JPH03280588A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH03280588A JPH03280588A JP8167490A JP8167490A JPH03280588A JP H03280588 A JPH03280588 A JP H03280588A JP 8167490 A JP8167490 A JP 8167490A JP 8167490 A JP8167490 A JP 8167490A JP H03280588 A JPH03280588 A JP H03280588A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- photosensitive resist
- wiring board
- resist
- photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 238000007747 plating Methods 0.000 claims abstract description 14
- 229920003986 novolac Polymers 0.000 claims abstract description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 9
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical compound [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract 3
- 239000012670 alkaline solution Substances 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- -1 azo compound Chemical class 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000004494 ethyl ester group Chemical group 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- OAZWDJGLIYNYMU-UHFFFAOYSA-N Leucocrystal Violet Chemical compound C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 OAZWDJGLIYNYMU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000006149 azo coupling reaction Methods 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はプリント配線板の製造方法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for manufacturing a printed wiring board.
（従来の技術）
プリント配線板は、例えば、絶縁基板に回路と逆パター
ンにめっきレジストを形成し、次いで無電解めっき払に
よりめっきレジスト以外の箇所をめっきして回路を形成
している。(Prior Art) In a printed wiring board, for example, a plating resist is formed on an insulating substrate in a pattern opposite to that of a circuit, and then areas other than the plating resist are plated by electroless plating to form a circuit.
めっきレジストを形成するには、スクリーン印刷による
方法とフォトによる方法とがあり、特に高密度化には後
者による方法が用いられている。There are two methods for forming a plating resist: a screen printing method and a photo method, and the latter method is particularly used for high density.
フォト法によりめっきレジストを形成するには、先ず、
絶縁基板の表面に感光性レジストとして感光性液状組成
物を塗布したり感光性フィルムを張り付ける。次いで、
感光性レジストの表面にネガフィルムを１ｉ＃Ｓし、紫
外線を照射し、活性光露光して照射部分の感光性レジス
トを重合する。露光後、１．１．１１−リクロロエタン
等の現像液等により現像して、感光性レジストの重合し
た以外の部分を除去する。To form a plating resist using the photo method, first,
A photosensitive liquid composition is applied as a photosensitive resist or a photosensitive film is attached to the surface of an insulating substrate. Then,
A negative film of 1i#S is placed on the surface of the photosensitive resist, irradiated with ultraviolet rays, and exposed to active light to polymerize the photosensitive resist in the irradiated areas. After exposure, the photosensitive resist is developed with a developer such as 1.1.11-lichloroethane to remove the portions of the photosensitive resist other than the polymerized portions.
なお、−船釣に、無電解めっき処理に用いるめっき液は
、ｐＨ＝１２程度の強アルカリ性である。In addition, the plating solution used for the electroless plating process for boat fishing is strongly alkaline with a pH of about 12.
それ故、感光性レジストには、アルカリ水溶液には溶解
しない、有機溶剤系現像液により現像可能な物質を用い
ている。Therefore, the photosensitive resist uses a substance that is not soluble in an alkaline aqueous solution but can be developed with an organic solvent developer.
（発明が解決しようとするＷＲ題）
ところで、有ｍ溶剤系現像液として代表的な１１．１ト
リクロロエタンは、環境を汚染する物質とされその処理
に炭制を受け、地下水への浸透による汚染量を３ｐρ腸
以内に抑えるよう行政指導がされている。しかし、この
処理は現在の技術では非常に困難な欠点がある。(WR problem to be solved by the invention) By the way, 11.1 trichloroethane, which is a typical solvent-based developer, is considered to be a substance that pollutes the environment, and its treatment is subject to carbon control. Administrative guidance has been given to keep the amount of alcohol to less than 3 pρ. However, this process has the disadvantage that it is very difficult with current technology.
