JPH0334957Y2 - - Google Patents
Info
- Publication number
- JPH0334957Y2 JPH0334957Y2 JP1985090162U JP9016285U JPH0334957Y2 JP H0334957 Y2 JPH0334957 Y2 JP H0334957Y2 JP 1985090162 U JP1985090162 U JP 1985090162U JP 9016285 U JP9016285 U JP 9016285U JP H0334957 Y2 JPH0334957 Y2 JP H0334957Y2
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- chip component
- lower rods
- mounting head
- driven
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 210000000078 claw Anatomy 0.000 claims description 5
- 230000001133 acceleration Effects 0.000 description 6
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Automatic Assembly (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、チツプ部品を吸着する吸着ピンを昇
降させるためのチツプ部品装着ヘツド装置に関す
る。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a chip component mounting head device for raising and lowering suction pins that attract chip components.
（従来の技術及び問題点）
従来、この種のチツプ部品装着ヘツドとして
は、エアーシリンダで吸着ピンを昇降させるもの
が一般的であつた。(Prior Art and Problems) Conventionally, this type of chip component mounting head has generally been one in which suction pins are raised and lowered using an air cylinder.
しかし、エアーシリンダはエアーを送つてから
実際にピストンがシリンダ内の静止摩擦に打ち勝
つて動き出すまでに時間がかかり、また動摩擦は
静止摩擦よりも小さいためピストンは一旦動きだ
すと比較的高速で動作し、この高速動作は停止直
前まで持続する特性を具備している。このような
特性は、吸着ピンで供給部よりチツプ部品を吸着
したり、吸着したチツプ部品をプリント基板に押
し付けたりする目的には余り好ましくない。すな
わち、チツプ部品に大きな加速度が加わらないよ
うに、チツプ部品を吸着して上昇もしくは下降を
開始するときは緩やかに動き出し、中間点で最大
速度となり、停止直前には速度は緩やかに低下し
て停止する特性が最も好ましいが、エアーシリン
ダではこのような吸着ピンの動作を実現するのは
不可能である。 However, with air cylinders, it takes time for the piston to overcome the static friction inside the cylinder and actually start moving after air is sent, and since kinetic friction is smaller than static friction, once the piston starts moving, it moves at a relatively high speed. This high-speed operation has the characteristic of continuing until immediately before stopping. Such characteristics are not very preferable for the purpose of sucking chip parts from the supply section with a suction pin or pressing the sucked chip parts against a printed circuit board. In other words, in order to prevent large acceleration from being applied to the chip parts, when the chip parts are picked up and begin to move up or down, they begin to move slowly, reaching the maximum speed at the halfway point, and just before stopping, the speed gradually decreases and then stops. However, it is impossible to realize such a suction pin operation with an air cylinder.
従つて、従来のエアーシリンダを用いたチツプ
部品装着ヘツドでは、チツプ部品に加わる加速度
が大きく、チツプ部品の吸着、保持を確実に実行
できるようにエアーシリンダの動作速度を低めに
設定せざるを得ず、高速化に限度があつた。 Therefore, in the conventional chip component mounting head using an air cylinder, the acceleration applied to the chip component is large, and the operating speed of the air cylinder must be set to a low value in order to reliably attract and hold the chip component. However, there was a limit to how high the speed could be increased.
（問題点を解決するための手段）
本考案は、上記の点に鑑み、チツプ部品を吸着
する吸着ピンをエアーシリンダで駆動するかわり
に、カム駆動による上下ロツドに吸着ピンを連結
したチツプ部品装着ヘツドの構成として、チツプ
部品に加わる加速度を最小限となるような理想的
速度特性で上下ロツドを駆動可能にし、かつまた
複数のチツプ部品装着ヘツドを１列配置して任意
のものを選択駆動する構成とすることにより、チ
ツプ部品装着動作全体の高速化及び効率化を図つ
たチツプ部品装着ヘツド装置を提供しようとする
ものである。(Means for Solving the Problems) In view of the above points, the present invention provides a method for attaching chip parts by connecting the suction pins to upper and lower rods driven by cams, instead of driving the suction pins that adsorb chip parts with air cylinders. The structure of the head allows the upper and lower rods to be driven with ideal speed characteristics that minimize the acceleration applied to the chip components, and also allows multiple chip component mounting heads to be arranged in one row to selectively drive any one. By adopting this structure, it is an object of the present invention to provide a chip component mounting head device which can increase the speed and efficiency of the entire chip component mounting operation.
