JPH0326953A - Manufacture of dew condensation sensor - Google Patents
Manufacture of dew condensation sensorInfo
- Publication number
- JPH0326953A JPH0326953A JP16301289A JP16301289A JPH0326953A JP H0326953 A JPH0326953 A JP H0326953A JP 16301289 A JP16301289 A JP 16301289A JP 16301289 A JP16301289 A JP 16301289A JP H0326953 A JPH0326953 A JP H0326953A
- Authority
- JP
- Japan
- Prior art keywords
- dew condensation
- hoop material
- lead
- lead pins
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009833 condensation Methods 0.000 title claims abstract description 61
- 230000005494 condensation Effects 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 15
- 238000004806 packaging method and process Methods 0.000 abstract description 7
- 108091027981 Response element Proteins 0.000 abstract 5
- 238000005406 washing Methods 0.000 abstract 2
- 238000010924 continuous production Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000003670 easy-to-clean Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は，例えばビデオテープレコーダ（ ＶＴＲ ）
一等に用いられ，結露状態を検出する結露センサの製造
方法に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention is applicable to, for example, a video tape recorder (VTR).
The present invention relates to a method of manufacturing a dew condensation sensor that is used in primary applications to detect dew condensation.
従来の技術
這年、ＶＴＲのシリンダ、自動車の窓ガラス建材、その
睦精密機器などの結露現象によるトラブｌレがクローズ
アップされ、この対策として結露センサが開発され実用
化に至っている。最近ではこのＶＴＲが一般家庭に普及
し、小型化・軽量化・低価格化が進むため、小型でしか
も安価な結露七ンサの要望が非常に大きくなってきてい
る。ここで述べる結露センサの製造方法は、このような
背景のもとに考案されたものである。In recent years, troubles caused by condensation in VTR cylinders, automobile window glass building materials, precision equipment, etc. have been highlighted, and as a countermeasure to this problem, dew condensation sensors have been developed and put into practical use. Recently, VTRs have become popular in general households, and as they have become smaller, lighter, and less expensive, there has been an increasing demand for compact and inexpensive dew condensation sensors. The method for manufacturing a dew condensation sensor described here was devised against this background.
従来の結露センサの構造を特公昭６８〜３２７６１号の
発明を例として第３図を参照にして説明する。The structure of a conventional dew condensation sensor will be explained with reference to FIG. 3, taking the invention of Japanese Patent Publication No. 68-32761 as an example.
第３図は従来の結露センサの部分破砕斜視図である。第
３図にふ・いて、１はア／レミナ基板で一方の表面に一
対の銀の対向電極２ａ，２ｂ、及び結露感応体３が配置
されている。対向電１ｉ２ｍ，２ｂには各々リード線４
ａ，ａｂが学田により接続されている。FIG. 3 is a partially exploded perspective view of a conventional dew condensation sensor. Referring to FIG. 3, reference numeral 1 denotes an alumina substrate, on one surface of which a pair of silver counter electrodes 2a, 2b and a dew condensation sensitive member 3 are arranged. Lead wires 4 to opposite electrodes 1i2m and 2b, respectively.
a and ab are connected by Gakuden.
以上のように構成された結露センサについて、以下その
動作について説明する。この結露センサは，導電性の炭
素粉と、水分を含むと膨張するアクリル系樹脂を混合し
たペーストを、あらかじめ銀などの対向電極が配置され
たアノレミナ基板１に塗市、焼き付けしたもので、結露
すると樹脂が膨潤し、炭素粒子間の距離が伸びて電気抵
抗値が増７ＪＯするという原祖になっている。この抵抗
値変化金対向電極２ａ，２ｂ金介してリード線４ｍ，４
ｂから倹出さぜるものである。The operation of the dew condensation sensor configured as described above will be described below. This dew condensation sensor is made by applying and baking a paste made of a mixture of conductive carbon powder and acrylic resin that expands when it contains moisture onto an anoremina substrate 1 on which a counter electrode such as silver has been arranged. This causes the resin to swell, increasing the distance between the carbon particles and increasing the electrical resistance by 7JO. This resistance value change gold counter electrodes 2a, 2b lead wires 4m, 4 through gold.
It is something that can be saved from b.
