JPH03265642A - Vinyl chloride resin composition - Google Patents
Vinyl chloride resin compositionInfo
- Publication number
- JPH03265642A JPH03265642A JP6598390A JP6598390A JPH03265642A JP H03265642 A JPH03265642 A JP H03265642A JP 6598390 A JP6598390 A JP 6598390A JP 6598390 A JP6598390 A JP 6598390A JP H03265642 A JPH03265642 A JP H03265642A
- Authority
- JP
- Japan
- Prior art keywords
- vinyl chloride
- chloride resin
- formulas
- tables
- compd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 239000011342 resin composition Substances 0.000 title claims description 7
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 4
- -1 amide compound Chemical class 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 9
- 150000001408 amides Chemical class 0.000 abstract description 5
- 239000006057 Non-nutritive feed additive Substances 0.000 abstract description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 abstract description 2
- 239000004926 polymethyl methacrylate Substances 0.000 abstract description 2
- 239000004800 polyvinyl chloride Substances 0.000 abstract description 2
- 229920000915 polyvinyl chloride Polymers 0.000 abstract description 2
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 229920005671 poly(vinyl chloride-propylene) Polymers 0.000 abstract 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 abstract 1
- 230000007423 decrease Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- GGSRTHRSSCWGGK-UHFFFAOYSA-L 2,2-dibutyl-5-hydroxy-1,3,2-dioxastannepane-4,7-dione Chemical compound CCCC[Sn]1(CCCC)OC(=O)CC(O)C(=O)O1 GGSRTHRSSCWGGK-UHFFFAOYSA-L 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000005660 chlorination reaction Methods 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 2
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- 125000005916 2-methylpentyl group Chemical group 0.000 description 1
- 235000010893 Bischofia javanica Nutrition 0.000 description 1
- 240000005220 Bischofia javanica Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- LCIKXZXTGWISSW-UHFFFAOYSA-N N-[2-(octadecanoylamino)cyclohexyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NC1CCCCC1NC(=O)CCCCCCCCCCCCCCCCC LCIKXZXTGWISSW-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000006367 bivalent amino carbonyl group Chemical group [H]N([*:1])C([*:2])=O 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 102200046998 rs62645894 Human genes 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は成形性及び耐熱性がすぐれた塩化ビニル系樹脂
組成物に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a vinyl chloride resin composition having excellent moldability and heat resistance.
（従来の技術）
従来より塩化ビニル系樹脂は成形品、フィルム、シート
等広く使用されているが耐熱性が悪いという欠点を有し
ている。そのため、塩化ビニル系樹脂を後塩素化する方
法が行なわれているが、塩素化度が高くなると溶融粘度
が高くなり成形性が悪くなるという欠点があった。又、
塩化ビニル系樹脂に他の合成樹脂を添加する方法も種々
提案されている（たとえばポリ酢酸ビニルを添加するこ
とが特開昭６０−７９０５２号公報に記載されている。(Prior Art) Vinyl chloride resins have been widely used in molded products, films, sheets, etc., but they have the disadvantage of poor heat resistance. Therefore, a method of post-chlorinating the vinyl chloride resin has been used, but this method has the drawback that as the degree of chlorination increases, the melt viscosity increases and moldability deteriorates. or,
Various methods have also been proposed for adding other synthetic resins to vinyl chloride resins (for example, Japanese Patent Application Laid-Open No. 79052/1983 describes the addition of polyvinyl acetate).
）が成形性はあまり改善されていない。), but the moldability has not improved much.
（発明が解決しようとする課題）
本発明の目的は、上記欠点に鑑み、熱流動性が良好で成
形性がすぐれ、耐熱性及び耐衝撃性のすぐれた成形品を
得ることができる塩化ビニル系樹脂組成物を提供するこ
とにある。(Problems to be Solved by the Invention) In view of the above-mentioned drawbacks, an object of the present invention is to provide a polyvinyl chloride-based molded product that has good thermal fluidity, excellent moldability, and can obtain molded products with excellent heat resistance and impact resistance. An object of the present invention is to provide a resin composition.