本考案は、チツプ部品装着ヘツドを、チツプ部
品を吸着する吸着ピンに連通する真空吸引通路を
有する上下ロツドと、該上下ロツドを摺動自在に
支持する如く支持フレーム上に立設固定された支
持体と、前記上下ロツドを下方に付勢するばね
と、前記上下ロツドに係合して当該上下ロツドを
上昇位置にロツクするロツク爪と、前記上下ロツ
ドとロツク爪との係合を外す係合解除手段とを有
する構成とし、かつチツプ部品装着ヘツドを前記
支持フレーム上に複数個１列に配列し、回転する
カムで駆動されるカムフオロアを固着した１本の
従動軸を各チツプ部品装着ヘツドの配列方向に沿
わせて配し、各チツプ部品装着ヘツドの前記上下
ロツドに対し下方より係合する従動アームをそれ
ぞれ前記従動軸に固着した構成を備えている。そ
して、選択されたチツプ部品装着ヘツドについて
前記係合解除手段によつて前記ロツク爪の前記上
下ロツドに対する係合を外して前記従動アームの
動作に従い昇降させるようにしている。 The present invention consists of upper and lower rods having vacuum suction passages communicating with suction pins that adsorb chip components, and supports that are erected and fixed on a support frame so as to slidably support the upper and lower rods. a spring that urges the upper and lower rods downward; a locking claw that engages with the upper and lower rods to lock the upper and lower rods in the raised position; and an engagement that releases the engagement between the upper and lower rods and the locking claws. A plurality of chip component mounting heads are arranged in a row on the support frame, and one driven shaft to which a cam follower driven by a rotating cam is fixed is connected to each chip component mounting head. A structure is provided in which driven arms are arranged along the arrangement direction and engage with the upper and lower rods of each chip component mounting head from below, and each is fixed to the driven shaft. The selected chip component mounting head is then disengaged from the lock pawl with the upper and lower rods by the disengagement means, and is moved up and down in accordance with the movement of the driven arm.
本考案は、上記の如き構成とすることにより、
従来技術の問題点を解決している。（作用）
本考案では、吸着ピンが連結された上下ロツド
を、カム機構によつて駆動される従動部材によつ
て上下させており、この結果、上下ロツドの上限
位置及び下限位置での動きを低速に、中間位置で
の動きを高速化し、チツプ部品に加わる加速度を
最小限にして全体としての上下ロツドの移動速度
を高速化することができる。従つて、チツプ部品
の装着動作の高速化を図ることができる。また、
カム機構はエアーシリンダに比べて動作が確実で
あり、動作の割り付けのオーバーラツプ（例えば
プリント基板を保持したXYテーブルが完全に停
止するまえに上下ロツドの下降を開始する等）が
可能である。さらに、チツプ部品装着ヘツドを複
数個１列に配列して共通のカム機構で駆動すると
ともに、任意のチツプ部品装着ヘツドのみを選択
状態として装着動作を実行させることができ、チ
ツプ部品装着の効率化も実現できる。 By having the above-mentioned configuration, the present invention has the following features:
This solves the problems of the conventional technology. (Function) In the present invention, the upper and lower rods to which the suction pins are connected are moved up and down by a driven member driven by a cam mechanism, and as a result, the movement of the upper and lower rods at the upper and lower limit positions is controlled. It is possible to increase the movement speed at a low speed or at an intermediate position, minimize the acceleration applied to the chip parts, and increase the overall movement speed of the upper and lower rods. Therefore, it is possible to increase the speed of the chip component mounting operation. Also,
The cam mechanism operates more reliably than an air cylinder, and it is possible to overlap the allocation of operations (for example, the upper and lower rods start lowering before the XY table holding the printed circuit board comes to a complete stop). Furthermore, a plurality of chip component mounting heads can be arranged in a row and driven by a common cam mechanism, and only a given chip component mounting head can be selected to perform the mounting operation, increasing the efficiency of chip component mounting. can also be achieved.
