldehyde, acetaldehyde, butyraldehyde, henzaldehyde; formic acid, acetic acid, propionic acid, succinic acid, butyric acid, oxalic acid, tartaric acid, Organic acids such as stearic acid; Acid esters such as methyl acetate and ethyl acetate; Dihydric alcohols such as ethylene glycol and diethylene glycol; -
Examples include carbon oxide and carbon dioxide.
含窒素化合物としては、例えば１〜リメチルアミン、ト
リエチルアミンなどのアミン類などを挙げることがてき
る。Examples of the nitrogen-containing compound include amines such as 1-trimethylamine and triethylamine.
また、前記炭素源ガスとして、単体てはないが、消防法
に規定される第４類危険物：ガソリンなどの第１石油類
、ケロシン、テレピン油、しょう脳油、松根油などの第
２石油類、重油などの第３石油類、キャー油、シリンタ
ー油などの第４石油類などのガスをも使用することかで
きる。また前記各種の炭素化合物を混合して使用するこ
ともできる。In addition, the carbon source gas may be classified as Class 4 hazardous substances stipulated in the Fire Service Act, such as gasoline and other class 1 petroleums, and kerosene, turpentine oil, ginger oil, pine oil, and other class 2 petroleum oils, although they are not individual. It is also possible to use gases such as tertiary petroleum such as oil, heavy oil, and tertiary petroleum such as carrier oil and cylinder oil. It is also possible to use a mixture of the various carbon compounds mentioned above.
これらの炭素源ガスの中でも、常温で気体または蒸気圧
の高いメタン、エタン、プロパン等のバラフイン系炭化
水素：あるいはアセトン、ヘンンフェノン等のケトン類
、メタノール、エタノール等のアルコール類、−酸化炭
素、二酸化炭素ガス等の含酸素化合物か好ましく、−酸
化炭素は特に好ましい。Among these carbon source gases, baraffinic hydrocarbons such as methane, ethane, and propane, which are gases or have high vapor pressure at room temperature; or ketones such as acetone and hennphenone; alcohols such as methanol and ethanol; carbon oxide, and carbon dioxide; Oxygen-containing compounds such as carbon gas are preferred, and -carbon oxide is particularly preferred.
前記水素ガスには、特に制限がなく、たとえば石油類の
ガス化、天然ガス、水性ガスなどの変成、水の電解、鉄
と水蒸気との反応、石炭の完全ガス化などにより得られ
るものを充分に精製したものを用いるととかてきる。There are no particular restrictions on the hydrogen gas, and hydrogen gas that can be obtained, for example, by gasification of petroleum, metamorphosis of natural gas, water gas, etc., electrolysis of water, reaction of iron with steam, complete gasification of coal, etc. is sufficient. This can be achieved by using purified products.
前記水素ガスを構成する水素は励起されることにより原
子状水素を形成する。Hydrogen constituting the hydrogen gas is excited to form atomic hydrogen.
この原子状水素は、前記タイヤセント類の析出と同時に
析出するクラファイトやアモルファスカーボン等の非タ
イヤセント成分を除去する作用を有する。This atomic hydrogen has the effect of removing non-tire cent components such as graphite and amorphous carbon, which are precipitated simultaneously with the precipitation of the tire cent substances.
前記原料ガスにおける前記炭素源ガスの濃度は、通常、
０．１〜９０％、好ましくは０．１〜８０％である。The concentration of the carbon source gas in the raw material gas is usually
It is 0.1-90%, preferably 0.1-80%.
前記炭素源ガスの濃度か０．１％よりも低いと、１
ダイヤモンドの析出速度か遅くなったり、前記原料ガス
を用いて得られるダイヤモンドと原料繊維との密着性か
充分てはなくなることがある。If the concentration of the carbon source gas is lower than 0.1%, the precipitation rate of diamond may slow down or the adhesion between the diamond and the raw material fiber obtained using the raw material gas may not be sufficient. .