（課題を解決するための手段）
本発明で使用される塩化ビニル系樹脂とは、塩化ビニル
樹脂、塩化ビニルと、塩化ビニルと共重合可能なエチレ
ン、プロピレン等のエチレン性不飽和結合を有するモノ
マーとの共重合体及びこれらの樹脂の後塩素化物をいう
。(Means for Solving the Problems) The vinyl chloride resin used in the present invention refers to vinyl chloride resin, vinyl chloride, and monomers having ethylenically unsaturated bonds such as ethylene and propylene that can be copolymerized with vinyl chloride. and post-chlorinated products of these resins.
塩化ビニル系樹脂の平均重合度は、小さくなると得られ
た成形体の耐衝撃性が低下し、大きくなると熱流動性が
低下するので３００〜１゜４００が好ましい。又、後塩
素化物も平均重合度が３００〜１，４００の塩化ビニル
系樹脂が後塩素化されたものが好ましい。The average degree of polymerization of the vinyl chloride resin is preferably from 300 to 1.degree. 400, since the smaller the degree, the lower the impact resistance of the molded product obtained, and the larger the degree, the lower the thermal fluidity. Also, the post-chlorinated product is preferably a post-chlorinated vinyl chloride resin having an average degree of polymerization of 300 to 1,400.
塩化ビニル系樹脂の平均塩素含有量は、少なくなると耐
熱性が低下し、逆に多くなると熱流動性が低下し、熱分
解しやすくなるので、５７〜７０ｗｔ％が好ましく、よ
り好ましくは６２〜６６ｗｔ％である。従って、塩化ビ
ニル系樹脂は、塩素含有量がこの範囲にはいるように単
独もしくは二種以上の樹脂が併用して使用されるのが好
ましい。The average chlorine content of the vinyl chloride resin is preferably 57 to 70 wt%, more preferably 62 to 66 wt%, because if it decreases, the heat resistance will decrease, and if it increases, the thermal fluidity will decrease, making it easier to thermally decompose. %. Therefore, the vinyl chloride resin is preferably used alone or in combination of two or more resins so that the chlorine content falls within this range.
本発明で使用されるアミド系化合物は一般式％式％
（）
式中、Ｒ１は炭素数１０〜２６の直鎖状アルキル基であ
り、炭素数が少なくなると融点が高くなり、成形性が低
下し、逆に多くなると融点が低くなって、得られた成形
品の耐熱性が低下するので炭素数１４〜２２の直鎖状ア
ルキル基が好ましい。The amide compound used in the present invention has the general formula % () where R1 is a linear alkyl group having 10 to 26 carbon atoms, and as the number of carbon atoms decreases, the melting point increases and moldability decreases. On the other hand, if the number is too large, the melting point will be lowered and the heat resistance of the obtained molded article will be lowered, so a linear alkyl group having 14 to 22 carbon atoms is preferable.
又、Ｒ２は、−（ＣＨｚ） ＋ ｔ−−ＣＨｚ−ＣＢ−
（ＣＪ） ｘ−１ＣＨ。Moreover, R2 is -(CHz) + t--CHz-CB-
(CJ) x-1CH.
Ｈｆｆ
ＣＨｚ−ＣＨ−ＣＨｚ−Ｃ−（ＣＨｚ）ｚ−ＣＨ，ＣＯ
。Hff CHz-CH-CHz-C-(CHz)z-CH,CO
.
ＣＨ。CH.
ド、２−メチル−４，４−ジメチルへキシルビスステア
リン酸アミド、Ｎ、Ｎ’−１，４−シクロヘキサンジイ
ルビスステアリン酸アミド、Ｎ、Ｎ’−１，３−シクロ
ヘキサンジイルビスステアリン酸アミド、Ｎ、Ｎ’−１
，２−シクロヘキサンジイルビスステアリン酸アミド、
Ｎ。2-methyl-4,4-dimethylhexylbisstearamide, N,N'-1,4-cyclohexanediylbisstearamide, N,N'-1,3-cyclohexanediylbisstearamide, N, N'-1
, 2-cyclohexanediyl bisstearamide,
N.
