JPH0324919A - Method for molding smc molded product, laminated sheet and printed wiring board - Google Patents
Method for molding smc molded product, laminated sheet and printed wiring boardInfo
- Publication number
- JPH0324919A JPH0324919A JP16053389A JP16053389A JPH0324919A JP H0324919 A JPH0324919 A JP H0324919A JP 16053389 A JP16053389 A JP 16053389A JP 16053389 A JP16053389 A JP 16053389A JP H0324919 A JPH0324919 A JP H0324919A
- Authority
- JP
- Japan
- Prior art keywords
- forming
- molding
- vibration
- wiring board
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 239000003365 glass fiber Substances 0.000 claims abstract description 10
- 229920001225 polyester resin Polymers 0.000 claims abstract description 10
- 239000004645 polyester resin Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000011888 foil Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000000748 compression moulding Methods 0.000 claims description 2
- 229920006267 polyester film Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 230000006837 decompression Effects 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、Ｓｈｅｅｔ Ｍｏｌｄｉｎｇ Ｃｏｍｐ
ｏｕｎｄ （以下ＳＭＣという）成形品、積層板及び配
線板の成形法に関する．
〔従来の技術〕
従来のＳＭＣ成形品の成形法は、ブレス成形機に固定さ
れた雄型上にガラス繊維チゴップにポリエステル樹脂等
を含浸させたシート状プリプレグを複数枚重ね合わせ予
熱し、ブレス成形機により、雌型を嵌合させ加熱、加圧
、減圧しなから脱泡、硬化させて所望の成形品を形成さ
せていた．また、従来の積層板の成形法は、ガラス繊維
又は紙などの基材にフェノール樹脂、エポキシ樹脂、ポ
リエステル樹脂等の熱硬化性樹脂を含浸させたシート状
プリプレグを複数枚重ね、これら全体を２枚の熱板で挟
んで成形プレス中に挿入し、予熱を加え加熱、加圧、減
圧しなから脱泡、圧着させて所望の厚さの積層板を形成
させていた．さらに、従来の配線板の成形法は、前記積
層板のシート状プリプレグを複数枚重ねた片面に金属箔
を載置し、同様な条件でプレスし、脱泡、圧着させて所
望の厚さの配線板を形成させていた．また、他のもう一
つのフレキシブル配線板の成形法は、フィルムと金属箔
との間に接着剤を介して予熱し、そして、加熱させたラ
ミネー夕により加熱、加圧して、脱泡、圧着させて所望
の配線板を形成させていた。[Detailed Description of the Invention] [Industrial Application Field] The present invention is directed to Sheet Molding Comp.
ound (hereinafter referred to as SMC) relates to molding methods for molded products, laminates, and wiring boards. [Conventional technology] The conventional molding method for SMC molded products is to preheat a plurality of sheets of prepreg made by impregnating glass fiber chigop with polyester resin, etc. on a male mold fixed to a breath molding machine, and then press molding. The desired molded product was formed by fitting a female mold using a machine, applying heat, applying pressure, reducing pressure, degassing, and curing. In addition, the conventional method for forming laminates is to stack multiple sheets of prepreg made by impregnating a base material such as glass fiber or paper with a thermosetting resin such as phenol resin, epoxy resin, or polyester resin, and then combine these sheets into two layers. The laminate was sandwiched between two hot plates and inserted into a forming press, then preheated, heated, pressurized, decompressed, defoamed, and crimped to form a laminate of the desired thickness. Furthermore, in the conventional wiring board forming method, metal foil is placed on one side of a plurality of sheets of prepreg of the laminate, pressed under similar conditions, degassed, and crimped to obtain the desired thickness. A wiring board was formed. Another method for forming flexible wiring boards is to preheat the film and metal foil through an adhesive, and then heat and pressurize the film and metal foil using a heated laminator to remove air bubbles and bond them. The desired wiring board was formed using the following steps.
しかしながら、前記の従来例にあっては、いずれの場合
もプリプレグ又は接着剤中の脱泡が不完全であり、形成
された成形品、積層板、配線板内に気泡、カスレが残り
、性能及び外観面において、悪影響を及ぼす欠点があっ
た。また、減圧して脱泡を行なうのに長時間を要してい
た．
本発明は、上記欠点に鑑みてなされたものであり、気泡
及びカスレがなく、性能及び外観良好で且つ短時間で成
形できる成形法を提供することを目的としたものである
。However, in the above-mentioned conventional examples, degassing in the prepreg or adhesive is incomplete in all cases, and air bubbles and scratches remain in the formed molded products, laminates, and wiring boards, resulting in poor performance. There were some drawbacks that had a negative impact on the appearance. In addition, it took a long time to depressurize and degas. The present invention was made in view of the above-mentioned drawbacks, and aims to provide a molding method that is free from bubbles and fading, has good performance and appearance, and can be molded in a short time.