方、９０％を超えると、非晶質炭素を多量に含むダイヤ
モンドか析出することかある。On the other hand, if it exceeds 90%, diamond containing a large amount of amorphous carbon may precipitate.
前記原料ガスを励起する手段としては、たとえばマイク
ロ波ブラスマＣＶＤ法（有磁場ＣＶＤ法、ＥＣＲ−ＣＶ
Ｄ法を含む。）、高周波プラズマＣＶＤ法（熱プラズマ
法を含む。）、直流プラズマＣＶＤ法（熱プラズマ法を
含む。）、熱フイラメント法（ＥＡＣＶＤ法を含む。）
、熱ＣＶＤ法、光ＣＶＤ法、燃焼炎法、スパッタリング
法などを挙げることかできる。As a means for exciting the raw material gas, for example, a microwave plasma CVD method (magnetic field CVD method, ECR-CV
Including method D. ), high frequency plasma CVD method (including thermal plasma method), DC plasma CVD method (including thermal plasma method), thermal filament method (including EACVD method)
, thermal CVD method, optical CVD method, combustion flame method, sputtering method, etc.
これらの中ても、好ましいのは各種プラズマＣＶＤ法（
有磁場ＣＶＤ法、ＥＣＲ−ＣＶＤ法を含む。）である。Among these, various plasma CVD methods (
Includes magnetic field CVD method and ECR-CVD method. ).
これらの方法においては、通常、以下の条件下に反応か
進行して、前記原料繊維の表面にダイヤモンド類か析出
する。In these methods, the reaction usually proceeds under the following conditions, and diamonds are precipitated on the surface of the raw material fiber.
すなわち、前記原料繊維の表面の温度は、前 ２
記原料ガスの励起手段によって異なるのて、概に決定す
ることはてきないが、通常、３００〜１．２００°Ｃ１
好ましくは５００〜１，１００°Ｃである。たとえばプ
ラズマＣＶＤ法を用いる場合には５００〜１．０００°
Ｃか好ましい。That is, the temperature of the surface of the raw material fiber varies depending on the excitation means of the raw material gas and cannot be determined generally, but it is usually 300 to 1.200°C.
Preferably it is 500 to 1,100°C. For example, when using the plasma CVD method, the angle is 500 to 1.000°.
C is preferable.
前記の温度か、３００°Ｃより低いと、前記原料繊維の
表面に析出するダイヤモンド類の析出速度か遅くなった
り、非ダイヤモンド成分を多量に含む膜が析出したりす
ることかある。一方、１，２００°Ｃより高くしても、
それに見合った効果は奏されず、エネルギー効率の点で
不利になるとともに、析出したダイヤモンド類かエツチ
ングされてしまうことがある。If the temperature is lower than 300° C., the rate of precipitation of diamonds deposited on the surface of the raw material fibers may be slowed down, or a film containing a large amount of non-diamond components may be deposited. On the other hand, even if the temperature is higher than 1,200°C,
It does not have a commensurate effect and is disadvantageous in terms of energy efficiency, and the precipitated diamonds may be etched away.
反応圧力は、通常、１０−６〜１０３ｔｏｒｒ、好まし
くは１Ｏ−５ｔｏｒｒ〜７５０ ｔｏｒｒである。The reaction pressure is usually 10-6 to 103 torr, preferably 10-5 torr to 750 torr.
また、必要により、反応室内に磁場を加えた状態で、前
記原料ガスを励起することもてきる。この場合には、前
記原料ガスの励起手段に有磁場ＣＶＤ法を好適に採用す
ることがてきる。Furthermore, if necessary, the raw material gas can be excited with a magnetic field applied inside the reaction chamber. In this case, a magnetic field CVD method can be suitably employed as the source gas excitation means.