Ｎ’−１，４−シクロヘキサンジイルビスステアリン酸
アミド、
ＣＩＪｆｆｓ＝ Ｃ０ＮＨ＋ ０ ＋ ＮＨＣＯ−ＣＩ
７８３ ｓＣ＋Ｊｓｓ Ｃ０ＮＨ＋ｓｏ、＋ＮＨＣＯ
−ＣＩｔＨｓｓＳ又はＣＨ，を示し、Ｒ４はＨ，ＣＨ，
又はＣ（ＣＨｓ）ｓを示す。N'-1,4-cyclohexanediylbisstearamide, CIJffs= C0NH+ 0 + NHCO-CI
783 sC+Jss C0NH+so, +NHCO
-CItHssS or CH, R4 is H, CH,
or C(CHs)s.
上記アミド系化合物としては、たとえばラウリルビスス
テアリン酸アξド、２−メチルペンチルビスステアリン
酸アくド、１−エチルプロピルビスステアリン酸アミド
、２．２−ジメチル−４−メチルへキシルビスステアリ
ン酸アもＣ＋Ｊ！ｓ Ｃ０ＮＨ＋ＣＨｚ＋ＮＨＣＯ−Ｃ
＋ＪｘｓＣ＋ ＋Ｉｈｘ Ｃ０ＮＨ＋ Ｓ ＋ ＮＨＣ
Ｏ−Ｃ＋ ＋ｌｂｉ等があげられる。Examples of the above-mentioned amide compounds include lauryl bisstearic acid ξ-do, 2-methylpentyl bisstearic acid amide, 1-ethylpropyl bisstearic acid amide, and 2,2-dimethyl-4-methylhexyl bisstearic acid. Amo C+J! s C0NH+CHz+NHCO-C
+JxsC+ +Ihx C0NH+ S + NHC
Examples include O-C+ +lbi.
上記アくド系化合物の添加量は少なくなると熱流動性が
改善されず成形性が向上せず、逆に多くなると耐熱性が
低下するので、塩化ビニル系樹脂１００重量部に対し、
２〜１５重量部添加されるのであり、好ましくは３〜１
０重量部である。If the amount of the above-mentioned ado-based compound added is small, the thermal fluidity will not be improved and moldability will not be improved, and if it is too large, the heat resistance will be reduced.
It is added in an amount of 2 to 15 parts by weight, preferably 3 to 1 part by weight.
It is 0 parts by weight.
本発明の塩化ビニル系樹脂組成物の構成は、上述の通り
であり、更に、塩化ビニル系樹脂の成形性、熱安定性等
を向上させるために一般に使用されているポリメチルメ
タクリレート系加工助剤、ジブチル錫マレート、ジブチ
ル錫メルカプト、金属石鹸、鉛化合物などの熱安定剤、
酸化防止剤、紫外線吸収剤、ＭＢＳ樹脂、ＡＢＳ樹脂な
どの改質剤、ステアリン酸エステル、ステアリルアルコ
ール、ポリエチレンワックスなどの滑剤、炭酸カルシウ
ム、ガラスファイバーなどの充填剤、酸化チタンなどの
顔料、染料、可塑剤等が併用されてもよい。The composition of the vinyl chloride resin composition of the present invention is as described above, and furthermore, a polymethyl methacrylate processing aid which is generally used to improve the moldability, thermal stability, etc. of vinyl chloride resin. , dibutyltin malate, dibutyltin mercapto, metal soaps, heat stabilizers such as lead compounds,
Antioxidants, ultraviolet absorbers, modifiers such as MBS resin and ABS resin, lubricants such as stearic acid ester, stearyl alcohol, and polyethylene wax, fillers such as calcium carbonate and glass fiber, pigments such as titanium oxide, dyes, A plasticizer or the like may also be used in combination.
