JPH03249891A - Video device - Google Patents
Video deviceInfo
- Publication number
- JPH03249891A JPH03249891A JP2047841A JP4784190A JPH03249891A JP H03249891 A JPH03249891 A JP H03249891A JP 2047841 A JP2047841 A JP 2047841A JP 4784190 A JP4784190 A JP 4784190A JP H03249891 A JPH03249891 A JP H03249891A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- prism
- state image
- meltable
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000007740 vapor deposition Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000010409 thin film Substances 0.000 claims abstract 2
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000354 decomposition reaction Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 2
- 230000008878 coupling Effects 0.000 abstract 2
- 238000010168 coupling process Methods 0.000 abstract 2
- 238000005859 coupling reaction Methods 0.000 abstract 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000011651 chromium Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Landscapes
- Color Television Image Signal Generators (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はカラーテレビカメラ等のビデオ装置に関し、特
に分解プリズムで分解された各コンポーネント像を夫々
、受像する固体撮像素子を分解プリズムに結合した構成
の装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a video device such as a color television camera, and more particularly, to a video device such as a color television camera, and more particularly, a solid-state image sensor that receives each component image separated by a separation prism is coupled to the separation prism. Regarding the configuration device.
［従来の技術］
像分解プリズムの各色チャンネルにおける光射出面と固
体撮像素子の受光面との相対位置関係は各色チヤンネル
毎のフォーカス（光軸方向）調整及び画面の片側のボケ
をなくす受光面の傾き調整、各色チヤンネル相互間のレ
ジストレーション（光軸に垂直面内の平行及び回転）調
整を考慮して決定されなければならない、この様な調整
を可能とするために像分解プリズムが固定された基板、
あるいはハウジングに各固体撮像素子を調整自在な保持
機構を介して取り付ける方式では、撮像装置自体が複雑
な保持機構を有する欠点を持つ、又像分解プリズムの各
色チャンネルの光射出面に透明な接着剤を用いて直接固
体撮像素子を接着する方式が実開昭５４−１１１４１９
号にある。しかしこの方式では光軸に垂直な面内での位
置及び回転方向の調整は可能であるが、光軸方向の調整
（フォーカス・片ボケ）は不可能である。[Prior art] The relative positional relationship between the light emitting surface of each color channel of an image resolving prism and the light receiving surface of a solid-state image sensor is determined by adjusting the focus (optical axis direction) for each color channel and adjusting the light receiving surface to eliminate blur on one side of the screen. The image resolving prism must be fixed to allow for tilt adjustment and registration (parallel and rotation in a plane perpendicular to the optical axis) adjustment between each color channel. substrate,
Alternatively, the method of attaching each solid-state image sensor to the housing via an adjustable holding mechanism has the disadvantage that the image pickup device itself has a complicated holding mechanism.Also, transparent adhesive is used on the light exit surface of each color channel of the image resolving prism. A method of directly bonding a solid-state image sensor using
It's in the issue. However, with this method, although it is possible to adjust the position and rotational direction in a plane perpendicular to the optical axis, adjustment in the optical axis direction (focus/unilateral blur) is not possible.
光軸方向の調整を可能にするため特開昭５８−６３２７
９号には可撓性を持ったスペーサーを像分解プリズムの
光射出面と固体撮像素子の縁の部分との間に介在させ、
接着剤をスペーサーの側面に塗布し、可撓変形状態を接
着剤の硬化によって維持させる方式が述べられているが
、接着剤のＭａｌ張係数が大きい場合、温度変化による
フォーカスズレが大きく解像度の高い固体撮像素子を使
用した場合に無視出来ない量となる畏れがある。又、こ
の方式では接着剤を厚く残すために経時変化によるフォ
ーカス、レジストレーションのズレも考えられる。To enable adjustment of the optical axis direction, Japanese Patent Application Laid-Open No. 58-6327
In No. 9, a flexible spacer is interposed between the light exit surface of the image resolving prism and the edge of the solid-state image sensor.