反応圧力か１Ｏ−６ｔｏｒｒよりも低いと、ダイヤモン
ド類の析出速度か遅くなったり、ダイヤモンド類か析出
しなくなったりすることかある。If the reaction pressure is lower than 10-6 torr, the rate of precipitation of diamonds may be slowed or no diamonds may be precipitated.
一方、１０３ｔｏｒｒより高くしてもそれに見合った効
果は奏されないことかある。On the other hand, even if the torque is set higher than 103 torr, the corresponding effect may not be achieved.
反応時間は、前記原料繊維の表面の温度、反応圧力、必
要とするダイヤモンド類の粒子径などにより相違するの
で一概に決定することはてきないか、通常は、１０時間
以内とすることができる。Since the reaction time varies depending on the surface temperature of the raw material fiber, the reaction pressure, the required particle size of diamonds, etc., it cannot be determined unconditionally, but it can usually be set within 10 hours.
本発明の可撓性研磨材料は、以上のようにして形成され
る前記ダイヤモンド類析出繊維を有する織布または不織
布を用いてなる。The flexible abrasive material of the present invention uses a woven fabric or nonwoven fabric having the diamond-precipitated fibers formed as described above.
すなわち、本発明の可撓性研磨材料は前記織布または不
織布布上に直接にダイヤモンド類を析出させることによ
り得ることもてきるし、前述の通り前記ダイヤモンド類
析出繊維な織布化あるいは不織布化することにより得る
こともてきる。なお、この場合に前記ダイヤモンド類を
析出させていないｍ維を加えることもてきる。That is, the flexible abrasive material of the present invention can be obtained by depositing diamonds directly on the woven or non-woven fabric, or by forming the diamond-precipitated fiber into a woven or non-woven fabric as described above. You can also gain by doing. In this case, it is also possible to add m-fibers in which the diamonds are not precipitated.
前記織布または不織布の厚みについては、可撓性を損な
わない限り、特に制限はないか１通常は０．０１〜２
ｍ ｍ程度である。Regarding the thickness of the woven fabric or non-woven fabric, there is no particular limit as long as flexibility is not impaired.1 Usually, it is 0.01 to 2.
It is about mm.
本発明の可撓性研磨材料は、たとえば第１図に示したよ
うに、織布または不＃ｌ＆布ｌにおけるダイヤモンド類
２を有する面とは反対側の面に樹脂層３を有していても
よい。この場合の樹脂層は、織布、不織布あるいは小孔
を多数形成したフィルム等て形成することが好ましい。As shown in FIG. 1, for example, the flexible abrasive material of the present invention has a resin layer 3 on the surface opposite to the surface having the diamonds 2 in a woven fabric or a non-woven fabric. Good too. In this case, the resin layer is preferably formed of a woven fabric, a nonwoven fabric, a film with many small holes, or the like.
前記樹脂層を形成する樹脂としては、たとえばエチレン
酢ピコポリマー、塩化ビニル樹脂、ポリエステル樹脂、
エポキシ樹脂、ポリエチレン樹脂、ポリプロピレン樹脂
、ポリアミド樹脂、ポリアミドイミド、ボリイミ１〜樹
脂、ポリウレタン樹脂、シリコーン樹脂などが挙げられ
る。Examples of the resin forming the resin layer include ethylene acetate picopolymer, vinyl chloride resin, polyester resin,
Examples include epoxy resin, polyethylene resin, polypropylene resin, polyamide resin, polyamideimide, polyimide resin, polyurethane resin, and silicone resin.
前記樹脂層を設ける場合、前記樹脂層の厚みは、通常、
０．０１〜１０ｍ ｍ程度である。When providing the resin layer, the thickness of the resin layer is usually
It is approximately 0.01 to 10 mm.
いずれにせよ、本発明の可撓性研磨材料においては、第
１図に示したように、織布または不織布１の全面にダイ
ヤモンド類２を有していてもよいし、織布または不織布
ｌの一部分にダイヤモンド類２を有していてもよい。ま
た、タイヤセント ５
類は粒子状てあってもよいし、被覆膜状てあってもよい
。In any case, in the flexible abrasive material of the present invention, as shown in FIG. A portion may contain diamonds 2. Furthermore, the tire cent type 5 may be in the form of particles or a coated film.