発明が解決しようとする課題
しかしながら上記従来の構成では、リード線を１木ずつ
半田付けするため短いリード線の場合は半田付けが困難
でしばしば製造作業者は火傷を負ってし１っていた。ま
た、リード線は柔らかくくせがあるので半田付け工程の
後もそのリード線金真直ぐに直し、各工程ではセンサ同
志が絡み合うのに注意しなければならず、特に包装工程
ではケースに人が一つ一つ摘まんで入れるなど、自動機
械化への量産性に欠けるという問題金有していた。Problems to be Solved by the Invention However, in the above-mentioned conventional structure, the lead wires are soldered one by one, so it is difficult to solder short lead wires, and manufacturing workers often suffer burns. In addition, the lead wires are soft and curly, so it is necessary to straighten the lead wires after the soldering process, and be careful not to let the sensors get entangled in each process.Especially in the packaging process, when there is only one person in the case. There was a problem in that it was not suitable for mass production due to automatic mechanization, such as picking one piece and putting it in.
また，リード線の被覆は有機溶剤などの洗浄剤に比較的
弱く，時には被覆が収縮したり変形したりするというこ
ともあり致命的な問題も有していた。Furthermore, the lead wire coating is relatively susceptible to cleaning agents such as organic solvents, and the coating sometimes shrinks or deforms, which is a fatal problem.
本発明は上記従来の問題点を解決するもので、安価で非
常に張産性に富んだ結露センサを製造することを目的と
する。The present invention solves the above-mentioned conventional problems, and aims to manufacture a dew condensation sensor that is inexpensive and highly productive.
課題金解決するための手段
上記目的を達或するために、本発明はフープ材に複数個
連結されたリードピンと一つの絶縁基板上に構成された
複数個の結露感応素子の対向電極とを各々電気的に接続
した後，前記リードビンをフープ材から分離し、前記絶
縁基板を切断［一各々の結露感応素子に分離する工程を
有したものである。Means for Solving the Problems In order to achieve the above object, the present invention provides a method in which a plurality of lead pins connected to a hoop material and a plurality of counter electrodes of a plurality of dew condensation sensitive elements formed on one insulating substrate are connected to each other. After the electrical connection is made, the lead bin is separated from the hoop material, and the insulating substrate is cut (separated into each dew condensation sensitive element).
作用
本発明によって、リードピンを複数個連結されたフープ
材を用い、一つの絶縁基板上に構成された複数個の結露
感応素子の対向電極と前記リードピンとを半田付け等に
より各々′ぼ気的に接続する工程の後、洗浄工程等金完
了し、前記リードビン金フープ材から分離するとともに
前記絶縁基板を切断し各々の結露感応素子に分離し、包
装するので、結露感応素子のリード線取り付けから洗浄
、包装に至るまで連続的に自動機械化することができる
。また、リードピンはフープ材に連結されているので人
が半田付けする場合も火傷もなく作業性良く製造できる
。さらに、耐溶剤性に欠ける柔らかいくせのあるリード
線ではなく、フープ材のような固いリードピン金用いて
いるのでセンサ同志が絡み付くこともなく、有機溶剤に
よる洗浄にも問題なく、包装などの工程で取扱いやすい
構造にできている。従って、安価で非常に量産性に富ん
だＭ露センサ金製造することができる。According to the present invention, a hoop material having a plurality of lead pins connected thereto is used, and the opposing electrodes of a plurality of dew condensation sensitive elements configured on one insulating substrate are connected to the lead pins by soldering or the like. After the connection process, the cleaning process, etc. is completed, and the lead bin is separated from the metal hoop material, and the insulating substrate is cut and separated into each condensation sensitive element and packaged, so the cleaning process starts from attaching the lead wires of the condensation sensitive element. , can be automated continuously up to packaging. In addition, since the lead pin is connected to the hoop material, even when soldering is performed by a person, the product can be easily manufactured without causing burns. Furthermore, since we use hard lead pins like hoop material instead of soft, curly lead wires that lack solvent resistance, the sensors do not get entangled with each other, and there is no problem with cleaning with organic solvents, making it suitable for packaging and other processes. It has a structure that is easy to handle. Therefore, M dew sensor gold can be manufactured at low cost and with great mass productivity.
実施例
以下、本発明の一実施例について、図面金参照しながら
説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
第２図は本発明の製造方法で製造される結露センサの斜
視図である。FIG. 2 is a perspective view of a dew condensation sensor manufactured by the manufacturing method of the present invention.