本発明の目的は、以上の欠点を改良し、廃液処理の容易
な現像液を用いることのできる感光性レジストを使用し
たプリント配線板の製造方法を提供するものである。An object of the present invention is to provide a method for manufacturing a printed wiring board using a photosensitive resist, which improves the above-mentioned drawbacks and allows the use of a developer that is easy to dispose of as waste.
（課題を解決するための手段ン
本発明は、上記の目的を達成するために、絶縁基板に感
光性レジストを積層し、これを活性光露光し現像してめ
っきレジストを形成し、次いで無電解めっき処理して回
路を形成するプリント配線板の製造方法において、感光
性レジストとしてキノンジアジド−ノボラックフェノー
ル系ポジ型感光性組成物を用い、これをアルカリ水溶液
系の現像液により現像することを特徴とするプリント配
線板の製造方法を提供するものである。(Means for Solving the Problems) In order to achieve the above object, the present invention involves laminating a photosensitive resist on an insulating substrate, exposing it to active light and developing it to form a plating resist, and then electroless plating resist. A method for manufacturing a printed wiring board in which a circuit is formed by plating, characterized by using a quinone diazide-novolac phenol positive photosensitive composition as a photosensitive resist, and developing this with an alkaline aqueous developer. A method for manufacturing a printed wiring board is provided.
（作用）
キノンジアジドーノポラックフ１ノール系ポジ型感光性
組成物からなる感光性レジストに紫外線を照射すると、
キノンジアジド成分が化学変化し、更に水と反応してカ
ルボン酸を生成する。従って、アルカリ水溶液系現像液
によって紫外線を照射した部分を溶解できる。(Function) When a photosensitive resist made of a quinone diazidonoporac 1-nor type positive photosensitive composition is irradiated with ultraviolet rays,
The quinonediazide component undergoes a chemical change and further reacts with water to produce carboxylic acid. Therefore, the portion irradiated with ultraviolet rays can be dissolved by the alkaline aqueous developer.
また、紫外線を照射しなかった部分では、キノンジアジ
ド成分は、アルカリ水溶液系現ｆ＃液やアルカリめっき
浴中で、特にジアジド部分が求電子試薬となり、フェノ
ールとカップリング反応を起こしてアゾ化合物となり、
現像液により溶１！ｌｉ’する。In addition, in the area that was not irradiated with ultraviolet rays, the quinone diazide component becomes an electrophilic reagent in an alkaline aqueous solution or an alkaline plating bath, causing a coupling reaction with phenol to form an azo compound.
Solved by developer! I'll do it.
（実施例） 以下、本発明を実施例に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on examples.
先ず、接看剤層付きの絶縁基板に孔を形成する。First, holes are formed in an insulating substrate with a contact layer.
孔を形成後、絶縁基板の表面に、キノンジアジド−ノボ
ラックフェノール系ポジ型感光竹組成初からなる液を塗
布するかフィルムを張り付【プ、感光性レジスト層を積
層する。この感光性レジスト層は、後の工程において紫
外線を照射した部分は現Ｉｌ液に溶解し易く、非照射部
分は溶解し難く、その溶解速度の差が大きいほど好まし
い。キノンジアジド成分とノボラックフェノール成分と
のアゾカップリング反応が容易であればこの条件を満足
できる。そのために、ノボラックフェノール成分は、ハ
イオルソノボラックフェノール樹脂が適当である。また
、組成物の一成分であるポリマーは、メタクリル酸メチ
ルエステルやエチルエステルにメタクリル酸を５ｗｔ％
以下加えて共重合させた物質を用いる。この場合メタク
リル酸エステルのアルキル基の炭系数は３以下が好まし
く、４以上にすると例えばメタクリル酸ブチルエステル
は温度２５℃でも粘着性を生じ製品化が困難になる。After forming the holes, a photosensitive resist layer is laminated on the surface of the insulating substrate by applying a liquid consisting of a quinonediazide-novolak phenol positive type photosensitive bamboo composition or pasting a film. In this photosensitive resist layer, the portion irradiated with ultraviolet rays in a later step is easily dissolved in the current Il solution, and the non-irradiated portion is difficult to dissolve, and the larger the difference in dissolution rate, the better. This condition can be satisfied if the azo coupling reaction between the quinone diazide component and the novolak phenol component is easy. For this purpose, a high ortho-novolac phenol resin is suitable as the novolak phenol component. In addition, the polymer that is one component of the composition is 5 wt% methacrylic acid in methacrylic acid methyl ester or ethyl ester.