上記の目的を違戒するための本発明の構或を以下説明す
る。The structure of the present invention for achieving the above object will be explained below.
第１発明は、成形品の成形法であって、ブレス成形機に
固定された雄型上に、ガラス繊維チラップにポリエステ
ル樹脂を含浸させたシート状プリプレグを複数枚重ね雌
型を嵌合させて予熱し、しかる後加熱、加圧又は加熱、
加圧、減圧しながら振動を加えて成形品を形成させるこ
とを特徴とする．
第２発明は、積層仮の成形法であって、プレス成形機上
にガラス繊維基材又は紙基材にフ五ノール樹脂、エポキ
シ樹脂、ポリエステル樹脂等の熱硬化性樹脂を含浸させ
たシート状プリプレグを複数積層し、プレスして予熱し
、しかる後加熱、加圧又は加熱、加圧、減圧しながら振
動を加えて積層板を形成させることを特徴とする。The first invention is a method for molding a molded product, in which a plurality of sheets of prepreg made of glass fiber chirap impregnated with polyester resin are stacked on a male die fixed to a breath molding machine, and a female die is fitted onto the male die. Preheating, then heating, pressurizing or heating,
It is characterized by forming a molded product by applying vibration while pressurizing or depressurizing it. The second invention is a laminated temporary molding method, in which a sheet is formed by impregnating a glass fiber base material or a paper base material with a thermosetting resin such as a phenol resin, an epoxy resin, or a polyester resin on a press molding machine. The method is characterized in that a plurality of prepregs are laminated, pressed and preheated, and then heated, pressurized, or vibrated while being heated, pressurized, or depressurized to form a laminate.
第３発明は、配線板の戒型法であって、ブレス成形機上
にガラス繊維基材又は紙基材にフエノール樹脂、エポキ
シ樹脂、ポリエステル樹脂等の熱硬化性樹脂を含浸させ
たシート状プリプレグを複数積層させてなる積層板上に
銅等の金属箔を積層しプレスして予熱し、しかる後加熱
、加圧又は加熱、加圧、減圧しながら振動を加えて配線
板を形成させることを特徴とする．
第４の発明は、第３発明の他の配線板の戒型法であって
、フィルムと金属箔とを接着剤を介して積層し予熱し、
しかる後ラミネート成形時に加熱、加圧及び振動を加え
てフレキシブル配線板を形戒させることを特徴とする。The third invention is a method for molding wiring boards, in which a sheet-like prepreg is prepared by impregnating a glass fiber base material or a paper base material with a thermosetting resin such as a phenol resin, an epoxy resin, or a polyester resin on a press molding machine. A wiring board is formed by laminating metal foil such as copper on a laminated board made by laminating multiple layers, pressing and preheating, and then applying vibration while heating, pressurizing, or heating, pressurizing, or reducing pressure. Features: A fourth invention is a method for forming a wiring board other than the third invention, in which a film and a metal foil are laminated via an adhesive and preheated.
After that, the flexible wiring board is shaped by applying heat, pressure, and vibration during lamination molding.
そして、本発明は前記の手段により、圧ｍ成形機、プレ
ス成形機、ラξネート成形機によって、ＳＭＣ成形品、
積Ｎ＋１ｉ、配線板を形成する場合、各成形機に加熱、
加圧、減圧を加える外成形機に振動を与えることにより
、プリプレグ又は接着剤内の気泡及びカスレを迅速に除
去することができる。According to the above-mentioned means, the present invention can produce SMC molded products by using an compression molding machine, a press molding machine, and a lanate molding machine.
Product N+1i, when forming a wiring board, each molding machine is heated,
By applying vibration to the external molding machine that applies pressure or vacuum, air bubbles and smudges in the prepreg or adhesive can be quickly removed.
実施例１
表１の（１）に示すように、ガラス繊維チョップ基材に
ポリエステル樹脂を含浸させ、半硬化状にさせたＳＭＣ
用プリプレグ６を第１図に示す減圧３及び振動装置４を
有する雄雌型７を備えたプレス機械１を用いて予熱温度
、加熱温度、プレス圧力、振動（振幅、周波数）を変え
てＡ，Ｂ，Ｃ、Ｄの条件で成形を行なった。Example 1 As shown in (1) in Table 1, SMC was prepared by impregnating a glass fiber chopped base material with polyester resin and making it into a semi-cured state.