A method has been described in which an adhesive is applied to the side surface of the spacer and the flexible deformation state is maintained by curing the adhesive, but if the Mal tension coefficient of the adhesive is large, the focus shift due to temperature changes is large and the resolution is high. When a solid-state image sensor is used, there is a fear that the amount will be non-negligible. Furthermore, since this method leaves a thick layer of adhesive, it is possible that focus and registration may shift due to changes over time.
他方、像分解プリズムに金属製取付具を接着し、この取
付具で固体撮像素子を保持することも提案されている。On the other hand, it has also been proposed to bond a metal fixture to the image resolving prism and hold the solid-state image sensor with this fixture.
しかしながら、急激な温度変化があった場合、像分解プ
リズムの材質の線膨張係数と取付具のそれとの間に大き
な差異があるとプリズムに大きな力が働いて損傷させる
畏れがある。また取付具とプリズム面を接着した間部に
塵埃が付着したときに除去し難い欠点がある。一方、固
体撮像素子に１つに故障が起きた場合、その固体撮像素
子を像分解プリズムから剥離して交換することになるが
、剥離作業の差異に像分解プリズムの表面を損うことが
多い。However, if there is a sudden temperature change and there is a large difference between the coefficient of linear expansion of the material of the image resolving prism and that of the fixture, there is a risk that a large force will act on the prism and damage it. Another drawback is that it is difficult to remove dust when it adheres to the space between the fixture and the prism surface. On the other hand, if a failure occurs in one of the solid-state image sensors, the solid-state image sensor must be removed from the image resolving prism and replaced, but the peeling process often damages the surface of the image resolving prism. .
実開昭５９−３９５８０号は、像分解プリズムの射出面
に支柱を設け、固体撮像素子を保持する取付具と支柱を
、電気部品を接合する様にハンダ付けすることを提案し
ている。ハンダによる結合は固体撮像素子を取外すのに
都合が良い。Japanese Utility Model Application Publication No. 59-39580 proposes providing a support on the exit surface of an image resolving prism, and soldering the support to a fixture for holding a solid-state image sensor so as to connect electrical parts. Bonding by solder is convenient for removing the solid-state image sensor.
特開昭６１−１３５２７９は、開口を有する支持具を分
解プリズムの射出面に夫々接着し。Japanese Patent Application Laid-Open No. 61-135279 discloses that supports having openings are adhered to the exit surface of a resolving prism.
この支持具の複数の脚と、固体撮像素子を取付けた取り
付は具の脚とをハンダで結合している。The plurality of legs of this support and the legs of the fixture to which the solid-state imaging device is attached are connected by soldering.
しかしながら、組立作業中に、支持具の開口の縁がプリ
ズムに接している部分に微細なゴミが付着すると除去す
るのが困難で、残留したゴミで撮影光が散乱されて画質
を低下させることがあり、また金属性の部材を接着剤で
プリズムに接着することに伴う上述の問題点もある。However, if fine dust adheres to the area where the edge of the opening of the support is in contact with the prism during assembly, it is difficult to remove, and the remaining dust may scatter the photographing light, reducing image quality. There are also the above-mentioned problems associated with bonding a metallic member to a prism with an adhesive.
本件出願人は先に実開平１−０２３１８６号を提案し、
上述の問題に対処するため分解プリズム側面に特殊ハン
ダの被着層を形成し、この被着層と固体撮像素子の保持
具の間隔を調整しつつ間隙を標準ハンダで埋めながら接
着することを実施例に開示している。しかしながらこの
方法で製作した場合、そのままではハンダ層か厚くなり
過ぎて強度的に弱くなることもあるため、この特殊ハン
ダ層を薄く切削した後、接着する工程があり、厚さの管
理に高い精度を求められる為、かなり手間を取る作業に
なっていた。また剥離と接着を繰返した場合、特殊ハン
ダ層が何回も加熱されるとガラス板との接合力がよりま
るごともあった。あるいは、超音波を掛ながら分解プリ
ズム側面に特殊ハンダを接着する際、ハンダを所望の形
状に塗着させるには熟練を要した。The applicant previously proposed Utility Model Application No. 1-023186,
To deal with the above problem, we formed a special solder adhesion layer on the side surface of the decomposition prism, adjusted the distance between this adhesion layer and the holder of the solid-state image sensor, and then bonded it while filling the gap with standard solder. Disclosed as an example. However, if manufactured using this method, the solder layer may become too thick and the strength may be weakened, so there is a process of cutting this special solder layer thin and then gluing it, which allows for high precision in controlling the thickness. It was a very time-consuming task as it required the following. Furthermore, when peeling and adhesion were repeated, the bonding strength with the glass plate was even stronger when the special solder layer was heated many times. Alternatively, when applying special solder to the side surface of the decomposition prism while applying ultrasonic waves, skill was required to apply the solder to the desired shape.