第２図において６は、アｔｖミナ基板６、対向電｛萌７
ａ ，７ｂ、結露感応膜８を備えた結露感応素子で、９
ａ ，ｓｂは、対向ＫＴｈ７ ｍ ， −ｒ ｂに半田
付けで固定接１読された後フープ材より切断されたリー
ドビンである。In FIG.
a, 7b, a dew condensation sensitive element equipped with a dew condensation sensitive film 8;
a, sb are lead bins which are fixedly connected to the opposing KTh7m, -rb by soldering and then cut from the hoop material.
以上のように構成された結露センサについて，以下その
動作を説明する。結露状態になった場合、結露感応膜を
構〕戊している樹脂が膨潤し，炭素粒子間の距離が伸び
て電気抵抗値が増加する。この抵抗値変化を対向電極７
ａ ，７ｂを介してリードビン９１Ｌ ， ９ｂから検
出される。リードビン９１Ｌ，９ｂは外部回路基板に接
続されることにより電気抵抗値変化が外部に伝えられる
。The operation of the dew condensation sensor configured as described above will be explained below. When dew condensation occurs, the resin forming the dew condensation sensitive film swells, the distance between carbon particles increases, and the electrical resistance value increases. This change in resistance value is measured by the counter electrode 7.
It is detected from the lead bins 91L and 9b via a and 7b. The lead bins 91L and 9b are connected to an external circuit board to transmit changes in electrical resistance to the outside.
第１図は、リードピンを複数個連結したフープ材を用い
，結露感応素子上の対向電極への半田付け工程を示した
状態図である。１枚のアｌＶミナ基板６上に構成された
複数の結露感応素子６の対向電極７１Ｌ ，７ｂに、フ
ープ材１０に接続されたりードピン９１Ｌ ，９ｂを重
ねるようにして設置し、半田付けを連続的に行う。本工
程の後，洗浄工程を経て．さらにリードビン９１Ｌ ，
９ｂ金フープ材１０から分離するとともに、前記アルミ
ナ基板６を切断し各々の結露感応素子６に分離する工程
の後、各々の結露センサの包装工程と、−Ｋ自動機械化
ラインで製造する。FIG. 1 is a state diagram showing a soldering process to a counter electrode on a dew condensation sensitive element using a hoop material in which a plurality of lead pins are connected. The dowel pins 91L, 9b connected to the hoop material 10 are placed on the opposing electrodes 71L, 7b of the plurality of dew condensation sensitive elements 6 constructed on one aluminum Vina substrate 6, and are successively soldered. Do it on purpose. After this process, a cleaning process is performed. Furthermore, lead bin 91L,
9B After separating from the gold hoop material 10 and cutting the alumina substrate 6 to separate it into each dew condensation sensitive element 6, a packaging process of each dew condensation sensor and a -K automated mechanization line are performed.
以上のように本実施例の製造方法によれば、リードビン
９１Ｌ ，ｇｂを複数個連結されたフープ材１０を用い
、結露感応素子６の対向電極７ａ ， ｙｂと前記リー
ドピン９ａ ， ９ｂが半田付け等により各々電気的に
接続した後、洗浄工程等金完了１〜でから前記リードピ
ン９ａ ， ９ｂをフープ材１ｏから分離しかつ各結露
感応素子６に分離して、最後に包装するため、結露感応
素子５のリード線９ａ，９ｂ取り付けから洗浄、包装に
至る１で連続的に自動機械化することができる。１た、
リードビンｇａ ， ９ｂはフープ材１０に連結されて
いるので人が半田付けする場合も火傷もなく作業性良く
製造できる。１たリードピン９ａ ， ９ｂが対向電販
７ａ ，７ｂに半田付けされる際に、結露感応素子６が
複数個連なっているため位置決めしやすく確実な半田付
けが行なえる。よって結露感応素子５の対向電極７ａ，
７ｂ以外の部分にずれてしまうことはなく、結露感応膜
８を傷めて感度劣化が発生したり、？．田付けによる接
続が不充分なために断線したり、接触抵抗が生じて特性
に影響金与えるなどという不具合を総て解決することと
なる。As described above, according to the manufacturing method of this embodiment, the hoop material 10 in which a plurality of lead bins 91L, gb are connected is used, and the opposing electrodes 7a, yb of the dew condensation sensing element 6 and the lead pins 9a, 9b are connected by soldering, etc. After electrically connecting each of them, the lead pins 9a and 9b are separated from the hoop material 1o and separated into each condensation sensitive element 6 after the cleaning process is completed, and finally the condensation sensitive element is packaged. The process from attaching the lead wires 9a and 9b in Step 5 to cleaning and packaging can be automated and automated continuously. 1.