（実施例）
以下、本考案に係るチツプ部品装着ヘツド装置
の実施例を図面に従つて説明する。(Example) Hereinafter, an example of the chip component mounting head device according to the present invention will be described with reference to the drawings.
第１図乃至第５図において、１は支持フレーム
であり、該支持フレーム１上に複数の（例えば10
個の）チツプ部品装着ヘツド２が第２図及び抜第
３図に示すように等間隔で垂直に配置されてい
る。 1 to 5, 1 is a support frame, and a plurality of (for example, 10
As shown in FIG. 2 and FIG. 3, the chip component mounting heads 2 are arranged vertically at regular intervals.
各チツプ部品装着ヘツド２は、第３図の−
断面を示す第１図のように支持フレーム１上に立
設固定された支持体３と、該支持体３により上下
方向（垂直方向）に摺動自在に支持される上下ロ
ツド４と、支持体３の外側に取り付けられた真空
用バルブ（開閉バルブ）５及び電磁プランジヤー
６とを有している。 Each chip component mounting head 2 is located at -
As shown in FIG. 1, which shows a cross section, a support body 3 is erected and fixed on a support frame 1, an upper and lower rod 4 is supported by the support body 3 so as to be slidable in the vertical direction (vertical direction), and a support body. It has a vacuum valve (opening/closing valve) 5 and an electromagnetic plunger 6 attached to the outside of the valve 3.
上下ロツド４の下端には、チツプ部品を吸着す
る吸着ピン（例えば中空円筒）１０が連結される
ようになつており、上下ロツド４にその下端面に
開口する真空吸引通路７が形成されている。この
真空吸引通路７は吸着ピン１０に連通し、さらに
上下ロツド４の側部に形成された長穴１１、支持
体３側の真空吸引通路１２を通して真空用バルブ
５に連通している。 A suction pin (for example, a hollow cylinder) 10 for suctioning chip parts is connected to the lower end of the upper and lower rods 4, and a vacuum suction passage 7 that opens at the lower end surface of the upper and lower rods 4 is formed. . This vacuum suction passage 7 communicates with the suction pin 10, and further communicates with the vacuum valve 5 through an elongated hole 11 formed on the side of the upper and lower rods 4 and a vacuum suction passage 12 on the support body 3 side.
また、上下ロツド４の側面には回り止め凹部１
５が形成され、これに支持体３に固定された回り
止め部材１６が係合している。 In addition, a detent recess 1 is provided on the side surface of the upper and lower rods 4.
5 is formed, and a detent member 16 fixed to the support body 3 engages with this.
さらに、上下ロツド４の側面にロツク用溝１７
が形成され、これに対し支持体３に枢着されたロ
ツク爪１８が係合可能に配置されている。このロ
ツク爪１８は係合解除手段としての前記電磁プラ
ンジヤー６に連結され、該プランジヤーが動作し
ていないときは伸長ばね１９により前記ロツク用
溝１７に係合して上下ロツド４を上昇位置にロツ
クする。プランジヤー６の引き込み動作時はロツ
ク爪１８とロツク用溝１７との係合が外れ、上下
ロツド４は自由に昇降可能になる。 Furthermore, a locking groove 17 is provided on the side surface of the upper and lower rods 4.