［発明が解決しようとしている問題点］本発明は上述の
難点を削減し、蒸着法を使用して、被ｉ暦を形成する場
合の、実際の装置に適用するのに適した構成を提供する
目的を有する。[Problems to be Solved by the Invention] The present invention reduces the above-mentioned difficulties and provides a configuration suitable for application to an actual device when forming a calendar using a vapor deposition method. Have a purpose.
［問題点を解決するための手段］
この目的を達成するため、プリズムの側面（入・出射面
以外の面）に蒸着法により金属被覆を形成し、更に金属
被膜に濡れ性を高めるための薄い予備ハンダ層を設けて
あり、予備ハンダ層と固体撮像素子のケージングに設け
た金属の溶着可能な材質の部材との間を所定厚さの溶融
性金属で埋めると共に両者を結合している。この構成を
実施すると、金属被膜の総厚をｌｐｍ以下に抑えること
が可能であり、殊に薄い予備ハンダ層を蒸着で形成すれ
ば、この層目体は０．３１Ｌｍ前後（ｏ、ｉ〜ｏ、ｓ）
とすることがてきる。[Means for solving the problem] To achieve this objective, a metal coating is formed on the side surfaces of the prism (surfaces other than the entrance and exit surfaces) by vapor deposition, and a thin layer is added to the metal coating to improve wettability. A preliminary solder layer is provided, and the gap between the preliminary solder layer and a member made of a metal weldable material provided on the casing of the solid-state image sensor is filled with a meltable metal of a predetermined thickness, and the two are bonded together. By implementing this configuration, it is possible to suppress the total thickness of the metal coating to 1pm or less, and if a particularly thin preliminary solder layer is formed by vapor deposition, the thickness of this layer can be approximately 0.31Lm (o, i to o , s)
It is possible to do this.
［実施例］
第１図は本発明の一実施例の斜視図、第２図は第１図の
一部分の光軸方向の要部断面図、第３図は第２図の一要
素である固体撮像素子の正面図である。[Example] Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a cross-sectional view of a part of Fig. 1 in the optical axis direction, and Fig. 3 is a solid state that is an element of Fig. 2. FIG. 2 is a front view of an image sensor.
第１図において１００は撮像部であり、像分解プリズム
ｌと固体撮像素子３を有している。像分解プリズムｌは
ダイクロイック膜による反射と透過を利用して入射光り
を３原色像に分解している。像分解プリズムｌの左方に
は図示しない撮影系が配されているものとする。この像
分解プリズムの構造は良く知られているので説明は省略
するが、像分解プリズムｌの他にも例えば２像に分解す
る像分解プリズムなどにも本発明は適用できる。In FIG. 1, reference numeral 100 denotes an imaging section, which includes an image resolving prism l and a solid-state imaging device 3. As shown in FIG. The image separating prism l uses reflection and transmission by a dichroic film to separate incident light into three primary color images. It is assumed that a photographing system (not shown) is arranged to the left of the image resolving prism l. Since the structure of this image resolving prism is well known, its explanation will be omitted, but the present invention can be applied to, for example, an image resolving prism that separates into two images in addition to the image resolving prism 1.
像分解プリズムｌには３像に対応した３個のチャンネル
ごとに出射面が設けられ、各出射面ごとにカラートリミ
ンフィルタ２が接着されている。The image resolving prism l is provided with an exit surface for each of three channels corresponding to three images, and a color trimming filter 2 is adhered to each exit surface.
