JPH03237310A - X-ray thickness gauge - Google Patents
X-ray thickness gaugeInfo
- Publication number
- JPH03237310A JPH03237310A JP3141290A JP3141290A JPH03237310A JP H03237310 A JPH03237310 A JP H03237310A JP 3141290 A JP3141290 A JP 3141290A JP 3141290 A JP3141290 A JP 3141290A JP H03237310 A JPH03237310 A JP H03237310A
- Authority
- JP
- Japan
- Prior art keywords
- ray
- plate thickness
- rays
- thickness value
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000011088 calibration curve Methods 0.000 abstract description 21
- 238000005259 measurement Methods 0.000 abstract description 14
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、Ｘ線量の変動に対しても安定して板厚を測定
できるＸ線厚み計に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an X-ray thickness meter that can stably measure plate thickness even when the X-ray dose varies.
（従来の技術）
鋼板等の圧延工程では厚み測定が必須であり、圧延速度
が向上できる放射線を使用した非接触式の厚み計が使用
されている。従来のシングルビーム形Ｘ線厚み計では１
校正時に校正信号を受けると、内蔵する基準板を順次Ｘ
線ビーム中に挿入をする。基準板が挿入される毎に透過
したＸ、１！量で得られた検出信号から装置内部に電圧
と板厚の関数である検量線を作成記憶する０校正終了後
、基準板はＸ線ビーム中からすべて引き抜かれる。ｍ定
されるべき被測定板がＸ線ビーム中に入ってくると、得
られる検出電圧から検量線を用いて被測定板の厚みを演
算する。(Prior Art) Thickness measurement is essential in the rolling process of steel plates, etc., and non-contact thickness gauges using radiation that can improve the rolling speed are used. Conventional single-beam X-ray thickness meter
When a calibration signal is received during calibration, the built-in reference plate is
Insert into the wire beam. X, 1 transmitted each time the reference plate is inserted! After the zero calibration is completed, in which a calibration curve as a function of voltage and plate thickness is created and stored inside the device from the detection signal obtained by the measurement, the reference plate is completely removed from the X-ray beam. When the plate to be measured enters the X-ray beam, the thickness of the plate to be measured is calculated from the obtained detection voltage using a calibration curve.
（発明が解決しようとする課題）
上述したＸ線厚み計においては１発生するＸ線量の変化
が直接厚み測定値の変動となって検出されるためＸ線源
の安定化をして測定精度を高める必要がある。(Problems to be Solved by the Invention) In the above-mentioned X-ray thickness meter, since a change in the generated X-ray dose is directly detected as a change in the thickness measurement value, it is necessary to stabilize the X-ray source to improve measurement accuracy. It is necessary to increase it.
本発明は、Ｘ線量の変化に対しても検量線を補正して、
安定に板厚を測定できるＸ線厚み計を提供することにあ
る。The present invention also corrects the calibration curve for changes in the X-ray dose,
An object of the present invention is to provide an X-ray thickness meter that can stably measure plate thickness.
（発明が解決しようとする手段）
上記目的を達成するために本発明は、基準板厚値を有す
る簗七カ被測定体に照射されるＸｗＡ源からのＸ線透過
量を検出する第１の検出手段と。(Means to be Solved by the Invention) In order to achieve the above object, the present invention provides a first method for detecting the amount of X-rays transmitted from an XwA source that irradiates an object to be measured having a reference plate thickness value. and detection means.
第１の検出手段からの検出信号に基づいて厚み基準曲線
を作成する作成手段と、Ｘ線源から照射されるＸｌ１Ａ
量の絶対的変化を検出する第２の検出手段と、
測定体を透過したＸ線量に基
づき基準曲線から求まる厚み値に対して第２の検出手段
からの信号を補正値とする補正手段で構成する。creation means for creating a thickness reference curve based on the detection signal from the first detection means; and Xl1A irradiated from the X-ray source.
a second detection means for detecting an absolute change in amount;
It is comprised of a correction means that uses a signal from the second detection means as a correction value for a thickness value determined from a reference curve based on the amount of X-rays transmitted through the measurement object.
