JPH03257999A - Conductive resin composition and its mold - Google Patents
Conductive resin composition and its moldInfo
- Publication number
- JPH03257999A JPH03257999A JP5776790A JP5776790A JPH03257999A JP H03257999 A JPH03257999 A JP H03257999A JP 5776790 A JP5776790 A JP 5776790A JP 5776790 A JP5776790 A JP 5776790A JP H03257999 A JPH03257999 A JP H03257999A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- resin
- melting point
- fibers
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 17
- 239000000835 fiber Substances 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- 238000002844 melting Methods 0.000 claims abstract description 30
- 230000008018 melting Effects 0.000 claims abstract description 27
- 239000008188 pellet Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 23
- 229910001385 heavy metal Inorganic materials 0.000 claims abstract description 17
- 239000006078 metal deactivator Substances 0.000 claims abstract description 17
- 239000011231 conductive filler Substances 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 claims description 4
- 230000006866 deterioration Effects 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 7
- 238000002156 mixing Methods 0.000 abstract description 6
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012964 benzotriazole Substances 0.000 abstract description 2
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229920005668 polycarbonate resin Polymers 0.000 description 4
- 239000004431 polycarbonate resin Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- -1 metal complex compound Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- MZZYGYNZAOVRTG-UHFFFAOYSA-N 2-hydroxy-n-(1h-1,2,4-triazol-5-yl)benzamide Chemical compound OC1=CC=CC=C1C(=O)NC1=NC=NN1 MZZYGYNZAOVRTG-UHFFFAOYSA-N 0.000 description 2
- 241000156978 Erebia Species 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000088 plastic resin Substances 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- LYGGDXLOJMNFBV-UHFFFAOYSA-N 2-nitrobenzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1[N+]([O-])=O LYGGDXLOJMNFBV-UHFFFAOYSA-N 0.000 description 1
- GGZZISOUXJHYOY-UHFFFAOYSA-N 8-amino-4-hydroxynaphthalene-2-sulfonic acid Chemical compound C1=C(S(O)(=O)=O)C=C2C(N)=CC=CC2=C1O GGZZISOUXJHYOY-UHFFFAOYSA-N 0.000 description 1
- 235000018185 Betula X alpestris Nutrition 0.000 description 1
- 235000018212 Betula X uliginosa Nutrition 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的コ
（産業上の利用分野）
本発明は、導電性、特にその経時安定性に優れた、信頼
性の高い導電性樹脂組成物およびその成形品に関する。DETAILED DESCRIPTION OF THE INVENTION [Purpose of the Invention (Industrial Field of Application) The present invention relates to a highly reliable conductive resin composition having excellent conductivity, particularly stability over time, and molded articles thereof.
（従来の技術）
従来より、熱可塑性樹脂に導電性繊維を配合して導電性
樹脂Ｍ酸物とし、該組成物は導電性樹脂成形品の材料に
利用されてきた。 これらには主として炭素系の導電性
繊維が配合されてきたか、その用途は静電気防止が主で
、近年問題となっている電磁波シールドに対しては導電
性が低くあまり有効でない。 そこで電磁波シールド用
には金属系の導電性繊維（以下単に金属繊維という）を
使用して導電性を向上させることが行われている。(Prior Art) Conventionally, conductive resin M acid has been prepared by blending conductive fibers with thermoplastic resin, and the composition has been used as a material for conductive resin molded articles. These materials have mainly been blended with carbon-based conductive fibers, and their use is mainly for preventing static electricity, and their conductivity is low and is not very effective for electromagnetic shielding, which has become a problem in recent years. Therefore, for electromagnetic wave shielding, metal-based conductive fibers (hereinafter simply referred to as metal fibers) are used to improve conductivity.
しかし、金属繊維を配合すると、比重が大きくなり、ま
た樹脂がもつ本来の特性を大きく損なうという問題があ
り、その配合量を最小限にすることが要求されている。However, when metal fibers are blended, there is a problem that the specific gravity increases and the original properties of the resin are significantly impaired, so it is required to minimize the amount of metal fibers blended.