The following added and copolymerized substances are used. In this case, the number of carbon atoms in the alkyl group of the methacrylic ester is preferably 3 or less; if it is 4 or more, for example, butyl methacrylate becomes sticky even at a temperature of 25° C., making it difficult to commercialize.
なお、メタクリル酸を使用しないメタクリル酸メチルや
エチルエステルのホモポリマを用いると、ポリマー中に
カルボキシル基が全く存在しなくなるため、その後にア
ルカリ水溶液系現像液を用いた場合に、現像が困難にな
る。Note that if a homopolymer of methyl methacrylate or ethyl ester that does not use methacrylic acid is used, there will be no carboxyl groups in the polymer, making development difficult when an alkaline aqueous developer is subsequently used.
感光性レジスト層を形成後、ネガフィルムを載ゼ、紫外
線を照射する。After forming the photosensitive resist layer, a negative film is placed on it and ultraviolet rays are irradiated.
紫外線を照射後、アルカリ水溶液系現像液により現像し
、感光性レジスト屑の紫外線照射部分を溶解する。After irradiation with ultraviolet rays, development is performed using an alkaline aqueous developer to dissolve the ultraviolet irradiated portions of the photosensitive resist scraps.
現像後は、無電解銅めっき沫により、感光性レジストＩ
Ｉ以外の箇所に銅めっきを形成し、回路等とする。After development, photosensitive resist I is coated with electroless copper plating droplets.
Copper plating is formed on locations other than I to form circuits, etc.
次に、上記実施例の方法により製造したプリント配線板
につき耐熱性試験を行ない、感光性レジスト胸の状態を
調べた。Next, a heat resistance test was conducted on the printed wiring board manufactured by the method of the above example, and the condition of the photosensitive resist was examined.
名実艶例の製造条件及び試験結果は次の通りである。The manufacturing conditions and test results for the famous gloss example are as follows.
実施例１）
絶縁基板として２００順×２００闇角で厚さ１．５１１
Ｉｎの、Ｎ＠剤層付きのガラスエポキシ樹脂（日立化成
Ｊ業株式会社製ＡＣＬ−Ｅ−１６８）を用いる。Example 1) As an insulating substrate, 200 order x 200 dark angle, thickness 1.511
A glass epoxy resin (ACL-E-168 manufactured by Hitachi Chemical Co., Ltd.) with an N@ agent layer is used.
キノンジアジド−ノボラックフェノール系ポジ型感光性
組成物は次の成分からなる。すなわち、キノンジアジド
成分として１．２−ナフトキノンジアジド−５−スルフ
ォニルクロリド２ｇｔｏｊとビスフェノールＡ Ｉ １
１０ｊとを縮合反応して得た２、２−ビス（１，２ナフ
トキノンジアシド−５−スルフォン酸）Ｉニル）プロパ
ン〔分子１６９６）（シンコ技研株式会社製Ｄ−０２２
）を２０重量部含む。また、ノボラック成分としてハイ
オルソノボラックフェノール樹脂（分子１１２８０）（
日立化成工業株式会社製ＨＰ−４９１）を４０重量部含
む。さらに、その他、の成分にトルエン２０！Ｉ量部、
メチルエチルケトン２０重量部を含む。そしてこれ等の
成分からなるポジ型感光性組成物を絶縁基板の表面にロ
ールコータ（パイロット精工株式会社製）で塗布し、温
度１００℃で３０分間乾燥し、不揮発分の犀さを２５μ
ｍとし、感光性レジストとする。The quinonediazide-novolac phenol positive-working photosensitive composition consists of the following components. That is, as the quinonediazide component, 2 gtoj of 1,2-naphthoquinonediazide-5-sulfonyl chloride and bisphenol A I 1
2,2-bis(1,2naphthoquinonediacid-5-sulfonic acid) I-nyl)propane [molecule 1696) obtained by condensation reaction with 10j (D-022 manufactured by Shinko Giken Co., Ltd.)