（作用）
このように構成されたものにおいて、第１の検出手段が
出力する基準板厚値を有する被測定体のＸ線透過量を示
す信号により厚み基準曲線を作成し、この基準曲線から
求まる厚み値に対して、Ｘ線源からのｘ、ｗ、ｍの絶対
的変化を検出する第２の検出手段の信号を補正値とする
補正手段で補正することにより、Ｘ線量の絶対的変化に
対して安定で高精度な測定が可能となる。(Function) In the device configured as described above, a thickness reference curve is created based on the signal indicating the amount of X-ray transmission of the object to be measured having the reference plate thickness value outputted by the first detection means, and the thickness reference curve is determined from this reference curve. By correcting the thickness value using a correction means that uses the signal of the second detection means that detects the absolute change in x, w, and m from the X-ray source as a correction value, the absolute change in the X-ray dose can be corrected. However, stable and highly accurate measurements are possible.
（実施例） 以下、本発明の実施例を図面を参照して説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図は、本発明によるＸ線厚み計のブロック図である
。FIG. 1 is a block diagram of an X-ray thickness meter according to the present invention.
１はＸ線発生器、２と３はＸ線検出器、４は補正演算に
必要な管電圧データを取るのに最適な状態をつくるフィ
ルタである。1 is an X-ray generator, 2 and 3 are X-ray detectors, and 4 is a filter that creates an optimal condition for obtaining tube voltage data necessary for correction calculations.
５はスタンダードチェンジャーで、基準となるＸ線量と
板厚の関数、すなわち検量線を作成するための複数の基
準板が内蔵されている。Reference numeral 5 denotes a standard changer, which contains a plurality of reference plates for creating a reference X-ray dose and plate thickness function, that is, a calibration curve.
６と７は増幅器で、Ｘ線検出器２，３の出力信号を増幅
して検出電圧とする。８と９はＡ／Ｄ変換器で、増幅器
６，７の出力信号をデジタル信号に変換する。Amplifiers 6 and 7 amplify the output signals of the X-ray detectors 2 and 3 to provide a detection voltage. A/D converters 8 and 9 convert the output signals of the amplifiers 6 and 7 into digital signals.
１０は演算回路で図示しない外部機器によって目標板厚
値が設定されると、目標板厚値を的確に測定できるｘａ
ａ：ｔが発生されるようにＸ線制御部１１の管電圧制御
回路１２と管電流制御回路１３を設定する。このとき、
管電圧制御回路１２と管電流制御回路１３は測定厚や校
正厚で決定するようにプログラムされている。なお、こ
こではＸ線量の変化に及ぼす影響は管電流に比べ管電圧
の方が大きいので。10 is an arithmetic circuit that can accurately measure the target plate thickness value when the target plate thickness value is set by an external device (not shown);
The tube voltage control circuit 12 and tube current control circuit 13 of the X-ray control unit 11 are set so that a:t is generated. At this time,
The tube voltage control circuit 12 and tube current control circuit 13 are programmed to determine the thickness based on the measured thickness or calibration thickness. Note that here, the tube voltage has a greater effect on changes in the X-ray dose than the tube current.
管電流制御回路１３の設定は行わない。Setting of the tube current control circuit 13 is not performed.
またスタンダードチェンジャー５を順次駆動させてＸ線
検出器２の出力から目標板厚値近傍の第１の検量線を作
成する。Further, the standard changer 5 is sequentially driven to create a first calibration curve near the target plate thickness value from the output of the X-ray detector 2.