Using a press machine 1 equipped with male and female molds 7 having a pressure reduction 3 and a vibration device 4 shown in FIG. Molding was performed under conditions B, C, and D.
その結果比較例と比べＢ，Ｃ，Ｄのものが成型時間が６
分、４分、４分と大幅に短縮され、且つピンホール及び
戒型時の樹脂の流れの不均一に起因する光沢の違い、表
面のへこみ等のカスレが減少し、良好な結果が得られた
．
実施例２
表１の（２）に示すように、ガラス繊維にポリエステル
樹脂を含浸させ、半硬化状にさせた積層板用プリプレグ
６を、第２図に示す滅圧３及び振動装Ｗ４を有する上下
熱板を備えたプレス機械１を用いて、実施例１と同様な
項目でＡ，Ｂ，Ｃ、Ｄの条件でプレス成形を行なった。As a result, compared to the comparative example, the molding time for B, C, and D was 6
The time was significantly shortened to 4 minutes, 4 minutes, and 4 minutes, and better results were obtained, with fewer differences in gloss and surface dents caused by pinholes and uneven resin flow during molding. Ta. Example 2 As shown in (2) of Table 1, a laminate prepreg 6 made by impregnating glass fiber with a polyester resin and making it into a semi-cured state was equipped with a vacuum 3 and a vibration device W4 shown in FIG. Using a press machine 1 equipped with upper and lower hot plates, press molding was carried out under the same conditions as in Example 1, including A, B, C, and D.
その結果比較例と比べＣ，Ｄのものが戒型時間が２０分
、ｌ８分と大幅に短縮され、且つピンホール及びカスレ
が減少し、良好な結果が得られた，
尚、上記実施例において、プリプレグをプレス成形して
単一の積層板を形成させた構戊としたが、単一の積層板
を複数接着剤を介して多層積層板を形成させた構或とし
ても同様な効果が得られる。As a result, compared to the comparative example, the molding time of C and D was significantly shortened to 20 minutes and 18 minutes, and pinholes and scratches were reduced, and good results were obtained. In the present invention, prepregs were press-molded to form a single laminate, but the same effect could be obtained by forming a multilayer laminate from a single laminate using multiple adhesives. It will be done.
実施例３
表１の（３）に示すように、実施例２によって形成され
た積層板に銅箔を積層し、２枚のメッキ板で挟んで第２
図に示す減圧３及び振動装置４を有するプレス機械１を
用いて、実施例１と同様な項目でＡ，Ｂ，Ｃ，Ｄの条件
でプレス成形を行なった．その結果比較例と比べＣ，Ｄ
のものが戒型時間１５分、１４分と大幅に短縮され、且
つピンホール及びカスレが減少し、良好な結果が得られ
た。Example 3 As shown in (3) of Table 1, copper foil was laminated on the laminate formed in Example 2, and a second layer was sandwiched between two plated plates.
Using a press machine 1 having a vacuum 3 and a vibration device 4 shown in the figure, press forming was carried out under conditions A, B, C, and D similar to those in Example 1. As a result, compared with the comparative example, C and D
The molding time was significantly shortened to 15 minutes or 14 minutes, and pinholes and scratches were reduced, and good results were obtained.
尚、上記実施例において、単一の積層板に単一のｗ４Ｗ
Ｂをプレス成形させた構戒としたが、積層板、銅箔、積
層板、ｗ４箔の順にブレス戊形し、多層銅張り配線板に
形戒させた構成としても同様な効果が得られる．
実施例４
表ｌの（４）に示すように、ポリイミドフイルムとｗ４
箔とを接着剤を介して、第３図に示す振動装置３及び加
熱装置５を有するラミネータ機械９を用いて実施例１と
同様な項目でＡ，Ｂ，Ｃ，Ｄの条件でラミネート成形を
行なった。その結果比較例と比べ、Ｃ，Ｄのものが戒型
時間０．３分、０．３分と大幅に短縮され、且つビンホ
ール及びカスレが減少し、良好な結果が得られた。In addition, in the above embodiment, a single laminate has a single w4W
B is constructed using press molding, but the same effect can also be obtained by pressing the laminate, copper foil, laminate, and W4 foil in this order and molding them into a multilayer copper-clad wiring board. Example 4 As shown in (4) of Table 1, polyimide film and w4
Using a laminator machine 9 having a vibrating device 3 and a heating device 5 shown in FIG. 3, laminate molding was carried out using the same conditions as in Example 1 and conditions A, B, C, and D using the foil and adhesive. I did it. As a result, compared to comparative examples, molding times for C and D were significantly shortened to 0.3 minutes and 0.3 minutes, and bottle holes and scratches were reduced, resulting in good results.