本発明の塩化ビニル系樹脂組成物は、押出成形、カレン
ダー成形、ロール・プレス底形、射出成形等従来公知の
任意の加熱成形法で成形することが可能である。The vinyl chloride resin composition of the present invention can be molded by any conventionally known heat molding method such as extrusion molding, calendar molding, roll press bottom molding, injection molding, etc.
（実施例） 次に本発明の詳細な説明する。(Example) Next, the present invention will be explained in detail.
実施例１〜２３、比較例１〜８
第１表及び第２表に示した所定量の塩素化塩化ビニル樹
脂（重合度３６０、塩素化度約６５重量％〉、アミド系
化合物、ジブチル錫マレート（三共有機合成社製、ＲＣ
４０ＦＴ）、ジブチル錫メルカプト（三共有機合成社製
、Ｊ Ｆ−９Ｂ）、ブチルステアレート （花王社製、
エキセパールＢＳ）、ステアリルアルコール（花王社製
、カルコール８６）及びエステル系滑剤（ヘンケル白水
社製、ロキシオールＧ７０Ｓ）をヘンシェルごキサ−に
供給し、６０℃で１５分間混合した後、１９０℃のロー
ルで３分間溶融混練した。得られた混練物を高化式フロ
ーテスターに供給し、吐出孔の直径１ｍ、長さ１０ｍの
ダイを用いて荷重１６０ｋｇｆ／ｄ、１９０℃の条件で
吐出量を測定した。又、得られた混練物を１８０℃、１
５０ｋｇｆ／ｃｄの条件でプレスし、厚さ６．４閣のシ
ートを得、ＪＩＳ Ｋ ７２０７に準拠（荷重１８
．５ ｋｇ／ｃ４”） してＨＤＴを測定した。測定
結果を第１表及び第２表に示した。Examples 1 to 23, Comparative Examples 1 to 8 Predetermined amounts of chlorinated vinyl chloride resin (degree of polymerization 360, degree of chlorination approximately 65% by weight) shown in Tables 1 and 2, amide compound, dibutyltin malate (Manufactured by Sankyoki Gosei Co., Ltd., RC
40FT), dibutyltin mercapto (manufactured by Sankyoki Gosei Co., Ltd., JF-9B), butyl stearate (manufactured by Kao Corporation,
EXEPAL BS), stearyl alcohol (Kao Corporation, Calcol 86), and ester lubricant (Henkel Hakusui Co., Ltd., Roxiol G70S) were supplied to a Henschel mixer, mixed at 60°C for 15 minutes, and then heated with a roll at 190°C. The mixture was melt-kneaded for 3 minutes. The obtained kneaded material was supplied to a Koka flow tester, and the discharge amount was measured using a die with a discharge hole of 1 m in diameter and 10 m in length under conditions of a load of 160 kgf/d and 190°C. Further, the obtained kneaded product was heated at 180°C for 1
Pressed under the conditions of 50 kgf/cd to obtain a sheet with a thickness of 6.4 cm, compliant with JIS K 7207 (load 18
．． 5 kg/c4") and HDT was measured. The measurement results are shown in Tables 1 and 2.
（発明の効果）
本発明の塩化ビニル系樹脂組成物の構成は上述の通りで
あるから、熱流動性が良好で成形性がすぐれており、得
られた成形棒は耐熱性、耐衝撃性等がすぐれている。(Effects of the Invention) Since the vinyl chloride resin composition of the present invention has the structure described above, it has good thermal fluidity and excellent moldability, and the obtained molded rod has good heat resistance, impact resistance, etc. is excellent.