ところが、これらの金属繊維の配合量を減少させると
、使用環境についても大きな制約を受ける。 すなわち
、樹脂と金属繊維との熱膨脹の差により、高温になると
導電性が劣化する。 そのため現状では、金属Ｉａ雑の
配合量を多くして導電性の低下・劣化を防止し、かつ使
用環境を限定することによって実用化されている。 そ
のように従来の金属繊維の導電性樹脂組成物及びその成
形品は、用途に制約を受けかつ特性が不安定で、信頼性
が低いという問題点があった。However, if the blending amount of these metal fibers is reduced, the usage environment is also subject to significant restrictions. That is, due to the difference in thermal expansion between the resin and the metal fibers, the conductivity deteriorates at high temperatures. Therefore, at present, it is put into practical use by increasing the amount of metal Ia mixed to prevent the decrease and deterioration of the conductivity, and by limiting the usage environment. As described above, conventional conductive resin compositions of metal fibers and molded products thereof have problems in that they are limited in use, have unstable properties, and have low reliability.
また、熱可塑性樹脂に金属繊維を充填すると樹脂の酸化
劣化分解を著しく促進する問題がある。Furthermore, when a thermoplastic resin is filled with metal fibers, there is a problem in that the oxidative deterioration and decomposition of the resin is significantly accelerated.
この金属繊維の触媒作用を防止するため重金属不活性化
剤を使用することがあるが、それを単に混合して導電性
樹脂に使用すると金属繊維表面に不活性〈非導電性）な
金属錯化合物が形成され導電性が低下する欠点がある。Heavy metal deactivators are sometimes used to prevent this catalytic action of metal fibers, but if they are simply mixed and used in conductive resin, an inert (non-conductive) metal complex compound is formed on the surface of the metal fibers. is formed, resulting in a decrease in conductivity.
従って、熱可塑性樹脂の劣化を十分防止することがで
きず、機械的特性が低下するという問題かあった。Therefore, there was a problem in that deterioration of the thermoplastic resin could not be sufficiently prevented and mechanical properties deteriorated.
（発明が解決しようとする課題）
本発明は、上記の欠点・問題点を解消するためになされ
たもので、高温においても成形品の導電性か劣化せず、
特にその経時安定性に優れ、さらに機械的特性の低下か
少ない、信頼性の高い導電性樹脂組成物およびその成形
品を提供しようとするものである。(Problems to be Solved by the Invention) The present invention has been made to solve the above-mentioned drawbacks and problems.
In particular, it is an object of the present invention to provide a highly reliable conductive resin composition that has excellent stability over time and little deterioration in mechanical properties, and a molded article thereof.
［発明の構成コ
（課題を解決するための手段〉
本発明者らは、上記の目的を達成しようと鋭意研究を重
ねた結果、Ｓ電性充填材として、導電性ｔＩｉ雌と、通
常の熱可塑性樹脂より高い融点を有する低融点金属とを
併用し、予め熱″ｑ塑性樹脂に含有させた重金属不活性
化剤を用いることによって、高温においても成形品の導
電性および機械的強度の劣化のない導電性樹脂組成物が
得られることを見いたし、本発明を完敗したものである
。[Structure of the Invention (Means for Solving the Problems)] As a result of intensive research to achieve the above object, the present inventors have developed a method using conductive tIi female and ordinary heat as an S conductive filler. By using a low melting point metal that has a higher melting point than the plastic resin, and by using a heavy metal deactivator that has been pre-contained in the plastic resin, it is possible to prevent deterioration of the conductivity and mechanical strength of the molded product even at high temperatures. However, the present invention was completely defeated.
すなわち、本発明は、
＜Ａ）長繊維状の導電性ＩＩ＆雌と（Ｂ）低融点金属と
からなる導電性充填材の表面に、（Ｃ）重金属不活性化
剤を含む（ＤＪ熱可塑性樹脂層を被覆形成一体化してベ
レット状に切断したマスターペレットと、（Ｅ）熱可塑
性ｔ！ｌ脂ペレットとを配合してなることを特徴とする
導電性樹脂組成物である。That is, the present invention provides the following features: (C) containing a heavy metal deactivator (DJ thermoplastic resin This is a conductive resin composition characterized by blending a master pellet obtained by integrally forming a coating layer and cutting into a pellet shape, and (E) a thermoplastic t!l fat pellet.