) contains 20 parts by weight. In addition, high ortho novolac phenol resin (molecule 11280) (
Contains 40 parts by weight of HP-491 (manufactured by Hitachi Chemical Co., Ltd.). In addition, 20% of toluene is added to the other ingredients! I parts,
Contains 20 parts by weight of methyl ethyl ketone. Then, a positive photosensitive composition consisting of these components was applied to the surface of an insulating substrate using a roll coater (manufactured by Pilot Seiko Co., Ltd.), dried at a temperature of 100°C for 30 minutes, and the non-volatile content was reduced to 25 μm.
Let m be a photosensitive resist.
感光性レジストを形成後、ネガフィルムを載せ、超高圧
水銀炉露光装置（株式会社オーク製作所製ＨＭＷ−２０
１＞を用い、紫外線を光量２００１ｒＬＪ／ｃｓｉ照射
した。After forming the photosensitive resist, a negative film was placed on it, and an ultra-high pressure mercury furnace exposure device (HMW-20 manufactured by Oak Seisakusho Co., Ltd.) was used.
1>, ultraviolet rays were irradiated at a light intensity of 2001 rLJ/csi.
紫外線を照射後、スプレ式現像機（デコボン社製Ｃプロ
セッサ）により炭酸ソーダ水溶液１゜５ｗｔ％を用い１
分間のアルカリ１２ＩＩｌを行った。After irradiating with ultraviolet rays, 1.5% by weight of aqueous sodium carbonate solution was used with a spray developing machine (C processor manufactured by Decobon Co., Ltd.).
Alkali for 12 II minutes was carried out.
解像度は２００μｍであった。The resolution was 200 μm.
現像後、ｍ度１２０℃で６０分間、後加熱を行った。After development, post-heating was performed at 120° C. for 60 minutes.
加熱後、フルアデイティブアルカリめっき浴を用いて、
厚さ２２μｍの銅箔回路を形成した。After heating, using a full additive alkaline plating bath,
A copper foil circuit with a thickness of 22 μm was formed.
めっき後、温度１６０℃で９０分間、後加熱した。After plating, post-heating was performed at a temperature of 160° C. for 90 minutes.
加熱後、温度２６０℃で２分間、はんだ耐熱試験を行っ
たところ、感光性レジストに興常は認められなかった。After heating, a solder heat resistance test was conducted at a temperature of 260° C. for 2 minutes, and no damage was observed to the photosensitive resist.
実施例２）
実施例１）において、ポジ型感光性組成物として、さら
に、結合性ポリマとしてメタクリル酸メチルエステル９
５ｗｔ％、メタクリル＠５ｗｔ％からなるメチルエチル
ケトン溶媒中で合成した共重合体（分子量１０万、不揮
光分＝５０％）を５０！Ｔ！―部加え、均一に攪拌混合
したものを用い、現像後の解像度が６０μｍとなった以
外は、同一゛の条件で製造する。Example 2) In Example 1), methacrylic acid methyl ester 9 was further used as a binding polymer as a positive photosensitive composition.
A copolymer (molecular weight 100,000, non-volatile light content = 50%) synthesized in a methyl ethyl ketone solvent consisting of 5 wt % and methacrylic @ 5 wt % was 50! T! - part was added, stirred and mixed uniformly, and manufactured under the same conditions except that the resolution after development was 60 μm.
そして、製造後、実施例１）と同じ条件ではんだ耐熱試
験を行ったが、感光性レジストに黄常は認められなかっ
た。After manufacturing, a soldering heat resistance test was conducted under the same conditions as in Example 1), but no yellowing was observed in the photosensitive resist.