なお、本発明において前記ダイヤモンド類としては、結
晶性の高いダイヤモンドであることか硬度等の点て好ま
しいか、用途によってはダイヤモンド状炭素てあっても
よい。In the present invention, the diamonds may be diamond-like carbon, which is preferable in terms of high crystallinity or hardness, or depending on the application.
本発明の可撓性研磨材料は、様々な材料の研磨に好適に
利用することがてきる。The flexible polishing material of the present invention can be suitably used for polishing various materials.
［実施例］
次に、本発明の実施例を示し、本発明についてさらに具
体的に説明する。[Example] Next, Examples of the present invention will be shown and the present invention will be explained more specifically.
（実施例１）
タンクステン繊維（平均繊維径１２ｐｍ）不織布（１，
００＋ｓ＋ｓＸ １０ｈ＋ｉ ）を反応室内の基板上に
載置した。(Example 1) Tanksten fiber (average fiber diameter 12 pm) nonwoven fabric (1,
00+s+sX 10h+i) was placed on the substrate in the reaction chamber.
次いて、この反応室内に一酸化炭素ガスおよび水素ガス
からなる原料ガス（ＣＯ濃度７％）を導入し、Ｔａフィ
ラメント温度２，３００℃、圧力４（ｌｔ、ｏｒｒ、基
板温度８５０℃、基板−フィラメント間隔３ｍｍの条件
にて、公知の熱フイラメント法に６
よるダイヤモンドの合成を３時間行なって、タンクステ
ン繊維不織布」−に析出物を得た。Next, raw material gas (CO concentration 7%) consisting of carbon monoxide gas and hydrogen gas was introduced into the reaction chamber, Ta filament temperature was 2,300°C, pressure was 4 (lt, orr, substrate temperature was 850°C, substrate - Diamond was synthesized by a known hot filament method for 3 hours under the condition that the filament spacing was 3 mm, and a precipitate was obtained on a tanksten fiber nonwoven fabric.
なお、タンクステン繊維不織布は超音波法による前処理
を行なって核発生密度の増したものを使用した。The tanksten fiber nonwoven fabric was pretreated by ultrasonication to increase the nucleation density.
この析出物についてラマン分光分析を行なったところ、
１３３３ｃｍ−’の位置にダイヤモンドに起因するシャ
ープなピークか認められた。When we performed Raman spectroscopy on this precipitate, we found that
A sharp peak due to diamond was observed at a position of 1333 cm-'.
また、この析出物の粒径は３〜５ｐｍて均一であった。Moreover, the particle size of this precipitate was 3 to 5 pm and uniform.
次いて、上記タンクステン繊維不織布の裏面にポリエス
テルからなる樹脂層（厚み０．５＋＊ｍ ）を溶着して
、可撓性研磨材料を得た。Next, a resin layer (thickness: 0.5+*m 2 ) made of polyester was welded to the back surface of the tanksten fiber nonwoven fabric to obtain a flexible abrasive material.
得られた可撓性研磨材料を用いて、超硬合金（ＷＣＣｏ
、 ＨＲＡ ９２．４人）を研磨したところ、Ｒ□、＝
１，０（１（ｌ入の鏡面に仕上げることができた。Using the obtained flexible abrasive material, cemented carbide (WCCo)
, HRA 92.4 people), R□,=
1,0(1(1) I was able to finish it to a mirror surface.
また、研磨粉の除去は容易てあった。Also, polishing powder was easy to remove.
（実施例２）
前記実施例１において、樹脂層を形成しなかったほかは
、前記実施例１と同様にして実施した。(Example 2) The same procedure as in Example 1 was carried out except that the resin layer was not formed.