また、この導電性樹脂組成物を低融点金属の融点以上の
温度で成形してなることを特徴とする導電性樹脂の成形
品である。Further, the present invention is a conductive resin molded article characterized in that the conductive resin composition is molded at a temperature equal to or higher than the melting point of a low-melting point metal.
本発明に用いる（Ａ）長繊維状の導電性繊維としては、
銅繊維、銅合金繊維、ステンレス繊維、アルミニウム繊
維、ニッケル繊維、又は表面に金属層（例えは銅、半田
、ニッケル、アルミニウム等）を有する他の金属繊維、
又は表面に金属層を有する有機繊維もしくは無機繊維等
が挙げられる。The (A) long fibrous conductive fiber used in the present invention includes:
Copper fibers, copper alloy fibers, stainless steel fibers, aluminum fibers, nickel fibers, or other metal fibers with a metal layer (e.g. copper, solder, nickel, aluminum, etc.) on the surface,
Alternatively, organic fibers or inorganic fibers having a metal layer on the surface may be used.
これら導電性繊維の直径は５〜１００μ−程度のもので
あることが望ましい、 繊維の直径が５ｎ和未満である
と機械的特性か悪くなり、取扱いか難しくなり、またコ
スト高となる。 １００μ口を超えると成形品の中で
繊維が十分に配分されず導電性が悪くなる。 樽電性繊
維束における繊維の数は１００〜５００本程度が好まし
く、この範囲を外れると導電性が悪くなる。 導電性繊
維の配合量は全体の導電性樹脂組成物に対して ５〜７
５重量％含有することが望ましい。 ５重量％未満で
は導電性が低く、また７５重量％を超えると組成物の流
動性や物性が低下する。The diameter of these conductive fibers is preferably about 5 to 100 .mu.-. If the diameter of the fibers is less than 5n, the mechanical properties will be poor, handling will be difficult, and the cost will be high. If the diameter exceeds 100 μm, the fibers will not be sufficiently distributed in the molded product, resulting in poor conductivity. The number of fibers in the barrel conductive fiber bundle is preferably about 100 to 500, and if it is out of this range, the conductivity will be poor. The amount of conductive fiber blended is 5 to 7 with respect to the entire conductive resin composition.
It is desirable to contain 5% by weight. If it is less than 5% by weight, the conductivity will be low, and if it exceeds 75% by weight, the fluidity and physical properties of the composition will deteriorate.
本発明に用いる（Ｂ）低融点金属としては、Ｓｎ又は５
ｎ−Ｐｂを主成分と、する一般ハンダ合金、Ｐｂ−Ａｇ
を主成分とする高温ハンダ合金、さらにはＳｎ −Ｐｂ
−Ｂｉを主成分とする低温ハンダ合金等が挙げられ、具
体的には第１表及び第２表にそれぞれ示した低融点合金
やハンダが使用できる。The low melting point metal (B) used in the present invention is Sn or 5
General solder alloy containing n-Pb as the main component, Pb-Ag
High-temperature solder alloys mainly composed of Sn-Pb
Examples include low-temperature solder alloys containing -Bi as a main component. Specifically, low-melting point alloys and solders shown in Tables 1 and 2 can be used.
低融点金属は、前述した長繊維状の導電性繊維をフラッ
クス浴槽に通してフラックス処理をし、次いでハンダ浴
槽に導いて、導電性繊維の表面にハンダをメツキ又は溶
融被覆した導電性充填材をつくる。 その際、低融点金
属繊維と導電性繊維との収束、あるいはフラックス処理
前、フラックス処理後、メツキまたは溶融処理後におけ
る導電性繊維の収束を組み合せることができる。 これ
らの低融点金属の融点は成形加工温度より１０〜２０℃
低く選定することがよい、 低融点金属の配合量は、導
電性繊維に対して５〜７０重量％の割合に配合すること
が望ましい。 その配合量が５重量％未満では樺電性＊
維を結合、被覆させるに不十分となり、まｆＳ７０重量
％を超えて過剰になると、低融点金属か遊離して組成物
の物性を低下させる。For low melting point metals, the long conductive fibers mentioned above are passed through a flux bath and subjected to flux treatment, and then guided to a solder bath, where the surface of the conductive fibers is coated with solder or a conductive filler is melted and coated with solder. to make. At that time, it is possible to combine the convergence of the low-melting point metal fiber and the conductive fiber, or the convergence of the conductive fiber before flux treatment, after flux treatment, after plating or melting treatment. The melting point of these low melting point metals is 10 to 20 degrees Celsius higher than the processing temperature.