A lock pawl 18 pivotally connected to the support body 3 is arranged to be engageable with the lock pawl 18 . This lock pawl 18 is connected to the electromagnetic plunger 6 as an engagement release means, and when the plunger is not operating, it engages with the locking groove 17 by an extension spring 19 to lock the upper and lower rods 4 in the raised position. do. When the plunger 6 is retracted, the locking pawl 18 and the locking groove 17 are disengaged, and the upper and lower rods 4 can freely move up and down.
前記支持体３の上面には、有底筒状のばね押さ
え部材２０が螺着され、このばね押さえ部材２０
と上下ロツド４の上端間に圧縮ばね２１が挿入さ
れている。従つて、上下ロツド４は圧緒ばね２１
によつて下方に付勢されている。 A bottomed cylindrical spring pressing member 20 is screwed onto the upper surface of the support body 3.
A compression spring 21 is inserted between the upper ends of the upper and lower rods 4. Therefore, the upper and lower rods 4 are connected to the compression spring 21.
is urged downward by.
さて、上下ロツド４の上端寄り位置の両側に外
部からの操作力を受けるために横方向ピン２５が
固着され、これにカム従動軸２６に固着された従
動部材としての従動アーム２７が第１図及び第２
図のように下方より係合している（従動アーム２
７の上面がピン２５の下面に当たつている。）。前
記カム従動軸２６は長尺であつて、各チツプ部品
装着ヘツド２の配列方向に沿つて配され、各々の
チツプ部品装着ヘツド２に対して共通に使用され
る。 Now, lateral pins 25 are fixed to both sides of the upper end of the upper and lower rods 4 in order to receive operating force from the outside, and a driven arm 27 as a driven member fixed to a cam driven shaft 26 is attached to these pins as shown in FIG. and second
As shown in the figure, it is engaged from below (driven arm 2
The upper surface of 7 is in contact with the lower surface of pin 25. ). The cam driven shaft 26 is elongated, is arranged along the arrangement direction of each chip component mounting head 2, and is commonly used for each chip component mounting head 2.
第５図のように、支持フレーム１にはサーボモ
ータ３０が固定され、該サーボモータ３０の回転
軸にカム３１が固着されている。そして、該カム
３１に当接するローラー３２を先端に枢着したカ
ムフオロア３３が前記従動軸２６に固着されてい
る。ここで、カム３１の形状は、１回転で前記従
動アーム２７を１往復（上昇位置−下降位置−上
昇位置）させるものであり、従動アーム２７の上
昇位置及び下降位置での動きを緩やかに（低速
に）、中間位置での動きを高速とするように設定
しておく。なお、従動軸２６の他端にはアーム３
５が固着され、該アーム３５はばねにより前記ロ
ーラー３２がカム３１に圧接する方向に付勢され
ている。 As shown in FIG. 5, a servo motor 30 is fixed to the support frame 1, and a cam 31 is fixed to the rotating shaft of the servo motor 30. As shown in FIG. A cam follower 33 is fixed to the driven shaft 26 and has a roller 32 pivoted at its tip that contacts the cam 31. Here, the shape of the cam 31 is such that it causes the driven arm 27 to reciprocate once (up position - down position - up position) in one rotation, and allows the movement of the driven arm 27 in the up position and down position to be gradual ( (low speed) and high speed movement at intermediate positions. Note that the arm 3 is attached to the other end of the driven shaft 26.
5 is fixed, and the arm 35 is biased by a spring in a direction in which the roller 32 comes into pressure contact with the cam 31.