次にＸ線量の絶対的変化に対して補正できるように管電
圧を変化させて板厚値を得るＸ線検出器２及び管電圧の
変化に伴うＸ線量の変化を得るＸ線検出器３の検出量か
ら第４図のような管電圧の変化に対するＸ線検出器２の
検出電圧の補正曲線を求める。この補正曲線から管電圧
の変化に対する検出電圧の変化量の係数αを得ると、管
電圧を正常に復帰させて校正動作を終了し測定待状態に
なる。被測定板がＸ線ビームに入り測定を開始すると、
スタンダードチェンジャー５の基準板をＸ線ビームから
引き抜く、モしてＸｇＡ検出器２からの被測定板の厚み
信号を得て検量線と比較演算して板厚値に変換する。管
電圧の変化量が検出電圧の板厚演算で例えば±０．１％
以上になり、補正する場合は次のように補正する。すな
わち１例えば定数とし、Ｘ線検出器３の検出電圧βに係
数αの逆数を乗じるとＸ線の変化量に対するＸ線検出器
２の検出電圧の変化量γが求まる。このγを第５図のよ
うに検量線のそれぞれの板厚値に対する検出電圧に加え
て補正する。このように補正した検量線をもとにＸ線検
出ｓ２からの厚み信号を比較して板厚値に変換し信号を
出力する。この操作をサンプリング周期毎に行い、管電
圧の変化による測定結果の変化を打ち消す。Next, the X-ray detector 2 obtains the plate thickness value by changing the tube voltage so as to be able to compensate for absolute changes in the X-ray dose, and the X-ray detector 3 obtains the change in the X-ray dose due to the change in the tube voltage. From the detected amount, a correction curve of the detection voltage of the X-ray detector 2 with respect to the change in tube voltage as shown in FIG. 4 is determined. When the coefficient α of the amount of change in the detected voltage with respect to the change in tube voltage is obtained from this correction curve, the tube voltage is returned to normal, the calibration operation is completed, and the system enters a measurement standby state. When the plate to be measured enters the X-ray beam and starts measurement,
The reference plate of the standard changer 5 is pulled out from the X-ray beam, and a thickness signal of the plate to be measured is obtained from the XgA detector 2, which is compared with a calibration curve and converted into a plate thickness value. For example, the amount of change in tube voltage is ±0.1% by calculating the plate thickness of the detected voltage.
If the above is true and you want to correct it, do it as follows. That is, by setting 1 to be a constant, for example, and multiplying the detected voltage β of the X-ray detector 3 by the reciprocal of the coefficient α, the amount of change γ in the detected voltage of the X-ray detector 2 with respect to the amount of change in X-rays can be found. This γ is added to the detection voltage for each plate thickness value of the calibration curve to correct it as shown in FIG. Based on the calibration curve corrected in this way, the thickness signal from the X-ray detection s2 is compared, converted into a plate thickness value, and the signal is output. This operation is performed every sampling period to cancel out changes in measurement results due to changes in tube voltage.
１４は記憶回路で、演算処理回路ｌＯが作成した検量線
及び補正曲線を記憶する。１５はＤ／Ａ変換器で、演算
処理回路１０の板厚値に基づく出力であるデジタル信号
をアナログ信号すなわち電圧に変換し、指示計１６でそ
の電圧値を指示する。14 is a storage circuit that stores the calibration curve and correction curve created by the arithmetic processing circuit IO. Reference numeral 15 denotes a D/A converter that converts a digital signal, which is an output based on the plate thickness value of the arithmetic processing circuit 10, into an analog signal, that is, a voltage, and indicates the voltage value with an indicator 16.
次に第２図乃至第３図を参照して演算処理回路１０の動
作について説明する。Next, the operation of the arithmetic processing circuit 10 will be explained with reference to FIGS. 2 and 3.
図示しない外部機器によって目標板厚値が設定され校正
動作が指令されると、演算処理回路１０は校正開始する
（ステップ２０１） 、 目標板厚値を測定するのに
必要な管電圧をセットする（ステップ２０２） 、
次に、スタンダードチェンジャー５を駆動して検量線作
成に必要な基準板をＸＩ＆ビーム中に挿入する（ステッ
プ２０３） 、 この基準板またはその組合せによる
厚み信号は透過ｘｍｍとしてＸ線検出１１２で検出され
、増幅器６で増幅される。When a target plate thickness value is set by an external device (not shown) and a calibration operation is commanded, the arithmetic processing circuit 10 starts calibration (step 201), and sets the tube voltage necessary to measure the target plate thickness value ( Step 202),
Next, the standard changer 5 is driven to insert a reference plate necessary for creating a calibration curve into the XI & beam (step 203), and the thickness signal from this reference plate or a combination thereof is detected by the X-ray detector 112 as transmitted x mm. , and are amplified by an amplifier 6.