尚、上記実施例において、単一のポリイミドフィルムと
単一の銅箔とを接着剤を介してフレキシブル配線板を形
戒させた構成としたが、上記フレキシブル配線板を複数
層重ね、多層フレキシブル配線板を形成させたＦＲ戊と
しても同様な効果が得られる。In the above example, a single polyimide film and a single copper foil were used to form a flexible wiring board using an adhesive. A similar effect can be obtained by using an FR plate formed with a plate.
本発明において、減圧しながら振動を加えることによっ
て、減圧と振動による相乗効果により短時間で脱泡がで
きる。In the present invention, by applying vibration while reducing pressure, defoaming can be achieved in a short time due to the synergistic effect of the reduced pressure and vibration.
〔効果］
本発明は上記構戒によりなるので、気泡、カスレがなく
性能及び外観良好で且つ短時間で成形できる成形法を提
供することができる。[Effect] Since the present invention is based on the above-mentioned principles, it is possible to provide a molding method that is free from bubbles and scratches, has good performance and appearance, and can be molded in a short time.
第１図、第２図及び第３図は本発明の実施例に用いられ
る成形ブレス機及びラミネー夕機の略正面図である。
符号の説明
ｌ 滅圧装置付振動熱成形ブレス機
２ 油圧装置 ３ 滅圧装置
４ 振動装置 ５ 加熱装置
６ プリプレグ ７ 金型1, 2, and 3 are schematic front views of a forming press and a laminating machine used in an embodiment of the present invention. Explanation of symbols 1 Vibrating thermoforming press machine with decompression device 2 Hydraulic device 3 Decompression device 4 Vibration device 5 Heating device 6 Prepreg 7 Mold
Claims (1)
成形してなるＳＭＣ成形品の成形方法において、成形時
に加熱、加圧又は加熱、加圧、減圧しながら振動を加え
て成形品を形成させることを特徴とするＳＭＣ成形品の
成形方法。 ２、請求項１記載のＳＭＣ成形品の成形法において、シ
ート状プリプレグが、ガラス繊維チョップ基材にポリエ
ステル樹脂を含浸させて半硬化状にさせたものであるこ
とを特徴とするＳＭＣ成形品の成形法。 ３、請求項１記載のＳＭＣ成形品の成形法において、予
熱温度４０〜７０℃、振動プレス温度１４０〜１６０℃
、圧力８５〜１００ｋｇ／ｃｍ＾２、振動振巾４０〜６
０μｍ、振動周波数２００〜２０００Ｈｚの条件で成形
することを特徴とするＳＭＣ成形品の成形法。 ４、シート状プリプレグを複数枚積層し予熱してプレス
成形してなる積層板の成形法において、成形時に加熱、
加圧又は加熱、加圧、減圧しながら振動を加えて積層板
を形成させることを特徴とする積層板の成形法。 ５、請求項３記載の積層板の成形法において、予熱温度
１００〜１８０℃、振動プレス温度１８０〜２００℃、
圧力８０〜１００ｋｇ／ｃｍ＾２、振動振巾３０〜５０
μｍ、振動周波数５０００〜１００００Ｈｚの条件で成
形することを特徴とする積層板の成形法。 ６、シート状プリプレグを積層してなる基板と金属箔と
を積層し、予熱してプレス成形してなる配線板の成形法
において、成形時に加熱、加圧又は加熱、加圧、減圧し
ながら振動を加えて配線板を形成させることを特徴とす
る配線板の成形法。 ７、請求項５記載の配線板の成形法において、予熱温度
１００〜１７０℃、振動プレス温度１８０〜２００℃、
圧力７０〜１００ｋｇ／ｃｍ＾２、振動振巾４０〜８０
μｍ、振動周波数６０００〜１００００Ｈｚの条件で成
形することを特徴とする配線板の成形法。 ８、請求項４記載の積層板及び請求項６記載の配線板の
成形法において、シート状プリプレグがガラス繊維又は
紙基材にフェノール樹脂又はエポキシ樹脂又はポリエス
テル樹脂のいずれかを含浸させ、半硬化状にさせたもの
であることを特徴とする積層板の成形法。 ９、フィルムと金属箔とを接着剤を介して積層し、予熱
してラミネート成形してなる配線板の成形法において、
成形時に加熱、加圧及び振動を加えてフレキシブル配線
板を形成させることを特徴とする配線板の成形法。 １０、請求項９記載の配線板の成形法において、予熱温
度１２０〜１７０℃、振動プレス温度１７０〜２２０℃
、圧力５０〜６０ｋｇ／ｃｍ＾２、振動振巾４０〜６０
μｍ、振動周波数５０００〜１３０００Ｈｚの条件で成
形することを特徴とする配線板の成形法。 １１、請求項９記載の配線板の成形法において、フィル
ムがポリイミドフィルム又はポリエステルフィルムであ
ることを特徴とする配線板の成形法。[Claims] 1. In a method for molding an SMC molded product by stacking a plurality of sheets of prepreg on a mold, preheating and compression molding, heating, pressurization, or vibration while heating, pressurizing, or depressurizing is applied during molding. A method for forming an SMC molded product, which further comprises forming a molded product. 2. The method for molding an SMC molded product according to claim 1, wherein the sheet-like prepreg is a glass fiber chopped base material impregnated with a polyester resin and made into a semi-cured state. Molding method. 3. In the method for molding an SMC molded product according to claim 1, the preheating temperature is 40 to 70°C, and the vibration press temperature is 140 to 160°C.