The amount of the low melting point metal, which should be selected to be low, is desirably 5 to 70% by weight based on the conductive fibers. If the amount is less than 5% by weight, birch conductivity*
It is insufficient to bind and coat the fibers, and if the amount exceeds 70% by weight, low melting point metals will be liberated and the physical properties of the composition will deteriorate.
本発明に用いる（Ｃ）重金属不活性化剤としては、訃ニ
トロベンズヒドラジド、３−アミノ −１，２４−トリ
アゾール、ベンゾトリアゾール等が挙げられ、具体的に
はＭＡＲＫ ＣＤＡ−１，ＭＡＲＫＣＤＡ−６（アテ
カアーカス化学社製、商品名）等があり、これらは単独
又は混合して使用することができる。 重金属不活性化
剤の配合量は、熱可塑性樹脂に対して０．１〜１重量９
≦、より好ましくは０．３〜０．５重量％である。 そ
の配合量が０．１重量％未満では特性保持に効果が不十
分であり、また１重量％を超えて充填しても効果は同じ
である。 重金属不活性化剤は熱可塑性樹脂中に含有さ
せておく。Examples of the heavy metal deactivator (C) used in the present invention include nitrobenzhydrazide, 3-amino-1,24-triazole, benzotriazole, etc. Specifically, MARK CDA-1, MARKCDA-6 ( (manufactured by Ateca Arcus Chemical Co., Ltd., trade name), etc., and these can be used alone or in combination. The blending amount of the heavy metal deactivator is 0.1 to 1% by weight9 based on the thermoplastic resin.
≦, more preferably 0.3 to 0.5% by weight. If the amount is less than 0.1% by weight, the effect on maintaining properties is insufficient, and even if the amount exceeds 1% by weight, the same effect will be obtained. The heavy metal deactivator is contained in the thermoplastic resin.
本発明の（Ｄ）熱可塑性樹脂層を形成する樹脂としては
、ポリプロピレン樹脂、ポリエチレン樹脂、ポリスチレ
ン樹脂、アクリロニトリル・ブタジェン・スチレン共重
合樹脂（透明な樹脂を含むン、変性ポリフェニレンオキ
サイド樹脂、ポリブチレンテレフタレート樹脂、ポリカ
ーボネート樹脂、ポリアミド樹脂、ポリエーテルイミド
樹脂、全芳香ポリエステル樹脂（液晶ポリマー）等が挙
げられ、これらは単独又は２種以上混合して使用するこ
とができる。 これらの熱可塑性樹脂は、前述した導電
性樹脂と低融点金属とからなる導電性充填材を被覆する
ものである。Examples of the resin forming the thermoplastic resin layer (D) of the present invention include polypropylene resin, polyethylene resin, polystyrene resin, acrylonitrile-butadiene-styrene copolymer resin (including transparent resin), modified polyphenylene oxide resin, and polybutylene terephthalate resin. resin, polycarbonate resin, polyamide resin, polyetherimide resin, fully aromatic polyester resin (liquid crystal polymer), etc., and these can be used alone or in a mixture of two or more. It is coated with a conductive filler made of a conductive resin and a low melting point metal.
本発明に用いる（Ｅ）熱可塑性樹脂ペレット（以下ナチ
ュラルペレットという）は、前記（Ｄ＞の熱可塑性樹脂
と同一・同種の樹脂でよい、 また（Ｄ）の熱可塑性樹
脂と混合されることによって界面に形成される第三の合
成樹脂が補強効果をもつもの、すなわち、ブレンドポリ
マーとなるものでもよい、 例えば（Ｄ）の熱可塑性樹
脂として変性ポリフェニレンオキサイド樹脂、ポリカー
ボネート樹脂等を使用するときは、ナチュラルペレット
としてスチレン系の熱可塑性樹脂を使用すると好結果が
得られる。 これらの組合せを適宜選択することによっ
て所要の特性をもつ成形品を得ることができる。The (E) thermoplastic resin pellets (hereinafter referred to as natural pellets) used in the present invention may be the same or similar type of resin as the thermoplastic resin (D>), or may be mixed with the thermoplastic resin (D). The third synthetic resin formed at the interface may have a reinforcing effect, that is, it may be a blended polymer. For example, when using modified polyphenylene oxide resin, polycarbonate resin, etc. as the thermoplastic resin (D), Good results can be obtained by using a styrene-based thermoplastic resin as the natural pellets.By appropriately selecting a combination of these resins, a molded product with desired characteristics can be obtained.