以上の実施例の動作をまずチツプ部品をプリン
ト基板に装着する場合で説明する。前記カム３１
の回転に伴う前記カム従動軸２６の往復回転運動
は、各チツプ部品装着ヘツド２に対応した従動ア
ーム２７を作動させている。ただし、選択されて
いないチツプ部品装着ヘツド２は電磁プランジヤ
ー６が励磁されず、ロツク爪１８により上下ロツ
ド４は上昇位置にラツチされているから、上下ロ
ツド４下端の吸着ピン１０は上昇した位置で停止
している。 The operation of the above-described embodiment will first be explained with reference to the case where a chip component is mounted on a printed circuit board. The cam 31
The reciprocating rotational movement of the cam driven shaft 26 accompanying the rotation of the cam driven shaft 26 operates the driven arm 27 corresponding to each chip component mounting head 2. However, in the unselected chip component mounting head 2, the electromagnetic plunger 6 is not energized and the upper and lower rods 4 are latched in the raised position by the lock claw 18, so the suction pins 10 at the lower ends of the upper and lower rods 4 are in the raised position. It's stopped.
選択されたチツプ部品装着ヘツド２では電磁プ
ランジヤー６が励磁される結果、ロツク爪１８と
ロツク用溝１７との係合は外れて上下ロツド４は
摺動自在に解放されるから、従動アーム２７の先
端の下降に伴つて上下ロツド４は上昇位置から下
降し始める。上下ロツド４は中間位置で最も高速
となり下降位置に近付くにしたがつて低速とな
る。そして、上下ロツド４の下際位置で吸着ピン
１０下端に吸着されたチツプ部品４０はプリント
基板４１に対し押し付けられて装着動作が実行さ
れる。この際、チツプ部品４０に加わる衝撃を最
小限とすることができる。その後、上下ロツド４
は従動アーム２７の動きに伴つて再び上昇位置に
復帰する。 In the selected chip component mounting head 2, the electromagnetic plunger 6 is energized, and as a result, the lock pawl 18 and the locking groove 17 are disengaged, and the upper and lower rods 4 are slidably released. As the tip descends, the upper and lower rods 4 begin to descend from the raised position. The vertical rod 4 is at its highest speed at the intermediate position and becomes slower as it approaches the lowered position. Then, the chip component 40 sucked to the lower end of the suction pin 10 at the bottom position of the upper and lower rods 4 is pressed against the printed circuit board 41, and the mounting operation is executed. At this time, the impact applied to the chip component 40 can be minimized. After that, the upper and lower rods 4
returns to the raised position as the driven arm 27 moves.
チツプ部品４０を位置決め及び方向転換する場
合には、カム３１は、半回転後停止し、さらに残
りの半回転を実行する。従つて、上下ロツド４は
上昇位置から下降位置に達した後、一旦停止し、
この停止状態で所要のチツプ部品の位置決め及び
方向転換を行い、その後上昇位置に復帰する。 When positioning and redirecting the chip part 40, the cam 31 stops after half a revolution and then performs the remaining half revolution. Therefore, after the vertical rod 4 reaches the lowered position from the raised position, it stops once, and
In this stopped state, necessary positioning and direction changes of the chip parts are performed, and then the chip returns to the raised position.