, pressure 85-100kg/cm^2, vibration amplitude 40-6
A method for molding an SMC molded product, characterized by molding under conditions of 0 μm and a vibration frequency of 200 to 2000 Hz. 4. In the method of forming a laminate by laminating, preheating, and press forming a plurality of sheets of prepreg, heating,
A method for forming a laminate, which is characterized by forming a laminate by applying vibration while pressurizing or heating, applying pressure, or reducing pressure. 5. In the method for forming a laminate according to claim 3, the preheating temperature is 100 to 180°C, the vibration press temperature is 180 to 200°C,
Pressure 80-100kg/cm^2, vibration amplitude 30-50
A method for forming a laminate, characterized by forming the plate under conditions of 5,000 to 10,000 Hz of vibration frequency. 6. In the method of forming a wiring board by laminating a substrate formed by laminating sheet-like prepreg and metal foil, preheating and press-forming, heating, pressurization, or vibration while heating, pressurizing, or depressurizing is applied during forming. A wiring board forming method characterized by forming a wiring board by adding. 7. In the wiring board forming method according to claim 5, the preheating temperature is 100 to 170°C, the vibration press temperature is 180 to 200°C,
Pressure 70-100kg/cm^2, vibration amplitude 40-80
A wiring board molding method characterized by molding under conditions of .mu.m and a vibration frequency of 6,000 to 10,000 Hz. 8. In the method for forming a laminate according to claim 4 and a wiring board according to claim 6, the sheet-like prepreg is semi-cured by impregnating glass fiber or paper base material with phenol resin, epoxy resin, or polyester resin. A method for forming a laminate, characterized in that it is shaped like a laminate. 9. A wiring board forming method in which a film and a metal foil are laminated via an adhesive, preheated, and laminated.
A wiring board forming method characterized by forming a flexible wiring board by applying heat, pressure, and vibration during molding. 10. In the wiring board forming method according to claim 9, the preheating temperature is 120 to 170°C, and the vibration press temperature is 170 to 220°C.
, pressure 50-60kg/cm^2, vibration amplitude 40-60
A wiring board molding method characterized by molding under conditions of μm and vibration frequency of 5,000 to 13,000 Hz. 11. The method for molding a wiring board according to claim 9, wherein the film is a polyimide film or a polyester film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16053389A JPH0324919A (en) | 1989-06-22 | 1989-06-22 | Method for molding smc molded product, laminated sheet and printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16053389A JPH0324919A (en) | 1989-06-22 | 1989-06-22 | Method for molding smc molded product, laminated sheet and printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0324919A true JPH0324919A (en) | 1991-02-01 |
Family
ID=15717031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16053389A Pending JPH0324919A (en) | 1989-06-22 | 1989-06-22 | Method for molding smc molded product, laminated sheet and printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0324919A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100462110B1 (en) * | 2002-05-14 | 2004-12-17 | 현대자동차주식회사 | Apparatus for preventing occurring of air bubble in molding process |
-
1989
- 1989-06-22 JP JP16053389A patent/JPH0324919A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100462110B1 (en) * | 2002-05-14 | 2004-12-17 | 현대자동차주식회사 | Apparatus for preventing occurring of air bubble in molding process |
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