第２図の５ａ、５ｂは像分解プリズムｌの側面に蒸着形
成されたハンダ層を含む金属被覆の被接着層である。構
成は後述する。６ａ。Reference numerals 5a and 5b in FIG. 2 are metal coating layers including a solder layer deposited on the side surfaces of the image resolving prism l. The configuration will be described later. 6a.
６ｂはハンダ層である。７は固定撮像素子３の一部に設
けられたハンダ付は可能なハンダ接合部材であり１本実
施例ではハンダのきく金属材を用いて取付枠として構成
しているが、ケージングに直接、金属層を設けても良い
。6b is a solder layer. Reference numeral 7 denotes a solder joint member that is provided on a part of the fixed image sensor 3 and can be soldered. A layer may be provided.
又、取付枠７は第３因に描かれている通り撮影光束が通
る開口を有し、又４本の足が７８が突出している。これ
らは１組立時に位置調整用工具で把持するのに都合が良
い様に設けたものである。固体撮像素子３はネジ９等で
取付枠７に結合される。取付枠７にはまた第２図に示す
ように２つの耳部７ｂが設けられており、これら耳部７
ｂと先程の金属被覆５ａ、５ｂが夫々ハンダ６ａ、６ｂ
で接着され、隙間が埋め込まれる。Further, the mounting frame 7 has an opening through which the photographing light flux passes, as shown in the third factor, and four legs 78 protrude. These are provided so that they can be conveniently grasped with a position adjustment tool during one assembly. The solid-state image sensor 3 is coupled to the mounting frame 7 with screws 9 and the like. The mounting frame 7 is also provided with two ears 7b as shown in FIG.
b and the previous metal coatings 5a and 5b are solder 6a and 6b, respectively.
are glued together and the gaps are filled in.
８は防塵枠で、撮影光束を通過させる孔を具え、スポン
ジゴムの様な可圧縮材で作製されていて、取付枠７とフ
ィルタ２との間に挟み込まれている。Reference numeral 8 denotes a dustproof frame, which is provided with a hole through which a photographing light beam passes, is made of a compressible material such as sponge rubber, and is sandwiched between the mounting frame 7 and the filter 2.
次に金属膜の形成について説明する。Next, the formation of the metal film will be explained.
本例では４層構成とし、取付用ガラスを基板として被接
着域の形状の開口を持つマスクを掛け、第１層をクロー
ム（Ｃｒ）の蒸着、第２層はクロームとニッケル（Ｎｉ
）の２元蒸着層、第３層はニッケルの蒸着層とし、いず
れも基板を２５０℃に加温して蒸着している。続いて基
板の温度７０℃としてハンダを第４Ｍとして蒸着してい
る。This example has a four-layer structure, using a mounting glass as a substrate and a mask with an opening in the shape of the bonded area.The first layer is chromium (Cr) vapor-deposited, and the second layer is made of chromium and nickel (Ni).
) and the third layer are nickel vapor deposited layers, both of which are vapor deposited by heating the substrate to 250°C. Subsequently, the temperature of the substrate was set to 70° C., and solder was vapor-deposited as No. 4 M.
用途に応じて膜厚を変えることはあるが、ｌａ厚が０．
２ｇｍ〜０．９μｍ程度で済む、ハンダの第４層の薄層
な他の方法で作成することは可能であるが、均一性の点
で蒸着で形成するのが最も結果が良かった。The film thickness may be changed depending on the application, but if the la thickness is 0.
Although it is possible to create a thin fourth layer of solder with a thickness of about 2 gm to 0.9 μm using other methods, the best results were obtained by vapor deposition in terms of uniformity.
ハンダ６ａ、６ｂにより像分解プリズムｌと固体撮像素
子３とを結合する方法について述べる。A method of connecting the image resolving prism l and the solid-state image sensor 3 using solders 6a and 6b will be described.