（考案の効果）
以上説明したように、本考案のチツプ部品装着
ヘツド装置では、各々のチツプ部品装着ヘツドが
チツプ部品を吸着する吸着ピンをエアーシリンダ
で駆動するかわりに、カム駆動による上下ロツド
に連結する構成となつており、チツプ部品に加わ
る加速度を最小限となるような理想的速度特性で
上下ロツドを駆動可能である。すなわち、上下ロ
ツドの上限位置及び下限位置での動きを低速に、
中間位置での動きを高速化し、チツプ部品に加わ
る加速度を最小限にして全体としての上下ロツド
の移動速度を高速化することができる。また、カ
ム機構は複数個１列に配置した各チツプ部品装着
ヘツドに共通に利用できるので機構が簡単にな
り、しかもエアーシリンダに比べて動作が確実で
あり、動作の割り付けのオーバーラツプ（例えば
プリント基板を保持したXYテーブルが完全に停
止するまえに上下ロツドの下降を開始する等）が
可能である。さらに、複数個のチツプ部品装着ヘ
ツドのうちの任意のものを選択的に昇降させるこ
とができるようになつている。従つて、チツプ部
品装着動作全体の高速化を図ることが出来、装着
動作の信頼性の向上も可能である。(Effects of the Invention) As explained above, in the chip component mounting head device of the present invention, each chip component mounting head uses an air cylinder to drive the suction pin that attracts the chip components, but instead uses the upper and lower rods driven by cams. The upper and lower rods can be driven with ideal speed characteristics that minimize the acceleration applied to the chip parts. In other words, the movement of the upper and lower rods at the upper and lower limit positions is slowed down,
It is possible to speed up the movement at the intermediate position, minimize the acceleration applied to the chip parts, and increase the overall movement speed of the upper and lower rods. In addition, the cam mechanism can be used in common for each chip component mounting head arranged in a row, which simplifies the mechanism.Moreover, compared to air cylinders, the operation is more reliable, and there is no overlap in operation allocation (for example, printed circuit boards). It is possible for the upper and lower rods to start descending before the XY table holding the table has completely stopped. Furthermore, any one of the plurality of chip component mounting heads can be selectively raised and lowered. Therefore, it is possible to speed up the entire chip component mounting operation, and it is also possible to improve the reliability of the mounting operation.
第１図は本考案に係るチツプ部品装着ヘツド装
置の実施例を示す一部を断面とした側面図、第２
図はチツプ部品装着ヘツドを支持フレームに複数
個配列した状態の平面図、第３図は同正面図、第
４図はカム駆動部分の側面図、第５図は同正面図
である。
１……支持フレーム、２……チツプ部品装着ヘ
ツド、３……支持体、４……上下ロツド、６……
電磁プランジヤー、７……真空吸引通路、１０…
…吸着ピン、２６……従動軸、２７……従動アー
ム、３１……カム。
FIG. 1 is a partially sectional side view showing an embodiment of the chip component mounting head device according to the present invention;
The figure is a plan view of a state in which a plurality of chip component mounting heads are arranged on a support frame, FIG. 3 is a front view of the same, FIG. 4 is a side view of the cam driving portion, and FIG. 5 is a front view of the same. DESCRIPTION OF SYMBOLS 1... Support frame, 2... Chip component mounting head, 3... Support body, 4... Upper and lower rods, 6...
Electromagnetic plunger, 7... Vacuum suction passage, 10...
...Adsorption pin, 26...driven shaft, 27...driven arm, 31...cam.
Claims (1)
吸引通路を有する上下ロツド４と、該上下ロツド
４を摺動自在に支持する如く支持フレーム１上に
立設固定された支持体３と、前記上下ロツド４を
下方に付勢するばね２１と、前記上下ロツド４に
係合して当該上下ロツド４を上昇位置にロツクす
るロツク爪１８と、前記上下ロツド４とロツク爪
１８との係合を外す係合解除手段とを有するチツ
プ部品装着ヘツド２を、前記支持フレーム１上に
複数個１列に配列し、 回転するカム３１で駆動されるカムフオロア３
３を固着した１本の従動軸２６を各チツプ部品装
着ヘツド２の配列方向に沿わせて配し、 各チツプ部品装着ヘツド２の前記上下ロツド４
に対し下方より係合する従動アーム２７をそれぞ
れ前記従動軸２６に固着した構成を備え、 選択されたチツプ部品装着ヘツド２について前
記係合解除手段によつて前記ロツク爪１８の前記
上下ロツド４に対する係合を外して前記従動アー
ム２７の動作に従い昇降させることを特徴とする
チツプ部品装着ヘツド装置。[Claims for Utility Model Registration] An upper and lower rod 4 having a vacuum suction passage communicating with a suction pin for suctioning chip parts, and an upper and lower rod 4 erected and fixed on a support frame 1 so as to slidably support it. A support body 3, a spring 21 that urges the upper and lower rods 4 downward, a lock claw 18 that engages with the upper and lower rods 4 to lock the upper and lower rods 4 in the raised position, and the upper and lower rods 4 and the lock claws. A plurality of chip component mounting heads 2 having disengagement means for disengaging from the chip component mounting head 18 are arranged in a row on the support frame 1, and a cam follower 3 driven by a rotating cam 31 is arranged on the support frame 1.