Since the lead bins ga and 9b are connected to the hoop material 10, even when soldering is performed by a person, there is no risk of burns and the manufacturing process can be performed with good work efficiency. When the first lead pins 9a and 9b are soldered to the opposing electrical contacts 7a and 7b, since a plurality of dew condensation sensitive elements 6 are connected, positioning is easy and reliable soldering can be performed. Therefore, the counter electrode 7a of the dew condensation sensitive element 5,
It will not shift to parts other than 7b, and it will damage the condensation sensitive film 8 and cause sensitivity deterioration. ．． This solves all problems such as wire breakage due to insufficient soldering, contact resistance, and other problems that affect characteristics.
さらに、耐溶剤性に欠ける柔らかいくせのあるリード線
ではなく、フープ材のような固いリードビンを用いてい
るのでセンサ同志が絡み付くこともなく、有機溶剤によ
る洗浄にも問題なく、包装などの工程で取扱いやすい構
造にできている。′また、この製造方法によって生産さ
れる結露センサは、従来のようにリード線が柔らかいた
めビス止め固定用ブラケノトにはりつけて取り付けると
いったことは不要で、固いリードビンで取り付けること
で充分固定することができる使い易い結露センサである
。従って、安価で非常に量産性に富んだ結露センサを製
造することができる。Furthermore, since we use a hard lead wire like a hoop material instead of a soft, curly lead wire that lacks solvent resistance, the sensors do not get entangled with each other, and there is no problem with cleaning with organic solvents, making it suitable for packaging and other processes. It has a structure that is easy to handle. 'In addition, the dew condensation sensor produced using this manufacturing method does not need to be attached to a screw fixing bracket because the lead wire is soft, as is the case with conventional methods, and can be sufficiently fixed by attaching it with a hard lead bin. It is an easy-to-use dew condensation sensor. Therefore, it is possible to manufacture a dew condensation sensor that is inexpensive and highly suitable for mass production.
定明の効果
以上のように本発明によれば、リードピンを複数個連結
されたフープ材を用い、結露感応素子の対向′五極と前
記リードピンが半田付け等により各々電気的に接続した
後、洗浄工程等を完了してから前記リードビンをフーグ
材から分離し、かつ各結露感応素子に分離して、最後に
包装するため、結露感応素子のリード線取り付けから洗
浄、包装に至るまで連続的自動機械化することができる
。As described above, according to the present invention, a hoop material having a plurality of lead pins connected thereto is used, and after the lead pins are electrically connected to the opposing five poles of the dew condensation sensitive element by soldering or the like, After completing the cleaning process, the lead bin is separated from the Hoog material, separated into each condensation sensitive element, and finally packaged, so the process from attaching the lead wire of the condensation sensitive element to cleaning and packaging is continuous and automated. Can be mechanized.
１た，リードビンはフープ材に連結されているので人が
半田付けする場合も火傷もなく作業性良く製造できる。First, since the lead bin is connected to the hoop material, it can be easily manufactured without causing burns when soldering by a person.
１たリードピンが対向Ｋｍに半田付けされる際に、結露
感応素子が複数個連なっているため位置決めしやすく確
実な半田付けが行なえる。よって結露感応素子の対向電
極以外の部分にずれてしまうことはなく、結露感応膜を
傷めて感度劣化が発生したり、半田付けによる接続が不
充分なために断線したシ、接触抵抗が生じて特性に影響
を与えるなどという不具合を総て解決することとなる。When the first lead pin is soldered to the opposite Km, since a plurality of dew condensation sensitive elements are connected, positioning is easy and reliable soldering can be performed. Therefore, the condensation sensitive element will not shift to any part other than the opposing electrode, which may damage the condensation sensitive film and cause deterioration in sensitivity, or cause disconnection or contact resistance due to insufficient soldering. This will solve all the problems that affect the characteristics.