本発明の導電性樹脂組成物は、通常衣のようにして製造
することができる。 長繊維状の導電性繊維に、低融点
金属を溶融被覆収束してなる導電性充填材を押出機のダ
イスに通し、予め重金属不活性化剤を混入した熱可塑性
樹脂を上記導電性充填材の表面に被覆して熱可塑性樹脂
層を形成し、次いで適当な大きさのペレットに切断して
マスク−ペレットとする。 このマスターペレットの形
状は、通常断面が円形であるが、偏平、その他の形状で
もよく、特に制限されない。 またマスターペレットの
製造工程は連続的に行うことが有利であるが、バッチ方
式でＷ遺してもよい。 このマスターペレットにナチュ
ラルペレットを混合して導電性樹脂組成物とする。The conductive resin composition of the present invention can be manufactured in the same manner as usual. A conductive filler made of long conductive fibers fused and coated with a low melting point metal is passed through a die of an extruder, and a thermoplastic resin mixed with a heavy metal deactivator is added to the conductive filler. The surface is coated to form a thermoplastic resin layer, and then cut into pellets of appropriate size to form mask pellets. The shape of this master pellet is usually circular in cross section, but may be flat or in other shapes, and is not particularly limited. Although it is advantageous to carry out the master pellet manufacturing process continuously, it may also be carried out in a batch manner. A conductive resin composition is prepared by mixing natural pellets with the master pellets.
こうして製造された導電性樹脂組成物は、低融点金属の
融点以上の成形温度で射出成形、順送成形、押出成形、
圧縮成形して、電磁波シールド又は導電性を必要とする
電子機器、計測機器、通信機器等のハウジングや部品用
の導電性樹脂成形品とすることができる。The conductive resin composition thus produced can be molded by injection molding, progressive molding, extrusion molding, etc. at a molding temperature higher than the melting point of the low melting point metal.
By compression molding, it can be made into conductive resin molded products for housings and parts of electronic devices, measuring devices, communication devices, etc. that require electromagnetic shielding or conductivity.
（作用〉
本発明によれば、導電性充填材として導電性繊維と低融
点金属を併用したことによって、熱可塑性樹脂中の導電
性繊維と導電性繊維の接合点を低融点金属が耐着して強
固な網目状結合を形成するから、経時変化によって導電
性が低下することかない。 さらに、重金属不活性化剤
の添加によって熱可塑性樹脂の導電性繊維による劣化を
防ぐことになり、その結果、樹脂本来有する機械的特性
の低下を少なくすることかできる。(Function) According to the present invention, by using conductive fibers and a low melting point metal together as a conductive filler, the low melting point metal can resist adhesion to the junction between the conductive fibers and the conductive fibers in the thermoplastic resin. The conductivity does not deteriorate over time because it forms a strong network bond.Furthermore, the addition of a heavy metal deactivator prevents deterioration of the thermoplastic resin due to the conductive fibers. It is possible to reduce the deterioration of the mechanical properties inherent in the resin.
（実施例） 次に本発明を実施例によって説明する。(Example) Next, the present invention will be explained by examples.