増幅された信号はＡ／Ｄ変換器８を通じてデジタル信号
に変換され検出電圧データとして収集される（ステップ
２０４）。収集した検出電圧が検量線を作成するのに十
分であるかどうかを判別する（ステップ２０５） 、検
出電圧の収集が不十分な場合は。The amplified signal is converted into a digital signal through the A/D converter 8 and collected as detected voltage data (step 204). Determine whether the collected detection voltages are sufficient to create a calibration curve (step 205), if the collection of detection voltages is insufficient.
ステップ２０２にもどり再度管電圧をセットして十分に
検出電圧データを収集できるまで同様な操作を繰り返す
、ステップ２０５において、 データ収集が十分な場合
には、Ｘ線検出器２から得られた検出電圧データで第１
の検量線を作成する（ステップ２０６） 。Returning to step 202, the tube voltage is set again and the same operation is repeated until sufficient detected voltage data can be collected.In step 205, if sufficient data has been collected, the detected voltage obtained from the X-ray detector 2 is First in data
A calibration curve is created (step 206).
また、検量線作成時に検量線作成には関与しないが、検
量線を補正するために検量線作成時の管電圧に関する情
報をＸ線検出器３で検出する。第３図において、被測定
板がＸ線ビームに入り測定が始まるとＸ線検出器２及び
Ｘ線検出器３の検出電圧を収集しくステップ３０１）
、 管電圧の変化情報から検出電圧の変化を演算して
補正曲線を作成する（ステップ３０２） 、このとき、
ステップ２０２で第４図のように管電圧を０．１％増加
させ、さらに減少させて厚み情報であるＸ線検出器２の
検出電圧Ｖ ｚｘ Ｔ Ｖｚｉ ｖ Ｖｚ３、Ｘ線のｆ
（［ＪｔであるＸｆＬ検出器３の検出電圧Ｖ ３１１
Ｖ ３ ！ ？ Ｖ ｆｆ ３．を収集すれば補正曲線
が曲線になっても直線とみなし係数αを求めることがで
きる。この補正曲線をもとに検量線を補正する（ステッ
プ３０３）。Further, although the X-ray detector 3 is not involved in creating the calibration curve, the X-ray detector 3 detects information regarding the tube voltage at the time of creating the calibration curve in order to correct the calibration curve. In FIG. 3, when the plate to be measured enters the X-ray beam and measurement begins, the detection voltages of X-ray detector 2 and X-ray detector 3 are collected (step 301).
, Calculate the change in detected voltage from the tube voltage change information to create a correction curve (step 302), at this time,
In step 202, the tube voltage is increased by 0.1% as shown in FIG.
(Detection voltage V 311 of XfL detector 3 which is [Jt
V3! ? Vff3. By collecting , even if the correction curve is a curve, it can be regarded as a straight line and the coefficient α can be obtained. The calibration curve is corrected based on this correction curve (step 303).
化量が検出電圧の板厚演算で±０．１％以上の差になる
か否かを判別する（ステップ３０５） 、 差がない
場合はその板厚値を出力する（ステップ３０８） 。It is determined whether or not the thickness difference is ±0.1% or more in the plate thickness calculation of the detected voltage (step 305). If there is no difference, the plate thickness value is output (step 308).
差がある場合は、第４図から補正量を求め、第５図のよ
うに検量線■を補正する（ステップ３０６） 。If there is a difference, the correction amount is determined from FIG. 4, and the calibration curve (2) is corrected as shown in FIG. 5 (step 306).
このようにして補正された検量線■からＸ線検出器２の
検出電圧を、板厚値に変換する（ステップ３０７） 、
この板厚値を出力して（ステップ３０８）測定を終了す
る。Converting the detection voltage of the X-ray detector 2 into a plate thickness value from the calibration curve (■) corrected in this way (step 307),
This plate thickness value is output (step 308) and the measurement is completed.
本発明によれば、管電圧あるいは管電流の変化をＸ線量
の情報として検出し、測定時は必要に応じて求めた検量
線を補正できるので、Ｘ線量の変化に対しても安定で高
精度なＸ線厚み計を得ることができる。According to the present invention, changes in tube voltage or tube current are detected as X-ray dose information, and the calibration curve obtained can be corrected as necessary during measurement, so it is stable and highly accurate even with changes in X-ray dose. It is possible to obtain an X-ray thickness gauge.