Claims (1)
で示されるアミド系化合物２〜１５重量部からなること
を特徴とする塩化ビニル系樹脂組成物。 Ｒ＾１−ＣＯＮＨ−Ｒ＾２−ＮＨＣＯ−Ｒ＾１・・・・
・（ I ）（式中、Ｒ＾１は炭素１０〜２６の直鎖状ア
ルキル基、Ｒ＾２は、−（ＣＨ＿２）＿１＿２−、▲数
式、化学式、表等があります▼、▲数式、化学式、表等
があります▼、▲数式、化学式、表等があります▼、 ▲数式、化学式、表等があります▼ ▲数式、化学式、表等があります▼、▲数式、化学式、
表等があります▼、▲数式、化学式、表等があります▼
、▲数式、化学式、表等があります▼ 又は▲数式、化学式、表等があります▼を示し、Ｒ＾３
はＯ、ＳＯ＿２、Ｓ又はＣＨ＿２を示し、Ｒ＾４はＨ、
ＣＨ＿３又はＣ（ＣＨ＿３）＿３を示す。）[Claims] 1. 100 parts by weight of vinyl chloride resin and general formula (I)
A vinyl chloride resin composition comprising 2 to 15 parts by weight of an amide compound represented by: R^1-CONH-R^2-NHCO-R^1...
・(I) (In the formula, R^1 is a linear alkyl group with 10 to 26 carbon atoms, R^2 is -(CH_2)_1_2-, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ Mathematical formulas, chemical formulas , tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ Mathematical formulas, chemical formulas,
There are tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼
, ▲There are mathematical formulas, chemical formulas, tables, etc.▼ or ▲There are mathematical formulas, chemical formulas, tables, etc.▼, and R^3
indicates O, SO_2, S or CH_2, R^4 is H,
Indicates CH_3 or C(CH_3)_3. )
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6598390A JPH03265642A (en) | 1990-03-15 | 1990-03-15 | Vinyl chloride resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6598390A JPH03265642A (en) | 1990-03-15 | 1990-03-15 | Vinyl chloride resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03265642A true JPH03265642A (en) | 1991-11-26 |
Family
ID=13302753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6598390A Pending JPH03265642A (en) | 1990-03-15 | 1990-03-15 | Vinyl chloride resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03265642A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10927237B2 (en) * | 2018-01-15 | 2021-02-23 | Korea Research Institute Of Chemical Technology | Compound having bis phenylene group substituted with alkylamide, composition for controlling polyphenylene polymer flowability and method of polyphenylene polymer flowability control using the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50123757A (en) * | 1974-01-14 | 1975-09-29 | ||
| JPS51136739A (en) * | 1975-05-22 | 1976-11-26 | Ube Ind Ltd | Process for producing polyamide moulded article with an improved surface property |
| JPS5525457A (en) * | 1978-08-11 | 1980-02-23 | Unitika Ltd | Thermoplastic polymer composition |
| JPS5558241A (en) * | 1978-10-24 | 1980-04-30 | Nippon Telegr & Teleph Corp <Ntt> | Vinyl chloride resin composition having improved abrasion quality |
| JPS57119951A (en) * | 1981-01-16 | 1982-07-26 | Ube Ind Ltd | Polyamide composition |
-
1990
- 1990-03-15 JP JP6598390A patent/JPH03265642A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50123757A (en) * | 1974-01-14 | 1975-09-29 | ||
| JPS51136739A (en) * | 1975-05-22 | 1976-11-26 | Ube Ind Ltd | Process for producing polyamide moulded article with an improved surface property |
| JPS5525457A (en) * | 1978-08-11 | 1980-02-23 | Unitika Ltd | Thermoplastic polymer composition |
| JPS5558241A (en) * | 1978-10-24 | 1980-04-30 | Nippon Telegr & Teleph Corp <Ntt> | Vinyl chloride resin composition having improved abrasion quality |
| JPS57119951A (en) * | 1981-01-16 | 1982-07-26 | Ube Ind Ltd | Polyamide composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10927237B2 (en) * | 2018-01-15 | 2021-02-23 | Korea Research Institute Of Chemical Technology | Compound having bis phenylene group substituted with alkylamide, composition for controlling polyphenylene polymer flowability and method of polyphenylene polymer flowability control using the same |
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