実施例３）
実施例２）において、ポジ型感光性組成物として、さら
に、看色剤にトリプＯモメチルフｌニルスルフォン、ロ
イコクリスタルバイオレット及びビクトリアピアブルー
を各々１ｍ畢部、１重量部及び０．１垂Φ部をトルエン
とメチルエチルケトン（重Φ比１：１）からなる溶１［
４重量部に溶解し、均一に攪拌し、なお、Ｉ躾しベリン
グ剤としてアクリル系のもの（モンサントケミカル製モ
ダフロ）、シリコーン系のもの（トーμ・シリコーン株
式会社製５Ｈ−１９３＞を各々０．０５ψ拳部づつ加え
て均一に攪拌したものとする。それ以外は、実施例２）
と同じ条件で製造する。Example 3) In Example 2), as a positive photosensitive composition, trip-O-momethylfurinyl sulfone, leuco crystal violet, and Victoria Pier blue were added as coloring agents at 1 m depth, 1 part by weight, and 0.5 m by weight, respectively. Add 1 part of Φ to a solution of toluene and methyl ethyl ketone (heavy Φ ratio 1:1) [
4 parts by weight, stirred uniformly, and added 00% each of an acrylic-based belling agent (Modaflo manufactured by Monsanto Chemical Co., Ltd.) and a silicone-based material (5H-193 manufactured by Tomu Silicone Co., Ltd.) as a belling agent. .05ψ fistfuls at a time and stirred uniformly.Other than that, Example 2)
Manufactured under the same conditions.
そして、実施例１）と同じ条件ではんだ耐熱試験を行っ
たが、感光性レジストに黄富は認められなかった。Then, a solder heat resistance test was conducted under the same conditions as in Example 1), but yellowing was not observed in the photosensitive resist.
実施例４）
実施例３）と同一のポジ型感光性組成物の溶液を、辱さ
２５μｍのポリエステルフィルム（デュポン社製マイラ
＃２５）１ｍに塗布し、温度１００℃で３０分間加熱乾
燥した後、ポリエチレンフィルムをラミネートする。Example 4) A solution of the same positive photosensitive composition as in Example 3) was applied to 1 m of polyester film (Mylar #25, manufactured by DuPont) with a thickness of 25 μm, and dried by heating at a temperature of 100° C. for 30 minutes. , laminating polyethylene film.
そしてこのラミネート後のフィルムを常圧ラミネータ（
ロールｆＡｆｉ１５０℃）を用い、ポリエチレンシート
を剥離しながら、実施例１）と同様の絶縁基板を予じめ
瀉ｆｌｊ８０℃に加熱し、これにラミネートする。Then, the film after lamination is placed in a normal pressure laminator (
While peeling off the polyethylene sheet using a roll fAfi (150° C.), an insulating substrate similar to that in Example 1) was previously heated to flj 80° C. and laminated thereon.
ラミネート後、実施例１）と同一の８置により紫外線を
光量２５０ｍＪ／ｃｊ＠射し、露光して、ポリエステル
フィルムを剥離する。After lamination, the polyester film is peeled off by irradiating ultraviolet rays at an amount of 250 mJ/cj@ in the same 8-position as in Example 1).
ポリエステルフィルムを剥離後、実施例１）と同じ条件
で１ｉ！会した。解像度は７０μｍであり、感光性レジ
ストの表面はきわめて平滑であった。After peeling off the polyester film, 1i! under the same conditions as in Example 1). We met. The resolution was 70 μm, and the surface of the photosensitive resist was extremely smooth.
その後、実施例１）と同じ条件で製造した。Thereafter, it was manufactured under the same conditions as in Example 1).
製造後、実施例１）と同じ条件ではんだ耐熱試験を行っ
たが、感光性レジストに興常は認められなかった。After manufacture, a solder heat resistance test was conducted under the same conditions as in Example 1), but no damage was observed to the photosensitive resist.