3 is fixedly attached to the driven shaft 26 along the arrangement direction of each chip component mounting head 2, and the upper and lower rods 4 of each chip component mounting head 2 are connected to each other.
A structure is provided in which driven arms 27 that engage from below are fixed to the driven shafts 26, respectively, and the lock pawl 18 is connected to the upper and lower rods 4 by the disengagement means for the selected chip component mounting head 2. A chip component mounting head device characterized in that the chip component mounting head device is moved up and down according to the movement of the driven arm 27 after being disengaged.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985090162U JPH0334957Y2 (en) | 1985-06-17 | 1985-06-17 | |
| CN 85107808 CN1007692B (en) | 1985-05-20 | 1985-09-10 | Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor |
| DE3532500A DE3532500C2 (en) | 1984-09-17 | 1985-09-12 | Pneumatically operated assembly head with suction chamber for a suction pipette |
| CA000490861A CA1239482A (en) | 1984-09-17 | 1985-09-16 | Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor |
| GB08522870A GB2166372B (en) | 1984-09-17 | 1985-09-16 | Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor |
| KR1019850006772A KR900000185B1 (en) | 1984-09-17 | 1985-09-17 | Mounting chip type circuit elements for method apparatus |
| FR8513777A FR2575630B1 (en) | 1984-09-17 | 1985-09-17 | METHOD FOR MOUNTING CHIP TYPE CIRCUIT ELEMENTS ON PRINTED CIRCUIT BOARDS AND APPARATUS THEREOF |
| US07/067,648 US4881319A (en) | 1984-09-17 | 1987-06-26 | Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor |
| MYPI87001971A MY102558A (en) | 1984-09-17 | 1987-09-26 | Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985090162U JPH0334957Y2 (en) | 1985-06-17 | 1985-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61207075U JPS61207075U (en) | 1986-12-27 |
| JPH0334957Y2 true JPH0334957Y2 (en) | 1991-07-24 |
Family
ID=30644910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985090162U Expired JPH0334957Y2 (en) | 1984-09-17 | 1985-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334957Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0682957B2 (en) * | 1988-04-25 | 1994-10-19 | 三洋電機株式会社 | Electronic component bonding equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57184294A (en) * | 1982-03-04 | 1982-11-12 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
| JPS5917975A (en) * | 1982-06-30 | 1984-01-30 | エ−ル・フレ−リツヒ・アクチエンゲゼルシヤフト・フユ−ル・エネルギ−リユツクゲヴインヌング | Method and apparatus for continuously producing maltose from grain |
| JPS5933999A (en) * | 1982-08-18 | 1984-02-24 | Nissan Shatai Co Ltd | Structure of flat type speaker |
| JPS59198800A (en) * | 1983-04-26 | 1984-11-10 | 株式会社デンソー | Multiheat part assembling device |
-
1985
- 1985-06-17 JP JP1985090162U patent/JPH0334957Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57184294A (en) * | 1982-03-04 | 1982-11-12 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
| JPS5917975A (en) * | 1982-06-30 | 1984-01-30 | エ−ル・フレ−リツヒ・アクチエンゲゼルシヤフト・フユ−ル・エネルギ−リユツクゲヴインヌング | Method and apparatus for continuously producing maltose from grain |
| JPS5933999A (en) * | 1982-08-18 | 1984-02-24 | Nissan Shatai Co Ltd | Structure of flat type speaker |
| JPS59198800A (en) * | 1983-04-26 | 1984-11-10 | 株式会社デンソー | Multiheat part assembling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61207075U (en) | 1986-12-27 |
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