JPH03261114A - Chip inductor - Google Patents
Chip inductorInfo
- Publication number
- JPH03261114A JPH03261114A JP2060200A JP6020090A JPH03261114A JP H03261114 A JPH03261114 A JP H03261114A JP 2060200 A JP2060200 A JP 2060200A JP 6020090 A JP6020090 A JP 6020090A JP H03261114 A JPH03261114 A JP H03261114A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- cylindrical insulator
- foil plating
- copper foil
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011889 copper foil Substances 0.000 claims abstract description 8
- 239000012778 molding material Substances 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 239000011888 foil Substances 0.000 abstract description 7
- 239000000919 ceramic Substances 0.000 abstract description 3
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract 2
- 239000000696 magnetic material Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000004804 winding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は各種電子機器に利用されるチップインダクタに
関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a chip inductor used in various electronic devices.
従来の技術
近年、各種電子機器は高機能化、小型化されてきており
、高品質のチップインダクタが広く求められている。BACKGROUND OF THE INVENTION In recent years, various electronic devices have become more sophisticated and smaller, and high-quality chip inductors are widely sought after.
従来、この種のチップインダクタはめっきしたコイル板
を重ねた積層構造のもの、あるいは第３図または第４図
に示すものが一般的であった。以下、第３図および第４
図によりその構成を説明する。Conventionally, this type of chip inductor has generally had a laminated structure in which plated coil plates are stacked, or one shown in FIG. 3 or 4. Below, Figures 3 and 4
The configuration will be explained with reference to figures.
図に示すように、ドラム形コア１０に巻線したコイル１
１のリード線１２を端子１３にはんだ処理を施して接続
し、端子１３の端部が出るように全体をモールド材１４
で底形していた。As shown in the figure, a coil 1 wound around a drum-shaped core 10
1 lead wire 12 is connected to the terminal 13 by soldering, and the whole is molded with molding material 14 so that the end of the terminal 13 is exposed.
It had a bottom shape.
発明が解決しようとする課題
このような従来のチップインダクタで積層構造のものは
薄板重ねのため特性面で少ない電流でインダクタンスの
低下が起り、またＱが低い課題がある。第３図または第
４図のような巻線構造では巻線ばらつきが大きく、微細
な巻数調整ができないため特性公差を縮めることが難し
く、また、細線を巻線しているため断線や端子との接続
時のトンネルはんだまたは焼は細りなどの課題がある。Problems to be Solved by the Invention Since such conventional chip inductors with a laminated structure are made of stacked thin plates, there are problems in terms of characteristics such as a decrease in inductance with a small current and a low Q. With the winding structure as shown in Figures 3 and 4, the winding variation is large and the number of turns cannot be adjusted finely, making it difficult to reduce the characteristic tolerance.Furthermore, since the wire is wound with thin wire, there is a possibility of wire breakage or contact with the terminal. Tunnel soldering or baking during connection has problems such as thinning.
本発明は上記課題を解決するもので、電気的特性を向上
し、断線、はんだ接続不良をなくして信頼性を向上する
ことを目的としている。The present invention is intended to solve the above-mentioned problems, and aims to improve reliability by improving electrical characteristics and eliminating disconnections and poor solder connections.
課題を解決するための手段
本発明は上記目的を達成するために、フェライトコアな
どの絶縁性のある磁性体またはセラミック、プラスチッ
クなどの絶縁性のある非磁性体により形威した円柱状絶
縁体の全周にｗ４箔めっきを施し、この円柱状絶縁体の
側面をｌｉ！箔めっきをコイル状につながるよう切削し
てコイルとし、円柱状絶縁体の両端の穴に端子を挿入し
、端子とＩＲ済めっきを電気的接続し、さらに両端の端
子の一端部が出るように全体をモールド材で成形したこ
とを課題解決手段としている。Means for Solving the Problems In order to achieve the above object, the present invention uses a cylindrical insulator formed of an insulating magnetic material such as a ferrite core or an insulating non-magnetic material such as ceramic or plastic. W4 foil plating is applied to the entire circumference, and the sides of this cylindrical insulator are li! Cut the foil plating so that it connects into a coil shape, insert the terminals into the holes at both ends of the cylindrical insulator, electrically connect the terminals and the IR-finished plating, and then make one end of the terminals at both ends stick out. The solution to this problem was to mold the entire product using molding material.
作用
本発明は上記した課題解決手段により、ｗ４箔めっきの
切削加工の寸法調整で電気的特性を微調整できて特性公
差を縮めることができ、円柱状絶縁体にスペース巻きに
コイルを巻いた構造となり、浮遊容量が少なくＱを高く
できる。さらに、円柱状絶縁体の両端に挿入した端子を
はんだ接続するとき、挿入穴以外の端子と接している広
い部分にできて断線などの課題がなくなる。Effects The present invention uses the above-mentioned problem-solving means to finely adjust the electrical characteristics and reduce the characteristic tolerance by adjusting the dimensions of the cutting process of W4 foil plating, and has a structure in which a coil is wound in a space winding around a cylindrical insulator. Therefore, stray capacitance is small and Q can be increased. Furthermore, when terminals inserted at both ends of the cylindrical insulator are connected by solder, problems such as wire breakage are eliminated because the terminals are formed in wide areas other than the insertion holes that are in contact with the terminals.
実施例
以下、本発明の一実施例を第１図および第２図に基づい
て説明する。EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 and 2.