実施例５）
実施例３）において、ポジ型感光性組成物の結合ポリマ
ーをメタクリル酸エチルエステル９５ｗｔ％、メタクリ
ル１１１５ ｗｔ％からなるメチルエチルケトン溶媒中
で合成した重合体とする他は、同一の方法で製造した。Example 5) In Example 3), the same method was used except that the binding polymer of the positive photosensitive composition was a polymer synthesized in a methyl ethyl ketone solvent consisting of 95 wt% ethyl methacrylate and 1115 wt% methacrylate. Manufactured.
製造後、実施例１）と同じ条件ではんだ耐熱試験を行っ
たが、感光性レジストに興常は認められず、表面が滑ら
かであった。After manufacturing, a soldering heat resistance test was conducted under the same conditions as in Example 1), but no defects were observed in the photosensitive resist, and the surface was smooth.
（発明の効果）
以上の通り、本発明の製造方法によれば、キノンジアジ
ド−ノボラックフェノール系ポジ型感光性組成物からな
る感光性レジストを形成することにより、アルカリ水溶
液により現像でき、廃液処理が容易であり、かつはんだ
耐熱性の良いプリント配線板が得られる。(Effects of the Invention) As described above, according to the production method of the present invention, by forming a photosensitive resist consisting of a quinonediazide-novolac phenol positive-working photosensitive composition, it can be developed with an alkaline aqueous solution and waste liquid treatment is easy. Therefore, a printed wiring board with good soldering heat resistance can be obtained.
Claims (1)
光露光し現像してめっきレジストを形成し、次いで無電
解めっき処理して回路を形成するプリント配線板の製造
方法において、感光性レジストとしてキノンジアジド−
ノボラックフェノール系ポジ型感光性組成物を用い、こ
れをアルカリ水溶液の現像液により現像することを特徴
とするプリント配線板の製造方法。(1) In a method for manufacturing a printed wiring board, in which a photosensitive resist is laminated on an insulating substrate, the photosensitive resist is exposed to active light and developed to form a plating resist, and then electroless plating is performed to form a circuit. as quinonediazide
1. A method for manufacturing a printed wiring board, which comprises using a novolak phenol-based positive photosensitive composition and developing the same with an alkaline aqueous developer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8167490A JPH03280588A (en) | 1990-03-29 | 1990-03-29 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8167490A JPH03280588A (en) | 1990-03-29 | 1990-03-29 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03280588A true JPH03280588A (en) | 1991-12-11 |
Family
ID=13752897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8167490A Pending JPH03280588A (en) | 1990-03-29 | 1990-03-29 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03280588A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007133258A (en) * | 2005-11-11 | 2007-05-31 | Fujifilm Corp | Laminate for printed wiring board and method for producing printed wiring board using the same |
| JP2008529080A (en) * | 2005-02-02 | 2008-07-31 | コーロン インダストリーズ，インコーポレイテッド | Positive dry film photoresist and composition for producing the same |
| JP2008537597A (en) * | 2005-02-02 | 2008-09-18 | コーロン インダストリーズ，インコーポレイテッド | Method for manufacturing array substrate for display device |
-
1990
- 1990-03-29 JP JP8167490A patent/JPH03280588A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008529080A (en) * | 2005-02-02 | 2008-07-31 | コーロン インダストリーズ，インコーポレイテッド | Positive dry film photoresist and composition for producing the same |
| JP2008537597A (en) * | 2005-02-02 | 2008-09-18 | コーロン インダストリーズ，インコーポレイテッド | Method for manufacturing array substrate for display device |
| US8216762B2 (en) | 2005-02-02 | 2012-07-10 | Kolon Industries, Inc. | Method for manufacturing array board for display device |
| JP2007133258A (en) * | 2005-11-11 | 2007-05-31 | Fujifilm Corp | Laminate for printed wiring board and method for producing printed wiring board using the same |
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