得られた可撓性研磨材料を用いて、超硬合金（ＷＣ−Ｇ
ｏ、 ＨＭＡ ９２．４人）を研磨したところ、Ｒ□つ
＝］、０００人の鏡面に仕上げることかできた。Using the obtained flexible abrasive material, cemented carbide (WC-G)
o, HMA 92.4 people), it was possible to finish it to a mirror surface of R□tsu=], 000 people.
また、研磨粉の除去は容易てあった。Also, polishing powder was easy to remove.
［発明の効果］
本発明によると、
（１） 織布または不織布からなるので、可撓性に優
れる、
（２） 繊維径、繊維の種類あるいはこれらの組み合
わせ等により、任意の仕上げか可能な研磨材料を得るこ
とかできる、
（３）シかも、気相法により析出したダイヤモンド類を
表面に有する繊維を含むので、研磨性能に優れるととも
に目詰りがない、
（４）シたかって、たとえば被研磨材が曲面や起伏面等
の複雑な形状を有していても効率良く研磨することかて
きる、
等の利点を有する工業的に有用な可撓性研磨材料を提供
することかてきる。[Effects of the Invention] According to the present invention, (1) It is made of woven fabric or non-woven fabric, so it has excellent flexibility. (2) It can be polished to any desired finish depending on the fiber diameter, type of fiber, or a combination thereof. (3) Since it contains fibers with diamonds deposited on the surface by the vapor phase method, it has excellent polishing performance and does not cause clogging. It is possible to provide an industrially useful flexible abrasive material having the following advantages: Even if the material has a complicated shape such as a curved surface or an undulating surface, it can be efficiently polished.
４、4,
第１図は本発明の可撓性研磨材料の一例を示す説明図で
ある。
・織布または不織布、
・タイヤ
セント類
９
第１
図FIG. 1 is an explanatory diagram showing an example of the flexible abrasive material of the present invention.・Woven or non-woven fabric, ・Tire cents 9 Figure 1
Claims (1)
はダイヤモンド状炭素を表面に有する繊維を含む織布ま
たは不織布を用いてなることを特徴とする可撓性研磨材
料。(1) A flexible abrasive material characterized by using a woven or nonwoven fabric containing fibers having diamond and/or diamond-like carbon on the surface deposited by a vapor phase method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13967489A JPH033778A (en) | 1989-06-01 | 1989-06-01 | Flexible polishing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13967489A JPH033778A (en) | 1989-06-01 | 1989-06-01 | Flexible polishing material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033778A true JPH033778A (en) | 1991-01-09 |
Family
ID=15250779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13967489A Pending JPH033778A (en) | 1989-06-01 | 1989-06-01 | Flexible polishing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033778A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5202534A (en) * | 1990-12-16 | 1993-04-13 | Ricoh Company, Ltd. | Developing apparatus using a liquid developer and having a system for cleaning the development region with a vacuum pressure |
| US5643343A (en) * | 1993-11-23 | 1997-07-01 | Selifanov; Oleg Vladimirovich | Abrasive material for precision surface treatment and a method for the manufacturing thereof |
| US5711773A (en) * | 1994-11-17 | 1998-01-27 | Plasmoteg Engineering Center | Abrasive material for precision surface treatment and a method for the manufacturing thereof |
-
1989
- 1989-06-01 JP JP13967489A patent/JPH033778A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5202534A (en) * | 1990-12-16 | 1993-04-13 | Ricoh Company, Ltd. | Developing apparatus using a liquid developer and having a system for cleaning the development region with a vacuum pressure |
| US5643343A (en) * | 1993-11-23 | 1997-07-01 | Selifanov; Oleg Vladimirovich | Abrasive material for precision surface treatment and a method for the manufacturing thereof |
| US5711773A (en) * | 1994-11-17 | 1998-01-27 | Plasmoteg Engineering Center | Abrasive material for precision surface treatment and a method for the manufacturing thereof |
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