まず撮影系を介して調整用パターンを撮影し、像分解プ
リズム１の射出面から所定量離れた位置に調整用パター
ン像を形成する、一方、取付枠の足７ａを図示しない位
置調整用工具で保持し、固体撮像素子３の受光面が調整
用パターン像に一致する様に工具を調節する。その際、
固体撮像素子のビデオ信号をテレビ受像器へ入力し、映
出された調整用パターンを見ながら、光軸方向、光軸に
垂直な方向の位置及び回転そして面の傾きを修正し、良
好な調整用パターンが得られる様にする。First, an adjustment pattern is photographed via a photographing system, and an adjustment pattern image is formed at a predetermined distance from the exit surface of the image resolving prism 1.Meanwhile, the legs 7a of the mounting frame are moved using a position adjustment tool (not shown). The tool is then adjusted so that the light-receiving surface of the solid-state image sensor 3 matches the adjustment pattern image. that time,
Input the video signal from the solid-state image sensor to the television receiver, and while looking at the projected adjustment pattern, correct the optical axis direction, the position and rotation in the direction perpendicular to the optical axis, and the inclination of the surface to make a good adjustment. so that you can obtain the desired pattern.
次に色分解プリズムｌの側面に予め設けた金属被膜５ａ
、５ｂと固体撮像素子３の取付枠の耳部７ｂとの隙間を
、ハンダゴテランプ、レーザー等の加熱器を用いてハン
ダをとかしハンダ６で埋め、これにより像分解プリズム
ｌに固体撮像素子３を結合している。Next, a metal coating 5a is provided in advance on the side surface of the color separation prism l.
, 5b and the ear portion 7b of the mounting frame of the solid-state image sensor 3, melt the solder using a heater such as a soldering iron lamp or a laser, and fill the gap with solder 6, thereby attaching the solid-state image sensor 3 to the image resolving prism l. are combined.
第４図、第６図は各々本発明の他の実施例の要部概略図
である。第４図に示す実施例ではハンダ接合部材として
の取付枠を第５図に示す形状の２つの取付金具１０ａ、
１０ｂより構成し、これらの取付金具１０ａ、１０ｂに
固体撮像素子３をネジ止めして構成している。4 and 6 are schematic diagrams of main parts of other embodiments of the present invention. In the embodiment shown in FIG. 4, the mounting frame as a solder joint member has two mounting brackets 10a having the shape shown in FIG.
10b, and the solid-state image sensor 3 is screwed to these mounting fittings 10a and 10b.
本実施例は固体撮像素子を取付枠に機械的に固定できる
ため、固体撮像素子の交換が容易になる利点がある。In this embodiment, since the solid-state image sensor can be mechanically fixed to the mounting frame, there is an advantage that the solid-state image sensor can be easily replaced.
第６図に示す実施例は固体撮像素子３の光入射面と逆の
面側に取付枠１１を取付けていることを特徴としている
。第７図は第６図を上方から見たときの説明図である。The embodiment shown in FIG. 6 is characterized in that a mounting frame 11 is attached to the surface of the solid-state image sensor 3 opposite to the light incident surface. FIG. 7 is an explanatory diagram when FIG. 6 is viewed from above.
本実施例は取付枠１１と固体撮像素子３との間隔に制約
がある場合に有効である。又、取付枠１１に開口部を必
要としない為に形状が簡素化されるので強制的、精度的
に有利である。This embodiment is effective when there is a restriction on the distance between the mounting frame 11 and the solid-state image sensor 3. Further, since no opening is required in the mounting frame 11, the shape is simplified, which is advantageous in terms of force and precision.
本発明はカラーテレビカメラに使用する他に、カラーフ
ィルムの画像を、ビデオ信号に変換する装置にも使用出
来その場合、固体撮像装置は一次元のアレイを使えば良
い、また像分解プリズム以外のビームスプリッタ−に固
体撮像素子を取付ける場合にも使用出来る。In addition to being used in color television cameras, the present invention can also be used in devices that convert color film images into video signals.In that case, a one-dimensional array may be used as the solid-state imaging device; It can also be used when attaching a solid-state image sensor to a beam splitter.