実施例 １
直径５０μ口の銅繊維を１５０本収束し、これをスパー
クルフラックスＰＯ−Ｚ−７（手性金属工業社製、商品
名）でフラックス処理した後、低融点金属（Ｓｎ６０％
、Ｐｂ４０％）の溶融槽に通し、低融点金属を被覆させ
て導電性充填材とする。 これを押出機のダイスに通し
、重金属不活性化剤のＣＤＡ−１＜アデカアーガス社製
、商品名）を樹脂に対して０．５重量％添加したタフレ
ックス４１０（三菱モンサント化成社製ＡＢＳ樹脂、商
品名）で溶融被覆して、導電性充填材の表面にＡＢＳ樹
脂層を形成した。 これを冷却した後、ペレタイザーで
繊維方向の長さ６Ｉｉ＋１に切断してマスターペレット
とした。 このマスターペレットに、ポリカーボネイト
樹脂であるツバレックス７０２５Ａ（三菱化成工業社製
、商品名）のナチュラルペレットを混合して導電性樹脂
組成物を製造した。Example 1 150 copper fibers with a diameter of 50 μm were bundled, and after flux treatment with Sparkle Flux PO-Z-7 (manufactured by Teshi Metal Industry Co., Ltd., trade name), a low melting point metal (Sn60%
, Pb40%) and coated with a low melting point metal to form a conductive filler. This was passed through a die of an extruder, and then the heavy metal deactivator CDA-1 (manufactured by Adeka Argus, trade name) was added in an amount of 0.5% by weight based on the resin. , trade name) to form an ABS resin layer on the surface of the conductive filler. After cooling, the pellets were cut into lengths of 6Ii+1 in the fiber direction using a pelletizer to obtain master pellets. Natural pellets of Tubarex 7025A (manufactured by Mitsubishi Chemical Industries, Ltd., trade name), which is a polycarbonate resin, were mixed with this master pellet to produce a conductive resin composition.
上記組成を第３表に示したか、この場合の銅繊維の充填
率は１５重量％であった。The above composition is shown in Table 3, and the copper fiber filling rate in this case was 15% by weight.
比較例
実施例１において、低融点金属の使用と重金属不活性化
剤の添加をしなかった以外は、実施例１と同様にして導
電性樹脂組成物を製造した。Comparative Example A conductive resin composition was produced in the same manner as in Example 1, except that the low melting point metal was not used and the heavy metal deactivator was not added.
実施例および比較例で製造した導電性樹脂組成物を用い
て射出成形品を製造した。 この成形品について機械的
特性、体積抵抗率、電磁波シールド効果の試験を行って
結果を得たので第３表に示したが、本発明の極めて顕著
な効果が確認された。Injection molded products were manufactured using the conductive resin compositions manufactured in Examples and Comparative Examples. This molded article was tested for mechanical properties, volume resistivity, and electromagnetic shielding effect, and the results are shown in Table 3, and the extremely remarkable effects of the present invention were confirmed.
第３表 〈単位〉 第３表（−ｙ５き） （単位） ＊１ ：三菱モンサント化成社製ＡＢＳ樹脂、商品名。Table 3 <unit> Table 3 (-y5ki) (unit) *1: ABS resin manufactured by Mitsubishi Monsanto Chemical Co., Ltd., product name.
＊２：三菱化成工業社製ポリカーボネイト樹脂、商品名
。*2: Polycarbonate resin manufactured by Mitsubishi Chemical Industries, Ltd., product name.
＊３：アデカアーガス化学社製、商品名。*3: Manufactured by Adeka Argus Chemical Co., Ltd., product name.
［発明の効果〕
以上の説明および第３表の結果から明らかなように、本
発明の導電性樹脂組成物は、導電性充填材として尋電性
繊維と低融点金属とを併用し、さらに被覆樹脂層に重金
属不活性化剤を添加したことによって、導電性＃Ａ雌同
士の結合が強固となり、導電性ｍ雌の配合量が減少でき
、またｍ械的特性も劣化することのないものであり、こ
の組成物を用いた成形品は、高温の環境変化を加えても
導電性及び機械的特性が低下することなく、電磁波シー
ルド効果の経時安定性に優れたものである。[Effects of the Invention] As is clear from the above explanation and the results in Table 3, the conductive resin composition of the present invention uses a conductive fiber and a low melting point metal together as a conductive filler, and is further coated with a low melting point metal. By adding a heavy metal deactivator to the resin layer, the bond between conductive #A females becomes stronger, the amount of conductive #A female can be reduced, and the mechanical properties of M do not deteriorate. Molded products using this composition do not deteriorate in conductivity or mechanical properties even when exposed to high-temperature environmental changes, and have excellent electromagnetic shielding effect over time.