図に示すように、円柱状絶縁体１はフェライトコアなど
の絶縁性のある磁性体またはセラミック、プラスチック
などの絶縁性のある非磁性体で形威し、この円柱状絶縁
体ｌの全周に銅箔めっき２を施し、その後側面をコイル
状につながるよう乙二切削してコイル３を形威し、コイ
ル本体４としている。円柱状絶縁体ｌの両端の中央部に
設けた穴５に端子６の突起部７を挿入しし、端子６と接
している銅箔めっき２とではんだ接続している。コイル
本体４と端子６とをはんだにより電気的に接続した状態
で、端子６の端部８が出るように外周を樹脂などのモー
ルド材９で成形し、端子６のモールド材９から出ている
端部８をホーミングし、面実装に使用できる。As shown in the figure, the cylindrical insulator 1 is made of an insulating magnetic material such as a ferrite core, or an insulating non-magnetic material such as ceramic or plastic, and the entire circumference of the cylindrical insulator 1 is Copper foil plating 2 is applied, and then the side surfaces are cut to form a coil 3 to form a coil body 4. A protrusion 7 of a terminal 6 is inserted into a hole 5 provided at the center of both ends of the cylindrical insulator 1, and is connected by solder to the copper foil plating 2 in contact with the terminal 6. With the coil body 4 and the terminal 6 electrically connected by solder, the outer periphery is molded with a molding material 9 such as resin so that the end 8 of the terminal 6 is exposed, and the terminal 6 is exposed from the molding material 9. The end portion 8 can be homed and used for surface mounting.
発明の効果
以上の実施例から明らかなように本発明によれば、円柱
状絶縁体の側面のｗ４箔めっきをコイル状に切削するの
でコイルのピッチ幅および巻数を微調整できるため、電
気的特性を狙い通り設定でき、特性公差を従来より縮小
できる。また、コイルはスペース巻きとなるため高周波
特性が良く、細線を使わないので断線など線処理の課題
がなく、信頼性を向上できる。Effects of the Invention As is clear from the above embodiments, according to the present invention, the W4 foil plating on the side surface of the cylindrical insulator is cut into a coil shape, so that the pitch width and number of turns of the coil can be finely adjusted. can be set as desired, and characteristic tolerances can be reduced compared to conventional methods. Additionally, since the coil is space-wound, it has good high-frequency characteristics, and since thin wires are not used, there are no problems with wire processing such as wire breaks, and reliability can be improved.
第１図は本発明の一実施例のチップインダクタの分解斜
視図、第２図は同チップインダクタのモールド材を透視
した状態の斜視図、第３図は従来のチップインダクタの
一例の断面図、第４図は同チップインダクタの他の例の
断面図である。
ｌ・・・・・・円柱状絶縁体、２・・・・・・ｔｉ４箔
めっき、３・・・・・・コイル、５・・・・・・穴、６
・・・・・・端子、８・・・・・・端部、９・・・・・
・モールド材。FIG. 1 is an exploded perspective view of a chip inductor according to an embodiment of the present invention, FIG. 2 is a perspective view of the same chip inductor as seen through the molding material, and FIG. 3 is a sectional view of an example of a conventional chip inductor. FIG. 4 is a sectional view of another example of the same chip inductor. l... Cylindrical insulator, 2... Ti4 foil plating, 3... Coil, 5... Hole, 6
...Terminal, 8... End, 9...
・Mold material.
Claims (1)
箔めっきをコイル状につながるよう切削して形成したコ
イルと、前記円柱状絶縁体の両端に設けた穴に突起部を
挿入し前記銅箔めっきに電気的接続した端子と、前記端
子の端部が表出するように全体を覆ったモールド材より
なるチップインダクタ。A cylindrical insulator, a coil formed by cutting copper foil plating applied to the entire circumference of the cylindrical insulator so as to be connected in a coil shape, and protrusions inserted into holes provided at both ends of the cylindrical insulator. A chip inductor comprising a terminal electrically connected to the copper foil plating and a molding material covering the entire terminal so that the end of the terminal is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2060200A JPH03261114A (en) | 1990-03-12 | 1990-03-12 | Chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2060200A JPH03261114A (en) | 1990-03-12 | 1990-03-12 | Chip inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03261114A true JPH03261114A (en) | 1991-11-21 |
Family
ID=13135278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2060200A Pending JPH03261114A (en) | 1990-03-12 | 1990-03-12 | Chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03261114A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018159333A1 (en) * | 2017-02-28 | 2018-09-07 | 日本電産リード株式会社 | Coiled electronic component, coil component, coil component manufacturing method, inductance element, t-type filter, oscillating circuit, and inductance element manufacturing method |
| JP2018142669A (en) * | 2017-02-28 | 2018-09-13 | 日本電産リード株式会社 | Coil component and method of manufacturing coil component |
| JP2018142636A (en) * | 2017-02-28 | 2018-09-13 | 日本電産リード株式会社 | Coiled electronic component |
-
1990
- 1990-03-12 JP JP2060200A patent/JPH03261114A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018159333A1 (en) * | 2017-02-28 | 2018-09-07 | 日本電産リード株式会社 | Coiled electronic component, coil component, coil component manufacturing method, inductance element, t-type filter, oscillating circuit, and inductance element manufacturing method |
| JP2018142669A (en) * | 2017-02-28 | 2018-09-13 | 日本電産リード株式会社 | Coil component and method of manufacturing coil component |
| JP2018142636A (en) * | 2017-02-28 | 2018-09-13 | 日本電産リード株式会社 | Coiled electronic component |
| TWI785012B (en) * | 2017-02-28 | 2022-12-01 | 日商日本電產理德股份有限公司 | Coil-shaped electronic component, coil component, manufacturing method of coil component, inductance element, T-type filter, oscillating circuit, and inductance element manufacturing method |
| US11527341B2 (en) | 2017-02-28 | 2022-12-13 | Nidec-Read Corporation | Coiled electronic component, coil component, manufacturing method of coil component, inductance element, T-type filter, oscillation circuit, and manufacturing method of inductance |
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