また、この製造方法によって生産される結露センサは、
従来のようにリード線が柔らかいためビス止め固定用プ
ラケントにはりつけて取り付けるといったことは不要で
、固いリードビンで取り付けることで充分固定すること
ができる使い易い結露センサである。さらに、耐溶剤性
に欠ける柔らかいくせのあるリード線ではなく、フープ
材のような固いリードビンを用いているので七ンサ同志
が絡み付くこともなく、有園溶剤による洗浄にも開明な
く、包装などの工程で取扱いやすい構造とすることがで
きる。In addition, the dew condensation sensor produced by this manufacturing method is
Since the lead wire is soft as in the past, there is no need to attach it to a screw fixing bracket, and it is an easy-to-use dew condensation sensor that can be sufficiently fixed by attaching it with a hard lead bin. Furthermore, since a hard lead wire like a hoop material is used instead of a soft and curly lead wire that lacks solvent resistance, the wires do not get entangled with each other, and it is also easy to clean with solvents, making it easy to clean packaging etc. The structure can be easily handled in the process.
従って、安価で非常に量産性に富んだ結露センサを製造
することができる。Therefore, it is possible to manufacture a dew condensation sensor that is inexpensive and highly suitable for mass production.
第１図はリードピン金複数個連結したフープ材を用い、
結露感応素子上の対向゛Ｅ極への半田付け工，程金示し
た斜視図、第２図は本発明の製造方法で製造される結露
センサの斜視図、第３図は従来の結露センサの部分破１
伜斜睨図である。
５・・・・・・結露感応素子、６・・・・・・アルミナ
基板、７ａ ，７ｂ・・・・・対向電極、８・・・・・
・結露感応膜、９１Ｌ ，９ｂ・・・・・・リードビン
、１０・・・・・・フープ材。Figure 1 uses a hoop material with multiple lead pins connected.
A perspective view showing the process of soldering to the opposite E electrode on the dew condensation sensing element, FIG. 2 is a perspective view of a dew condensation sensor manufactured by the manufacturing method of the present invention, and FIG. Partial damage 1
This is a perspective view. 5... Condensation sensing element, 6... Alumina substrate, 7a, 7b... Counter electrode, 8...
- Condensation sensitive membrane, 91L, 9b... Lead bin, 10... Hoop material.
Claims (3)
絶縁基板上に構成された複数個の結露感応素子の対向電
極とを各々電気的に接続する工程と、前記リードピンを
フープ材から分離するとともに前記絶縁基板を切断し各
々の結露感応素子に分離する工程とを有した結露センサ
の製造方法。(1) The step of electrically connecting a plurality of lead pins connected to a hoop material and the counter electrodes of a plurality of dew condensation sensing elements configured on one insulating substrate, and separating the lead pins from the hoop material. A method for manufacturing a dew condensation sensor, comprising the steps of: cutting the insulating substrate to separate each condensation sensing element;
ノマー樹脂と炭素粉で構成された分散抵抗皮膜からなる
ことを特徴とする請求項１記載の結露センサの製造方法
。(2) The method for manufacturing a dew condensation sensor according to claim 1, wherein the dew condensation sensing element is comprised of a dispersed resistance film made of an acrylic monomer resin and carbon powder on an alumina substrate.
より形成されてることを特徴とする請求項１記載の結露
センサの製造方法。(3) The method for manufacturing a dew condensation sensor according to claim 1, wherein the counter electrode is made of carbon and silver and is formed by thick film printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16301289A JPH0326953A (en) | 1989-06-26 | 1989-06-26 | Manufacture of dew condensation sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16301289A JPH0326953A (en) | 1989-06-26 | 1989-06-26 | Manufacture of dew condensation sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0326953A true JPH0326953A (en) | 1991-02-05 |
Family
ID=15765519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16301289A Pending JPH0326953A (en) | 1989-06-26 | 1989-06-26 | Manufacture of dew condensation sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0326953A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003021246A1 (en) * | 2001-08-31 | 2003-03-13 | Kurabe Industrial Co., Ltd. | Capacitive humidity-sensor and capacitive humidity-sensor manufacturing method |
-
1989
- 1989-06-26 JP JP16301289A patent/JPH0326953A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003021246A1 (en) * | 2001-08-31 | 2003-03-13 | Kurabe Industrial Co., Ltd. | Capacitive humidity-sensor and capacitive humidity-sensor manufacturing method |
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