第１図は本発明の実施例を示すブロック図、第２図及び
第３図は本発明のｘｍ厚み計の動作を示す流れ図、第４
図は補正曲線を示す図、第５図は測定時の検量線の補正
方法を示す図である。
１・・・Ｘ線発生器 ２・・・Ｘ線検出器３・・・
Ｘ線検出器
５・・・スタンダードチェンジャーFIG. 1 is a block diagram showing an embodiment of the present invention, FIGS. 2 and 3 are flow charts showing the operation of the xm thickness gauge of the present invention, and FIG.
The figure shows a correction curve, and FIG. 5 shows a method of correcting a calibration curve during measurement. 1...X-ray generator 2...X-ray detector 3...
X-ray detector 5...Standard changer
Claims (1)
Ｘ線透過量を検出する第１の検出手段と、 この第１の検出手段からの検出信号に基づいて厚み基準
曲線を作成する作成手段と、 前記Ｘ線源から照射されるＸ線量の絶対的変化を検出す
る第２の検出手段と、 前記被測定体を透過し たＸ線量に基づき前記基準曲線から求まる厚み値に対し
てこの第２の検出手段からの信号を補正値とする補正手
段と を有するＸ線厚み計。[Scope of Claims] A first detection means for detecting the amount of X-ray transmission from an X-ray source irradiating a measured object having a reference plate thickness value; and a detection signal based on the first detection means. a second detection means for detecting an absolute change in the amount of X-rays irradiated from the X-ray source; An X-ray thickness meter comprising a correction means that uses a signal from the second detection means as a correction value for the thickness value to be determined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3141290A JP2856815B2 (en) | 1990-02-14 | 1990-02-14 | X-ray thickness gauge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3141290A JP2856815B2 (en) | 1990-02-14 | 1990-02-14 | X-ray thickness gauge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03237310A true JPH03237310A (en) | 1991-10-23 |
| JP2856815B2 JP2856815B2 (en) | 1999-02-10 |
Family
ID=12330544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3141290A Expired - Lifetime JP2856815B2 (en) | 1990-02-14 | 1990-02-14 | X-ray thickness gauge |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2856815B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555013U (en) * | 1991-12-24 | 1993-07-23 | 横河電機株式会社 | X-ray transmission type sheet material measuring device |
| JP2002350120A (en) * | 2001-05-23 | 2002-12-04 | Anritsu Corp | Method for measuring thickness by x-ray and x-ray thickness measuring apparatus |
| JP2011242254A (en) * | 2010-05-18 | 2011-12-01 | Nippon Steel Corp | Steel plate thickness measuring instrument and calibration method thereof |
| WO2014037984A1 (en) * | 2012-09-10 | 2014-03-13 | 株式会社 東芝 | X ray thickness meter |
| CN105526888B (en) * | 2015-11-30 | 2018-06-19 | 广东核生科技有限公司 | Thickness measuring method and thickness measuring system |
-
1990
- 1990-02-14 JP JP3141290A patent/JP2856815B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555013U (en) * | 1991-12-24 | 1993-07-23 | 横河電機株式会社 | X-ray transmission type sheet material measuring device |
| JP2002350120A (en) * | 2001-05-23 | 2002-12-04 | Anritsu Corp | Method for measuring thickness by x-ray and x-ray thickness measuring apparatus |
| JP2011242254A (en) * | 2010-05-18 | 2011-12-01 | Nippon Steel Corp | Steel plate thickness measuring instrument and calibration method thereof |
| WO2014037984A1 (en) * | 2012-09-10 | 2014-03-13 | 株式会社 東芝 | X ray thickness meter |
| JP2014052342A (en) * | 2012-09-10 | 2014-03-20 | Toshiba Corp | X-ray thickness meter |
| TWI490448B (en) * | 2012-09-10 | 2015-07-01 | Toshiba Kk | X-ray thickness meter |
| CN105526888B (en) * | 2015-11-30 | 2018-06-19 | 广东核生科技有限公司 | Thickness measuring method and thickness measuring system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2856815B2 (en) | 1999-02-10 |
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