［発明の効果］
本発明によれば、分解プリズムと固体撮像素子を結合す
るのに使用する溶融性金属層の厚さを強度の低下しない
範囲に抑えることを極めて容易に行ない得る効果かある
。また被接着層を所望の形状に簡単に形成できる効果か
ある。[Effects of the Invention] According to the present invention, it is possible to extremely easily suppress the thickness of the meltable metal layer used to connect the resolving prism and the solid-state imaging device to a range that does not reduce the strength. Further, there is an effect that the adherend layer can be easily formed into a desired shape.
その他、結合にハンダの様な溶融性金属を使用している
から、効果時間が短く、また接合中に他に加わることが
ないため組立誤作が生じ難く、更に接着剤による接合に
比して経年変化による強度低下が少なく、環境変化、機
械的外力に対して位置変化を抑えられる。また特に像分
解プリズム側の接合部が堅固になり１画質に悪影響を与
えることもない、フォーカス・レジストレーション、傾
き調整が正確に達成されるから、画質向上に資する処が
大きい。In addition, since a meltable metal such as solder is used for bonding, the effective time is short, and since no other material is added during bonding, assembly errors are less likely to occur, and compared to bonding using adhesives, There is little strength decline due to aging, and positional changes can be suppressed due to environmental changes and external mechanical forces. In addition, the joints on the image-resolving prism side are particularly strong, and focus registration and tilt adjustment are accurately achieved without adversely affecting image quality, which greatly contributes to improving image quality.
第１図は本発明の一実施例の斜視図、第２図は第１図の
一部分の光軸方向の要部断面図、第３図は第２図の正面
図、第４図、第６図は各々本発明の他の実施例の要部断
面図、第５図は第４図の一部分の説明図、第７図は第６
図を上方から見たときの平面図である。
図中１００は撮像部、ｌは像分解プリズム、２はフィル
タ、３は固体撮像素子、５ａ。
５ｂは被接着層、８ａ、６ｂはハンダ、７はハンダ接合
部材、８は防塵枠である。
２
？FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a sectional view of a part of FIG. 1 in the optical axis direction, FIG. 3 is a front view of FIG. 2, and FIGS. Each figure is a sectional view of a main part of other embodiments of the present invention, FIG. 5 is an explanatory diagram of a part of FIG. 4, and FIG.
It is a top view when the figure is seen from above. In the figure, 100 is an imaging unit, l is an image resolving prism, 2 is a filter, 3 is a solid-state image sensor, and 5a. 5b is a bonded layer, 8a and 6b are solder, 7 is a solder joint member, and 8 is a dustproof frame. 2?
Claims (2)
複数の個体撮像素子を結合した光学装置において、前記
分解プリズムの側面に蒸着法により、金属被膜を形成し
、更に金属被膜に予備ハンダ薄膜を設けて予備ハンダ層
と固体撮像素子のケージングに設けた金属の溶着可能な
材質の部材との間を所定厚さの溶融性金属で埋めると共
に両者を結合したビデオ装置。(1) In an optical device in which a plurality of solid image sensors are coupled to a decomposition prism that decomposes image light from an objective optical system, a metal coating is formed on the side surface of the decomposition prism by vapor deposition, and a preliminary solder is further applied to the metal coating. A video device in which a thin film is provided to fill the space between a preliminary solder layer and a member made of a metal weldable material provided in a casing of a solid-state imaging device with a meltable metal of a predetermined thickness, and the two are bonded together.
求の範囲第１項記載のビデオ装置。(2) The video device according to claim 1, wherein the preliminary solder layer is formed by a vapor deposition method.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2047841A JPH03249891A (en) | 1990-02-27 | 1990-02-27 | Video device |
| US07/598,795 US5042913A (en) | 1989-03-17 | 1990-10-17 | Electrical signal forming apparatus having image splitting prism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2047841A JPH03249891A (en) | 1990-02-27 | 1990-02-27 | Video device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03249891A true JPH03249891A (en) | 1991-11-07 |
Family
ID=12786595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2047841A Pending JPH03249891A (en) | 1989-03-17 | 1990-02-27 | Video device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03249891A (en) |
-
1990
- 1990-02-27 JP JP2047841A patent/JPH03249891A/en active Pending
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