この成形品を電子機器、通信機器等に使用すれば極めて
高い信頼性を付与することができる。If this molded product is used in electronic equipment, communication equipment, etc., extremely high reliability can be provided.
Claims (2)
からなる導電性充填材の表面に、（Ｃ）重金属不活性化
剤を含む（Ｄ）熱可塑性樹脂層を被覆形成一体化してペ
レット状に切断したマスターペレットと、（Ｅ）熱可塑
性樹脂ペレットとを配合してなることを特徴とする導電
性樹脂組成物。1. (C) A thermoplastic resin layer containing a heavy metal deactivator (D) is integrally formed on the surface of a conductive filler consisting of (A) long fibrous conductive fibers and (B) a low melting point metal. 1. A conductive resin composition comprising a master pellet cut into pellets and (E) a thermoplastic resin pellet.
からなる導電性充填材の表面に、（Ｃ）重金属不活性化
剤を含む（Ｄ）熱可塑性樹脂層を被覆形成一体化してペ
レット状に切断したマスターペレットと、（Ｅ）熱可塑
性樹脂ペレットとを配合した導電性樹脂組成物を、該低
融点金属の融点以上の温度で成形してなることを特徴と
する導電性樹脂成形品。2. (C) A thermoplastic resin layer containing a heavy metal deactivator (D) is integrally formed on the surface of a conductive filler consisting of (A) long fibrous conductive fibers and (B) a low melting point metal. A conductive resin characterized in that it is formed by molding a conductive resin composition containing master pellets cut into pellets and (E) thermoplastic resin pellets at a temperature higher than the melting point of the low melting point metal. Molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5776790A JPH03257999A (en) | 1990-03-08 | 1990-03-08 | Conductive resin composition and its mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5776790A JPH03257999A (en) | 1990-03-08 | 1990-03-08 | Conductive resin composition and its mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03257999A true JPH03257999A (en) | 1991-11-18 |
Family
ID=13065029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5776790A Pending JPH03257999A (en) | 1990-03-08 | 1990-03-08 | Conductive resin composition and its mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03257999A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007154015A (en) * | 2005-12-05 | 2007-06-21 | Sumitomo Chemical Co Ltd | Process for producing molded article made of electroconductive thermoplastic resin |
-
1990
- 1990-03-08 JP JP5776790A patent/JPH03257999A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007154015A (en) * | 2005-12-05 | 2007-06-21 | Sumitomo Chemical Co Ltd | Process for producing molded article made of electroconductive thermoplastic resin |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0283844B1 (en) | Conductive resin composition and molded product using the same | |
| JPH03257999A (en) | Conductive resin composition and its mold | |
| JPH0778515A (en) | Conductive plastic goods | |
| JPS63218309A (en) | Electrically conductive resin composition and molded item made thereof | |
| JPH03258000A (en) | Conductive resin composition and its mold | |
| JP2523098B2 (en) | Conductive resin composition and molded article thereof | |
| JPS63218310A (en) | Electrically conductive resin composition and molded item made thereof | |
| JPH0212987B2 (en) | ||
| JP2658000B2 (en) | Conductive resin composition and molded article thereof | |
| JPH0763971B2 (en) | Conductive resin molding | |
| JPS63235368A (en) | Electrically conductive resin composition and molded product thereof | |
| JPS63297459A (en) | Electrically conductive polymer blend | |
| JPH0237120B2 (en) | DODENSEIJUSHISOSEIBUTSUOYOBISONOSEIKEIHIN | |
| JP2523097B2 (en) | Conductive resin composition and molded article thereof | |
| JPH06128494A (en) | Production of electrically conductive resin composition | |
| JPH06128493A (en) | Production of electrically conductive resin composition | |
| JPH0212988B2 (en) | ||
| JPH06339921A (en) | Conductive resin molded product | |
| JPH0813904B2 (en) | Conductive resin composition | |
| JPH01204966A (en) | Conductive resin composition and its molding | |
| JPH02229498A (en) | Conductive resin composition and molding thereof | |
| JPH01198665A (en) | Electrically conductive resin composition | |
| JPH073072A (en) | Conductive resin composition and its molding | |
| JPH0743965B2 (en) | Conductive resin composition | |
| JPS63251468A (en) | Electrically conductive resin composition |